2SK2329(L), 2SK2329(S)
Silicon N-Channel MOS FET
Application
High speed power switching
Features
• Low on-resistance
• High speed switching
• Low drive current
• 2.5 V gate drive device can be driven from 3 V source
• Suitable for Switching regulator, DC-DC converter
Outline
1
2
3
1
2
3
4
4
DPAK-2
1. Gate
2. Drain
3. Source
4. Drain
D
G
S
2SK2329(L), 2SK2329(S)
2
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V
DSS
30 V
Gate to source voltage V
GSS
±10 V
Drain current I
D
10 A
Drain peak current I
D(pulse)
*
1
40 A
Body to drain diode reverse drain current I
DR
10 A
Channel dissipation Pch*
2
20 W
Channel temperature Tch 150 °C
Storage temperature Tstg –55 to +150 °C
Notes 1. PW ≤ 10 µs, duty cycle ≤ 1 %
2. Value at Tc = 25 °C
2SK2329(L), 2SK2329(S)
3
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown
voltage
V
(BR)DSS
30 — — V ID = 10 mA, VGS = 0
Gate to source breakdown
voltage
V
(BR)GSS
±10 — — V IG = ±200 µA, VDS = 0
Gate to source leak current I
GSS
——±10 µAV
GS
= ±6.5 V, VDS = 0
Zero gate voltage drain current I
DSS
— — 100 µAV
DS
= 25 V, VGS = 0
Gate to source cutoff voltage V
GS(off)
0.4 — 1.4 V ID = 1 mA, VDS = 10 V
Static drain to source on state
resistance
R
DS(on)
— 0.03 0.04 Ω ID = 5 A
V
GS
= 4 V*
1
— 0.04 0.06 Ω ID = 5 A
V
GS
= 2.5 V*
1
Forward transfer admittance |yfs|1018—SI
D
= 5 A
V
DS
= 10 V*
1
Input capacitance Ciss — 1250 — pF VDS = 10 V
Output capacitance Coss — 540 — pF VGS = 0
Reverse transfer capacitance Crss — 120 — pF f = 1 MHz
Turn-on delay time t
d(on)
— 20 — ns ID = 5 A
Rise time t
r
— 145 — ns VGS = 4 V
Turn-off delay time t
d(off)
— 225 — ns RL = 2 Ω
Fall time t
f
— 125 — ns
Body to drain diode forward
voltage
V
DF
— 0.9 — V IF = 10 A, VGS = 0
Body to drain diode reverse
recovery time
t
rr
— 100 — ns IF = 10 A, VGS = 0,
di
F
/ dt = 20 A / µs
Note 1. Pulse Test