HITACHI 42PMA225EZ Service Manual

SERVICE MANUAL MANUEL D'ENTRETIEN WARTUNGSHANDBUCH
CAUTION:
Before servicing this chassis, it is important that the service technician read the “Safety Precautions” and “Product Safety Notices” in this service manual.
SM0065
42PMA225EZ
Data contained within this Service manual is subject to alteration for improvement.
ATTENTION:
Avant d’effectuer l’entretien du châassis, le technicien doit lire les «Précautions de sécurité» et les «Notices de sécurité du produit» présentés dans le présent manuel.
VORSICHT:
Vor Öffnen des Gehäuses hat der Service-Ingenieur die „Sicherheitshinweise“ und „Hinweise zur Produktsicherheit“ in diesem Wartungshandbuch zu lesen.
Les données fournies dans le présent manuel d’entretien peuvent faire l’objet de modifications en vue de perfectionner le produit.
Die in diesem Wartungshandbuch enthaltenen Spezifikationen können sich zwecks Verbesserungen ändern.
SPECIFICATIONS AND PARTS ARE SUBJECT TO CHANGE FOR IMPROVEMENT
Colour Television
September 2004
TABLE OF CONTENTS
INTRODUCTION.......................................................................................................................................1
1.
2. MULTI STANDARD SOUND PROCESSOR ............................................................................................1
3. VIDEO SWITCH TEA6415........................................................................................................................1
4. AUDIO AMPLIFIER STAGE WITH TDA8928ST ......................................................................................1
5. POWER SUPPLY (SMPS)........................................................................................................................1
6. MICROCONTROLLER..............................................................................................................................2
7. SERIAL ACCESS CMOS 4K x 8 (32K bit) EEPROM 24C32A .................................................................2
8. CLASS AB STEREO HEADPHONE DRIVER TDA1308..........................................................................2
9. IC DESCRIPTIONS AND INTERNAL BLOCK DIAGRAM........................................................................2
9.1. TEA6415C .............................................................................................................................................3
9.1.1. General Description .....................................................................................................................3
9.1.2. Features ........................................................................................................................................3
9.1.3. Pinning..........................................................................................................................................3
9.2. 24C32A..................................................................................................................................................3
9.2.1. Features ........................................................................................................................................3
9.2.2. Description....................................................................................................................................4
9.2.3. Pin Function table........................................................................................................................4
9.2.4. Functional Descriptions..............................................................................................................5
9.3. LM317....................................................................................................................................................5
9.3.1. General Description .....................................................................................................................5
9.3.2. Features ........................................................................................................................................5
9.4. ST24LC21 .............................................................................................................................................5
9.4.1. Description....................................................................................................................................5
9.4.2. Features ........................................................................................................................................5
9.4.3. Pin connections ...........................................................................................................................6
9.5. TLC7733................................................................................................................................................6
9.5.1. Description....................................................................................................................................6
9.6. 74LVC257A ...........................................................................................................................................7
9.6.1. Features ........................................................................................................................................7
9.6.2. Description....................................................................................................................................7
9.6.3. Pin Description.............................................................................................................................7
9.7. 74LVC14A .............................................................................................................................................7
9.7.1. Features ........................................................................................................................................7
9.7.2. Applications..................................................................................................................................7
9.7.3. Description....................................................................................................................................7
9.7.4. Pin Description.............................................................................................................................8
9.8. TEA6420................................................................................................................................................8
9.8.1. Features ........................................................................................................................................8
9.8.2. Description....................................................................................................................................8
9.9. LM1086..................................................................................................................................................8
9.9.1. Description....................................................................................................................................8
9.9.2. Features ........................................................................................................................................8
9.9.3. Applications..................................................................................................................................9
9.9.4. Connection Diagrams..................................................................................................................9
9.10. LM1117 ..............................................................................................................................................9
9.10.1. General Description .................................................................................................................9
9.10.2. Features.....................................................................................................................................9
9.10.3. Applications..............................................................................................................................9
9.10.4. Connection Diagrams ..............................................................................................................9
9.11. DS90C385 .......................................................................................................................................10
9.11.1. General Description ...............................................................................................................10
9.11.2. Features...................................................................................................................................10
9.11.3. Pin Description .......................................................................................................................10
9.12. MSP34X1G ......................................................................................................................................12
9.12.1. Introduction.............................................................................................................................12
9.12.2. Features...................................................................................................................................13
9.12.3. Pin connections......................................................................................................................13
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TDA1308..........................................................................................................................................15
9.13.
