Technical Data Sheet
Hysol®E-00NS™
December-2006
PRODUCT DESCRIPTION
Hysol®E-00NS™ provides the following product
characteristics:
Technology Epoxy
Chemical Type (Resin) Epoxy
Chemical Type
(Hardener)
Mercaptan
Appearance (Resin) Translucent white to yellow paste
LMS
Appearance (Hardener) Clear colorless to slightly yellow
liquid
LMS
Appearance (Mixed) translucent to yellow solid
LMS
Components Two component - requires mixing
Viscosity Low
Mix Ratio, by volume -
Resin : Hardener
1 : 1
Mix Ratio, by weight Resin : Hardener
100 : 92
Cure Room temperature cure after mixing
Application Bonding
Hysol®E-00NS™ is a fast setting, non-sagging,
thixotropic, industrial grade epoxy adhesive. Once mixed, the
two component epoxy cures at room temperature to form a
translucent, rigid, machineable bondline. When fully cured, the
epoxy is resistant to a wide range of chemicals and solvents,
and acts as an excellent electrical insulator. Typical
applications include bonding plastic, metal, glass, wood,
ceramic, rubber, and masonry materials. Its non-sagging
formula is especially suited for use on vertical surfaces to avoid
run-off, as well as staking fillet bonds and general industrial
repairs. Designed for use in component assembly, appliances,
electronics, & fiber optics.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Resin:
Specific Gravity @ 25 °C 1.1 to 1.3
LMS
Flash Point - See MSDS
Viscosity @ 25°C, mPa·s (cP) 200,000 to 700,000
LMS
Hardener:
Specific Gravity @ 25 °C 1.0 to 1.2
LMS
Flash Point - See MSDS
Viscosity @ 25°C, mPa·s (cP) 20,000 to 70,000
LMS
Mixed:
Specific Gravity @ 25 °C 1.15
Working life, minutes 3
Tack Free Time minutes 3.5
2 Grams, 60° Angle ≤2.54
LMS
TYPICAL CURING PERFORMANCE
Cure Speed vs. Time
The graph below shows shear strength developed with time on
abraded, acid etched aluminum lapshears @ 25 °C with an
average bondline gap of 0.1 to 0.2 mm and tested according to
ISO 4587.
% of Full Strength on Alumin.
Cure Time
100
75
50
25
0
1min 5min 10min 30min 1h 3h 6h 24h 72h
Gel Time
Gel time, 25 °C, minutes 2 to 6
LMS
TYPICAL PROPERTIES OF CURED MATERIAL
Cured @ 25 °C
Physical Properties:
Glass Transition Temperature (Tg), °C 20
Shore Hardness, ISO 868, Durometer D 80
Elongation, ISO 527-2, % 15
Tensile Strength, ISO 527-2 N/mm² 10
(psi) (1,500)
Electrical Properties:
Dielectric Breakdown Strength, IEC 60243-1, kV/mm 16
TYPICAL PERFORMANCE OF CURED MATERIAL
Adhesive Properties
Cured for 5 days @ 22 °C
Lap Shear Strength, ISO 4587:
Steel (grit blasted) N/mm² 11
(psi) (1,600)
Aluminum (acid etched & abraded),
0.1 to 0.2 mm gap
N/mm² 17
(psi) (2,500)
Aluminum (anodised) N/mm² 8
(psi) (1,200)
Stainless steel N/mm² 4.3
(psi) (620)
Polycarbonate N/mm² 3.2
(psi) (460)
Documentation Provided By HMC Electronics
33 Springdale Ave. Canton, MA 02021
http://www.hmcelectronics.com
(800) 482-4440
TDS Hysol®E-00NS™, December-2006
Nylon N/mm² 1.0
(psi) (150)
Wood (Fir) N/mm² 10
(psi) (1,400)
Block Shear Strength, ISO 13445:
PVC N/mm² 13
(psi) (1,900)
ABS N/mm² 3.2
(psi) (460)
Epoxy N/mm² 9
(psi) (1,300)
Acrylic N/mm² 1.7
(psi) (250)
Glass N/mm² 27
(psi) (3,900)
TYPICAL ENVIRONMENTAL RESISTANCE
Cured for 12 hours @ 65 °C followed by 4 hours @ 22 °C
Lap Shear Strength, ISO 4587:
Aluminum (acid etched & abraded), 0.1 to 0.2 mm gap
Hot Strength
Tested at temperature
% Strength @ 22 °C
Temperature, °C
100
75
50
25
0
0 50 100 150
Cured for 5 days @ 22 °C
Lap Shear Strength, ISO 4587:
Steel
Heat Aging
Aged at temperature indicated and tested @ 22 °C
% Initial Strength @ 22 °C
Exposure Time, hours
250
200
150
100
50
0
0 200 400 600 800 1000
177 °C
150 °C
66 °C
120 °C
93 °C
Chemical/Solvent Resistance
Aged under conditions indicated and tested @ 22 °C.
