HOLTEK ht8972 User Manual

Features

·

Operating voltage: 4.5V~5.5V

·

ADM algorithm

·

Low noise

-

Echo mode: -85dB

-

Surround mode: -90dB

Applications

·

Television

·

Karaoke systems

General Description

The HT8972 is an echo/surround effect processor. It is
designed for various audio systems including karaoke,
television, sound equipments, etc. The chip consists of
a built-in pre-amplifier, VCO or Voltage Control OSC,
40Kb SRAM, A/D and D/A converters as well as delay
time control logic.

HT8972

Voice Echo

·

Low distortion rate

-

Echo mode: 1%

-

Surround mode: 0.2%

·

Built-in 40Kb SRAM

·

Automatic reset function

·

16-pin DIP/SOP package

·

Video disc player

·

Sound equipments

Its built-in 40Kb SRAM can generate delay time effect
and can control the delay time value through the exter
nal VCO resistor.

The VCO circuit can reduce external components and
make it easy to adjust the delay time.

-

Block Diagram

L P F 1 _ I N

V C C A G N D D G N D

L P F 1 _ O U T L P F 2 _ O U T L P F 2 _ I N O P 2 _ O U T O P 2 _ I N O P 1 _ I N O P 1 _ O U T C C 0 C C 1

C O M P

L P F 1

1 / 2 V C C

A U T O

R E S E T

L P F 2

D I

M O M I C L O C K

4 0 K B i t s

R A M

V C O

O S C _ OR E F

v c o

4 . 7 k

4 . 7 k

W

W

M O D

D E M

D O 0 D O 1

Rev. 1.00 1 December 23, 2008

Pin Assignment

Pad Assignment

HT8972

L P F 1 _ I N

1 6

1

V C C

2

R E F

V C O

C C 1

C C 0

1 6 D I P - A / S O P - A

R E F

3

4

5

6

7

8

H T 8 9 7 2

A G N D

D G N D

O S C _ O

D G N D

A G N D

L P F 1 _ O U T

1 5

L P F 2 _ O U T

1 4

L P F 2 _ I N

1 3

O P 2 _ O U T

1 2

O P 2 _ I N

1 1

O P 1 _ I N

1 0

O P 1 _ O U T

9

L P F 1 _ O U T

L P F 1 _ I N

V C C

L P F 2 _ O U T

L P F 2 _ I N

1 6

1

2

O S C _ O

3

V C O

1 5

1 4

( 0 , 0 )

6

5

4

C C 1

C C 0

7

O P 1 _ I N

O P 1 _ O U T

1 2 1 1

1 3

1 0

8

9

O P 2 _ I N

O P 2 _ O U T

Chip size: 2475´2065 (mm)

2

* The IC substrate should be connected to VSS in the PCB layout artwork.

Rev. 1.00 2 December 23, 2008

HT8972

Pad Coordinates

Pad No. X Y Pad No. X Y

1

2

3

4

5 147.425

6 395.225

7 587.425

8 835.225

-883.875

-865.105 -891.900

-564.105 -892.700

-44.775 -892.700

861.250 9 1027.425

10 907.375 890.431

11 715.175 890.429

12 467.375 890.431

-892.700

-892.700

-892.700

-892.700

13 275.175 890.429

14 60.790 879.700

15

16

-203.150

-783.875

Pad Description

Pad No. Pad Name I/O Internal Connection Description

1 DGND I

2 OSC_O O

3 VCO I

4 CC1

5 CC0

6 OP1_OUT O

7 OP1_IN I

8 OP2_IN I

9 OP2_OUT O

10 LPF2_IN I

11 LPF2_OUT O

12 LPF1_OUT O

13 LPF1_IN I

14 VCC I

15 REF I

16 AGND I

¾

¾

¾

¾¾

¾¾

¾

¾

¾

¾

¾

¾

¾

¾

¾

¾

¾

Digital ground

System oscillator output

System oscillator input, system frequency adjustable pin

Current control 1

Current control 0

OP1 output

OP1 input

OP2 input

OP2 output

Low pass filter 2 input

Low pass filter 2 output

Low pass filter 1 output

Low pass filter 1 input

Analog and positive power supply

Analog reference voltage

Analog ground

Unit: mm

-892.700

868.440

861.250

Absolute Maximum Ratings

Supply Voltage...........................VSS-0.3V to VSS+6.0V

Input Voltage..............................V

Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may

cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed
in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.