9.13.1. General Description ...............................................................................................................15
9.13.2. Features...................................................................................................................................15
9.13.3. Pinning.....................................................................................................................................16
9.14. PI5V330 ...........................................................................................................................................16
9.14.1. General Description ...............................................................................................................16
9.15. AD9883A..........................................................................................................................................16
9.15.1. General Description ...............................................................................................................16
9.15.2. Features...................................................................................................................................16
9.15.3. Pin Descriptions .....................................................................................................................17
9.16. SAA7118E .......................................................................................................................................19
9.16.1. General Description ...............................................................................................................19
9.16.2. Features...................................................................................................................................20
9.16.3. Pinning.....................................................................................................................................21
9.17. TPS72501 ........................................................................................................................................25
9.17.1. General Description ...............................................................................................................25
9.17.2. Features...................................................................................................................................25
9.18. TSOP1836 .......................................................................................................................................26
9.18.1. Description..............................................................................................................................26
9.18.2. Features...................................................................................................................................26
9.19. PCF8591..........................................................................................................................................26
9.19.1. General Description ...............................................................................................................26
9.19.2. Features...................................................................................................................................26
9.19.3. Pinning.....................................................................................................................................27
9.20. PW1231 ...........................................................................................................................................27
9.20.1. General Description ...............................................................................................................27
9.20.2. Features...................................................................................................................................27
9.20.3. Applications............................................................................................................................28
9.21. PW181 .............................................................................................................................................28
9.21.1. General Description ...............................................................................................................28
9.21.2. Features...................................................................................................................................28
9.21.3. Applications............................................................................................................................29
9.22. SIL151B ...........................................................................................................................................29
9.22.1. General Description ...............................................................................................................29
9.22.2. Features...................................................................................................................................29
9.23. SDRAM 4M x 16 (MT48LC4M16A2TG-75) .....................................................................................29
9.23.1. General Description ...............................................................................................................29
9.23.2. Features...................................................................................................................................30
9.23.3. Pin Descriptions .....................................................................................................................30
9.24. FLASH 8MBit ...................................................................................................................................32
9.24.1. Description..............................................................................................................................32
9.24.2. Features...................................................................................................................................32
10. SERVICE MENU SETTINGS..................................................................................................................33
10.1. display menu....................................................................................................................................33
10.2. calibration menu...............................................................................................................................35
deinterlacer menu...........................................................................................................................................36
10.3. Service menu factory reset values...................................................................................................38
11. BLOCK DIAGRAM ..................................................................................................................................39
12. CIRCUIT DIAGRAMS .............................................................................................................................47
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1. INTRODUCTION
42” Plasma TV is a progressive TV control system with built-in de-interlacer and scaler. It uses a
852*480 panel with 16:9 aspect ratio. The TV is capable of operation in PAL, SECAM, NTSC (playback) colour standards and multiple transmission standards as B/G, D/K, I/I’, and L/L´ including German and NICAM stereo. Sound system output is supplying 2x10W (10%THD) for stereo 8! speakers. The chassis is equipped with many inputs and outputs allowing it to be used as a center of a media system.
It supports following peripherals: 2 SCART’s with all of them supporting full SCART features including RGB input 1 AV inputs. (CVBS+ Stereo Audio) 1 SVHS input 1 Streeo Headphone output 1 D-Sub 15 PC input 1 DVI input 1 Stereo audio input for PC/DVI Other features include, Picture-In-Picture (PIP) , Picture-And-Picture (PAP) .
2. MULTI STANDARD SOUND PROCESSOR
The MSP34x1G family of single-chip Multistandard Sound Processors covers the sound processing of all analog TV-Standards worldwide, as well as the NICAM digital sound standards. The full TV sound processing, starting with analog sound IF signal-in, down to processed analog AF-out, is performed on a single chip. These TV sound processing ICs include versions for processing the multichannel television sound (MTS) signal conforming to the standard recommended by the Broadcast Television Systems Committee (BTSC). The DBX noise reduction, or alternatively, Micronas Noise Reduction (MNR) is performed alignment free. Other processed standards are the Japanese FM-FM multiplex standard (EIA-J) and the FM Stereo Radio standard. Current ICs have to perform adjustment procedures in order to achieve good stereo separation for BTSC and EIA-J. The MSP34x1G has optimum stereo performance without any adjustments.
3. VIDEO SWITCH TEA6415
In case of three or more external sources are used, the video switch IC TEA6415 is used. The main function of this device is to switch 8 video-input sources on the 6 outputs. Each output can be switched on only one of each input. On each input an alignment of the lowest level of the signal is made (bottom of sync. top for CVBS or black level for RGB signals). Each nominal gain between any input and output is 6.5dB.For D2MAC or Chroma signal the alignment is switched off by forcing, with an external resistor bridge, 5VDC on the input. Each input can be used as a normal input or as a MAC or Chroma input (with external Resistor Bridge). All the switching possibilities are changed through the BUS. Driving 75ohm load needs an external resistor. It is possible to have the same input connected to several outputs.
4. AUDIO AMPLIFIER STAGE WITH TDA8928ST
The TDA8928ST is a switching power stage for high efficiency class-D audio power amplifier system. With this power stage a compact 2x10 W Self Oscillating Digital Amplifier System (SODA) can be built, operating with high efficiency and very low dissipation. No heat sink is required. The system operates over a wide supply voltage range from ±7.5 V to ±30 V and consumes a very low quiescent current.
5. POWER SUPPLY (SMPS)
The DC voltages required at various parts of the chassis are provided by an SMPS transformer controlled by the IC MC44608, which is designed for driving, controlling and protecting switching transistor of SMPS. The transformer generates 145V for FBT input, +/-14V for audio amplifier, 5V and
3.3V stand by voltage and 33V, 12V and 5V supplies for other different parts of the chassis. An optocoupler is used to control the regulation of line voltage and stand-by power consumption. There is a regulation circuit in secondary side. This circuit produces a control voltage according to the changes in 145V DC voltage, via an optocoupler (TCET1102G) to pin3 of the IC. During the switch on period of the transistor, energy is stored in the transformer. During the switch off period energy is fed to the load via secondary winding. By varying switch-on time of the power
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transistor, it controls each portion of energy transferred to the second side such that the output voltage remains nearly independent of load variations.
6. MICROCONTROLLER
The microprocessor is embedded inside PW181 chip which also handles scaling, frame rate conversion and OSD generation. The on-chip 16-bit microprocessor is a Turbo x86-compatible processor core with on-chip peripherals (timers, interrupt controller, 2-wire serial master/slave interface, UART, I/O ports, and more). Special peripherals such as Infrared (IR) pulse decoders and a digital pulse width modulator (PWM) are also included. There are two independent 2-wire serial master/slave interface modules that can be multiplexed to control up to five 2-wire serial ports. The slave 2-wire interface is designed for HDCP use only (and requires the use of HDCP Image Processors). On-chip RAM of up to 64 Kbytes is available. A complete microprocessor system can be implemented simply by adding external ROM. The on-chip processor can be disabled to allow external processor control of all internal functions.
