SPECIFICATIONS AND PARTS ARE SUBJECT TO CHANGE FOR IMPROVEMENT
DVD PLAYER
2000March
Digital Media Products Division, Tokai
1-1
1. Precautions
1-1 Safety Precautions
1) Before returning an instrument to the customer,
always make a safety check of the entire
instrument, including, but not limited to, the
following items:
(1) Be sure that no built-in protective devices are
defective or have been defeated during servicing.
(1)Protective shields are provided to protect both
the technician and the customer. Correctly replace
all missing protective shields, including any
remove for servicing convenience.
(2)When reinstalling the chassis and/or other assembly in the cabinet, be sure to put back in place
all protective devices, including, but not limited to,
nonmetallic control knobs, insulating fish papers,
adjustment and compartment covers/shields, and
isolation resistor/capacitor networks. Do not
operate this instrument or permit it to be operated
without all protective devices correctly installed
and functioning.
(2) Be sure that there are no cabinet openings through
which adults or children might be able to insert
their fingers and contact a hazardous voltage. Such
openings include, but are not limited to,
excessively wide cabinet ventilation slots, and an
improperly fitted and/or incorrectly secured
cabinet back cover.
(3) Leakage Current Hot Check-With the instrument
completely reassembled, plug the AC line cord
directly into a 120V AC outlet. (Do not use a
isolation transformer during this test.) Use a
leakage current tester or a metering system that
complies with American National Standards
institute (ANSI) C101.1 Leakage Current for
Appliances and Underwriters Laboratories (UL)
1270 (40.7). With the instrument’s AC switch first
in the ON position and then in the OFF position,
measure from a known earth ground (metal water
pipe, conduit, etc.) to all exposed metal parts of the
instrument (antennas, handle brackets, metal
cabinets, screwheads, metallic overlays, control
shafts, etc.), especially any exposed metal parts
that offer an electrical return path to the chassis.
Any current measured must not exceed 0.5mA.
Reverse the instrument power cord plug in the
outlet and repeat the test. See Fig. 1-1.
Any measurements not within the limits specified
herein indicate a potential shock hazard that must
be eliminated before returning the instrument to
the customer.
Fig. 1-1 AC Leakage Test
(4) Insulation Resistance Test Cold Check-(1) Unplug
the power supply cord and connect a jumper wire
between the two prongs of the plug. (2) Turn on
the power switch of the instrument. (3) Measure
the resistance with an ohmmeter between the
jumpered AC plug and all exposed metallic
cabinet parts on the instrument, such as
screwheads, antenna, control shafts, handle
brackets, etc. When an exposed metallic part has a
return path to the chassis, the reading should be
between 1 and 5.2 megohm. When there is no
return path to the chassis, the reading must be
infinite. If the reading is not within the limits
specified, there is the possibility of a shock hazard,
and the instrument must be re-pared and
rechecked before it is returned to the customer. See
Fig. 1-2.
Fig. 1-2 Insulation Resistance Test
(READING SHOULD
NOT BE ABOVE
0.5mA)
EARTH
GROUND
DEVICE
UNDER
TEST
TEST ALL
EXPOSED METER
SURFACES
2-WIRE CORD
ALSO TEST WITH
PLUG REVERSED
(USING AC ADAPTER
PLUG AS REQUIRED)
LEAKAGE
CURRENT
TESTER
Antenna
Terminal
Exposed
Melal Part
ohm
ohmmeter
Precautions
1-2
2) Read and comply with all caution and safety related notes non or inside the cabinet, or on the
chassis.
3) Design Alteration Warning-Do not alter of add to
the mechanical or electrical design of this
instrument. Design alterations and additions,
including but not limited to, circuit modifications
and the addition of items such as auxiliary audio
output connections, might alter the safety
characteristics of this instrument and create a
hazard to the user. Any design alterations or
additions will make you, the service, responsible
for personal injury or property damage resulting
therefrom.
4) Observe original lead dress. Take extra care to
assure correct lead dress in the following areas:
(1) near sharp edges, (2) near thermally hot parts
(be sure that leads and components do not touch
thermally hot parts), (3) the AC supply, (4) high
voltage, and (5) antenna wiring. Always inspect in
all areas for pinched, out-of-place, or frayed wiring,
Do not change spacing between a component and
the printed-circuit board. Check the AC power cord
for damage.
