HIT HAT1029R-D Datasheet

HAT1029R
Silicon P Channel Power MOS FET
High Speed Power Switching
ADE-208-522 (Z)
1st. Edition
May 1997
Features
Capable of 2.5 V gate drive
Low drive current
High density mounting
Outline
SOP–8
1
2
3
4
5
6
7
8
G
DSD
G
DSD
MOS1
MOS2
1
2
78
4
5
6
3
1, 3 Source 2, 4 Gate 5, 6, 7, 8 Drain
HAT1029R
2
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V
DSS
–20 V
Gate to source voltage V
GSS
±10 V
Drain current I
D
–3.5 A
Drain peak current I
D(pulse)
Note1
–28 A
Body–drain diode reverse drain current I
DR
–3.5 A
Channel dissipation Pch
Note2
2W
Channel dissipation Pch
Note3
3W Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C
Note: 1. PW 10µs, duty cycle 1 %
2. 1 Drive operation : When using the glass epoxy board (FR4 40 x 40 x 1.6 mm), PW 10s
3. 2 Drive operation : When using the glass epoxy board (FR4 40 x 40 x 1.6 mm), PW 10s
HAT1029R
3
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown voltage
V
(BR)DSS
–20 V ID = –10mA, VGS = 0
Gate to source breakdown voltage
V
(BR)GSS
±10——V I
G
= ±100µA, VDS = 0
Gate to source leak current I
GSS
——±10 µAV
GS
= ±8V, VDS = 0
Zero gate voltege drain current I
DSS
——–1µAV
DS
= –20 V, VGS = 0
Gate to source cutoff voltage V
GS(off)
–0.5 –1.5 V VDS = –10V, I D = –1mA
Static drain to source on state R
DS(on)
0.10 0.14 ID = –2A, VGS = –4V
Note4
resistance R
DS(on)
0.16 0.23 ID = –2A, VGS = –2.5V
Note4
Forward transfer admittance |yfs| 3 4.5 S ID = –2A, VDS = –10V
Note4
Input capacitance Ciss 465 pF VDS = –10V Output capacitance Coss 270 pF VGS = 0 Reverse transfer capacitance Crss 100 pF f = 1MHz Turn-on delay time t
d(on)
14 ns VGS = –4V, ID = –2A
Rise time t
r
80 ns VDD –10V
Turn-off delay time t
d(off)
—70—ns
Fall time t
f
—80—ns
Body–drain diode forward voltage
V
DF
–0.95 –1.24 V IF = –3.5A, VGS = 0
Note4
Body–drain diode reverse recovery time
t
rr
55 ns IF = –3.5A, VGS = 0
diF/ dt =20A/µs
Note: 4. Pulse test
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