The HD155101BF was developed for GSM and EGSM cellular systems, and integrates most of the
functions of a transceiver. The HD155101BF incorporates the bias circuit for a RF LNA, a 1st mixer, 1stIF amplifier, 2nd mixer, AGC amplifier and an IQ quadrature demodulator for the receiver, and an IQ
quadrature modulator and offset PLL for the transmitter. Also, on chip are the dividers for the 1st & 2nd
local oscillator signals and 90˚ phase splitter. Moreover the HD155101BF includes control circuits to
implement power saving modes. These functions can operate down to 2.7 V and are housed in a 48-pin
LQFP SMD package.
HD155101BF
ADE-207-256A (Z)
2nd Edition
September 1998
Hence the HD155101BF can form a small size transceiver handset for GSM and EGSM by adding a PLL
frequency synthesizer IC, a power amplifier and some external components. See page 7 “Configuration”.
The HD155101BF is fabricated using a 0.6 µm double-polysilicon Bi-CMOS process.
The HD155101BF is housed in a 48-pin LQFP SMD package to which is suitable for applications where
space is limited. “Pin Functions” shows the arrangement and roles assigned for each pin of the
HD155101BF.
MIX1IN
MIX1INB
GNDMIX1
VCCMIX1
RFLOIN
MIX1OUTB
MIX1OUT
VCCIF
GNDIF
IFIN
IFINB
MIX2O
373839404142434445464748
POONRX1
1
36
MIX2OB
POONRX2
RFOUT
VCCLNA
GNDLNA
RFIN
POONTX
VCCPLL
GNDPLL
VCOIN
VCCCOMP
PLLOUT
2
3
4
5
6
7
8
9
10
11
12
QINB
ICURAD
QIN
IINB
181716151413
IIN
MODB
(Top View)
MOD
VCCIQ
IFLO
GNDIQ
35
34
33
32
31
30
29
28
27
26
25
242322212019
IFVCOI
IFVCOO
GNDAGC
VCCAGC
AGCOUT
AGCOUTB
VCCDIV
GNDDIV
VCONT
IOUT
IOUTB
QOUT
QOUTB
3
Page 4
HD155101BF
Pin Functions
Pin
No.Symbol
1POONRX1Input PO wer ON for RX1 If ‘H’, LNA and MIX1 are active.
2POONRX2Input PO wer ON for RX2 LNA and MIX1 don’t care.
3RFOUTOutput RF signal OUT putOpen collector type output of LNA.
4VCCLNAVcc VCC of LNA blockPower supply of LNA
5GNDLNAGnd GND of LNA blockGround of LNA
6RFINInput RF signal IN putInput of LNA.
7POONTXInput PO wer ON for TX If ‘H’, the blocks for transmitter are active.
8VCCPLLVcc VCC of O PLL blockPower supply for offset PLL except phase
9GNDPLLGnd GND of O PLL blockGround of offset PLL
10VCOINInput VCO signal IN putInput of Tx. VCO signal
11VCCCOMPVcc VCC of phase
12PLLOUTOutputO PLL OUT putCurrent output to control and modulate Tx. VCO
13ICURADInput I CUR rent AD justThis pin should be connected an external R to
14QINBInput Q signal IN put B arQ negative signal input of IQ quadrature modulator
15QINInput Q signal IN putQ positive signal input of IQ quadrature modulator
16IINBInput I signal IN put B arI negative signal input of IQ quadrature modulator
17IINInput I signal IN putI positive signal input of IQ quadrature modulator
18MODBOutput MOD ulator output B arNegative output of IQ quadrature modulator
19MODOutput MOD ulator outputPositive output of IQ quadrature modulator
20VCCIQVcc VCC of IQ blockPower supply of IQ block
21IFLOInput/
22GNDIQGnd GND of IQ blockGround of IQ block
23IFVCOOOutput IFVCO O utputEmitter of IFVCO transistor
24IFVCOIInput IFVCO I nputBase of IFVCO transistor
Input/
OutputMeaning of symbolFunction
Other receiver blocks don’t care.
If ‘H’, Other receiver blocks are active.
The collector of LNA transistor.