5) Components, parts, and/or wiring that appear to
have overheated or that are otherwise damaged
should be replaced with components, parts and/ or
wiring that meet original specifications.
Additionally, determine the cause of overheating
and/or damage and, if necessary, take corrective
action to remove any potential safety hazard.
6) Product Safety Notice-Some electrical and
mechanical parts have special safety-related
characteristics which are often not evident from
visual inspection, nor can the protection they give
necessarily be obtained by replacing them with
components rated for higher voltage, wattage, etc.
Parts that have special safety characteristics are
identified by shading, an ( )or a ( )on
schematics and parts lists. Use of a substitute
replacement that does not have the same safety
characteristics as the recommended replacement
part might created shock, fire and/or other
hazards. Product safety is under review
continuously and new instructions are issued
whenever appropriate.
Precautions
1-3
1-2 Servicing Precautions
CAUTION : Before servicing Instruments covered
by this service manual and its supplements, read and
follow the Safety Precautions section of this manual.
Note : If unforseen circument create conflict between
the following servicing precautions and any of the
safety precautions, always follow the safety
precautions. Remember: Safety First.
1-2-1 General Servicing Precautions
(1) a. Always unplug the instrument’s AC power cord
from the AC power source before (1) re-moving
or reinstalling any component, circuit board,
module or any other instrument assembly, (2)
disconnecting any instrument electrical plug or
other electrical connection, (3) connecting a test
substitute in parallel with an electrolytic
capacitor in the instrument.
b. Do not defeat any plug/socket B+ voltage
interlocks with which instruments covered by
this service manual might be equipped.
c. Do not apply AC power to this instrument and
/or any of its electrical assemblies unless all
solid-state device heat sinks are correctly installed.
d. Always connect a test instrument’s ground lead
to the instrument chassis ground before
connecting the test instrument positive lead.
Always remove the test instrument ground lead
last.
Note : Refer to the Safety Precautions section ground
lead last.
(2) The service precautions are indicated or printed on
the cabinet, chassis or components. When
servicing, follow the printed or indicated service
precautions and service materials.
(3) The components used in the unit have a specified
flame resistance and dielectric strength.
When replacing components, use components
which have the same ratings. Components ientified by shading, by( ) or by ( ) in the circuit
diagram are important for safety or for the
characteristics of the unit. Always replace them
with the exact replacement components.
(4) An insulation tube or tape is sometimes used and
some components are raised above the printed
wiring board for safety. The internal wiring is
sometimes clamped to prevent contact with
heating components. Install such elements as they
were.
(5) After servicing, always check that the removed
screws, components, and wiring have been installed correctly and that the portion around the
serviced part has not been damaged and so on.
Further, check the insulation between the blades of
the attachment plug and accessible conductive
parts.
1-2-2 Insulation Checking Procedure
Disconnect the attachment plug from the AC outlet
and turn the power ON. Connect the insulation resistance meter (500V) to the blades of the attachment
plug. The insulation resistance between each blade of
the attachment plug and accessible conductive
parts(see note) should be more than 1 Megohm.
Note : Accessible conductive parts include metal
panels, input terminals, earphone jacks, etc.
Precautions
1-4
1-3 ESD Precautions
Electrostatically Sensitive Devices (ESD)
Some semiconductor (solid state) devices can be
damaged easily by static electricity.
Such components commonly are called Electrostatically Sensitive Devices(ESD). Examples of typical ESD
devices are integrated circuits and some field-effect
transistors and semiconductor chip components. The
following techniques should be used to help reduce
the incidence of component damage caused by static
electricity.
(1) Immediately before handling any semiconductor
component or semiconductor-equipped assembly,
drain off any electrostatic charge on your body by
touching a known earth ground. Alternatively,
obtain and wear a commercially available
discharging wrist strap device, which should be
removed for potential shock reasons prior to
applying power to the unit under test.
(2) After removing an electrical assembly equipped
with ESD devices, place the assembly on a
conductive surface such as aluminum foil, to
prevent electrostatic charge buildup or exposure of
the assembly.
(3) Use only a grounded-tip soldering iron to solder
or unsolder ESD devices.
(4) Use only an anti-static solder removal devices.
Some solder removal devices not classified as
“anti-static” can generate electrical charges
sufficient to damage ESD devices.
