HITACHI PF0030 Datasheet

PF0030 Series

MOS FET Power Amplifier

Features

• High stability: Load VSWR = 20 : 1

• Low power control current: 400 µA

• Thin package: 5 mmt

Ordering Information

Type No Operating Frequency Application

PF0030 824 to 849 MHz AMPS
PF0032 872 to 905 MHz E-TACS

ADE-208-460 (Z)

1st Edition

July 1996

Pin Arrangement

• RF-B2

5

1: Pin
2: V

4

3

2

5

1

APC

3: V

DD

4: Pout
5: GND

PF0030 Series

Internal Diagram and External Circuit

G

GND

Pin1

Pin

Z1

C1 C3 C2

Pin

Pin2

V

APC

FB1 FB2

V

APC

Pin3

V

DD

Pin4
Pout

V

DD

Pout

C1 = C2 = 0.01 µF (Ceramic chip capacitor)
C3 = 10 µF (Aluminum Electrolyte Capacitor)
FB = Ferrite bead BL01RN1-A62-001 (Manufacture: MURATA) or equivalent
Z1 = Z2 = 50 Ω (Microstrip line)

Absolute Maximum Ratings (Ta = 25°C)

Item Symbol Rating Unit

Supply voltage V
Supply current I
APC voltage V

DD

DD

APC

Input power Pin 20 mW
Operating case temperature Tc (op) –30 to +110 °C
Storage temperature Tstg –40 to +110 °C

17 V
3A
±8V

G

GND

Z2

2

PF0030 Series

Electrical Characteristics (Ta = 25°C)

Item Symbol Min Typ Max Unit Test Condition

Drain cutoff current I
Total efficiency η

DS

T

— — 500 µAVDD = 17 V, V

35 40 — % Pin = 2 mW,
2nd harmonic distortion 2nd H.D. — –50 –30 dB VDD = 12.5 V,
3rd harmonic distortion 3rd H.D. — –50 –30 dB Pout = 6 W (at APC controlled)
Input VSWR VSWR (in) — 1.5 3 — Zin = Zout = 50 Ω
Output VSWR VSWR (out) — 1.5 — —
Stability — No parasitic oscillation — Pin = 2 mW, VDD = 12.5 V,

Pout = 6 W (at APC controlled),
Zin = 50 Ω,
Output VSWR = 20:1 All phases,
t = 20 sec

Test System Diagram

APC

= 0 V

S.G

L.P.F

3dB
ATT

Power

Meter

Directional
Coupler

V

APCVDD

Test

Fixture

Spectrum

Analyzer

Power Meter

Directional
Coupler

3

PF0030 Series

Test Fixture Pattern

Unit: mm

2.88

15

26.5

3.5

4

4

4.5

2.88
3

V

APC

16

100

2.88
6

V

DD

4

1.5

28

4

80

3.5

2.88

4

16.5

Grass Epoxy Double sided PCB
(t = 1.6 mm, εr = 4.8)

Mechanical Characteristics

Item Conditions Spec

Torque for screw up the heatsink flange M3 Screw Bolts 4 to 6 kg•cm
Warp size of the heatsink flange: S

S

S = 0
+0.3/–0 mm

4

PF0030 Series

Note for Use

• Unevenness and distortion at the surface of the heatsink attached module should be less than 0.05 mm.

• It should not be existed any dust between module and heatsink.

• MODULE should be separated from PCB less than 1.5 mm.

• Soldering temperature and soldering time should be less than 230°C, 10 sec.

(Soldering position spaced from the root point of the lead frame: 2 mm)

• Recommendation of thermal joint compounds is TYPE G746.

(Manufacturer: Shin-Etsu Chemical, Co., Ltd.)

• To protect devices from electro-static damage, soldering iron, measuring-equipment and human body etc.

should be grounded.

• Torque for screw up the heatsink flange should be 4 to 6 kg · cm with M3 screw bolts.

• Don’t solder the flange directly.

• It should make the lead frame as straight as possible.

• The module should be screwed up before lead soldering.

• It should not be given mechanical and thermal stress to lead and flange of the module.

• When the external parts (Isolator, Duplexer, etc.) of the module are changed, the electrical characteristics

should be evaluated enough.

• Don’t washing the module except lead pins.

• To get good stability, ground impedance between the module GND flange and PCB GND pattern should

be designed as low as possible.

5

PF0030 Series

Characteristics Curve

PF0030

20

16

Pout, ηT vs. VDD (1)

η

T

50

40

12

8

Pout

Output Power Pout (W)

4

f = 824 MHz
Pin = 2 mW
V

APC

0

0 4 8 12 16 20

Supply Voltage VDD (V)

Pout, ηT vs. VDD (2)

20

16

η

T

12

= 4 V

30

20

10

0

50

40

30

(%)

T

Efficiency η

(%)

T

8

Pout

20

Efficiency η

Output Power Pout (W)

4

f = 849 MHz

10
Pin = 2 mW
V

= 4 V

APC

0

0

0 4 8 12 16 20

Supply Voltage VDD (V)

6