Rev. 1.00 3 December 23, 2008

-0.3V to VDD+0.3V

SS

Storage Temperature ............................-50°Cto125°C

Operating Temperature .............................-20°Cto70°

HT8972

Electrical Characteristics

Symbol Parameter

V

CC

I

CC

G

V

V

OMAX

THD Total Harmonic Distortion 5V

N

O

PSRR Power Supply Rejection Ratio 5V

Operating Voltage

Operating Current 5V

Voltage Gain 5V

Maximum Output Voltage 5V THD=10% 0.9 1.8

Output Noise Voltage 5V

Test Conditions

V

DD

Conditions

¾¾

Min. Typ. Max. Unit

4.5 5.0 5.5 V

¾¾

=47kW¾-0.9

R

L

Filter= A-Weighting ¾

Filter= A-Weighting ¾-85 -60

DV

=-20dBV (0.1Vrms)

CC

f=100Hz

¾-40 -30

Ta=25°C

15 30 mA

2.5 dB

Vrms

¾

0.7 1.5 %

dBV

dB

Rev. 1.00 4 December 23, 2008

Functional Description

The HT8972 is an echo/surround effect generator with
built-in 40Kb SRAM. It ensures low distortion as well as
low noise for processing audio signal delay. The chip
provides two playing modes (echo and surround) and
the playing function block diagrams are shown as fol
lows.

