HIT 2SK1933 Datasheet

Silicon N-Channel MOS FET
Application
High speed power switching
Features
Low on-resistance
High speed switching
No secondary breakdown
2SK1933
Outline
TO-3P
G
D
1
2
3
1. Gate
2. Drain
S
(Flange)
3. Source
2SK1933
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V Gate to source voltage V Drain current I Drain peak current I Body to drain diode reverse drain current I Channel dissipation Pch*
DSS
GSS
D
D(pulse)
DR
1
*
2
Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C
Notes 1. PW 10 µs, duty cycle 1 %
2. Value at Tc = 25°C
900 V ±30 V 10 A 30 A 10 A 150 W
2
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test conditions
Drain to source breakdown
V
(BR)DSS
voltage Gate to source breakdown
V
(BR)GSS
voltage Gate to source leak current I Zero gate voltage drain current I Gate to source cutoff voltage V Static drain to source on state
R
GSS
DSS
GS(off)
DS(on)
resistance Forward transfer admittance |yfs| 4.5 7 S ID = 5 A
Input capacitance Ciss 2620 pF VDS = 10 V Output capacitance Coss 830 pF VGS = 0 Reverse transfer capacitance Crss 320 pF f = 1 MHz Turn-on delay time t Rise time t Turn-off delay time t Fall time t Body to drain diode forward
V
d(on)
r
d(off)
f
DF
voltage Body tp drain diode reverse
t
rr
recovery time Note 1. Pulse Test
900 V ID = 10 mA, VGS = 0
±30 V IG = ±100 µA, VDS = 0
——±10 µAVGS = ±25 V, VDS = 0 — 250 µAVDS = 720 V, VGS = 0
2.0 3.0 V ID = 1 mA, VDS = 10 V — 0.9 1.2 ID = 5 A
V
= 10 V*
GS
V
= 20 V*
DS
1
1
30 ns ID = 5 A — 140 ns VGS = 10 V — 285 ns RL = 6 170 ns — 0.9 V IF = 10 A, VGS = 0
1600 ns IF = 10 A, VGS = 0,
di
/ dt = 100 A / µs
F
2SK1933
3
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