7. SERIAL ACCESS CMOS 4K x 8 (32K bit) EEPROM 24C32A
The Microchip Technology Inc. 24C32A is a 4K x 8 (32K bit) Serial Electrically Erasable PROM. It has been developed for advanced, low power applications such as personal communications or data acquisition. The 24C32A also has a page-write capability of up to 32 bytes of data. The 24C32A is capable of both random and sequential reads up to the 32K boundary. Functional address lines allow up to eight 24C32A devices on the same bus, for up to 256K bits address space. Advanced CMOS technology and broad voltage range make this device ideal for low-power/low-voltage, non-volatile code and data applications.
8. CLASS AB STEREO HEADPHONE DRIVER TDA1308
The TDA1308 is an integrated class AB stereo headphone driver contained in a DIP8 plastic package. The device is fabricated in a 1 mm CMOS process and has been primarily developed for portable digital audio applications.
9. IC DESCRIPTIONS AND INTERNAL BLOCK DIAGRAM
TEA6415C 24C32 LM317T ST24LC21 TLC7733 74LVC257A
74LVC14A
TEA6420D LM1086 LM1117 DS90C385 TL431 MSP3411G TDA7265 TDA1308 PI5V330 AD9883A SAA7118E TPS72501 TSOP1836 PCF8591 PW1231 PW181 SIL151B SDRAM 4M x 16 (MT48LC4M16A2TG-75) FLASH
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9.1.
TEA6415C
9.1.1. General Description
The main function of the IC is to switch 8 video input sources on 6 outputs. Each output can be switched on only one of each input. On each input an alignment of the lowest level of the signal is made (bottom of synch. top for CVBS or black level for RGB signals). Each nominal gain between any input and output is 6.5dB. For D2MAC or Chroma signal the alignment is switched off by forcing, with an external resistor bridge, 5 V
DC on the input. Each input can be used as a normal input or as a MAC or
Chroma input (with external resistor bridge). All the switching possibilities are changed through the BUS. Driving 75" load needs an external transistor. It is possible to have the same input connected to several outputs. The starting configuration upon power on (power supply: 0 to 10V) is undetermined. In this case, 6 words of 16 bits are necessary to determine one configuration. In other case, 1 word of 16 bits is necessary to determine one configuration.
9.1.2. Features
• 20MHz Bandwidth
• Cascadable with another TEA6415C (Internal address can be changed by pin 7 voltage)
• 8 Inputs (CVBS, RGB, MAC, CHROMA,)
• 6 Outputs
• Possibility of MAC or chroma signal for each input by switching-off the clamp with an external resistor bridge
• Bus controlled
• 6.5dB gain between any input and output
• 55dB crosstalk at 5 MHz
• Fully ESD protected
9.1.3. Pinning
1. Input : Max : 2Vpp, Input Current: 1mA, Max : 3mA
2. Data : Low level : -0.3V Max: 1.5V, High level : 3.0V Max : Vcc+0.5V
3. Input : Max : 2Vpp, Input Current: 1mA, Max : 3mA
4. Clock : Low level : -0.3V Max: 1.5V, High level : 3.0V Max : Vcc+0.5V
5. Input : Max : 2Vpp, Input Current: 1mA, Max : 3mA
6. Input : Max : 2Vpp, Input Current: 1mA, Max : 3mA
7. Prog
8. Input : Max : 2Vpp, Input Current: 1mA, Max: 3mA
9. Vcc : 12V
10. Input : Max : 2Vpp, Input Current: 1mA, Max : 3mA
11. Input : Max : 2Vpp, Input Current: 1mA, Max : 3mA
12. Ground
13. Output : 5.5Vpp, Min: 4.5Vpp
14. Output : 5.5Vpp, Min: 4.5Vpp
15. Output : 5.5Vpp, Min: 4.5Vpp
16. Output : 5.5Vpp, Min: 4.5Vpp
17. Output : 5.5Vpp, Min: 4.5Vpp
18. Output : 5.5Vpp, Min: 4.5Vpp
19. Ground
20. Input : Max: 2Vpp, Input Current : 1mA, Max : 3mA
9.2.
24C32A
9.2.1. Features
• Voltage operating range: 4.5V to 5.5V
- Maximum write current 3 mA at 5.5V
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- Standby current 1 mA typical at 5.0V
• 2-wire serial interface bus, I
2CTM
compatible
• 100 kHz and 400 kHz compatibility
• Self-timed ERASE and WRITE cycles
• Power on/off data protection circuitry
• Hardware write protect
• 1,000,000 Erase/Write cycles guaranteed
• 32-byte page or byte write modes available
• Schmitt trigger filtered inputs for noise suppression
• Output slope control to eliminate ground bounce
• 2 ms typical write cycle time, byte or page
• Up to eight devices may be connected to the same bus for up to 256K bits total memory
• Electrostatic discharge protection > 4000V
• Data retention > 200 years
• 8-pin PDIP and SOIC packages
• Temperature ranges
- Commercial (C): 0°C to 70°C
- Industrial (I): -40°C to +85°C
- Automotive (E): -40°C to +125°C
9.2.2. Description
The Microchip Technology Inc. 24C32A is a 4K x 8 (32K bit) Serial Electrically Erasable PROM. It has been developed for advanced, low power applications such as personal communications or data acquisition. The 24C32A also has a page-write capability of up to 32 bytes of data. The 24C32A is capable of both random and sequential reads up to the 32K boundary. Functional address lines allow up to eight 24C32A devices on the same bus, for up to 256K bits address space. Advanced CMOS technology and broad voltage range make this device ideal for low-power/low-voltage, non-volatile code and data applications. The 24C32A is available in the standard 8-pin plastic DIP and both 150 mil and 200 mil SOIC packaging.
