HOLTEK HT36A3 User Manual

查询HT36A3供应商

Features

·

Operating voltage: 2.4V~5.0V

·

Operating frequency: 3.58MHz~12MHz (typ. 8MHz)

·

20 bidirectional I/O lines

·

Two 8-bitprogrammable timer with 8 stage prescaler

·

Watchdog Timer

·

Built-in 8-bit MCU with 208´8 bits RAM

·

Built-in 32K´16-bit ROM for program/data shared

·

Mono output

·

High D/A converter resolution: 16 bits

·

Polyphonic up to 8 notes

·

Independent pan and volume mix can be assigned to
each sound component

General Description

The HT36A3 is an 8-bit high performance RISC-like
microcontroller specifically designed for music applica
tions. It provides an 8-bit MCU and a 8 channel
wavetable synthesizer. The program ROM is composed
of both program control codes and wavetable voice
codes, and can be easily programmed.

HT36A3

8-Bit Music Synthesizer MCU

·

Sampling rate of 25kHz as 6.4MHz for system
frequency

·

Eight-level subroutine nesting

·

HALT function and wake-up feature to reduce power
consumption

·

Bit manipulation instructions

·

16-bit table read instructions

·

63 powerful instructions

·

All instructions in 1 or 2 machine cycles

·

28-pin SOP, 48-pin SSOP package

The HT36A3 has a built-in 8-bit microprocessor which
programs the synthesizer to generate the melody by

­setting the special register from 20H~2AH. A HALT fea
ture is provided to reduce power consumption.

-

Block Diagram

P A 0 ~ P A 7

P B 0 ~ P B 7

P C 0 ~ P C 3

O S C 1

O S C 2

R E S

8 - B i t
M C U

3 2 K´1 6 - b i t

R O M

2 0 8

8

´

R A M

M u l t i p l i e r / P h a s e

G e n e r a l

1 6 - B i t

D A C

V D D
V S S
V D D A
V S S A

A U D

Rev. 1.00 1 June 30, 2003

Pin Assignment

V S S A

V D D

V D D A

T E S T

A U D

P A 4

P A 5

P A 6

P A 7

N C

N C

N C

V S S

N C

1

2

3

4

5

6

7

8

9

1 0

1 1

1 2

1 3

1 4

H T 3 6 A 3

2 8 S O P - A

HT36A3

P A 4

1

P A 5

2

P A 6

3

P A 7

4

P B 0

5

P B 1

6

P B 2

7

P B 3

8

P B 4

9

P B 5

V S S A

V D D

V D D A

1 0

P B 6

1 1

P B 7

1 2

N C

1 3

N C

1 4

V S S

1 5

1 6

1 7

1 8

N C

1 9

N C

2 0

N C

2 1

N C

2 2

N C

2 3

N C

2 4

2 8

P A 3

2 7

P A 2

2 6

P A 1

2 5

P A 0

2 4

N C

2 3

N C

2 2

O S C 2

2 1

N C

2 0

O S C 1

1 9

N C

1 8

R E S

1 7

N C

1 6

N C

1 5

N C

H T 3 6 A 3

4 8 S S O P - A

P A 3

4 8

P A 2

4 7

P A 1

4 6

P A 0

4 5

P C 3

4 4

P C 2

4 3

P C 1

4 2

P C 0

4 1

N C

4 0

N C

3 9

N C

3 8

N C

3 7

N C

3 6

N C

3 5

O S C 2

3 4

O S C 1

3 3

N C

3 2

N C

3 1

R E S

3 0

N C

2 9

N C

2 8

N C

2 7

A U D

2 6

T E S T

2 5

Pad Assignment

V S S

V S S A

V D D

V D D A

P B 4

P B 5

P B 6

P B 7

P C 3

P C 2

P C 1

P B 3

P B 2

P B 1

P B 0

P A 7

P A 6

P A 5

P A 4

P A 3

P A 2

P A 1

P A 0

2 9

2 8

1

2

3

4

2 7 2 6

2 4

2 5

2 3 2 2

1 9

2 1

1 8 1 7

2 0

P C 0

1 4

1 5

1 6

( 0 , 0 )

1 3

O S C 2

5

6

7

1 2

8

9

1 0

A U D

T E S T

O S C 1

1 1

R E S

Chip size: 83 ´ 111 (mil)

2

* The IC substrate should be connected to VSS in the PCB layout artwork.