(5) Do not use freon-propelled chemicals. These can
generate electrical charges sufficient to damage
ESD devices.
(6) Do not remove a replacement ESD device from its
protective package until immediately before your
are ready to install it.(Most replacement ESD
devices are packaged with leads electrically
shorted together by conductive foam, aluminum
foil or comparable conductive materials).
(7) Immediately before removing the protective ma-
terials from the leads of a replacement ESD device,
touch the protective material to the chassis or
circuit assembly into which the device will be
installed.
CAUTION : Be sure no power is applied to the chassis or circuit, and observe all other safety
precautions.
(8) Minimize bodily motions when handling
unpackaged replacement ESD devices. (Otherwise
harmless motion such as the brushing together of
your clothes fabric or the lifting of your foot from a
carpeted floor can generate static electricity
sufficient to damage an ESD device).
Precautions
1-5
1-4 Handling the optical pick-up
The laser diode in the optical pick up may suffer
electrostatic breakdown because of potential static
electricity from clothing and your body.
The following method is recommended.
(1) Place a conductive sheet on the work bench (The
black sheet used for wrapping repair parts.)
(2) Place the set on the conductive sheet so that the
chassis is grounded to the sheet.
(3) Place your hands on the conductive sheet(This
gives them the same ground as the sheet.)
(4) Remove the optical pick up block
(5) Perform work on top of the conductive sheet. Be
careful not to let your clothes or any other static
sources to touch the unit.
•Be sure to put on a wrist strap grounded to the
sheet.
•Be sure to lay a conductive sheet made of copper etc.
Which is grounded to the table.
Fig.1-3
(6) Short the short terminal on the PCB, which is in-
side the Pick-Up ASS’Y, before replacing the PickUp. (The short terminal is shorted when the PickUp Ass’y is being lifted or moved.)
(7) After replacing the Pick-up, open the short
terminal on the PCB.
THE UNIT
WRIST-STRAP
FOR GROUNDING
1M
1M
CONDUCTIVE SHEET
Precautions
1-6
1-5 Pick-up disassembly and reassembly
1-5-1 Disassembly
1) Remove the power cable.
2) Switch SW3 on deck PCB to“OFF” before
removing the FPC.
( Inserted into Main PCB DCN1. See Fig. 1-4)
3) Disassemble the deck.
4) Disassemble the deck PCB.
1-5-2 Assembly
1) Replace the Pick-up.
2) Assemble the deck PCB.
3) Reassemble the deck.
4) Insert FPC into Main PCB DCN1 and switch SW3
on deck PCB to “ON”. (See Fig 1-4)
Note : If the assembly and disassembly are not done in correct sequence, the Pick-up may be damaged.
4PDIPower-down and Reset. When low the AK4393 is in Power-down Mode and held in reset.
The AK4393 should always be reset after power-up.
5BICKIAudio Serial Data Clock Input. A clock input of 64fs or more is recommended.
6
SD ATAI
Serial Data Input.
7LRCKILeft/Right Clock Input. Defines the sampling rate, F
s
.
8SMUTE
(or CS
)
ISoft Mute Input or Chip Select Input. If the P/S
pin (pin 25) is high, SMUTE controls the
soft mute function as follows:
- When SMUTE goes high, the soft mute cycle is initiated.
- When SMUTE goes low, the output mute is slowly released.
If the P/S
pin is low, SMUTE is the Chip Select Input for the Serial Control Mode. Chip
select is active when SMUTE is low.
9DFSIDouble Sampling Speed Input. When low, this pin defines the Normal Speed Mode, and
128 x F
s
oversampling is implemented. When high, the DFS pin defines the Double Speed
Mode, implemented with 64 x F
s
oversampling. This pin features an internal pull-down.
10DEM0
(or CCLK)
IDe-emphasis Enable #0 or Control Data Clock Input. If the P/S
pin (pin 25) is high,
DEM0 is used to select the De-emphasis Mode according to Table 3. If the P/S pin os low
DEM0 is the clock input for the Serial Control Mode.
11DEM1
(or CDTI)
IDe-emphasis Enable #1 or Control Data Input. If the P/S
pin (pin 25) is high, DEM1 is
used to select the De-emphasis Mode according to Table 3. If the P/S pin is low, DEM1 is
the control data input for the Serial Control Mode.