% of initial strength
Environment °C 500 h 1000 h
Air 87 85 95
Motor oil (10W30) 87 91 84
Unleaded gasoline 87 92 91
Water/glycol 50/50 87 60 43
Salt fog 22 23 21
95% RH 38 35 25
Condensing Humidity 49 17 11
Water 22 58 33
Acetone 22 63 61
Isopropanol 22 106 96
GENERAL INFORMATION
This product is not recommended for use in pure oxygen
and/or oxygen rich systems and should not be selected as
a sealant for chlorine or other strong oxidizing materials.
For safe handling information on this product, consult the
Material Safety Data Sheet (MSDS).
Directions for use
1. For high strength structural bonds, remove surface
contaminants such as paint, oxide films, oils, dust, mold
release agents and all other surface contaminants.
2. Use gloves to minimize skin contact. DO NOT use
solvents for cleaning hands.
3. Dual Cartridges: To use simply insert the cartridge into
the application gun and start the plunger into the cylinders
using light pressure on the trigger. Next, remove the
cartridge cap and expel a small amount of adhesive to be
sure both sides are flowing evenly and freely. If automatic
mixing of resin and hardener is desired, attach the mixing
nozzle to the end of the cartridge and begin dispensing
the adhesive. For hand mixing, expel the desired amount
of the adhesive and mix thoroughly. Mix for approximately
15 seconds after uniform color is obtained.
Bulk Containers: Mix thoroughly by weight or volume in
the proportions specified in Product Description section.
Mix vigorously, approximately 15 seconds after uniform
color is obtained.
4. For maximum bond strength apply adhesive evenly to
both surfaces to be joined.
5. Application to the substrates should be made within 3
minutes. Larger quantities and/or higher temperatures
will reduce this working time.
6. Join the adhesive coated surfaces and allow to cure at
25 °C for 24 hours for high strength. Heat up to 93 °C, will
speed curing.
7. Keep parts from moving during cure. Contact pressure is
neccesary. Maximum shear strength is obtained with a 0.1
to 0.2 mm bond line.
8. Excessive uncured adhesive can be cleaned up with
ketone type solvents.
Henkel Loctite Americas
+860.571.5100
Henkel Loctite Europe
+49.89.9268.0
Henkel Loctite Asia Pacific
+81.45.758.1810
For the most direct access to local sales and technical support visit: www.loctite.com
Documentation Provided By HMC Electronics
33 Springdale Ave. Canton, MA 02021
http://www.hmcelectronics.com
(800) 482-4440
TDS Hysol®E-00NS™, December-2006
Loctite Material Specification
LMS
LMS dated July-19, 2001 (Resin) and LMS dated July-19, 2001
(Hardener). Test reports for each batch are available for the
indicated properties. LMS test reports include selected QC test
parameters considered appropriate to specifications for
customer use. Additionally, comprehensive controls are in
place to assure product quality and consistency. Special
customer specification requirements may be coordinated
through Henkel Loctite Quality.
Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: 8 °C to 21 °C. Storage below 8 °C or
greater than 28 °C can adversely affect product properties.
Material removed from containers may be contaminated during
use. Do not return product to the original container. Henkel
Corporation cannot assume responsibility for product which
has been contaminated or stored under conditions other than
those previously indicated. If additional information is required,
please contact your local Technical Service Center or
Customer Service Representative.
Conversions
(°C x 1.8) + 32 = °F
kV/mm x 25.4 = V/mil
mm / 25.4 = inches
µm / 25.4 = mil
N x 0.225 = lb
N/mm x 5.71 = lb/in
N/mm² x 145 = psi
MPa x 145 = psi
N·m x 8.851 = lb·in
N·m x 0.738 = lb·ft
N·mm x 0.142 = oz·in
mPa·s = cP
Note
The data contained herein are furnished for information only
and are believed to be reliable. We cannot assume
responsibility for the results obtained by others over whose
methods we have no control. It is the user's responsibility to
determine suitability for the user's purpose of any production
methods mentioned herein and to adopt such precautions as
may be advisable for the protection of property and of persons
against any hazards that may be involved in the handling and
use thereof. In light of the foregoing, Henkel Corporation
specifically disclaims all warranties expressed or implied,
including warranties of merchantability or fitness for a
particular purpose, arising from sale or use of Henkel
Corporation’s products. Henkel Corporation specifically
disclaims any liability for consequential or incidental
damages of any kind, including lost profits. The discussion
herein of various processes or compositions is not to be
interpreted as representation that they are free from
domination of patents owned by others or as a license under
any Henkel Corporation patents that may cover such
processes or compositions. We recommend that each
prospective user test his proposed application before repetitive
use, using this data as a guide. This product may be covered
by one or more United States or foreign patents or patent
applications.
Trademark usage
Except as otherwise noted, all trademarks in this document
are trademarks of Henkel Corporation in the U.S. and
elsewhere. ® denotes a trademark registered in the U.S.
Patent and Trademark Office.
Reference 0.0
Henkel Loctite Americas
+860.571.5100
Henkel Loctite Europe
+49.89.9268.0
Henkel Loctite Asia Pacific
+81.45.758.1810
For the most direct access to local sales and technical support visit: www.loctite.com
Documentation Provided By HMC Electronics
33 Springdale Ave. Canton, MA 02021
http://www.hmcelectronics.com
(800) 482-4440
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