·

Surround mode

V

I N

L P F 1 A / D

D e l a y

D / A L P F 2

V

O U T

HT8972

·

Echo mode

V

O U T

V

I N

L P F 1 A / D

-

D e l a y

D / A L P F 2

R

OSC-fOSC

R

f

THD

R

f

THD

R

f

THD

R

f

THD

-Delay_time-Distortion Cross table

OSC

OSC

Td

56.2 44 36.3 30.6 25.9 23.1 20.7

2 2.5 3 3.5 4 4.5 5 MHz

320 264 219 188 164 147 132 ms

1.3 1.05 0.815 0.625 0.58 0.525 0.43 %

OSC

OSC

Td

18.5 16.7 15.1 14.5 13.9 11.9 10.9

5.5 6 6.5 7 7.5 8 8.5 MHz

120 110 102 93 88 82 78 ms

0.4 0.335 0.315 0.3 0.275 0.26 0.25 %

OSC

OSC

Td

10 9 8.06 7.3 6.4 5.8 5.3

9 101112131415MHz

73.2 65.6 59.2 54.4 50 46 44 ms

0.23 0.218 0.205 0.19 0.17 0.1675 0.1575 %

OSC

OSC

Td

4.8 4.4 4 3.7 3.3 3 2.8

16 17 18 19 20 21 22 MHz

41.2 38.4 36 33.6 33 32 30 ms

0.16 0.145 0.14 0.14 0.13 0.125 0.12 %

kW

kW

kW

kW

Rev. 1.00 5 December 23, 2008

Application Circuits

Echo Mode

HT8972

1mF

1 k

W

M I C

4 . 7 k

W

V C C

V C C

F

0 . 1

m

1 0 0mF

4 7mF

R

O S C

F

0 . 1

m

2 0 k

2 0 k

W

D e l a y T i m e

0 . 1mF

1mF

4 . 7 k

W

4 . 7 k

W

1

V C C

2

R E F

3

A G N D

4

D G N D

5

O S C _ O

W

6

V C O

7

C C 1

8

C C 0

4 7 k

1 0 0mF

4 . 7 k

W

L P F 1 _ O U T

L P F 2 _ O U T

O P 2 _ O U T

O P 1 _ O U T

1 k

W

L P F 1 _ I N

L P F 2 _ I N

O P 2 _ I N

O P 1 _ I N

W

5 6 0

W

2 2mF

1 6

1 5

1 4

1 3

1 2

1 1

1 0

9

3

4 5 5 8

2

6 8 0 0 p F

1 0 k

1 0 0 0 p F

4 . 3 k

3 . 3 k

4 . 3 k

5 6 0 p F

1 0 k

4 . 3 k

6 8 0 0 p F

6 8 0 0 p F

9 V

8

1

4

4 7 k

W

3 9 p F

4 . 3 k

4 . 7mF

W

4 . 7 k

W

W

W

W

W

W

W

1 0mF

0 . 0 3 3mF

6 8 0 0 p F

M I C V O L

4 . 7mF

2 . 7 k

1 0mF

4 . 7mF

W

F e e d B a c k

5 0 k

2 0 k

E c h o M o d e

W

W

1 0 0 k

W

O u t p u t

1
2

H T 8 9 7 2

Note: 1. : Analog ground, : Digital ground

2. When the value of the Rosc increases, the range of the Delay time also increases. Please refer to the
R

OSC-fOSC

-Delay_time-Distortion Cross table for the R

& Delay time values.

OSC

Rev. 1.00 6 December 23, 2008

Surround Mode

M I C

0 . 1

HT8972

1mF

1 k

W

4 . 7 k

W

V C C

V C C

F

m

1 0 0mF

4 7mF

R

O S C

F

0 . 1

m

2 0 k

2 0 k

W

D e l a y T i m e

0 . 1mF

1mF

4 . 7 k

W

4 . 7 k

W

1

V C C

2

R E F

3

A G N D

4

D G N D

5

O S C _ O

W

6

V C O

7

C C 1

8

C C 0

4 7 k

1 0 0mF

4 . 7 k

W

L P F 1 _ O U T

L P F 2 _ O U T

O P 2 _ O U T

O P 1 _ O U T

1 k

W

L P F 1 _ I N

L P F 2 _ I N

O P 2 _ I N

O P 1 _ I N

W

5 6 0

W

2 2mF

1 6

1 5

1 4

1 3

1 2

1 1

1 0

9

3

4 5 5 8

2

6 8 0 0 p F

1 0 k

1 0 0 0 p F

4 . 3 k

4 . 3 k

5 6 0 p F

1 0 k

4 . 3 k

6 8 0 0 p F

6 8 0 0 p F

9 V

8

1

4

4 7 k

W

3 9 p F

4 . 3 k

W

W

3 . 3 k

W

W

W

W

W

6 8 0 0 p F

4 . 7mF

M I C V O L

4 . 7mF

1 0mF

2 0 k

S u r r o u n d M o d e

W

1 0 0 k

W

O u t p u t

1
2

H T 8 9 7 2

Note: 1. : Analog ground, : Digital ground

2. When the value of the Rosc increases, the range of the Delay time also increases. Please refer to the
R

OSC-fOSC

-Delay_time-Distortion Cross table for the R

& Delay time values.

OSC

Rev. 1.00 7 December 23, 2008

Package Information

16-pin DIP (300mil) Outline Dimensions

A

HT8972

A

1 6

B

1

C

D

E

Fig1. Full Lead Packages

·

MS-001d (see fig1)

Symbol

A 780

B 240

C 115

D 115

E14

F45

G

H 300

I

9

8

H

G

F

I

1 6

B

1

C

D

E

F

9

8

H

G

I

Fig2. 1/2 Lead Packages

Dimensions in mil

Min. Nom. Max.

¾

¾

¾

¾

¾

¾

¾

100

¾

¾¾

880

280

195

150

22

70

¾

325

430

·

MS-001d (see fig2)

Symbol

Min. Nom. Max.

A 735

B 240

C 115

D 115

E14

F45

G

¾

H 300

I

¾¾

Dimensions in mil

¾

¾

¾

¾

¾

¾

100

¾

775

280

195

150

22

70

¾

325

430

Rev. 1.00 8 December 23, 2008

·

MO-095a (see fig2)

Symbol

A 745

B 275

C 120

D 110

E14

F45

G

H 300

I

Dimensions in mil

Min. Nom. Max.

