VCE = –6V,
IC = –10 mA,
f = 1 kHz,
Rg = 0, ∆f = 1Hz
3
Page 4
2SA1083, 2SA1084, 2SA1085
Maximum Collector Dissipation Curve
600
(mW)
C
400
200
Collector power dissipation P
050100
Ambient Temperature Ta (°C)
Typical Output Characteristics (2)
–20
–35
–16
(mA)
C
–12
–40
–30
–25
–20
–15
–8
–10
150
Typical Output Characteristics (1)
–50
–120
–40
(mA)
C
–30
–140
–100
–80
–60
–40
–20
–20 µA
–10
Collector current I
IB = 0
0–4–12–20–8–16
Collector to Emitter Voltage V
Typicaol Transfer Characteristics
–10
–5
(mA)
C
–2
–1.0
–0.5
P
C
= 0.4 W
(V)
CE
VCE = –12 V
–4
Collector current I
0–4–8
Collector to Emitter Voltage V
–5 µA
IB = 0
–12–16–20
CE
(V)
Collector Current I
–0.2
–0.1
0–0.4–0.8–0.2–0.6–1.0
Base to Emitter Voltage V
BE
(V)
4
Page 5
2SA1083, 2SA1084, 2SA1085
DC Current Transfer Ratio vs.
Collector Current
5,000
FE
2,000
1,000
500
200
100
DC current teransfer ratio h
50
–0.1–1.0–10–100–3–30–0.3
Collector Current I
Base to Emitter Saturation Voltage
vs. Collector Current
–10
–5
–2
(V)
–1.0
BE(sat)
V
–0.5
VCE = –12 V
Pulse
(mA)
C
IC = 10 I
Collector to Emitter Saturation
Voltage vs. Collector Current
–1.0
IC = 10 I
B
–0.5
–0.2
(V)
–0.1
CE(sat)
V
–0.05
–0.02
Collector to emitter saturation voltage
–0.01
–1–5–2–20–100–10–50
Collector Current I
(mA)
C
Gain Bandwidth Product vs.
Collector Current
2,000
B
VCE = –12 V
1,000
(MHz)
T
500
200
100
–0.2
Base to emitter saturation voltage
–0.1
–1–5–2–20–100–10–50
Collector Current I
(mA)
C
50
Gain bandwidth product f
20
–1–5–20–100–2–10–50
Collector Current I
(mA)
C
5
Page 6
2SA1083, 2SA1084, 2SA1085
Collector Output Capacitance vs.
Collector to Base Voltage
100
(pF)
50
ob
20
10
5
2
Collector output capacitance C
1
–0.5–2–10–50–1.0–5–20
Collector to Base Voltage V
Contours of Constant Noise Figure (2)
100
30
(kΩ)
g
10
3
1.0
NF = 0.5 dB
0.3
0.1
0.03
Singnal source resistance R
0.01
–0.01–0.1
–0.03–0.3
–1.0–10–100
–3–30
Collector Current IC (mA)
IE = 0
f = 1 MHz
(V)
CB
VCE = –6 V
f = 120 Hz
1
2 4 6
10
Contours of Constant Noise Figure (1)
100
30
(kΩ)
g
10
3
1.0
0.3
0.1
NF = 0.5 dB
1
2
4
6
0.03
Singnal source resistance R
0.01
–0.01–0.1
10
–0.03–0.3
–1.0–10–100
Collector Current IC (mA)
Contours of Constant Noise Figure (3)
100
30
(kΩ)
g
10
3
NF = 0.5 dB
1.0
0.3
0.1
0.03
Singnal source resistance R
0.01
–0.01–0.1
–0.03–0.3
–1.0–10–100
Collector Current IC (mA)
V
= –6 V
CE
f = 1 kHz
–3–30
VCE = –6 V
f = 10 Hz
1
2 4 6 10
–3–30
6
Page 7
0.60 Max
0.5 ± 0.1
4.8 ± 0.3
3.8 ± 0.3
5.0 ± 0.2
0.7
2.3 Max
12.7 Min
0.5
1.27
2.54
Hitachi Code
JEDEC
EIAJ
Weight
(reference value)
TO-92 (1)
Conforms
Conforms
0.25 g
Unit: mm
Page 8
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URLNorthAmerica : http:semiconductor.hitachi.com/
For further information write to:
Hitachi Semiconductor
(America) Inc.
179 East Tasman Drive,
San Jose,CA 95134
Tel: <1> (408) 433-1990
Fax: <1>(408) 433-0223
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Japan: http://www.hitachi.co.jp/Sicd/indx.htm
Hitachi Asia Ltd.
Taipei Branch Office
3F, Hung Kuo Building. No.167,
Tun-Hwa North Road, Taipei (105)
Tel: <886> (2) 2718-3666
Fax: <886> (2) 2718-8180
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
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7/F., North Tower, World Finance Centre,
Harbour City, Canton Road, Tsim Sha Tsui,
Kowloon, Hong Kong
Tel: <852> (2) 735 9218
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