9.2.3. Pin Function table
Name Function
A0, A1, A2 User Configurable Chip Selects Vss Ground SDA Serial Address/Data I/O SCL Serial Clock WP Write Protect Input Vcc +4.5V to 5.5V Power Supply
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9.2.4. Functional Descriptions
The 24C32A supports a Bi-directional 2-wire bus and data transmission protocol. A device that sends data onto the bus is defined as transmitter, and a device receiving data as receiver. The bus must be controlled by a master device which generates the Serial Clock (SCL), controls the bus access, and generates the START and STOP conditions, while the 24C32A works as slave. Both master and slave can operate as transmitter or receiver but the master device determines which mode is activated.
9.3.
LM317
9.3.1. General Description
The LM117/LM217/LM317 are monolithic integrated circuit in TO-220, ISOWATT220, TO-3 and D
2
PAK packages intended for use as positive adjustable voltage regulators. They are designed to supply more than 1.5A of load current with an output voltage adjustable over a
1.2 to 37V range. The nominal output voltage is selected by means of only a resistive divider, making the device exceptionally easy to use and eliminating the stocking of many fixed regulators.
9.3.2. Features
• Output voltage range: 1.2 to 37V
• Output current In excess of 1.5A
• 0.1% Line and Load Regulation
• Floating Operation for High Voltages
• Complete Series of Protections: Current Limiting, Thermal Shutdown And Soa Control
ST24LC21
9.4.
9.4.1. Description
The ST24LC21 is a 1K bit electrically erasable programmable memory (EEPROM), organized by 8 bits.
2
This device can operate in two modes: Transmit Only mode and I
C bidirectional mode. When powered,
the device is in Transmit Only mode with EEPROM data clocked out from the rising edge of the signal
2
applied on VCLK. The device will switch to the I applied on SCL pin. The ST24LC21 can not switch from the I
C bidirectional mode upon the falling edge of the signal
2
C bidirectional mode to the Transmit Only
mode (except when the power supply is removed). The device operates with a power supply value as
low as 2.5V. Both Plastic Dual-in-Line and Plastic Small Outline packages are available.
9.4.2. Features
• 1 million Erase/Write cycles
• 40 years data retention
• 2.5V To 5.5V single supply voltage
• 400k Hz compatibility over the full range of supply voltage
• Two wire serial interface I
2
C bus compatible
• Page Write (Up To 8 Bytes)
• Byte, random and sequential read modes
• Self timed programming cycle
• Automatic address incrementing
• Enhanced ESD/Latch up
• Performances
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9.4.3. Pin connections
DIP Pin connections CO Pin connections
NC: Not connected
Signal names
SDA Serial data Address Input/Output SCL Serial Clock (I2C mode) Vcc Supply voltage Vss Ground VCLK Clock transmit only mode
9.5.
TLC7733
9.5.1. Description
The TLC77xx family of micro power supply voltage supervisors is designed for reset control, primarily in microcomputer and microprocessor systems. During power-on, RESET is asserted when V
reaches 1 V. After minimum V
DD
(. 2 V) is established,
DD
the circuit monitors SENSE voltage and keeps the reset outputs active as long as SENSE voltage
I(SENSE)
)
(V remains below the threshold voltage. An internal timer delays return of the output to the inactive state to ensure proper system reset. The delay time, t
= 2.1 x 10 4 x CT
t
d
, is determined by an external capacitor:
d
Where
is in farads
C
T
is in seconds
t
d
The TLC77xx has a fixed SENSE threshold voltage set by an internal voltage divider. When SENSE voltage drops below the threshold voltage, the outputs become active and stay in that state until SENSE voltage returns above threshold voltage and the delay time, t
, has expired.
d
In addition to the power-on-reset and under voltage-supervisor function, the TLC77xx adds power-down control support for static RAM. When CONTROL is tied to GND, RESET will act as active high. The voltage monitor contains additional logic intended for control of static memories with battery backup during power failure. By driving the chip select (CS) of the memory circuit with the RESET output of the TLC77xx and with the CONTROL driven by the memory bank select signal (CSH1) of the microprocessor (see Figure 10), the memory circuit is automatically disabled during a power loss. (In this application the TLC77xx power has to be supplied by the battery.)
The TLC77xxQ is characterized for operation over a temperature range of –4C to 125°C, and the TLC77xxI is characterized for operation over a temperature range of –40°C to 85°C.
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9.6.
74LVC257A
9.6.1. Features
Wide supply voltage range of 1.2 to 3.6 V In accordance with JEDEC standard no. 8-1A CMOS lower power consumption Direct interface with TTL levels Output drive capability 50 _ transmission lines at 85°C 5 Volt tolerant inputs/outputs, for interfacing with 5 Volt logic
9.6.2. Description
The 74LVC257A is a high-performance, low-power, low-voltage, Si-gate CMOS device and superior to most advanced CMOS compatible TTL families. Inputs can be driven from either 3.3V or 5.0V devices. In 3-State operation, outputs can handle 5V. This feature allows the use of these devices as translators in a mixed 3.3V/5V environment. The 74LVC257A is a quad 2-input multiplexer with 3-state outputs, which select 4 bits of data from two sources and are controlled by a common data select input (S). The data inputs from source 0 (1l 0 to 4l 0 ) are selected when input S is LOW and the data inputs from source 1 (1l 1 to 4l 1 ) are selected when S in HIGH. Data appears at the outputs (1Y to 4Y) in true (non-inverting) form from the selected inputs. The 74LVC257A is the logic implementation of a 4-pole, 2-position switch, where the position of the switch is determined by the logic levels applied to S. The outputs are forced to a high impedance OFF-state when OE is HIGH.
