HIT HAT2053M Datasheet

HAT2053M
Silicon N Channel Power MOS FET
Power Switching
Features
Low drive current
High density mounting
2.5V gate drive device can be driven from 3V source
Outline
ADE-208-755B(Z)
Preliminary 3rd. Edition
December 1998
TSOP–6
3
G
12 5 6 DSD
DD
4
4
5
6
1
4 Source 3 Gate 1, 2, 5, 6 Drain
3
2
HAT2053M
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V Gate to source voltage V Drain current ID* Drain peak current I Body-drain diode reverse drain current IDR* Channel dissipation Pch
DSS
GSS
D(pulse)
Pch
2
*
2
(pulse)
(continuous)
1
2
*
3
* Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C
Notes: 1. PW 10µs, duty cycle 1 %
2. When using the alumina ceramic board (50 x 50 x 0.7 mm), PW 5s,Ta=25°C
3. When using the alumina ceramic board (50 x 50 x 0.7 mm) ,Ta=25°C
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown voltage V Gate to source leak current I Zero gate voltege drain current I Gate to source cutoff voltage V Static drain to source on state R resistance R
(BR)DSS
GSS
DSS
GS(off)
DS(on)
DS(on)
Forward transfer admittance |yfs| 6.5 11 S ID = 3A, VDS = 10V * Input capacitance Ciss 570 pF VDS = 10V Output capacitance Coss 220 pF VGS = 0 Reverse transfer capacitance Crss 160 pF f = 1MHz Turn-on delay time t Rise time t Turn-off delay time t Fall time t Body–drain diode forward voltage V Body–drain diode reverse
t
d(on)
r
d(off)
f
DF
rr
recovery time Note: 1. Pulse test
20——V I ——±0.1 µAVGS = ±12V, VDS = 0 ——1 µAVDS = 20 V, VGS = 0
0.4 1.4 V VDS = 10V, I D = 1mA —2833m ID = 3A, VGS = 4.5V * —3748m ID = 3A, VGS = 2.5V *
15 ns VGS = 4.5V, ID = 3A — 100 ns RL = 3.3 —90—ns — 105 ns — 0.95 V IF = 6.1A, VGS = 0 * — (50) ns IF = 6.1A, VGS = 0
20 V ±12 V
6.1 A
24.4 A
6.1 A
2.0 W
1.05 W
= 10mA, VGS = 0
D
diF/ dt =20A/µs
1
1
1
1
2
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