12DIF0IDigital Input Format Select #0.
13DIF1IDigital Input Format Select #1.
14DIF2IDigital Input Format Select #2.
15BVSS-Substrate Ground Pin. Substrate ground is 0V.
16VREFLILow Level Voltage Reference Input. Normally connected to analog ground.
17VREFHIHigh Level Voltage Reference Input. Normally connected to analog supply.
18AVDD-Analog Supply. Analog supply is 5V nominal.
19AVSS-Analog Ground. Analog ground is 0V.
20AOUTR-ORight Channel Negative Output.
21AOUTR+ORight Channel Positive Output.
22AOUTL-OLeft Channel Negative Output.
23AOUTL+OLeft Channel Positive Output.
24VCOMOCommon Voltage Output. Common voltage output is 2.6V nominal.
25P/S
IParallel/Serial Control Mode Select Input. If Low, the Serial Control Mode is
implemented. If High, the Parallel Control Mode is selected. This pin has an internal
pull-up.
38P91ACT MUTEDriver IC MUTE(Actuator)0DRIVER(MUTE4, 37)
34P73SDAEEPROM DATA I/O0KS24C020(5)
35P74OPENTray Out Motor Control Output0DRIVER(0PIN-, 16)
39P92M/D MUTEDriver IC MUTE(Spindle)0DRIVER(MUTE3, 38)
36P75CLOSETray In Motor Control Output0DRIVER(0PIN-, 17)
37INT5FGINT
0ZiVA-4(52)
AV Decoder Reset(Active H:4.0, L:4.1)
40P93ZRSTDSP H/W reset0KS1453(124)
41INT7/DVDINTInterrupt from AV-DECIINV(ZiVA-4(51))
42INT8/DSPINTInterrupt from DSPIINV(KS1453(126))
43P96ZIVA_RST
44Vcc5D
45D0HAD0Data 0I/0
46D1HAD1Data 1I/0
47D2HAD2Data 2I/0
48D3HAD3Data 3I/0
49D4HAD4Data 4I/0
50D5HAD5Data 5I/0
Reference Information
2-8
2-1-5 MIC2 (M27C801 ; 8Mbit (1Mbx8) UVEPROM and OTP EPROM)
LOGIC DIAGRAM
Vcc
A19
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
Q0
Q1
Q2
Vss
10
11
12
13
14
15
16
20
8
A0-A19A0-Q7
E
GVpp
Vss
TOP VIEW
Vcc
1
2
3
4
5
6
7
8
9
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
A18
A17
A14
A13
A8
A9
A11
GV
A10
E
Q7
Q6
Q4
Q4
Q3
PP
NAME
A0-A19
Q0-Q7
E
OVpp
Vcc
Vss
Data Outputs
FUNCTION
Address Inputs
Chip Enable
Output Enable/Program Supply
Supply Voltage
Ground
Reference Information
2-9
2-1-6 MIC3 (KM681000C ; CMOS 1M SRAM)
BLOCK DIAGRAM
CS1
CS2
WE
OE
I/O
I/O8
A4
A5
A6
A7
A8
A12
A13
A14
A15
A16
1
Control
logic
Clk gen.
Row
select
Data
cont
Data
cont
Precharge circuit.