¾

¾

¾

¾

¾

¾

¾

¾¾

100

¾

785

295

150

150

22

60

¾

325

430

HT8972

Rev. 1.00 9 December 23, 2008

16-pin SOP (300mil) Outline Dimensions

HT8972

·

MS-013

1 6

A

1

C

D

E F

Symbol

A 393

B 256

C12

C¢

D

E

F4

G16

H8

9

B

8

C '

G

H

a

Dimensions in mil

Min. Nom. Max.

¾

¾

¾

398

¾

¾¾

¾

50

¾

¾

¾

a 0°¾8°

419

300

20

413

104

¾

12

50

13

Rev. 1.00 10 December 23, 2008

Product Tape and Reel Specifications

Reel Dimensions

HT8972

T 2

A

B

T 1

D

SOP 16W (300mil)

Symbol Description Dimensions in mm

A Reel Outer Diameter

B Reel Inner Diameter

C Spindle Hole Diameter

D Key Slit Width

T1 Space Between Flange

T2 Reel Thickness

330.0±1.0

100.0±1.5

13.0

2.0±0.5

16.8

22.2±0.2

C

+0.5/-0.2

+0.3/-0.2

Rev. 1.00 11 December 23, 2008

Carrier Tape Dimensions

HT8972

D

E

F

PD 1

P 1P 0

W

A 0

R e e l H o l e

I C p a c k a g e p i n 1 a n d t h e r e e l h o l e s
a r e l o c a t e d o n t h e s a m e s i d e .

B 0

C

SOP 16W (300mil)

Symbol Description Dimensions in mm

W Carrier Tape Width

P Cavity Pitch

E Perforation Position

F Cavity to Perforation (Width Direction)

D Perforation Diameter 1.50

D1 Cavity Hole Diameter 1.50

P0 Perforation Pitch

P1 Cavity to Perforation (Length Direction)

A0 Cavity Length

B0 Cavity Width

K0 Cavity Depth

t Carrier Tape Thickness

C Cover Tape Width

16.0±0.2

12.0±0.1

1.75±0.10

7.5±0.1

+0.10/-0.00

+0.25/-0.00

4.0±0.1

2.0±0.1

10.9±0.1

10.8±0.1

3.0±0.1

0.30±0.05

13.3±0.1

t

K 0

Rev. 1.00 12 December 23, 2008

Holtek Semiconductor Inc. (Headquarters)

No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan
Tel: [phone]
Fax: [phone]
http://www.holtek.com.tw

Holtek Semiconductor Inc. (Taipei Sales Office)

4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan
Tel: [phone]
Fax: [phone]
Fax: [phone] (International sales hotline)

HT8972

Holtek Semiconductor Inc. (Shanghai Sales Office)

G Room, 3 Floor, No.1 Building, No.2016 Yi-Shan Road, Minhang District, Shanghai, China 201103
Tel: [phone]
Fax: [phone]
http://www.holtek.com.cn

Holtek Semiconductor Inc. (Shenzhen Sales Office)

5F, Unit A, Productivity Building, Gaoxin M 2nd, Middle Zone Of High-Tech Industrial Park, ShenZhen, China 518057
Tel: [phone]
Fax: [phone]

Holtek Semiconductor Inc. (Beijing Sales Office)

Suite 1721, Jinyu Tower, A129 West Xuan Wu Men Street, Xicheng District, Beijing, China 100031
Tel: [phone]
Fax: [phone]

Holtek Semiconductor Inc. (Chengdu Sales Office)

709, Building 3, Champagne Plaza, No.97 Dongda Street, Chengdu, Sichuan, China 610016
Tel: [phone]
Fax: [phone]

Holtek Semiconductor (USA), Inc. (North America Sales Office)

46729 Fremont Blvd., Fremont, CA 94538, USA
Tel: [phone]
Fax: [phone]
http://www.holtek.com

Copyright Ó 2008 by HOLTEK SEMICONDUCTOR INC.

The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek as
sumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used
solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable
without further modification, nor recommends the use of its products for application that may present a risk to human life
due to malfunction or otherwise. Holtek¢s products are not authorized for use as critical components in life support devices
or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information,
please visit our web site at http://www.holtek.com.tw.

-

Rev. 1.00 13 December 23, 2008