9.6.3. Pin Description
PIN NUMBER SYMBOL DESCRIPTION
1 S Common data select input 2, 5, 11, 14 3, 6, 10, 13
1| 1|
to 4|
0
to 4|
1
Data inputs from source 0
0
Data outputs from source 1
1
4,7,9,12 1Y to 4Y 3-State multiplexer outputs 8 GND Ground (0V) 15 OE 3-State output enable input (active LOW) 16 Vcc Positive supply voltage
9.7. 74LVC14A
9.7.1. Features
• Wide supply voltage range of 1.2 to 3.6 V
• In accordance with JEDEC standard no. 8-1A
• Inputs accept voltages up to 5.5 V
• CMOS low power consumption
• Direct interface with TTL levels
9.7.2. Applications
• Wave and pulse shapers for highly noisy environments
• Astable multivibrators
• Monostable multivibrators
9.7.3. Description
The 74LVC14A is a high-performance, low power, low-voltage Si-gate CMOS device and superior to most advanced CMOS compatible TTL families. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in a mixed 3.3 V/5 V environment. The 74LVC14A provides six inverting buffers with Schmitt-trigger action. It is capable of transforming slowly changing input signals into sharply defined, jitter-free output signals.
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9.7.4. Pin Description
PIN NUMBER SYMBOL DESCRIPTION
1, 3, 5, 9, 11, 13 1A – 6A Data inputs 2, 4, 6, 8, 10, 12 1Y – 6Y Data outputs 7 GND Ground (0V) 14 Vcc Positive supply voltage
9.8.
TEA6420
9.8.1. Features
• 5 Stereo Inputs
• 4 Stereo Outputs
• Gain Control 0/2/4/6db/Mutefor Each Output
• Cascadable (2 Different Addresses)
• Serial Bus Controlled
• Very Low noise
• Very Low distortion
9.8.2. Description
The TEA6420 switches 5 stereo audio inputs on 4 stereo outputs.
2
All the switching possibilities are changed through the I
C bus.
9.9.
LM1086
9.9.1. Description
The LM1086 is a series of low dropout positive voltage regulators with a maximum dropout of 1.5V at
1.5A of load current. It has the same pin-out as National Semiconductor’s industry standard LM317. The LM1086 is available in an adjustable version, which can set the output voltage with only two external resistors. It is also available in five fixed voltages: 2.5V, 2.85V, 3.3V, 3.45V and 5.0V. The fixed versions integrate the adjust resistors. The LM1086 circuit includes a zener trimmed band-gap reference, current limiting and thermal shutdown.
9.9.2. Features
• Available in 2.5V, 2.85V, 3.3V, 3.45V, 5V and Adjustable Versions
• Current Limiting and Thermal Protection
• Output Current 1.5A
• Line Regulation 0.015% (typical)
• Load Regulation 0.1% (typical)
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9.9.3. Applications
• SCSI-2 Active Terminator
• High Efficiency Linear Regulators
• Battery Charger
• Post Regulation for Switching Supplies
• Constant Current Regulator
• Microprocessor Supply
9.9.4. Connection Diagrams
TO-220 TO-263
Top View
10094802
10094804
Top View
9.10. LM1117
9.10.1. General Description
The LM1117 is a series of low dropout voltage regulators with a dropout of 1.2V at 800mA of load current. It has the same pin-out as National Semiconductor’s industry standard LM317. The LM1117 is available in an adjustable version, which can set the output voltage from 1.25V to 13.8V with only two external resistors. In addition, it is also available in five fixed voltages, 1.8V, 2.5V, 2.85V, 3.3V, and 5V. The LM1117 offers current limiting and thermal shutdown. Its circuit includes a zener trimmed bandgap reference to as-sure output voltage accuracy to within ±1%. The LM1117 series is available in SOT­223, TO-220, and TO-252 D-PAK packages. A minimum of 10µF tantalum capacitor is required at the
output to improve the transient response and stability.
9.10.2. Features
• Available in 1.8V, 2.5V, 2.85V, 3.3V, 5V, and Adjustable Versions
• Space Saving SOT-223 Package
• Current Limiting and Thermal Protection
• Output Current 800mA
• Line Regulation 0.2% (Max)
• Load Regulation 0.4% (Max)
• Temperature Range — LM1117 0°C to 125°C
— LM1117I -40°C to 125°C
9.10.3. Applications
• 2.85V Model for SCSI-2 Active Termination
• Post Regulator for Switching DC/DC Converter
• High Efficiency Linear Regulators
• Battery Charger
• Battery Powered Instrumentation
9.10.4. Connection Diagrams
SOT-223
Top
View
TO-220
Top
View
9
TO-252
Top
View
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9.11. DS90C385
9.11.1. General Description
The DS90C385 transmitter converts 28 bits of LVCMOS/LVTTL data into four LVDS (Low Voltage Differential Signalling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link. Every cycle of the transmit clock 28 bits of input data are sampled and transmitted. At a transmit clock frequency of 85 MHz, 24 bits of RGB data and 3 bits of LCD timing and control data (FPLINE, FPFRAME, DRDY) are transmitted at a rate of 595 Mbps per LVDS data channel. Using an 85 MHz clock, the data throughput is 297.5 Mbytes/sec. Also available is the DS90C365 that converts 21 bits of LVCMOS/LVTTL data into three LVDS (Low Voltage Differential Signalling) data streams. Both transmitters can be programmed for Rising edge strobe or falling edge strobe through a dedicated pin. A Rising edge or Falling edge strobe transmitter will interoperate with a Falling edge strobe Receiver (DS90CF386/DS90CF366) without any translation logic. The DS90C385 is also offered in a 64 ball, 0.8mm fine pitch ball grid array (FBGA) package which provides a 44 % reduction in PCB footprint compared to the TSSOP package. This chipset is an ideal means to solve EMI and cable size problems associated with wide, high-speed TTL interfaces.