VCC
VSS
Memory array
1024 rows
128· 8 columns
I/O Circuit
Column select
A0 A1 A2 A3 A9A11A10
N.C
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O1
I/O2
I/O3
VSS
TOP VIEW
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
NameFunctionNameFunction
VCC
32
A15
31
CS2
30
WE
29
28
A13
A8
27
A9
26
25
A11
24
OE
23
A10
22
CS
1
21
I/O8
20
I/O7
19
I/O6
18
I/O5
17
I/O4
CS1,CS2 Chip Select Inputs I/O1~I/O8 Data Inputs/Out-
OE
WE
0~A16Address InputsN.CNo Connection
A
Output Enable VccPower
Write Enable VssGround
Reference Information
2-10
2-1-7 FIC1 (LC86P6232 ; Front Micom)
IRPLA
SIO 0
SIO 1
Timer 0
Timer 1
BUS
Interrupt Control
Stand-by Control
CF
Clock
RC
Generator
X’tal
Bus InterfaceBase Timer
Port 1
Port 7
Port 8
Port 2
BUS
ROM
PC
ACC
B Reg
C Reg
ALU
ADC
INT0-3
Noise Filter
Real Time
Service
XRAM
(128 bytes)
VFD Controller
High Voltage
Output
Port 3
Port 4
Port 5
PWM 1
PSW
RAR
RAM
Stack Pointer
PORT 0
Watch Dog Timer
Reference Information
2-11
51S18-SEG7FLT SEGMENT CONTROLFLT
52S19-SEG8FLT SEGMENT CONTROLFLT
NOPORT NAMETYPEASSIGNED NAMEDESCRIPTIONREMARK
53S20-SEG9FLT SEGMENT CONTROLFLT
54S210SEG10FLT SEGMENT CONTROLFLT
55S220SEG11FLT SEGMENT CONTROLFLT
56S230SEG12FLT SEGMENT CONTROLFLT
57S240SEG13FLT SEGMENT CONTROLFLT
58S250SEG14FLT SEGMENT CONTROLFLT
59S260SEG15FLT SEGMENT CONTROLFLT
60S270SEG16FLT SEGMENT CONTROLFLT
61S280SEG17FLT SEGMENT CONTROLFLT
62S290SEG18FLT SEGMENT CONTROLFLT
63S300SEG19FLT SEGMENT CONTROLFLT
64S310SEG20FLT SEGMENT CONTROLFLT
65P00IMODE4HARDWARE MODE SELECTMARKET CODE
66P01IMODE3HARDWARE MODE SELECTMARKET CODE
67P02IMODE2HARDWARE MODE SELECTMARKET CODE
68P03IMODE1HARDWARE MODE SELECTMARKET CODE
69P04IMODE0HARDWARE MODE SELECTMARKET CODE
70P05-TP10NC
71P06-TP11NC
72P07--NC
73P10/S0 00TXDSERIAL DATA OUTSERIAL DATA OUT
74P11/S1 0IRXDSERIAL DATA INSERIAL DATA IN
75P12/SC K00SCLKSERIAL CLOCKSERIAL CLOCK
76P13/S0 1-TP12NC
77P14/SI 1-TP13NC
78P15/SC K1-TP14NC
79P16/BU Z-TP15NC
80 P17/PW MO-TP16NC
81P30IS1SHUTTLE DATAJOG/SHUTTLE
82P31IS2SHUTTLE DATAJOG/SHUTTLE
83P32IS3SHUTTLE DATAJOG/SHUTTLE
84P33IS4SHUTTLE DATAJOG/SHUTTLE
85P34IJ1JOG DATAJOG/SHUTTLE
86P35IJ2JOG DATAJOG/SHUTTLE
87P36IATVIDEO OUT SEL.VIDEO SELECT(OPEN)
88P37IADVIDEO OUT SEL.VIDEO SELECT
89VSS-+5V
90VDD-GND
91P400RGBCTLSCART CONTROLSCART JACK
92P410SCON_BSCART CONTROLSCART JACK
93P42-TP28NC
94P430WIDESCART CONTROLSCART JACK
95P440SRQrequest to main micomNC
96P450SAVEPOWER SAVE MODEPOWER
97P460AMUTE1REAR MUTEAUDIO
98P470AMUTE0FRONT MUTEAUDIO
99P500LEDSTANDBY LEDLED
100P510ON/OFFPOWER ON/OFF CONTROLPOWER
1P520MRSTFront end resetRESET
2PWM1-TP1NC
NOPORT NAMETYPEASSIGNED NAMEDESCRIPTIONREMARK
3P200CS1Chip Select 1AK4393
4P210CCLKControl Data ClockAK4393/AK4356
5P220CDTIControl DataAK4393/AK4356
6P230CS2Chip Select 2AK4356
7P240DARSTPD(Power Down)AK4393
8P250DARST 1PD(Power Down)AK4356
9P260VMUTE0BA7660 MUTE(VIC2)VIDEO(RESERVED)
10P270VMUTE1BA7660 MUTE(VIC1)VIDEO(RESERVED)