The base of LNA transistor
The reciver blocks don’t care.
comparator
Power supply for just phase comparator of offset
Output
COMP arator
IF LO cal signal
input/output
PLL
This pin should be connected external loop filter.
determine charge pump current of phase
comparator
IF local signal input to be fed to divider
4
Page 5
Pin Function (cont)
HD155101BF
Pin
No.Symbol
25QOUTBOutput Q signal OUT put B arQ negative signal output of IQ quadrature
26QOUTOutput Q signal OUT putQ positive signal output of IQ quadrature
27IOUTBOutput I signal OUT put B arI negative signal output of IQ quadrature
28IOUTOutput I signal OUT putI positive signal output of IQ quadrature
29VCONTInput V oltage of AGC
30GNDDIVGnd GND of DIV ider blockGround of divider to make IF local signals
31VCCDIVVcc VCC of DIV ider blockPower supply of divider to make IF local signals
32AGCOUTBOutput AGC OUT put B arAGC negative signal output to be fed to IQ
33AGCOUTOutput AGC OUT putAGC positive signal output to be fed to IQ
34VCCAGCVcc VCC of AGC blockPower supply of AGC
35GNDAGCGnd GND of AGC blockGround of AGC
36MIX2OBOutput MIX2 O utput B ar2nd mixer (MIX2) negative signal output to be fed
37MIX2OOutput MIX2 O utput2nd mixer (MIX2) positive signal output to be fed to
38IFINBInput1st IF signal IN put B arIFAMP negative signal input for 1st IF signal
39IFINInput1st IF signal IN putIFAMP positive signal input for 1st IF signal
40GNDIFGnd GND of IF MIX2 blockGround of IFAMP and 2nd mixer (MIX2)
41VCCIFVcc VCC of IF MIX2 blockPower supply of IFAMP and 2nd mixer (MIX2)
42MIX1OUTOutput MIX1 O utput1st mixer (MIX1) positive signal output
43MIX1OUTBOutput MIX1 O utput B ar1st mixer (MIX1) negative signal output
44RFLOINInput RF LO cal signal IN putRF 1st local signal input to be fed to 1st mixer
45VCCMIX1Vcc VCC of MIX1 blockPower supply of 1st mixer (MIX1)
46GNDMIX1Gnd GND of MIX1 blockGround of 1st mixer (MIX1)
47MIX1INBInput MIX1 I nput B ar1st mixer (MIX1) negative signal input
48MIX1INInput MIX1 I nput1st mixer (MIX1) positive signal input
Input/
OutputMeaning of symbolFunction
demodulator
demodulator
demodulator
demodulator
The DC voltage input to control the power gain of
CONT rol
AGC
quadrature demodulator
quadrature demodulator
to AGC
AGC
(MIX1) and the down converter of offset PLL
5
Page 6
HD155101BF
Block Diagram
225 MHz
MIX2OB
45 MHz
MIX2O
IFINB
IFIN
GNDIF
VCCIF
MIX1OUT
MIX1OUTB
1172 MHz
RFLOIN
VCCMIX1
GNDMIX1
36
Vref
Vref
GNDAGC
VCCAGC
35
)
Mix2
(
(IF)
*2
Vref
(Mix1)
45 MHz
AGOUT
34
33
270 MHz
1172 MHz
VCCDIV
AGCOUTB
32
31
Linearizer
45 MHz
)
AGC
Vref
(
Bias generator
*2
1172 MHz
GNDDIV
30
)
Vref
Div, Rx
(
÷2÷2
÷3
÷2
÷2
(90 deg)
)
Vref
Div, Tx
(
÷2(90 deg)
100 kHz
to
VCONT
IOUT 0 to 100 kHz
29
IOUTB 0
28
÷2, ÷12
(90 deg)
)
Vref
Demod
(
270 MHz
)
Mod
Vref
(
270 MHz
27
100 kHz
100 kHz
to
to
QOUT 0
QOUTB 0
26
IFVCO
Bias
Circuit
540 MHz
25
23
IFVCOI
IFVCOO
GNDIQ
IFLO
VCCIQ
MOD
MODB
Vtune
IFLO
To Synth.
