This device each contains an 8-bit serial-in, parallel-out shift registers that feeds an 8-bit D-type storage
register. The storage register has parallel 3-state outputs. Separate clocks are provided for both the shift
register anf the storage register. The shift register has a direct-overriding clear, serial input, and serial
output pins for cascading.
Both the shift register anf the storage register clocks are positive-edge triggered. If the user wishes to
connect both clocks together, the shift register state will always be one clock pulse ahead of the storage
register. Low-voltage and high-speed operation is suitable for the battery-powered products (e.g., notebook
computers), and the low-power consumption extends the battery life.
Features
• VCC = 2.0 V to 5.5 V operation
• All inputs VIH (Max.) = 5.5 V (@VCC = 0 V to 5.5 V)
• All outputs VO (Max.) = 5.5 V (@VCC = 0 V)
• Typical VOL ground bounce < 0.8 V (@VCC = 3.3 V, Ta = 25°C)
• Typical VOH undershoot > 2.3 V (@VCC = 3.3 V, Ta = 25°C)
• Output current ±6 mA (@VCC = 3.0 V to 3.6 V), ±12 mA (@VCC = 4.5 V to 5.5 V)
HD74LV595A
Function Table
Inputs
SERSRCLKSRCLRRCLKGFunction
X XXXHForce outputs into high-impedance state
X XXXLEnable paralle output
XXLXXReset shift register
L↑HXXShift data into shift register
H↑HXXShift data into shift register
X↓HXXShift register remains unchanged
XXX↑XTransfer shift register contents to latch
Note: Skew between any outputs of the same package switching in the same direction. This parameter is
warranted but not production tested.
Operating Characteristics
• CL = 50 pF
ItemSymbolV
Power
dissipation
capacitance
C
PD
= (V)MinMaxMinMaxUnit
CC
2.3 to 2.7—2.0—2.0ns
3.0 to 3.6—1.5—1.5
4.5 to 5.5—1.0—1.0
Ta = 25°C
= (V)MinTypMaxUnitTest Conditions
CC
3.3—32.7—pFf = 10 MHz
5.0—33.1—
Noise Characteristics
• CL = 50 pF
ItemSymbolV
Quiet output,
maximum
dynamic V
Quiet output,
minimum
dynamic V
Quiet output,
minimum
dynamic V
High-level
dynamic
input voltage
Low-level
dynamic
inout voltage
V
OL (P)
OL
V
OL (V)
OL
V
OH (V)
OH
V
IH (D)
V
IL (D)
Ta = 25°C
= (V)MinTypMaxUnitTest Conditions
CC
3.3—0.650.8V
3.3—–0.59–0.8
3.3—2.84—
3.32.31——
3.3——0.99
12
Test Circuit
Output
C
HD74LV595A
Ω
1 K
S2
L
OPEN
GND
V
CC
TEST
t / t
PLH PHL
t / t
ZH HZ
t / t
ZLLZ
Note: C includes the probe and jig capacitance.
L
S2
OPEN
GND
V
CC
13
HD74LV595A
Waveform – 1
SRCLK
Waveform – 2
SRCLR
Q
H'
Q
50% V
H'
90%
10%
10%
CC
t
90%
50% V
t
PHL
r
CC
t
f
V
CC
GND
t
w
1/f
max
t
PLH
t
TLH
50% V
t
PHL
t
THL
t
w
V
CC
CC
GND
50% V
CC
SRCLK
Waveform – 3
RCLK
Q
A-QH
50% V
CC
t
PLH/tPHL
50% V
CC
t
su
50% V
CC
V
CC
GND
V
CC
GND
14
Waveform – 4
G
Waveform – A
Waveform – B
Waveform – 5
SRCLK
SER
t
f
t
r
90 %90 %
50 % V
CC
50 % V
10 %10 %
t
ZL
50 % V
CC
t
ZH
50 % V
CC
t
LZ
t
HZ
Valid
50% V
CC
t
su
t
h
50% V
CC
CC
V + 0.3 V
V – 0.3 V
V
GND
V
GND
CC
CC
OL
OH
HD74LV595A
V
CC
0 V
V
CC
V
OL
V
OH
0 V
Waveform – 6
SRCLK
Notes:
1. Input waveform: PRR ≤ 1 MHz, Zo = 50 Ω, t ≤ 3 ns, t ≤ 3 ns
2. Waveform-A is for an output with internal conditions such that the output is low except when disabled
by the output control.