11TEST1-TP4NC
12*RESI*RESReset
13XT1-GNDLow Frequency OSC in
14XT2-TP5Low Frequency OSC out
15VSS-GND
16CF1I-High Frequency OSC in
17CF20-High Frequency OSC out
18VDD-VDD
19ANO/P8 0IECHO_VRECHO volume A/D inputKARAOKE
20AN1/P8 1IMIC_DETMIC detectKARAOKE
21AN2/P8 2-TP19NC
22AN3/P8 3IKEY0KEY SCANTACT SW
23AN4/P8 4IKEY1KEY SCANTACT SW
24AN5/P8 5IKEY2KEY SCANTACT SW
25AN6/P8 6-NC
26AN7/P8 7-NC
27P70/IN TOIRRQRequest to Front MicomMAIN MICOM
28P71/IN T1-TP25NC
29P72/IN T2-TP26NC
30P73/IN T3IREMOCONREMOCON data inREMOCON EYE
31S0/T00GRID11FLT GRID CONTROLFLT
32S1/T10GRID10FLT GRID CONTROLFLT
33S2/T20GRID9FLT GRID CONTROLFLT
34S3/T30GRID8FLT GRID CONTROLFLT
35S4/T40GRID7FLT GRID CONTROLFLT
36S5/T50GRID6FLT GRID CONTROLFLT
37S6/T60GRID5FLT GRID CONTROLFLT
38S7/T70GRID4FLT GRID CONTROLFLT
39S8/T80GRID3FLT GRID CONTROLFLT
40S9/T90GRID2FLT GRID CONTROLFLT
41S10/T100GRID1FLT GRID CONTROLFLT
42S11/T110
43S12/T120SEG1FLT SEGMENT CONTROLFLT
44S13/T130SEG2FLT SEGMENT CONTROLFLT
45S14/T140SEG3FLT SEGMENT CONTROLFLT
46S15/T150SEG4FLT SEGMENT CONTROLFLT
47VOD-+5V
48VP--28V
49S160SEG5FLT SEGMENT CONTROLFLT
50S170SEG6FLT SEGMENT CONTROLFLT
Reference Information
2-12
2-1-8 RIC1 (KS1461 ; RF Signal Processor)
ACD
BCD
CCD
DCD
ADVD
BDVD
CDVD
DDVD
RREFBF
RR EFEQ
RREF
VREFEQ
ADVD 1
BDVD 1
CDVD1
DDVD1
ACD1
BCD1
CCD1
DCD1
AVCC
VREF A
FOFST
VZOCTL
PLL F
EQF
100989492898591768487888293
to RF EQ
TUNING BLO CK
1
2
3
4
5
RF
MUX
A
B
C
D
6
7
8
CDR SEL( 00H )
9
VREF
GENERATOR
10
11
EQ VC
12
AMP
E
13
14
F
TBAL(01 H)
15
16
17
18
19
20
21
22
23
24
CDRS EL(00H )
ANALOG
VC AMP
25
AGCL EVEL
RDPF
EQG
AGCP
EQGND
AGCB
AGCI
9795969986
AGC-HOLD(00 H)
MUX
+
+
RF SUM
&AGC
+
+
GAIN_EQ(02 H)
DELAY_AB(07 H)
DELAY_C D(07H )
PLLC TL
DVCTL_SEL(02H)
D
D
D
D
GA _PLL DN (09 H )
GA _PLL DP (09 H)
GAIN_TE3(02H)
GCA
-
+
GCA
TEOFST(04H)
D1
C1
SUB
A1
RF
MUX
GAIN_FE(03 H)
FE_OFST(05H)
ALPC
B1
ga_RFSUM(08H)
GCA
MUX3
GCA
TE3B
OFSTHOLD
FE
LDONB (00 H)
+
FOFST
RFAGCO
AGCC
BCATH
EQIN
90
AGC_D ET
RF
Equali zer
S12
CD1
TE1RES
DELAY_SEL(00H)
PLL CTL
TBAL( 01H)
DPDEQ 1
+
+
+
+
OFSTHOLD
EQ
EQ
COM
COM
DPDEQ 2
CDR SEL( 00H )
OFSTHOLD
ABCD_ OFST(06H)
MUX
TESEL(00H )
-
-+
GAIN_ABCD(00H)
+
+
AB CD
+
SUM
+
-
DELA Y
TE1_LIMIT
Ab normal wav eform
Det ectio n c ircu it
DELAY_SEL(00H)
PLL CTL
ENV_SEL(02 H)
EQVCC
RFEQO
HOL D_CT L ( 0 8 H)
DPDMUTE
DPD_MUTE(02H)
SEOFHO LD
FL T _ CT L ( 0 0 H)
CAL_ENDB(02H)
PD,LPF
TEOFST( 04H)
PDLIMITRES
PD_L IMI T( 08 H)
FAUL TOUT
EQIN
MUX
ENVELOPEFOKDE FE CT
MROFST
83
CP1
CB1
RF RP
RFCT
MIRR
RFRPN
RFRP
CP2
CB2
8077787981
&
CD1
S12
DVD1
DVD2
LDONB
FLT_CTL
CDRSEL
TESEL
AGC HOLD
TBAL
GAIN_TE3
ENV_ SE L
DVCTL_SEL
DPD_MUTE
GAIN_EQ
GAIN_FE
GAIN_AB CD
TE_OFST
FE_OFST
AB CD_OF ST
DELAY_CD
DELAY_AB
PDL IM I T
ga_RFSUM
HOLD_CTL
ga_PLLDP
ga_PLLDN
11 RREF- Analog Block bias resistance connection terminalANALOG-
12 VREFEQ- CAP connection terminal for RF EQ Center voltageEQ VC AMP-