0 to 100 kHz IIN
0 to 100 kHz IINB
0 to 100 kHz QIN
Notes: 1. H = Active, L = Off
0 to 100 kHz QINB
All biases are H active
When Bias generator is off, all circuits will be off.
2. When POONRX1 = ‘H’ and POONRX2 = ‘L’, bias generator will be off.
Vref
LNA
Bias
1
2
*1
POONRX2
POONRX1
(LNA)
Circuit
RFOUT
3
4
VCCLNA
GNDLNA
Vref
(PLL)
5
6
7
902 MHz
8
RFIN
GNDPLL
VCCPLL
POONTX
9
Phase
10
VCOIN
detector
11
12
PLLOUT
VCCCOMP
ICURAD
1314151617181920212224
947 MHz
947 MHz
MIX1INB
484746454443424140393837
MIX1IN
*1
*1
902 MHz
947 MHz
Tx.VCO
6
Page 7
Configuration
HD155101BF
B.B.
I
Q
Block
I
Q
I & Q
AGC
LC
45 MHz
IF
SAW
225 MHz
RF
SAW
Demo.
filter
filter
filter
90 deg
45 MHz
270 MHz
÷2
Shift
HD155101BF
÷2
IFVCO
RF VCO
Dual
1150 to
1185 MHz
÷6
PLL2PLL1
synth.
Shift
90 deg
540 MHz
÷2
270 MHz
270 MHz
270 MHz
Mod
I & Q
Phase
Detector
filter
Loop
880 to
buffer
915 MHz
bias
RF
circuit
filter
LNA
925 to 960 MHz
TCXO
13 MHz
HD155017T
HPA Module
LPF
7
Page 8
HD155101BF
A GSM Application Example
225 MHz
947 MHz
45 MHz
MIX2O
IFINB
IFIN
GNDIF
VCCIF
1172 MHz
RFLOIN
VCCMIX1
GNDMIX1
MIX1INB
MIX1IN
947 MHz
MIX2OB
36
38
3937
40
41
42
MIX1OUT
MIX1OUTB
44
4847464543
1
POONRX1
DAC
10 bit
GNDAGC
VCCAGC
35
Vref
(Mix2)
(IF)
Vref
Vref
(Mix1)
Vref
(LNA)
LNA
Bias
Circuit
2
RFOUT
POONRX2
DAC
10 bit
45 MHz
AGOUT
34
270 MHz
1172 MHz
3
VCCLNA
Base Band
System
Controller
Base Band
ADC
12 bit
AGCOUTB
33
32
45 MHz
Vref
(AGC)
*2
Bias generator
4
5
GNDLNA
&
Physical
Layer
Interface
Processing
VCCDIV
31
Linearizer
1172 MHz
Vref
6
RFIN
947 MHz
Processor
DAC
10 bit
GNDDIV
30
Vref
÷2÷2
÷3
÷2
(90 deg)
Vref
(Div, Tx)
÷2(90 deg)
(PLL)
7
POONTX
ADC
12 bit
VCONT
29
÷2, ÷12
(Div, Rx)
÷2
(90 deg)
270 MHz
8
VCCPLL
DAC
IOUT
28
Vref
(Demod)
270 MHz
Vref
902 MHz
9
GNDPLL
PA
10 bit
IOUTB
27
(Mod)
10
VCOIN
ALC
13 MHz
QOUT
QOUTB
26
540 MHz
Phase
detector
11
PLLOUT
VCCCOMP
902 MHz
Tx.VCO
Dual PLL synth.
VHF(IF)
PLL Synth.
UHF(RF)
PLL Synth.
25
12
IFVCOI
IFVCOO
GNDIQ
IFLO
VCCIQ
MOD
MODB
IIN
IINB
QIN
QINB
ICURAD
131415161718192021222324
8
Page 9
HD155101BF
Functional Operation
The HD155101BF has been designed from system stand point and incorporated a large number of the
circuit blocks necessary in the design of a digital cellular handset.
Receiver Operation
The HD155101BF incorporates a LNA bias circuit for an external RF transistor, whose NF and power gain
can be better selected.