3. Waveform-B is for an output with internal conditions such that the output is high except when disabled
by the output control.
4. The output are measured one at a time with one transition per measurement.
RCLK
V
CC
50% V
CC
GND
t
su
50%
V
CC
t
w
V
CC
GND
15
HD74LV595A
Package Dimensions
16
10.06
10.5 Max
9
5.5
1
0.80 Max
1.27
0.42 ± 0.08
± 0.06
0.40
Dimension including the plating thickness
Base material dimension
8
0.12
0.10 ± 0.10
0.15
M
2.20 Max
7.80
0.22 ± 0.05
0.20 ± 0.04
0.70 ± 0.20
Hitachi Code
JEDEC
EIAJ
Weight
(reference value)
+ 0.20
– 0.30
1.15
0
° – 8°
FP-16DA
—
Conforms
0.24 g
16
16
HD74LV595A
Unit: mm
9.9
10.3 Max
9
1
1.27
0.635 Max
*0.42 ± 0.08
0.40 ± 0.06
*Dimension including the plating thickness
Base material dimension
8
0.25
+ 0.11
– 0.04
0.14
0.15
3.95
1.75 Max
M
6.10
1.08
0.20 ± 0.03
*0.22 ± 0.03
+ 0.67
0.60
– 0.20
Hitachi Code
JEDEC
EIAJ
Weight
+ 0.10
– 0.30
0° – 8°
(reference value)
FP-16DN
Conforms
Conforms
0.15 g
17
HD74LV595A
0.22
0.20 ± 0.06
5.0
5.3 Max
169
4.40
18
0.65
+ 0.08
– 0.07
0.13
0.65 Max
1.0
M
6.40 ± 0.20
0.10
1.10 Max
Dimension including the plating thickness
Base material dimension
0.17 ± 0.05
0.15 ± 0.04
+0.03
–0.04
0.07
0° – 8°
Hitachi Code
JEDEC
EIAJ
Weight
(reference value)
0.50 ± 0.10
TTP-16DA
—
—
0.05 g
18
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URLNorthAmerica : http:semiconductor.hitachi.com/
For further information write to:
Hitachi Semiconductor
(America) Inc.
179 East Tasman Drive,
San Jose,CA 95134
Tel: <1> (408) 433-1990
Fax: <1>(408) 433-0223
Europe: http://www.hitachi-eu.com/hel/ecg
Asia (Singapore): http://www.has.hitachi.com.sg/grp3/sicd/index.htm
Asia (Taiwan): http://www.hitachi.com.tw/E/Product/SICD_Frame.htm
Asia (HongKong): http://www.hitachi.com.hk/eng/bo/grp3/index.htm
Japan: http://www.hitachi.co.jp/Sicd/indx.htm
Hitachi Asia Ltd.
Taipei Branch Office
3F, Hung Kuo Building. No.167,
Tun-Hwa North Road, Taipei (105)
Tel: <886> (2) 2718-3666
Fax: <886> (2) 2718-8180
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
Hitachi Asia (Hong Kong) Ltd.
Group III (Electronic Components)
7/F., North Tower, World Finance Centre,
Harbour City, Canton Road, Tsim Sha Tsui,
Kowloon, Hong Kong
Tel: <852> (2) 735 9218
Fax: <852> (2) 730 0281
Telex: 40815 HITEC HX
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