HIT HD74ALVCH16501 Datasheet

HD74ALVCH16501
18-bit Universal Bus Transceivers with 3-state Outputs
ADE-205-168A (Z)
2nd. Edition
December 1999
Description
Data flow in each direction is controlled by output enable (OEAB and OEBA), latch enable (LEAB and LEBA), and clock (CLKAB and CLKBA) inputs. For A to B data flow, the device operates in the transparent mode when LEAB is high. When LEAB is low, the A data is latched if CLKAB is held at a high or low logic level. If LEAB is low, the A bus data is stored in the latch flip flop on the low to high transition of CLKAB. When OEAB is high, the outputs are active. When OEAB is low, the outputs are in the high impedance state. Data flow for B to A is similar to that of A to B but uses OEBA, LEBA, and CLKBA. The output enables are complementary (OEAB is active high, and OEBA is active low). Active bus hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
Features
VCC = 2.3 V to 3.6 V
Typical VOL ground bounce < 0.8 V (@VCC = 3.3 V, Ta = 25°C)
Typical VOH undershoot > 2.0 V (@VCC = 3.3 V, Ta = 25°C)
High output current ±24 mA (@VCC = 3.0 V)
Bus hold on data inputs eliminates the need for external pullup / pulldown resistors
HD74ALVCH16501
Function Table
*3
Inputs Output B OEAB LEAB CLKAB A
LXXXZ HHXL L HHXHH HL LL HL HH HLHXB HLLXB
*1
0
*2
0
H : High level L : Low level X : Immaterial Z : High impedance : Low to high transition Notes: 1. Output level before the indicated steady state input conditions were established.
2. Output level before the indicated steady state input conditions were established, provided that CLKAB was high before LEAB went low.
3. A to B data flow is show; B to A flow is similar but uses OEBA, LEBA, and CLKBA.
2
Pin Arrangement
HD74ALVCH16501
OEAB
LEAB
A1
GND
A2 A3
V
CC
A4 A5
A6
GND
A7 A8
A9
A10 A11 A12
GND
A13 A14 A15 V
CC
A16 A17
GND
A18
OEBA
LEBA
10 11
12 13 14
15 16
17 18
19
20 21 22 23 24 25 26 27 28
GND
1 2
3 4 5
6 7
8
9
56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29
CLKAB B1 GND B2 B3
V
CC
B4 B5
B6 GND
B7 B8
B9 B10 B11
B12 GND B13 B14 B15 V
CC
B16 B17 GND B18 CLKBA GND
(Top view)
3
HD74ALVCH16501
Absolute Maximum Ratings
Item Symbol Ratings Unit Conditions
Supply voltage V Input voltage
Output voltage
*1, 2
*1, 2
Input clamp current I Output clamp current I Continuous output current I
Maximum power dissipation at Ta = 55°C (in still air)
*3
CC
V
I
V
O
IK
OK
O
P
T
Storage temperature Tstg –65 to 150 °C Notes: Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage
to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
1. The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.
2. This value is limited to 4.6 V maximum.
3. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils.
–0.5 to 4.6 V –0.5 to 4.6 V Except I/O ports –0.5 to VCC +0.5 I/O ports –0.5 to VCC +0.5 V –50 mA VI < 0
±50 mA VO < 0 or VO > V ±50 mA VO = 0 to V
CC
±100 1 W TSSOP
CC
Recommended Operating Conditions
Item Symbol Min Max Unit Conditions
Supply voltage V Input voltage V Output voltage V High level output current I
Low level output current I
CC
I
O
OH
OL
Input transition rise or fall rate t / v 0 10 ns / V Operating temperature Ta –40 85 °C
Note: Unused control inputs must be held high or low to prevent them from floating.
4
2.3 3.6 V 0VCCV 0VCCV — –12 mA VCC = 2.3 V — –12 VCC = 2.7 V — –24 VCC = 3.0 V —12mAV —12 V —24 V
= 2.3 V
CC
= 2.7 V
CC
= 3.0 V
CC
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