HIT HAT2054M Datasheet

HAT2054M
Silicon N Channel Power MOS FET
Power Switching
Features
Low drive current
High density mounting
4.5V gate drive device can be driven from 5V source
Outline
ADE-208-756B(Z)
Preliminary
3rd. Edition
December 1998
TSOP–6
3
G
12 5 6 DSD
DD
4
4
5
6
1
4 Source 3 Gate 1, 2, 5, 6 Drain
3
2
HAT2054M
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V Gate to source voltage V Drain current ID* Drain peak current I Body-drain diode reverse drain current IDR* Channel dissipation Pch
DSS
GSS
D(pulse)
Pch
2
*
2
(pulse)
(continuous)
1
2
*
3
* Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C
Notes: 1. PW 10µs, duty cycle 1 %
2. When using the alumina ceramic board (50 x 50 x 0.7 mm), PW 5s,Ta=25°C
3. When using the alumina ceramic board (50 x 50 x 0.7 mm) ,Ta=25°C
Electrical Characteristics (Ta = 25°C)
30 V ±20 V
6.3 A
25.2 A
6.3 A
2.0 W
1.05 W
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown voltage V Gate to source leak current I Zero gate voltege drain current I Gate to source cutoff voltage V Static drain to source on state R resistance R
(BR)DSS
GSS
DSS
GS(off)
DS(on)
DS(on)
30——V I ——±0.1 µAVGS = ±20V, VDS = 0 ——1 µAVDS = 30 V, VGS = 0
1.0 2.5 V VDS = 10V, I D = 1mA —2631m ID = 3A, VGS = 10V * —4052m ID = 3A, VGS = 4.5V *
Forward transfer admittance |yfs|47—SI
= 10mA, VGS = 0
D
= 3A, VDS = 10V *
D
Input capacitance Ciss 620 pF VDS = 10V Output capacitance Coss 170 pF VGS = 0 Reverse transfer capacitance Crss 110 pF f = 1MHz Turn-on delay time t Rise time t Turn-off delay time t Fall time t Body–drain diode forward voltage V Body–drain diode reverse
recovery time
t
d(on)
r
d(off)
f
DF
rr
13 ns VGS = 10V, ID = 3A — 90 ns RL = 3.3 —50—ns —40—ns — 0.95 V IF = 6.3A, VGS = 0 * — (50) ns IF = 6.3A, VGS = 0
diF/ dt =20A/µs
Note: 1. Pulse test
1
1
1
1
2
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