HIT 2SJ483 Datasheet

Features
Low on-resistance
R
= 0.08typ (at VGS = –10 V, ID = –2.5 A)
4V gate drive devices.
Large current capacitance
ID = –5 A
Outline
2SJ483
Silicon P Channel MOS FET
High Speed Power Switching
ADE-208-519
1st. Edition
TO-92MOD.
G
D
3
2
1
S
1. Source
2. Drain
3. Gate
2SJ483
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V Gate to source voltage V Drain current I Drain peak current I Body to drain diode reverse drain current I
DSS
GSS
D
D(pulse)
DR
Note1
Channel dissipation Pch 0.9 W Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C
Note: 1. PW 10µs, duty cycle 1 %
–30 V ±20 V –5 A –20 A –5 A
2
2SJ483
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown
V
(BR)DSS
voltage Gate to source breakdown
V
(BR)GSS
voltage Zero gate voltege drain current I Gate to source leak current I Gate to source cutoff voltage V Static drain to source on state
R
DSS
GSS
GS(off)
DS(on)
resistance
R
DS(on)
Forward transfer admittance |yfs| 35—SI
Input capacitance Ciss 630 pF VDS = –10V Output capacitance Coss 390 pF VGS = 0 Reverse transfer capacitance Crss 135 pF f = 1MHz Turn-on delay time t Rise time t Turn-off delay time t Fall time t Body to drain diode forward
V
d(on)
r
d(off)
f
DF
voltage Body to drain diode reverse
t
rr
recovery time Note: 1. Pulse test
–30 V ID = –10mA, VGS = 0
±20——V I
= ±100µA, VDS = 0
G
–10 µAVDS = –30 V, VGS = 0 ——±10 µAVGS = ±16V, VDS = 0 –1.0 –2.0 V ID = –1mA, VDS = –10V — 0.08 0.11 ID = –2.5A
V
= –10V*
GS
0.12 0.17 ID = –2.5A
V
= –4V*
GS
= –2.5A,
D
V
= –10V*
DS
1
1
1
15 ns VGS = –10V, ID = –2.5A — 70 ns RL = 4 —65—ns —60—ns — –1.0 V ID = –5A, VGS = 0
60 ns IF = –5A, VGS = 0
diF/ dt = 20A/µs
3
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