9.11.2. Features
• 20 to 85 MHz shift clock support
• Best–in–Class Set & Hold Times on TxINPUTs
• Tx power consumption <130 mW (typ) @85MHz Grayscale
• Tx Power-down mode <200µW (max)
• Supports VGA, SVGA, XGA and Dual Pixel SXGA.
• Narrow bus reduces cable size and cost
• Up to 2.38 Gbps throughput
• Up to 297.5 Megabytes/sec bandwidth
• 345 mV (typ) swing LVDS devices for low EMI
• PLL requires no external components
• Compatible with TIA/EIA-644 LVDS standard
• Low profile 56-lead or 48-lead TSSOP package
• DS90C385 also available in a 64 ball, 0.8mm fine pitch ball grid array (FBGA) package
9.11.3. Pin Description
DS90C385 MTD56 (TSSOP) Package Pin Description-FPD Link Transmitter
Pin Name I/O No. Description
TxIN
TxOUT+ TxOUT- TxCLKIN R_FB TxCLK OUT+ TxCLK OUT- PWR DOWN
Vcc GND PLL Vcc PLL GND LVDS Vcc LVDS GND
I 28
O 4 O 4 I 1 I 1 O 1 O 1 I 1
I 3 I 4 I 1 I 2 I 1 I 3
TTL level input. This includes: 8 Red, 8 Green, 8 Blue, and 4 control lines —FPLINE, FPFRAME and DRDY (also referred to as HSYNC, VSYNC, Data Enable). Positive LVDS differentiaI data output.
Negative LVDS differential data output. TTL Ievel clock input. Pin name TxCLK IN.
Programmable strobe select Positive LVDS differential clock output.
Negative LVDS differential clock output. TTL level input. Assertion (low input) TRI-STATES the outputs, ensuring low current at
power down. Power supply pins for TTL inputs.
Ground pins for TTL inputs.
Power supply pin for PLL. Ground pins for PLL. Power supply pin for LVDS outputs.
Ground pins for LVDS outputs.
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DS90C385SLC SLC64A Package Pin Description-FPD Link Transmitter
Pin Name I/O No. Description
TxIN TxOUT+ TxOUT- TxCLKIN R_FB TxCLK OUT+ TxCLK OUT- PWR DOWN
Vcc GND PLL Vcc PLL GND LVDS Vcc LVDS GND NC
I 28 O 4 O 4 I 1 I 1 O 1 O 1 I 1
I 3 I 5 I 1 I 2 I 2 I 4 6
TTL level input. Positive LVDS differentiaI data output. Negative LVDS differential data output. TTL Ievel clock input. The rising edge acts as data strobe. Pin name TxCLK IN. Programmable strobe select. HIGH = rising edge, LOW = falling edge. Positive LVDS differential clock output. Negative LVDS differential clock output. TTL level input. Assertion (low input) TRI-STATES the outputs, ensuring low
current at power down. Power supply pins for TTL inputs.
Ground pins for TTL inputs.
Power supply pin for PLL. Ground pins for PLL. Power supply pin for LVDS outputs.
Ground pins for LVDS outputs. Pins not connected.
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9.12. MSP34X1G
MSP3411G
Multistandard Sound Processor Family
9.12.1. Introduction
The MSP 34x1G family of single-chip Multistandard Sound Processors covers the sound processing of all analog TV-Standards worldwide, as well as the NICAM digital sound standards. The full TV sound processing, starting with analog sound IF signal-in, down to processed analog AF-out, is performed on a single chip. Figure shows a simplified functional block diagram of the MSP 34x1G. The MSP 34x1G has all functions of the MSP 34x0G with the addition of a virtual surround sound feature. Surround sound can be reproduced to a certain extent with two loudspeakers. The MSP 34x1G includes the Micronas virtualizer algorithm “3D-PANORAMA” which has been approved by the Dolby
1)
Laboratories for with the "Virtual Dolby Surround" technology. In addition, the MSP 34x1G includes the “PAN-ORAMA” algorithm. These TV sound processing ICs include versions for processing the multichannel television sound (MTS) signal conforming to the standard recommended by the Broadcast Television Systems Committee (BTSC). The DBX noise reduction, or alternatively, Micronas Noise Reduction (MNR) is performed alignment free. Other processed standards are the Japanese FM-FM multiplex standard (EIA-J) and the FM Stereo Radio standard. Current ICs have to perform adjustment procedures in order to achieve good stereo separation for BTSC and EIA-J. The MSP 34x1G has optimum stereo performance without any adjustments. The MSP 34x1G has built-in automatic functions: The IC is able to detect the actual sound standard automat-ically (Automatic Standard Detection). Furthermore, pilot levels and identification signals can be evaluated internally with subsequent switching between mono/stereo/bilingual; no I
2 C interaction is
necessary (Automatic Sound Selection).