13 EI CD Optical sub beam E input terminal for ServosTE 3BP/U
14 FI CD Optical sub beam F input terminal for ServosTE 3BP/U
15 ADVD1I Optical main beam A input terminal for DVD of Servo blockSERVO AMP P/U
16 BDVD1I Optical main beam B input terminal for DVD of Servo blockSERVO AMP P/U
17 CDVD1I Optical main beam C input terminal for DVD of Servo blockSERVO AMP P/U
18 DDVD1I Optical main beam D input terminal for DVD of Servo blockSERVO AMP P/U
19 ACD1I Optical main beam A input terminal for CD of Servo blockSERVO AMP P/U
20 BCD1I Optical main beam B input terminal for CD of Servo blockSERVO AMP P/U
21 CCD1I Optical main beam C input terminal for CD of Servo blockSERVO AMP P/U
22 DCD1I Optical main beam D input terminal for CD of Servo blockSERVO AMP P/U
23 AVCCP Power voltage input terminal for Analog PartANALOG-
24 VREFAI/O CAP connection terminal for Analog Part center voltage
25 FOFST- CAP connection terminal (open) for Focus Auto OffsetsFE AMP-
26 OFSTHOLDI On/Off terminal for Auto Offset Block.
27 VREFLP_BGI I Band gap voltage input block for ALPCALPC-
28 LDODVDO
29 PDDVDI
30 LDOCDO
31 PDCDI
32 AGNDP
33 FEO
34 FENI
35 TENI
36 TEO
37 PDLIMTRES-
38 ABCDNI
39 ABCDO
40 ABCDII
41 ENVP-
42 ENVB-
43 ENVO
44 DGNDP
45 FOKTHI
46 FOKBO
47 DFCT_CP1-
48 DFCT_CP2-
49 CC1O
50 CC2I
51 DVCC P
52 DFCTTH2-
53 DFCTTH1-
54 DFCT1O
55 DFCT2O
56 DPDVCCP
57 MIRRO
58 BCAO
block
block
block
block
block
block
block
block
Uses an external block
(L: Auto Offset Adjustments, H: Serial Offset Adjustments)
Optical Laser Diodes operation voltage output terminal for DVD
Optical Laser Monitor Diode voltage input terminal for DVD
Optical Laser Diode operating voltage output terminal for CD
Optical Laser Monitor Diode voltage input terminal for CD
Power GND terminal for Analog Part
FE AMP output terminal
Input terminal for selecting FE AMP Gain
Input terminal for selecting TE AMP Gain
TE AMP output terminal
Bias resistance terminal for PDLIMIT
ABCD AMP for selecting Gain (
ABCD AMP output terminal
ABCD AC Coupling input terminal for servo monitor
CAP connection terminal for selecting the RC value of Peak Hold
for detecting RF Envelopes
CAP connection terminal for selecting the RC value of Bottom
Hold for detecting RF Envelopes
RF Envelope Detect Output terminal
Power GND input terminal for digital circuits
Focus OK comparating level input terminal
Focus OK comparator output terminal (L: Focus OK)
Connection terminal for RC value of Peak Hold, for selecting the
maximum time for Servo signal
Connection terminal for RC value of Peak Hold, for selecting the
minimum defect time for PLL
Peak Hold Output terminal for selecting the minimum Defect time
for Defect
Peak Hold AC Coupling Input terminal for Defect
Power voltage input terminal for digital circuit
Resistance connection terminal for selecting the Defect Comparating Level for PLL