This circuit amplifies the RF signal after selection by the antenna filter before the signal enters the first
mixer section. The RF signal is combined with a high side local oscillator (LO) signal to generate a wanted
first IF signal in the 130 to 300 MHz range. The 1st mixer circuit uses a double-balanced Gilbert cell
architecture, which has open collector differential outputs. If, at 225 MHz, a 800 Ω LC load is connected
to the mixer’s outputs then a SSB NF of 9.0 dB with a gain of 7.0 dB is realizable. The corresponding
input compression point is –11 dBm, which allows the device to be used within a GSM and EGSM system.
A filter is used after the 1st mixer to provide image rejection and the conditioned signal is then passed
through an intermediate amplifier, before being down converted to a second IF in the range of 26 to 60
MHz.
The second mixer can generate a 45 MHz 2nd IF, if a 270 MHz 2nd LO signal is used. The 2nd LO is
obtained by dividing the IFLO signal by 2. The 2nd mixer also uses the Gilbert cell architecture, but with
internal resistive differential outputs of 300 Ω. IF amplifier and second mixer has a SSB NF of 5.6 dB, a
power gain of 12 dB and an input compression point of –25 dBm. In order to improve the blocking
characteristics of the device an external LC resonator across the differential outputs of the second mixer is
recommended.
The signal is then passed to the AGC circuit, which has a dynamic range of more than 80 dB (–42 dB to
+55 dB Typ) and is controlled by a DC voltage, which is generated by the microprocessor. This DC
control range is from 0.15 V to 2.3 V. The AGC, which is designed for the GSM system, provides a
linearity of ±1.0 dB in any 20 dB window. The outputs of the AGC are 2 kΩ differential and are connected
the external supply via inductors.
The signal is then down converted by a demodulator to I and Q. Internal divider circuits convert the IFLO
signal to the same frequency as the 2nd IF before passing this local signal through a phase splitter / shifter
in order to generate the in phase and quadrature IQ components. The phase accuracy of the IQ
demodulator is < ±1° and the amplitude mismatch is < ±0.5 dB. In order to accommodate different
baseband interfaces the HD155101BF IQ differential outputs have a voltage swing of 2.4 Vp-p and a DC
offset of < ±60 mV. Within each output stage a 2nd order Butterworth filter (fc = 210 kHz), is used to
improve the blocking performance of the device.
In order to allow flexibility in circuit implementation the HD155101BF can configured to use either a
single-ended or balanced external circuitry and components.
9
Page 10
HD155101BF
LNA
Vref
LNA
bias
circuit
Pinput
Poutput
RFOUT
3
VCCLNA
4Vcc
GNDLNA
5
RFIN
6
Figure 1 LNA Bias Circuit
Transmitter Operation
The transmitter chain converts differential IQ baseband signals to a suitable format for transmission by a
power amplifier.
The common mode DC voltage range of the modulator inputs is 0.8 to 1.2 V and they have 2.4 Vp-p Max
differential swing. The modulator circuit uses double-balanced mixers for the I and Q paths. The LO
signals are generated by dividing the IFLO signal by 2 and then passing them through a phase splitter /
shifter. The IF signals generated are then summed and produce a single modulated IF signal which is
amplified and fed into the offset PLL block. Carrier suppression due to the mixer circuit is better than 31
dBc. However, if the common mode DC voltage of the I and Q inputs is adjusted, carrier suppression can
be improved better than 40 dBc easily. In addition, upper side-band suppression is better than 35 dBc.
Within the offset PLL block there is a down converter, a phase comparator and a VCO driver. The down
converter mixes the 1st LO signal and the TX VCO to create a reference LO signal for use in the offset
PLL circuit. The phase comparator and the VCO driver generate an error current, which is proportional to
the phase difference between the reference IF and the modulated IF signals. This current is used in a 2nd
order loop filter to generate a voltage, which in turn modulates the TX VCO. In order to optimize the PLL
loop gain, the error current value can be modified by changing the value of an external resistor - ICURAD.
In order to accommodate a range of TX VCO, the offset PLL circuit has been designed to operate with a
supply voltage of up to 5.25 V.
