Silicon P Channel MOS FET
High Speed Switching
Features
• Low on-resistance
RDS = 8.5 Ω typ. (VGS = -4 V , ID = -25 mA)
RDS = 15 typ. (VGS = -2.5 V , ID = -10 mA)
• 2.5 V gate drive device.
• Small package (SMPAK)
Outline
2SJ587
ADE-208-801 (Z)
1st.Edition.
June 1999
SMPAK
2
G
3
1
2
D
3
1. Source
2. Gate
3. Drain
1
S
2SJ587
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V
Gate to source voltage V
Drain current I
Drain peak current I
Body-drain diode reverse drain current I
Channel dissipation Pch
DSS
GSS
D
D(pulse)
DR
Note1
Note 2
Channel temperature Tch 150 °C
Storage temperature Tstg –55 to +150 °C
Note: 1. PW ≤ 10 µs, duty cycle ≤ 1%
2. Value on the alumina ceramic board (12.5x 20 x0.7 mm)
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown
V
(BR)DSS
voltage
Gate to source breakdown
V
(BR)GSS
voltage
Gate to source leak current I
Zero gate voltege drain
GSS
I
DSS
current
Gate to source cutoff voltage V
Static drain to source on state R
resistance R
GS(off)
DS(on)
DS(on)
Forward transfer admittance |yfs| 32.5 50 — mS I
Input capacitance Ciss — 13 — pF VDS = -10 V
Output capacitance Coss — 10 — pF VGS = 0
Reverse transfer capacitance Crss — 1.8 — pF f = 1 MHz
Turn-on delay time t
Rise time t
Turn-off delay time t
Fall time t
d(on)
r
d(off)
f
Note: 3. Pulse test
4. Marking is DP
-20 — — V ID = -100 µA, VGS = 0
±10 — — V IG = ±100 µA, VDS = 0
——±5 µAV
——-1µAV
-0.8 — -1.8 V ID = -10µA, VDS = -5 V
— 4.1 5.0 Ω I
— 6.0 8.5 Ω I
—22—nsI
—48—nsR
—50—ns
—60—ns
-20 V
±10 V
-50 mA
-200 mA
-50 mA
100 mW
= ±8 V, VDS = 0
GS
= -20 V, VGS = 0
DS
= -25 mA,VGS = -4 V
D
= -10 mA,VGS = -2.5 V
D
= -25 mA, VDS = -10 V
D
= -25 mA, VGS = -4 V
D
= 400 Ω
L
Note 3
Note 3
Note 3
2
Main Characteristics
2SJ587
Power vs.Temperature Derating
200
150
100
50
Channel Dissipation *Pch (mW)
0
50 100 150 200
Ambient Temperature Ta ( °C)
*Value on the alumina ceramic board.(12.5x20x0.7mm)
Typical Output Characteritics
-0.2
-6 V
-5 V
-4 V
Pulse Test
-0.16
D
-0.12
-3 V
-0.08
Maximum Safe Operation Area
-5
-2
-1.0
-0.5
-0.2
D
-0.1
-0.05
-0.02
-0.01
-0.005
Drain Current I (A)
-0.002
-0.001
-0.0005
-0.05
Operation in this area
is limited by RDS(on)
Ta=25 °C
-0.1 -1.0
-0.2 -0.5
Drain to Source Voltage V (V)
Value on the alumina ceramic board.(12.5x20x0.7mm)
DC Operation
-2 -5
-10
DS
PW = 10 ms
(1 shot)
-20
Typical Transfer Characteristics
-0.2
-0.16
D
-0.12
-0.08
10 µs
100 µs
1 ms
-50
Drain Current I (A)
-0.04
0
-2 -4- -6 -8 -10
Drain to Source Voltage V (V)
V = -2V
GS
DS
Drain Current I (A)
-0.04
75 °C
0
-1 -2 -3 -4 -5
Gate to Source Voltage V (V)
Tc = –25 °C
V = -10 V
25 °C
Pulse Test
DS
GS
3