Resistance connection terminal for selecting the Defect Comparating Level for Servo
Defect output terminal for Servo
Defect output terminal for PLL
Power voltage input terminal for DPD TE
Mirror output terminal
BCA output terminal
- ) input terminal
PRE AMPP/U
PRE AMPP/U
PRE AMPP/U
PRE AMPP/U
PRE AMPP/U
PRE AMPP/U
PRE AMPP/U
PRE AMPP/U
ANA VC AMP SERVO
OFSTCTLMICOM
ALPCP/U
ALPCP/U
ALPCP/U
ALPCP/U
ANALOG-
FE AMPDSSP
FE AMP-
TE AMP-
TE AMPDSSP
DPD-
ABCD AMP-
ABCD AMP-
SERVO MONIT -
RF ENV-
RF ENV-
RF ENVDSSP
DIGITAL-
FOKB-
FOKBDSSP
DFCT-
DFCT-
DFCT-
DFCT-
DIGITAL-
DEFECT-
DEFECT-
DEFECTDSSP
DEFECTPLL
DPD-
MIRRDSSP
BCADSP
Related
Part
Pin
Pin NameI/O DescriptionRelated Block
No.
59 TE3OFST-
60 DPDEQ1O
61 DPDEQ2O
62 FAULTOUTO
63 DPDMUTEI
64 PLLCTLI
65 TE1RESI
66 DPDGNDP
67 VREFDPDO
68 RREFDLY-
69DATAI
70 CLOCKI
71 STBI
72 OSC
73 RESETI
74 BCAII
75 BCAOO
76 RFCTO
77 CB2-
78 CP2-
79 RFRPO
80 RFRPNI
81 MROFSTI
82 CB1-
83 CP1-
84 MIRRII
85 EQVCCP
86 RFEQ00
87 BCATHI
88 EQINI
89 RFAGCOO
90 AGCC-
91 AGCII
92 EQGNDP
93 AGCLEVELI
94 AGCB-
95 AGCP-
96 RDPF-
97 EQGI
98 EQFI
99 PLLFI
100 VZOCTLI
Cap connection terminal (open) for 3B TE Offset
DPD EQ (A+C) output terminal
DPD EQ (B+D) output terminal
DPD abnormal wave form output terminal (monitor)
DPD TE MUTE control terminal (H: Mute)
DPD TE PLL variable input terminal
DPD TE PLL variable bias resistance
Power GND input terminal for DPD TE
CAP connection terminal for DPD TE center voltage
Bias resistance connection terminal for Delay Block
Data input terminal
Clock input terminal
Data Enable input terminal
Input terminal for RC value of OSC, for Auto Offset Block
Reset input terminal (L: Reset) for Auto Offset Block
BCA Filter1
BCA Filter2
RF Ripple Center voltage output terminal for Mirror
CAP connection terminal of RC value of Bottom Hold, for RFCT
generation
CAP connection terminal of RC value of Peak Hold, for RFCT generation
RF Ripple Amp output terminal for Mirror
Input terminal for selecting RFRP Amp gain
RF Ripple Offset control terminal for Mirror
RC connection terminal of RC value of Bottom Hold, for RFRP
generation
RC connection terminal of RC value of Peak Hold, for RFRP generation
Input terminal for MIRR signal generation
Power voltage input signal for RF EQ
RF EQ output terminal
BCA Comparating Level control terminal
RFAGCO input terminal for RF EQ
RF AGC AMP output terminal
CAP connection terminal for time constant of AGC
AGC voltage input terminal while in AGC hold
Power GND input terminal for RF EQ
AGC Level control voltage input terminal (3.5 V) while in AGC hold
off
RC connection terminal for RC value of Bottom Hold, for RF AGC
RC connection terminal for RC value of Peak Hold, for RF AGC
Bias resistance connection terminal for selecting RF EQ frequency
RF EQ Boost Gain control voltage input terminal
RF EQ Peak Frequency control voltage input terminal
Wide-band PLL compatible RF EQ Peak Frequency Control terminal