Operating Modes
The HD155101BF has the necessary control circuitry to implement the necessary states within the GSM
system. Also provided is a power save mode which reduces the current consumption of the device by
powering down unnecessary function blocks. Three pins are assigned for mode control, POONRX1,
POONRX2 and POONTX. Table 1 shows the relationship between the pins and the required operating
mode. Control of these pins are by the system controller.
As per GSM requirements the TX and RX sections are not on at the same time. For the receiver there is a
calibration mode for which the LNA bias circuit and 1st mixer are switched off. During this period the
gain of the AGC can be adjusted. Also the DC offsets of the IQ demodulator are measured and
subsequently canceled.
In order to change between the RX and TX modes a state called “warm-up” is used to ensure that the LO
signals are not unduly affected. This method of switching between TX and RX ensures that lock is
achieved first time.
10
Page 11
HD155101BF
Power saving is implemented through use of the idle mode. All function blocks of the HD155101BF are
switched off until such time as the system controller commends the device to power up again.
POONTX (pin 7)LLLHDon’t care
HD155101BFLNA biasONOFFOFFOFFOFF
circuit status1st mixerONOFFOFFOFFOFF
IF AMPONONOFFOFFOFF
2nd mixerONONOFFOFFOFF
AGCONONOFFOFFOFF
IO demodulatorONONOFFOFFOFF
Divider (Rx.)ONONOFFOFFOFF
Divider (Tx.)OFFOFFOFFONOFF
IO modulatorOFFOFFOFFONOFF
Offset PLLOFFOFFOFFONOFF
RF 1st local bufferONONONONOFF
IF local bufferONONONONOFF
IFVCOONONONONOFF
Total current42.5 mA Typ32 mA Typ10.5 mA Typ38 mA Typ1 µA Typ
The slots of
GSM system
Operating modes
of the HD155101BF
POONRX1(pin 1)
POONRX2(pin 2)
POONTX (pin 7)
Power Amplifier ON
UHF PLL synth. ON
UHF PLL synth. load
VCO control voltage
of UHF PLL synth.
4.615ms
7012345670123456701
RxRxTxTx
CalCalCalCal
RxRxRxRx
TxTx
Lo-ONLo-ON
MonMon
LoON
LoON
4.615ms
Lo-
ON
LoON
Idle(PS) mode don’t care
Figure 2 Control Diagram for Operating Mode Selection
PS
11
Page 12
HD155101BF
IFVCO Operation
The HD155101BF incorporates an IFVCO circuit. The IFVCO circuit consists of an IFVCO transistor and
a bias circuit for it, whose current are 2.0 mA and 0.5 mA respectively. If an internal IFVCO is used, treat
pin 23 (IFVCOO), pin 24 (IFVCOI) and pin 21 (IFLO) as shown figure 3-(a).
Using an external IFVCO, pin 23 (IFVCOO) and pin 24 (IFVCOI) cannot be connected any pattern and
component, and any component to feed direct current must be also removed from pin 21 (IFLO).
If pin 23 (IFVCOO), pin 24 (IFVCOI) and pin 21 (IFLO) are treated as shown figure 3-(b), current
consumption will decrease 2.0 mA.
IFVCO
bias circuit
23
2124
IFLO
IFVCOO
Vcc
(a) using an internal IFVCO(b) using an external IFVCO
HD155101BF
IFVCOI
Vtune
IFLO
PLL
synth.
23
2124
IFLO
IFVCOO
External
IFVCO
Figure 3 Control Diagram for Operating Mode Selection
IFVCO
bias circuit
HD155101BF
IFVCOI
Vtune
IFLO
PLL
synth.
12
Page 13
HD155101BF
Absolute Maximum Ratings
Any stresses in excess of the absolute maximum ratings can cause permanent damage to the HD155101BF.
