HMC Electronics 29294 User Manual
Technical Data Sheet
Hysol®E-00NS™
December-2006
PRODUCT DESCRIPTION
Hysol®E-00NS™ provides the following product
characteristics:
Technology Epoxy
Chemical Type (Resin) Epoxy
Chemical Type
(Hardener)
Mercaptan
Appearance (Resin) Translucent white to yellow paste
LMS
Appearance (Hardener) Clear colorless to slightly yellow
liquid
LMS
Appearance (Mixed) translucent to yellow solid
LMS
Components Two component - requires mixing
Viscosity Low
Mix Ratio, by volume -
Resin : Hardener
1 : 1
Mix Ratio, by weight Resin : Hardener
100 : 92
Cure Room temperature cure after mixing
Application Bonding
Hysol®E-00NS™ is a fast setting, non-sagging,
thixotropic, industrial grade epoxy adhesive. Once mixed, the
two component epoxy cures at room temperature to form a
translucent, rigid, machineable bondline. When fully cured, the
epoxy is resistant to a wide range of chemicals and solvents,
and acts as an excellent electrical insulator. Typical
applications include bonding plastic, metal, glass, wood,
ceramic, rubber, and masonry materials. Its non-sagging
formula is especially suited for use on vertical surfaces to avoid
run-off, as well as staking fillet bonds and general industrial
repairs. Designed for use in component assembly, appliances,
electronics, & fiber optics.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Resin:
Specific Gravity @ 25 °C 1.1 to 1.3
LMS
Flash Point - See MSDS
Viscosity @ 25°C, mPa·s (cP) 200,000 to 700,000
LMS
Hardener:
Specific Gravity @ 25 °C 1.0 to 1.2
LMS
Flash Point - See MSDS
Viscosity @ 25°C, mPa·s (cP) 20,000 to 70,000
LMS
Mixed:
Specific Gravity @ 25 °C 1.15
Working life, minutes 3
Tack Free Time minutes 3.5
2 Grams, 60° Angle ≤2.54
LMS
TYPICAL CURING PERFORMANCE
Cure Speed vs. Time
The graph below shows shear strength developed with time on
abraded, acid etched aluminum lapshears @ 25 °C with an
average bondline gap of 0.1 to 0.2 mm and tested according to
ISO 4587.
% of Full Strength on Alumin.
Cure Time
100
75
50
25
0
1min 5min 10min 30min 1h 3h 6h 24h 72h
Gel Time
Gel time, 25 °C, minutes 2 to 6
LMS
TYPICAL PROPERTIES OF CURED MATERIAL
Cured @ 25 °C
Physical Properties:
Glass Transition Temperature (Tg), °C 20
Shore Hardness, ISO 868, Durometer D 80
Elongation, ISO 527-2, % 15
Tensile Strength, ISO 527-2 N/mm² 10
(psi) (1,500)
Electrical Properties:
Dielectric Breakdown Strength, IEC 60243-1, kV/mm 16
TYPICAL PERFORMANCE OF CURED MATERIAL
Adhesive Properties
Cured for 5 days @ 22 °C
Lap Shear Strength, ISO 4587:
Steel (grit blasted) N/mm² 11
(psi) (1,600)
Aluminum (acid etched & abraded),
0.1 to 0.2 mm gap
N/mm² 17
(psi) (2,500)
Aluminum (anodised) N/mm² 8
(psi) (1,200)
Stainless steel N/mm² 4.3
(psi) (620)
Polycarbonate N/mm² 3.2
(psi) (460)
Documentation Provided By HMC Electronics
33 Springdale Ave. Canton, MA 02021
http://www.hmcelectronics.com
(800) 482-4440
TDS Hysol®E-00NS™, December-2006
Nylon N/mm² 1.0
(psi) (150)
Wood (Fir) N/mm² 10
(psi) (1,400)
Block Shear Strength, ISO 13445:
PVC N/mm² 13
(psi) (1,900)
ABS N/mm² 3.2
(psi) (460)
Epoxy N/mm² 9
(psi) (1,300)
Acrylic N/mm² 1.7
(psi) (250)
Glass N/mm² 27
(psi) (3,900)
TYPICAL ENVIRONMENTAL RESISTANCE
Cured for 12 hours @ 65 °C followed by 4 hours @ 22 °C
Lap Shear Strength, ISO 4587:
Aluminum (acid etched & abraded), 0.1 to 0.2 mm gap
Hot Strength
Tested at temperature
% Strength @ 22 °C
Temperature, °C
100
75
50
25
0
0 50 100 150
Cured for 5 days @ 22 °C
Lap Shear Strength, ISO 4587:
Steel
Heat Aging
Aged at temperature indicated and tested @ 22 °C
% Initial Strength @ 22 °C
Exposure Time, hours
250
200
150
100
50
0
0 200 400 600 800 1000
177 °C
150 °C
66 °C
120 °C
93 °C
Chemical/Solvent Resistance
Aged under conditions indicated and tested @ 22 °C.
% of initial strength
Environment °C 500 h 1000 h
Air 87 85 95
Motor oil (10W30) 87 91 84
Unleaded gasoline 87 92 91
Water/glycol 50/50 87 60 43
Salt fog 22 23 21
95% RH 38 35 25
Condensing Humidity 49 17 11
Water 22 58 33
Acetone 22 63 61
Isopropanol 22 106 96
GENERAL INFORMATION
This product is not recommended for use in pure oxygen
and/or oxygen rich systems and should not be selected as
a sealant for chlorine or other strong oxidizing materials.
For safe handling information on this product, consult the
Material Safety Data Sheet (MSDS).
Directions for use
1. For high strength structural bonds, remove surface
contaminants such as paint, oxide films, oils, dust, mold
release agents and all other surface contaminants.
2. Use gloves to minimize skin contact. DO NOT use
solvents for cleaning hands.
3. Dual Cartridges: To use simply insert the cartridge into
the application gun and start the plunger into the cylinders
using light pressure on the trigger. Next, remove the
cartridge cap and expel a small amount of adhesive to be
sure both sides are flowing evenly and freely. If automatic
mixing of resin and hardener is desired, attach the mixing
nozzle to the end of the cartridge and begin dispensing
the adhesive. For hand mixing, expel the desired amount
of the adhesive and mix thoroughly. Mix for approximately
15 seconds after uniform color is obtained.
Bulk Containers: Mix thoroughly by weight or volume in
the proportions specified in Product Description section.
Mix vigorously, approximately 15 seconds after uniform
color is obtained.
4. For maximum bond strength apply adhesive evenly to
both surfaces to be joined.
5. Application to the substrates should be made within 3
minutes. Larger quantities and/or higher temperatures
will reduce this working time.
6. Join the adhesive coated surfaces and allow to cure at
25 °C for 24 hours for high strength. Heat up to 93 °C, will
speed curing.
7. Keep parts from moving during cure. Contact pressure is
neccesary. Maximum shear strength is obtained with a 0.1
to 0.2 mm bond line.
8. Excessive uncured adhesive can be cleaned up with
ketone type solvents.
Henkel Loctite Americas
+860.571.5100
Henkel Loctite Europe
+49.89.9268.0
Henkel Loctite Asia Pacific
+81.45.758.1810
For the most direct access to local sales and technical support visit: www.loctite.com
Documentation Provided By HMC Electronics
33 Springdale Ave. Canton, MA 02021
http://www.hmcelectronics.com
(800) 482-4440
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