HIT HAT2050T-D Datasheet

HAT2050T
Silicon N Channel Power MOS FET
High Speed Power Switching
ADE-208-660A (Z)
2nd. Edition
February 1999
Features
Capable of 4 V gate drive
Low drive current
High density mounting
Outline
TSSOP–8
1, 8 Drain 2, 3, 6, 7 Source 4, 5 Gate
1
2
3
4
8
7
6
5
G
D
S 2
4
1
S 3
G
D
S S
5
8
6
7
MOS1
MOS2
HAT2050T
2
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V
DSS
100 V
Gate to source voltage V
GSS
± 20 V
Drain current I
D
1A
Drain peak current I
D(pulse)
Note1
4A
Body-drain diode reverse drain current I
DR
1A
Channel dissipation Pch
Note2
1.0 W
Channel dissipation Pch
Note3
1.5 W Channel temperature Tch 150 °C Storage temperature Tstg – 55 to + 150 °C
Note: 1. PW 10µs, duty cycle 1 %
2. 1 Drive operation : When using the glass epoxy board (FR4 40 x 40 x 1.6 mm), PW 10s
3. 2 Drive operation : When using the glass epoxy board (FR4 40 x 40 x 1.6 mm), PW 10s
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown voltage V
(BR)DSS
100 V ID = 10 mA, VGS = 0
Gate to source breakdown voltage V
(BR)GSS
± 20 V IG = ± 100 µA, VDS = 0
Gate to source leak current I
GSS
——± 10 µAVGS = ± 16 V, VDS = 0
Zero gate voltege drain current I
DSS
——1 µAVDS = 100 V, VGS = 0
Gate to source cutoff voltage V
GS(off)
1.3 2.3 V VDS = 10 V, I D = 1 mA
Static drain to source on state R
DS(on)
0.56 0.75 ID = 0.5 A, VGS = 10 V
Note4
resistance R
DS(on)
0.72 1.0 ID = 0.5 A, VGS = 4 V
Note4
Forward transfer admittance |yfs| 0.7 1.1 S ID = 0.5 A, VDS = 10 V
Note4
Input capacitance Ciss 90 pF VDS = 10 V Output capacitance Coss 42 pF VGS = 0 Reverse transfer capacitance Crss 20 pF f = 1MHz Turn-on delay time t
d(on)
11 ns VGS = 4 V, ID = 0.5 A
Rise time t
r
24 ns VDD 10 V
Turn-off delay time t
d(off)
—14—ns
Fall time t
f
—11—ns
Body–drain diode forward voltage V
DF
0.84 1.1 V IF = 1 A, VGS = 0
Note4
Body–drain diode reverse recovery time
t
rr
85 ns IF = 1 A, VGS = 0
diF/ dt = 20 A/µs
Note: 4. Pulse test
HAT2050T
3
Main Characteristics
0
50 100 150 200
10
3 1
0.3
0.1
0.03
0.01
0.003
0.001
0.2
1
3
10
30
100
5
4
3
2
1
0
246810
5
4
3
2
1
0
2468
10
2.0
1.5
1.0
0.5
10V
6 V
5 V
8 V
Pulse Test
4.0 V
Tc = 75°C
25°C
–25°C
V = 10 V
DS
Pulse Test
3.0 V
200
10 µs
100 µs
1 ms
PW = 10 ms
Channel Dissipation Pch (W)
Ambient Temperature Ta (°C)
Power vs. Temperature Derating
Drain to Source Voltage V (V)
DS
Drain Current I (A)
D
Maximum Safe Operation Area
Drain to Source Voltage V (V)
DS
Drain Current I (A)
D
Typical Output Characteristics
Gate to Source Voltage V (V)
GS
Drain Current I (A)
D
Typical Transfer Characteristics
Note 5 : When using the glass epoxy board (FR4 40x40x1.6 mm)
2 Drive Operation
1 Drive Operation
Operation in this area is limited by R
DS(on)
Test Condition : When using the glass epoxy board (FR4 40x40x1.6 mm), PW < 10 s
Ta = 25°C 1 shot Pulse 1 Drive Operation
DC Operation (PW < 10 s)
Note5
V = 2.5 V
GS
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