Source Select
2
S bus interface consists of five pins:
I
2
S_DA_IN1, I2S_DA_IN2: For input, four channels (two channels per line, 2*16 bits) per sampling
1. I cycle (32 kHz) are transmitted.
2
S _DA_OUT: For output, two channels (2*16 bits) per sampling cycle (32 kHz) are transmitted.
2. I
2
S _CL: Gives the timing for the transmission of I2S serial data (1.024 MHz).
3. I
2
S _WS: The I2S _WS word strobe line defines the left and right sample.
4. I
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9.12.2. Features
• 3D-PANORAMA virtualizer (approved by Dolby Laboratories) with noise generator
• PANORAMA virtualizer algorithm
• Standard Selection with single I
2
C transmission
• Automatic Sound Selection (mono/stereo/bilingual),
• Automatic Carrier Mute function
• Interrupt output programmable (indicating status change)
• Loudspeaker / Headphone channel with volume, balance, bass, treble, loudness
• AVC: Automatic Volume Correction
• Subwoofer output with programmable low-pass and complementary high-pass filter
• 5-band graphic equalizer for loudspeaker channel
• Spatial effect for loudspeaker channel, processing of all deemphasis filtering
• Two selectable sound IF (SIF) inputs
• Four Stereo SCART (line) inputs, one Mono input; two Stereo SCART outputs
• Complete SCART in/out switching matrix
• Two I
2
S inputs; one I2S output
• Automatic Standard Detection of terrestrial TV standards
• Demodulation of the BTSC multiplex signal and the SAP channel
• Alignment free digital DBX noise reduction
• BTSC stereo separation (MSP 3441G also EIA-J) significantly better than specification
• SAP and stereo detection for BTSC system
• Demodulation of the FM-Radio multiplex signal
9.12.3. Pin connections
NC = not connected; leave vacant LV = if not used, leave vacant OBL = obligatory; connect as described in circuit diagram DVSS: if not used, connect to DVSS AHVSS: connect to AHVSS
Pin No. Pin Name Type
PLCC 68-pin
1 16 14 9 8 ADR_WS OUT LV ADR word strobe 2 - - - - NC LV Not connected 3 15 13 8 7 ADR_DA OUT LV ADR Data Output 4 14 12 7 6 I2S_DA_IN1 IN LV I2S1 data input 5 13 11 6 5 I2S_DA_OUT OUT LV I2S data output 6 12 10 5 4 I2S_WS IN/OUT LV I2S word strobe 7 11 9 4 3 I2S_CL IN/OUT LV I2S clock 8 10 8 3 2 I2C_DA IN/OUT OBL I2C data 9 9 7 2 1 I2C_CL IN/OUT OBL I2C clock 10 8 - 1 64 NC LV Not connected 11 7 6 80 63 STANDBYQ IN OBL Stand-by (low-active) 12 6 5 79 62 ADR_SEL IN OBL I2C bus address select 13 5 4 78 61 D_CTR_I/O_0 IN/OUT LV D_CTR_I/O_0 14 4 3 77 60 D_CTR_I/O_1 IN/OUT LV D_CTR_I/O_1 15 3 - 76 59 NC LV Not connected 16 2 - 75 58 NC LV Not connected 17 - - - - NC LV Not connected
18 1 2 74 57 AUD_CL_OUT OUT LV
19 64 1 73 56 TP LV Test pin 20 63 52 72 55 XTAL_OUT OUT OBL Crystal oscillator 21 62 51 71 54 XTAL_IN IN OBL Crystal oscillator 22 61 50 70 53 TESTEN IN OBL Test pin
23 60 49 69 52 ANA_IN2+ IN
24 59 48 68 51 ANA_IN- IN
25 58 47 67 50 ANA_IN1+ IN LV IF input 1
PSDIP 64-pin
PSDIP 52-pin
PQFP 80-pin
PLQFP 64-pin
Connection (if not used)
AVSS via 56 pF/LV
AVSS via 56 pF/LV
Short Description
Audio clock output (18.432 MHz)
IF Input 2 (can be left vacant, only if IF input 1 is also not in use) IF common (can be left vacant, only if IF input 1 is also not in use)
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26 57 46 66 49 AVSUP OBL Analog power supply 5V
- - - 65 - AVSUP OBL Analog power supply 5V
- - - 64 - NC LV Not connected
- - - 63 - NC LV Not connected 27 56 45 62 48 AVSS OBL Analog ground
- - - 61 - AVSS OBL Analog ground 28 55 44 60 47 MONO_IN IN LV Mono input
- - - 59 - NC LV Not connected
29 54 43 58 46 VREFTOP OBL
30 53 42 57 45 SC1_IN_R IN LV SCART 1 input, right 31 52 41 56 44 SC1_IN_L IN LV SCART 1 input, left 32 51 - 55 43 ASG1 AHVSS Analog Shield Ground 1 33 50 40 54 42 SC2_IN_R IN LV SCART 2 input, right 34 49 39 53 41 SC2_IN_L IN LV SCART 2 input, left 35 48 - 52 40 ASG2 AHVSS Analog Shield Ground 2 36 47 38 51 39 SC3_IN_R IN LV SCART 3 input, right 37 46 37 50 38 SC3_IN_L IN LV SCART 3 input, left 38 45 - 49 37 ASG4 AHVSS Analog Shield Ground 4 39 44 - 48 36 SC4_IN_R IN LV SCART 4 input, right 40 43 - 47 35 SC4_IN_L IN LV SCART 4 input, left 41 - - 46 - NC LV or AHVSS Not connected 42 42 36 45 34 AGNDC OBL Analog reference voltage 43 41 35 44 33 AHVSS OBL Analog ground
- - - 43 - AHVSS OBL Analog ground
- - - 42 - NC LV Not connected