ItemSymbolRatingUnit
Power supply voltage (VCC)VCC–0.3 to +4.0V
Power supply voltage (VCCCOMP)VCCCOMPVCC to +5.5V
Pin voltageV
Maximum power dissipationP
Operating temperatureTopr–20 to +85°C
Storage temperatureTstg–55 to +125°C
T
T
–0.3 to VCC + 0.3 (6.0 Max)V
400mW
13
Page 14
HD155101BF
Oco
C
C
Electrical Characteristics (Ta = 25°C)
Specifications
ItemSymbolMinTypMaxUnitTest Conditions
Power supply voltage (1)V
Power supply voltage (2)V
Power supply current (Rx.)I
Power supply current (Tx.)I
Power supply current
CC
CCCOMP
CC(Rx.)
CC(Tx.)
I
CC(Lo-ON)
(Lo-ON)
Power saving mode supply
I
CC(PS)
current
Power up time (Rx.)t up
Power up time (Tx.)t up
Power on control voltage
range (Rx1, Rx2, Tx)
Vthon
Vthon
Vthon
Power off control voltage
range (RX1, Rx2, Tx)
Vthoff
Vthoff
Vthoff
I/Q common-mode output
voltage
I/Q differential output swingV
I/Q output offset voltageV
I/Q common-mode input
voltage
I/Q differential input swingV
V
I
V
QOcom
IOsw
V
QOsw
IOoffset
V
QOoffset
V
IIcom
V
QIcom
IIsw
V
QIsw
Note: ( ) : These data are actual spread, not guaranteed.
Frequency (RF)925940960MHz
Frequency (LO)105511651260MHz
Frequency (IF)(130)225(300)MHz
Conversion gain4.57.09.0dBRF = 940MHz/Pin = –50dBm,
LO = 1165MHz/Pin = –10dBm, IF = 225MHz
Noise figure(6.0)9.0(12.0)dBRF = 940MHz,
LO = 1165MHz/Pin = –10dBm, IF = 225MHz
i/p IP3—–1.0—dBmRF1 = 940.8MHz, RF2 = 941.6MHz,
LO = 1165MHz/Pin = –10dBm
o/p IP3—6.0—dBmRF1 = 940.8MHz, RF2 = 941.6MHz,
LO = 1165MHz/Pin = –10dBm
i/p CP–13.5–11.0(–8.0)dBmRF = 940MHz,
LO = 1165MHz/Pin = –10dBm, IF = 225MHz
o/p CP(–9.5)–5.0(–0.5)dBmRF = 940MHz,
LO = 1165MHz/Pin = –10dBm, IF = 225MHz
RF i/p VSWR—1.5(2.0)RF = 940MHz, 50Ω
LO i/p VSWR—1.5(2.0)RF = 1165MHz, 50Ω
IF o/p VSWR—1.5(2.0)RF = 225MHz, 800Ω (400Ω + 400Ω Balanced)
Note: ( ) : These data are actual spread, not guaranteed.
15
Page 16
HD155101BF
• Specifications of IFAmp + Mixer 2
ItemMinTypMaxUnitTest Conditions
Input frequency (IF1)(130)225(300)MHz
Frequency (LO2)(156)270(360)MHzLO2 = IFLO/2
Output frequency (IF2)(26)45(60)MHz
Conversion gain9.012.014.5dBIF1 = 225MHz/Pin = –40dBm,
IFLO = 540MHz/Pin = –10dBm, IF2 = 45MHz
Noise figure(4.5)5.6(7.0)dBIF1 = 225MHz,
IFLO = 540MHz/Pin = –10dBm, IF2 = 45MHz
i/p IP3—–16.0—dBmIF11 = 225.8MHz, IF2 = 226.6MHz,
IFLO = 540MHz/Pin = –10dBm
o/p IP3—–4.0—dBmIF11 = 225.8MHz, IF2 = 226.6MHz,
IFLO = 540MHz/Pin = –10dBm
i/p CP–27.5–25.0(–23.0)dBmIF1 = 225MHz,
IFLO = 540MHz/Pin = –10dBm, IF2 = 45MHz
o/p CP(–18.0)–14.0(–11.0)dBmIF1 = 225MHz,
IFLO = 540MHz/Pin = –10dBm, IF2 = 45MHz
Isolation(55)60—dBBetween mixer 1 outputs and IFAmp inputs
Note: ( ) : These data are actual spread, not guaranteed.