Rev. 1.00 2 June 30, 2003

Pad Coordinates

Pad No. X Y Pad No. X Y

1

2

3

4

5

6

7

8

9

10

11 875.950

12 875.950

13 875.950

14 901.500 1240.150 29

15 793.900 1240.150

-879.100

-879.100

-879.100

-879.100

-898.600 -805.050

-898.600 -931.910

-847.650 -1041.910

-847.650 -1180.350

-193.090 -1200.600

-81.290 -1200.600

1202.400 16 693.900 1240.150

1097.100 17 583.300 1240.150

986.500 18 483.300 1240.150

886.500 19 372.700 1240.150

20 272.700 1240.150

21 162.100 1240.150

22 62.100 1240.150

-1262.274

-1149.626

-471.774

23

24

25

26

27

28

-48.500

-148.500

-259.100

-359.100

-469.700

-569.700

-680.300

Pad Description

I

I

Internal

Connection

Pull-High

or None

Pull-High

or None

Pull-High

or None

¾

¾

¾

Function

Bidirectional 8-bit Input/Output port

Bidirectional 8-bit Input/Output port

Bidirectional 8-bit Input/Output port

Negative power supply, ground

Negative power supply of DAC, ground

Digital power supply

DAC power supply

Audio output

No connection (open)

Reset input, active low (no pull-high)

OSC1 and OSC2 are connected to an RC network or a crystal (by mask op
tion) for the internal system clock. In the case of RC operation, OSC2 is the
output terminal for 1/8 system clock. The system clock may come from the
crystal, the two pins cannot be floating.

Pad Name I/O

PA0~PA7 I/O

PB0~PB7 I/O

PC0~PC3 I/O

VSS

VSSA

VDD

VDDA

AUD O

TEST

RES

OSC1
OSC2

¾¾

¾¾

¾¾

¾¾

¾¾

O

HT36A3

1240.150

1240.150

1240.150

1240.150

1240.150

1240.150

1240.150

-

Rev. 1.00 3 June 30, 2003

HT36A3

Absolute Maximum Ratings

Supply Voltage .............................VSS-0.3V to VSS+6V

Input Voltage .............................V

3V to VDD+0.3V

SS-0.

Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may

cause substantial damage to the device. Functional operation of this device at other conditions beyond those
listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil
ity.

Storage Temperature ...........................-50°Cto125°C

Operating Temperature ..........................-25°Cto70°C

-

D.C. Characteristics

Symbol Parameter

V

I

I

I

I

V

V

DD

DD

STB

OH

OL

IH

IL

Operating Voltage

Operating Current 4.5V

Standby Current (WDT Disabled) 4.5V No load, System HALT

I/O Ports Source Current 4.5V

I/O Ports Sink Current 4.5V

Input High Voltage for I/O Ports 4.5V

Input Low Voltage for I/O Ports 4.5V

Test Conditions

V

DD

Conditions

¾¾

No load, f

=4.5V

V

OH

=0.5V

V

OL

OSC

=8MHz

¾

¾

Ta=25°C

Min. Typ. Max. Unit

2.2 4.5 5.5 V

¾

¾

23

23

0.8V

0

816mA

13

¾

¾

V

¾

DD

¾

DD

0.2V

DD

mA

mA

mA

V

V

Rev. 1.00 4 June 30, 2003

Application Circuit

HT36A3

V

D D

1 0

W

1 0 0 k

0 . 1mF

O S C 1

V D D

V D D A

P A 0 ~ P A 7

4 7mF

0 . 1mF

P B 0 ~ P B 7

V

P C 0 ~ P C 3

1 k

A U D

V

D D

W

D D

S P K
8

W

7 5 0

W

W

R E S

V S S A

V S S

H T 3 6 A 3

V

D D

1 0

W

V D D V D D A

4 7mF

0 . 1mF

1 0 0 k

0 . 1mF

8 M H z

O S C 1

O S C 2

P A 0 ~ P A 7

P B 0 ~ P B 7

P C 0 ~ P C 3

V

D D

4 7mF

I N

H T 8 2 V 7 3 3

5

C E

V D D

8

O U T N

V S S

1

7

O U T P

4

S P K
8

W

A U D

2 0 k

W

V

D D

W

R E S

V S S A

1 0

F

0 . 1

m

2

V r e f

3

F

m

V S S

H T 3 6 A 3

Rev. 1.00 5 June 30, 2003

Package Information

28-pin SOP (300mil) Outline Dimensions

HT36A3

2 8

A

1

C

C '

D

E

Symbol

A 394

B 290

C14

C¢

D92

E

F4

G32

H4

1 5

B

1 4

G

H

F

a

Dimensions in mil

Min. Nom. Max.

¾

¾

¾

697

¾

¾

¾

50

¾¾

¾

¾

a 0°¾10°

419

300

20

713

104

¾

38

12

Rev. 1.00 6 June 30, 2003

48-pin SSOP (300mil) Outline Dimensions

HT36A3

4 8

A

1

C

C '

D

E

Symbol

Min. Nom. Max.