- - - 41 - NC LV Not connected 44 40 34 40 32 CAPL_M OBL Volume capacitor MAIN 45 39 33 39 31 AHVSUP OBL Analog power supply 8V 46 38 32 38 30 CAPL_A OBL Volume capacitor AUX 47 37 31 37 29 SC1_OUT_L OUT LV SCART output 1, left 48 36 30 36 28 SC1_OUT_R OUT LV SCART output 1, right 49 35 29 35 27 VREF1 OBL Reference ground 1 50 34 28 34 26 SC2_OUT_L OUT LV SCART output 2, left 51 33 27 33 25 SC2_OUT_R OUT LV SCART output 2, right 52 - - 32 - NC LV Not connected 53 32 - 31 24 NC LV Not connected 54 31 26 30 23 DACM_SUB OUT LV Subwoofer output 55 30 - 29 22 NC LV Not connected 56 29 25 28 21 DACM_L OUT LV Loudspeaker out, left 57 28 24 27 20 DACM_R OUT LV Loudspeaker out, right 58 27 23 26 19 VREF2 OBL Reference ground 2 59 26 22 25 18 DACA_L OUT LV Headphone out, left 60 25 21 24 17 DACA_R OUT LV Headphone out, right
- - - 23 - NC LV Not connected
- - - 22 - NC LV Not connected 61 24 20 21 16 RESETQ IN OBL Power-on-reset 62 23 - 20 15 NC LV Not connected 63 22 - 19 14 NC LV Not connected 64 21 19 18 13 NC LV Not connected 65 20 18 17 12 I2S_DA_IN2 IN LV I2S2-data input 66 19 17 16 11 DVSS OBL Digital ground
- - - 15 - DVSS OBL Digital ground
- - - 14 - DVSS OBL Digital ground 67 18 16 13 10 DVSUP OBL Digital power supply 5V
- - - 12 - DVSUP OBL Digital power supply 5V
- - - 11 - DVSUP OBL Digital power supply 5V 68 17 15 10 9 ADR_CL OUT LV ADR clock
Reference voltage IF A/D converter
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9.13. TDA1308
9.13.1. General Description
The TDA1308 is an integrated class AB stereo headphone driver contained in an SO8 or a DIP8 plastic package. The device is fabricated in a 1 mm CMOS process and has been primarily developed for portable digital audio applications. It gets its input from two analog audio outputs (DACA_L and DACA_R) of MSP 34x0G. The gain of the output is adjustable by the feedback resistor between the inputs and outputs.
9.13.2. Features
Wide temperature range
No switch ON/OFF clicks
Excellent power supply ripple rejection
Low power consumption
Short-circuit resistant
High performance
high signal-to-noise ratio
High slew rate
Low distortion
Large output voltage swing.
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9.13.3. Pinning
SYMBOL PIN DESCRIPTION
OUTA 1 Output A INA(neg) 2 Inverting input A INA(pos) 3 Non-inverting input A VSS 4 Negative supply INB(pos) 5 Non-inverting input B INB(neg) 6 Inverting input B OUTB 7 Output B VDD 8 Positive supply
9.14. PI5V330
9.14.1. General Description
The PI5V330 is well suited for video applications when switching composite or RGB analog. A picture­in-picture application will be described in this brief. The pixel-rate creates video overlays so two or more pictures can be viewed at the same time. An inexpensive NTSC titler can be implemented by superimposing the output of a character generator on a standard composite video background.
9.15. AD9883A
9.15.1. General Description
The AD9883A is a complete 8-bit, 140 MSPS, monolithic analog interface optimized for capturing RGB graphics signals from personal computers and workstations. Its 140 MSPS encode rate capability and full power analog bandwidth of 300 MHz supports resolutions up to SXGA (1280 × 1024 at 75 Hz). The AD9883A includes a 140 MHz triple ADC with internal 1.25 V reference, a PLL, and programmable gain, offset, and clamp control. The user provides only a 3.3 V power supply, analog input, and Hsync and COAST signals. Three-state CMOS outputs may be powered from 2.5 V to 3.3 V. The AD9883A’s on-chip PLL generates a pixel clock from the Hsync input. Pixel clock output frequencies range from 12 MHz to140 MHz. PLL clock jitter is 500 ps p-p typical at 140 MSPS. When the COAST signal is presented, the PLL maintains its output frequency in the absence of Hsync. A sampling phase adjustment is provided. Data, Hsync, and clock output phase relationships are maintained. The AD9883A also offers full sync processing for composite sync and sync-on-green applications. A clamp signal is generated internally or may be provided by the user through the CLAMP input pin. This interface is fully programmable via a 2-wire serial interface. Fabricated in an advanced CMOS process, the AD9883A is provided in a space-saving 80-lead LQFP surface-mount plastic package and is specified over the –40.˚C to +85. ˚C temperature range.
9.15.2. Features
• Industrial Temperature Range Operation
• 140 MSPS Maximum Conversion Rate
• 300 MHz Analog Bandwidth
• 0.5 V to 1.0 V Analog Input Range
• 500 ps p-p PLL Clock Jitter at 110 MSPS
• 3.3 V Power Supply
• Full Sync Processing
• Sync Detect for Hot Plugging
• Midscale Clamping
• Power-Down Mode
• Low Power: 500 mW Typical
• 4:2:2 Output Format Mode
• APPLICATIONS
• RGB Graphics Processing
• LCD Monitors and Projectors
• Plasma Display Panels
• Scan Converters
• Microdisplays
• Digital TV
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