• Specifications of AGC
ItemMinTypMaxUnitTest Conditions
Input frequency(26)45(60)MHz
Control voltage range0.15—2.3V
Gain range8998107dBGain 1 – Gain 3
Gain linearity(–1.0)—(1.0)dBin any 20dB window
Gain 1455565dBVcont = 2.3V
Gain 2132333dBVcont = 1.5V
Gain 3–55–40–35dBVcont = 0.15V
i/p CP 1(–64)–59—dBmGain = 50dB
i/p CP 2(–34)–29—dBmGain = 10dB
i/p CP 3(–22)–17—dBmGain = –30dB
Note: ( ) : These data are actual spread, not guaranteed.
16
Page 17
HD155101BF
• Specifications of IQ Demodulator
ItemMinTypMaxUnitTest Conditions
Power gain–0.51.43.5dBIF2 = 45MHz, Pin = –25dBm, Rout = 10kΩ,
IFLO = 540MHz, Pin = –10dBm
IQ phase accuracy–1.001.0deg.Baseband = 67.7kHz
IQ amplitude mismatch(–0.5)0.1(0.5)dBBaseband = 67.7kHz
Output DC offset voltage–60060mV|IOUT – IOUTB| and |QOUT – QOUTB|
IQ differential output
swing
I/Q common mode
output voltage
Note: ( ) : These data are actual spread, not guaranteed.
2.43.0—Vp-pBaseband = 67.7kHz
|IOUT – IOUTB| and |QOUT – QOUTB|
1.11.31.5VVCC = 3.0V
17
Page 18
HD155101BF
• Specifications of IQ Modulator and Offset PLL
(RFLO and IFLO signals are supplied by Signal Generator)
ItemMinTypMaxUnitTest Conditions (Loop bandwidth = 1.4MHz)
Frequency (RF)880902915MHz
Frequency (LO)105511721260MHz
Frequency (IF)(120)135(180)MHz
Power up time—0.3(0.5)µsecfrom PS mode
Lock up time—20(80)µsecfrom PS mode to 915MHz
Carrier suppression ratio3140—dBcAll ‘1’ GMSK (Baseband = 67.7kHz)
Upper side-band
Tx noise in RX band—–157(–151)dBc/Hz925MHz to 935MHz (10MHz up from Tx band)
(Tx power = 0dBc = 30dBm)—–165(–163)dBc/Hz935MHz to 960MHz (20MHz up from Tx band)
Isolation of the 1st local
input to TXVCO input
IQ differential input swing—2.0(2.4)Vp-p|IIN – IINB| and |QIN – QINB|
I/Q common mode input
voltage
Note: ( ) : These data are actual spread, not guaranteed.
3545—dBcI/Q differential input swing = 2.0Vp-p
I/Q common mode input voltage = 1.0V
—–74.0(–63.0)dBc600kHz to 1.8MHz offset / 30kHz Bandwidth
—–77.0(–66.0)dBc1.8MHz to 3MHz offset / 100kHz Bandwidth
—–80.5(–68.0)dBc3MHz to 6MHz offset / 100kHz Bandwidth
—–82.0(–74.0)dBc6MHz upwards offset / 100kHz Bandwidth
Figure 36 Demodulator Output Waveforms (67.7 kHz) at Vcc = 3.0 V, Ta = 25°C
37
Page 38
HD155101BF
Transmitter Measurement Results
Input(LO),−10dBm
1150 to 1185MHz
Spectrum
analyzer
50 Ω
GMSK RF
TX. signal
890 to 915MHz
MURATA MQE502-902
or MQE601-902
Kv=11MHz/V,C3=100pF
loop band width=1.5MHz
50 Ω
1000p
Conditions:
Vcc = 3.0 V
POONRX1 (pin 1) = 0 V
POONRX2 (pin 2) = 0 V
POONTX (pin 7) = 3.0 V
VCO
3300p
5.0V
R3
220
C2
18
ICURAD
R
R2
130
8.2k
51 p3 p
RFLOIN
3.9n
VCOIN
0.75 p
VCCCOMP
1000p
PLLOUT
ICURAD
C1
220p
14
10
11
12
13
3.0 V
1000 p
12482031 3441 45
LO buffer
VCO buffer
on
off
SW1
Power save control
POONTX=H, SW1=Off
5
7 9 22 30 35 40 4616 172115141918
Low pass
I1I3
I2
Charge Pump
