Silicon N-Channel MOS FET
Application
High speed power switching
Features
• Low on–resistance
• High speed switching
• No secondary breakdown
• Suitable for Switching regulator
2SK1934
Outline
TO-3P
G
D
1
2
3
1. Gate
2. Drain
S
(Flange)
3. Source
2SK1934
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V
Gate to source voltage V
Drain current I
Drain peak current I
Body to drain diode reverse drain current I
Channel dissipation Pch*
DSS
GSS
D
D(pulse)
DR
1
*
2
Channel temperature Tch 150 °C
Storage temperature Tstg –55 to +150 °C
Notes 1. PW ≤ 10 µs, duty cycle ≤ 1 %
2. Value at Tc = 25°C
1000 V
±30 V
8A
24 A
8A
150 W
2
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test conditions
Drain to source breakdown
V
(BR)DSS
voltage
Gate to source breakdown
V
(BR)GSS
voltage
Gate to source leak current I
Zero gate voltage drain current I
Gate to source cutoff voltage V
Static drain to source on state
R
GSS
DSS
GS(off)
DS(on)
resistance
Forward transfer admittance |yfs|46—SI
Input capacitance Ciss — 2690 — pF VDS = 10 V
Output capacitance Coss — 920 — pF VGS = 0
Reverse transfer capacitance Crss — 375 — pF f = 1 MHz
Turn-on delay time t
Rise time t
Turn-off delay time t
Fall time t
Body to drain diode forward
V
d(on)
r
d(off)
f
DF
voltage
Body to drain diode reverse
t
rr
recovery time
Note 1. Pulse Test
1000 — — V ID = 10 mA, VGS = 0
±30 — — V IG = ±100 µA, VDS = 0
——±10 µAVGS = ±25 V, VDS = 0
— — 250 µAVDS = 800 V, VGS = 0
2.0 — 3.0 V ID = 1 mA, VDS = 10 V
— 1.2 1.6 Ω ID = 4 A
V
= 10 V*
GS
= 4 A
D
V
= 20 V*
DS
1
1
— 35 — ns ID = 4 A
— 135 — ns VGS = 10 V
— 300 — ns RL = 7.5 Ω
— 205 — ns
— 0.9 — V IF = 8 A, VGS = 0
— 1600 — µsI
= 8 A, VGS = 0,
F
di
/ dt = 100 A / µs
F
2SK1934
3