A 395

B 291

C8

C¢

613

D85

E

¾

F4

G25

H4

2 5

B

2 4

F

Dimensions in mil

¾

¾

¾

¾

¾

25

¾

¾

¾

G

a

a 0°¾8°

H

420

299

12

637

99

¾

10

35

12

Rev. 1.00 7 June 30, 2003

Product Tape and Reel Specifications

Reel Dimensions

HT36A3

T 2

A

B

T 1

D

SOP 28W (300mil)

Symbol Description Dimensions in mm

A Reel Outer Diameter

B Reel Inner Diameter

C Spindle Hole Diameter

D Key Slit Width

T1 Space Between Flange

T2 Reel Thickness

330±1.0

62±1.5

13.0+0.5

2.0±0.5

24.8+0.3

30.2±0.2

C

-0.2

-0.2

SSOP 48W

Symbol Description Dimensions in mm

A Reel Outer Diameter

B Reel Inner Diameter

C Spindle Hole Diameter

D Key Slit Width

T1 Space Between Flange

T2 Reel Thickness

330±1.0

100±0.1

13.0+0.5

-0.2

2.0±0.5

32.2+0.3

-0.2

38.2±0.2

Rev. 1.00 8 June 30, 2003

Carrier Tape Dimensions

HT36A3

D

E

F

PD 1

P 1P 0

W

A 0

B 0

C

SOP 28W (300mil)

Symbol Description Dimensions in mm

W Carrier Tape Width

P Cavity Pitch

E Perforation Position

F Cavity to Perforation (Width Direction)

24.0±0.3

12.0±0.1

1.75±0.1

11.5±0.1

D Perforation Diameter 1.5+0.1

D1 Cavity Hole Diameter 1.5+0.25

P0 Perforation Pitch

P1 Cavity to Perforation (Length Direction)

A0 Cavity Length

B0 Cavity Width

K0 Cavity Depth

t Carrier Tape Thickness

4.0±0.1

2.0±0.1

10.85±0.1

18.34±0.1

2.97±0.1

0.35±0.01

C Cover Tape Width 21.3

t

K 0

Rev. 1.00 9 June 30, 2003

HT36A3

D

E

F

PD 1

P 1P 0

W

A 0

B 0

C

SSOP 48W

Symbol Description Dimensions in mm

W Carrier Tape Width

P Cavity Pitch

E Perforation Position

F Cavity to Perforation (Width Direction)

32.0±0.3

16.0±0.1

1.75±0.1

14.2±0.1

D Perforation Diameter 2.0 Min.

D1 Cavity Hole Diameter 1.5+0.25

P0 Perforation Pitch

P1 Cavity to Perforation (Length Direction)

A0 Cavity Length

B0 Cavity Width

K1 Cavity Depth

K2 Cavity Depth

t Carrier Tape Thickness

4.0±0.1

2.0±0.1

12.0±0.1

16.20±0.1

2.4±0.1

3.2±0.1

0.35±0.05

C Cover Tape Width 25.5

t

K 1

K 2

Rev. 1.00 10 June 30, 2003

Holtek Semiconductor Inc. (Headquarters)

No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan
Tel: [phone]
Fax: [phone]
http://www.holtek.com.tw

HT36A3

Holtek Semiconductor Inc. (Taipei Sales Office)

4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan
Tel: [phone]
Fax: [phone]
Fax: [phone] (International sales hotline)

Holtek Semiconductor Inc. (Shanghai Sales Office)

7th Floor, Building 2, No.889, Yi Shan Rd., Shanghai, China 200233
Tel: [phone]
Fax: [phone]
http://www.holtek.com.cn

Holtek Semiconductor Inc. (Shenzhen Sales Office)

43F, SEG Plaza, Shen Nan Zhong Road, Shenzhen, China 518031
Tel: [phone]
Fax: [phone]
ISDN: 0755-8346-5591

Holtek Semiconductor Inc. (Beijing Sales Office)

Suite 1721, Jinyu Tower, A129 West Xuan Wu Men Street, Xicheng District, Beijing, China 100031
Tel: [phone]
Fax: [phone]

Holmate Semiconductor, Inc. (North America Sales Office)

46712 Fremont Blvd., Fremont, CA 94538
Tel: [phone]
Fax: [phone]
http://www.holmate.com

Copyright Ó 2003 by HOLTEK SEMICONDUCTOR INC.

The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek as
sumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used
solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable
without further modification, nor recommends the use of its products for application that may present a risk to human life
due to malfunction or otherwise. Holtek¢s products are not authorized for use as critical components in life support devices
or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information,
please visit our web site at http://www.holtek.com.tw.

-

Rev. 1.00 11 June 30, 2003