(Current mode driver)
Vcc
filter
Phase detector
1st. local signal
1150 to 1185 MHz
Down-converter
(offset mixer)
270 MHz
GMSK modulated IF
270 MHz
Low
pass
filter
MODB
18n
fo=270MHz
I&Q baseband
signal generator
I&Q modulator block
÷2
(90° phase shifter)
QIN
MOD
QINB
8p
18n
Q baseband signal
100 kHz
I baseband signal
100 kHz
IIN
IINB
0.01µ
50Ω
IFLO
Input(IFLO)
540MHz,
−10dBm
Figure 37 Evaluation Circuit for the Upconverter (I&Q Modulator and Offset PLL Block)
5
4
3
2
I1 peak, I2 peak, I3 [mA]
1
0
24681020
R
Figure 38 I1 Peak, I2 Peak, I3 vs. R
ICURAD
[kΩ]
Characteristics
ICURAD
I1 peak
I2 peak
I3
30
38
Page 39
HD155101BF
Phase accuracy and lock up time characteristics depend on the OPLL loop bandwidth. The following table
shows measurement result of each characteristic, when the OPLL loop bandwidth is changed.
Table 2Measurement Results of Transmitter Characteristics vs. OPLL Loop Bandwidth
Figure 47 GMSK Modulated Transmitter Output Spectrum Using an Iternal IFVCO
47
Page 48
HD155101BF
Frequency [MHz]
570
Vcc=3.0V
560
550
540
530
520
00.511.522.53
Vtune [V]
Figure 48 IFVCO Oscillation Frequency vs. Vtune Voltage
48
0.2V/div
278µs
100µs/div
Figure 49 IFVCO Lock Up Time (from PS mode to 540 MHz)
Page 49
Package Dimesions
9.0 ± 0.2
0.21 ± 0.05
0.19 ± 0.04
9.0 ± 0.2
7.0
3625
37
48
24
13
0.5
112
M
0.08
0.750.75
1.70 Max
1.40
0.17 ± 0.05
0.15 ± 0.04
HD155101BF
Unit: mm
1.00
0°− 8°
0.10
Dimension including the plating thickness
Base material dimension
0.10 ± 0.07
0.50 ± 0.10
Hitachi Code
JEDEC
EIAJ
Weight
(reference value)
FP-48
Conforms
0.2 g
49
Page 50
HD155101BF
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & IC Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URLNorthAmerica : http:semiconductor.hitachi.com/
For further information write to:
Hitachi Semiconductor
(America) Inc.
2000 Sierra Point Parkway
Brisbane, CA 94005-1897
Tel: <1> (800) 285-1601
Fax: <1> (303) 297-0447
Europe: http://www.hitachi-eu.com/hel/ecg
Asia (Singapore): http://www.has.hitachi.com.sg/grp3/sicd/index.htm
Asia (Taiwan): http://www.hitachi.com.tw/E/Product/SICD_Frame.htm
Asia (HongKong): http://www.hitachi.com.hk/eng/bo/grp3/index.htm
Japan: http://www.hitachi.co.jp/Sicd/indx.htm
Hitachi Europe GmbH
Electronic components Group
Dornacher Straße 3
D-85622 Feldkirchen, Munich
Germany
Tel: <49> (89) 9 9180-0
Fax: <49> (89) 9 29 30 00
Hitachi Europe Ltd.
Electronic Components Group.
Whitebrook Park
Lower Cookham Road
Maidenhead
Berkshire SL6 8YA, United Kingdom
Tel: <44> (1628) 585000
Fax: <44> (1628) 778322
Hitachi Asia (Hong Kong) Ltd.
Group III (Electronic Components)
7/F., North Tower, World Finance Centre,
Harbour City, Canton Road, Tsim Sha Tsui,
Kowloon, Hong Kong
Tel: <852> (2) 735 9218
Fax: <852> (2) 730 0281
Telex: 40815 HITEC HX
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.