HIT 2SJ574 Datasheet

Silicon P Channel MOS FET
High Speed Switching
Features
Low on-resistance
RDS = 1.1 typ. (VGS = -10 V , ID = -150 mA) RDS = 2.2 typ. (VGS = -4 V , ID = -150 mA)
4 V gate drive device.
Small package (MPAK)
Outline
2SJ574
ADE-208-739B (Z)
3rd.Edition.
June 1999
MPAK
2
G
3
1
D
3
1
S
2
1. Source
2. Gate
3. Drain
2SJ574
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V Gate to source voltage V Drain current I Drain peak current I Body-drain diode reverse drain current I Channel dissipation Pch
DSS
GSS
D
D(pulse)
DR
Note1
Note 2
Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C
Note: 1. PW 10 µs, duty cycle 1%
2. Value on the alumina ceramic board (12.5x20x0.7mm)
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown
V
(BR)DSS
voltage Gate to source breakdown
V
(BR)GSS
voltage Gate to source leak current I Zero gate voltege drain
GSS
I
DSS
current Gate to source cutoff voltage V Static drain to source on state R resistance R
GS(off)
DS(on)
DS(on)
Forward transfer admittance |yfs| 195 300 mS I Input capacitance Ciss 50 pF VDS = -10 V Output capacitance Coss 40 pF VGS = 0 Reverse transfer capacitance Crss 15 pF f = 1 MHz Turn-on delay time t Rise time t Turn-off delay time t Fall time t
d(on)
r
d(off)
f
Note: 3. Pulse test
4. Marking is BP
-30 V ID = -100 µA, VGS = 0
±20 V IG = ±100 µA, VDS = 0
——±5 µAVGS = ±16 V, VDS = 0 ——-1µAVDS = -30 V, VGS = 0
-1.3 -2.3 V ID = -10µA, VDS = -5 V — 1.1 1.3 I 2.2 3.1 I
—20—nsI —50—nsR — 110 ns — 105 ns
-30 V ±20 V
-300 mA
-1.2 A
-300 mA 400 mW
= -150 mA,VGS = -10 V
D
= -150 mA,VGS = -4 V
D
= -150 mA, VDS = -10 V
D
= -150 mA, VGS = -10 V
D
= 66.6
L
Note 3
Note 3
Note 3
2
Main Characteristics
2SJ574
Power vs. Temperature Derating
800
600
400
200
Channel Dissipation *Pch (mW)
0
50 100 150 200
Ambient Temperature Ta ( °C)
*Value on the alumina ceramic board.(12.5x20x0.7mm)
Typical Output Characteristics
-6 V
-1.0
-7 V
-5 V
Pulse Test
-0.8
D
-0.6
-4 V
-0.4
Maximum Safe Operation Area
-5
-2
-1.0
-0.5
D
-0.2
-0.1
-0.05
-0.02
-0.01
-0.005
Drain Current I (A)
-0.002
-0.001
-0.0005
Operation in this area is limited by RDS(on)
Ta=25 °C
-0.2 -0.5
-0.1
-0.05
-1.0
Drain to Source Voltage V (V)
Value on the alumina ceramic board.(12.5x20x0.7mm)
PW = 10 ms
DC Operation
(1 shot)
-2 -5 -20
-10 DS
Typical Transfer Characteristics
-1.0
-0.8
D
-0.6
75 °C
25 °C
Tc = –25 °C
-0.4
10 µs 100 µs 1 ms
-50
Drain Current I (A)
-0.2
0
-2 -4- -6 -8 -10
Drain to Source Voltage V (V)
V = -3V
GS
DS
Drain Current I (A)
-0.2
0
-2 -4 -6 -8 -10
Gate to Source Voltage V (V)
V = -10 V
DS
Pulse Test
GS
3
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