HIT 2SJ450 Datasheet

Application
High speed power switching
Features
Low on-resistance.
High speed switching
2.5 V gate drive device.
2SJ450
Silicon P-Channel MOS FET
ADE-208-381
1st. Edition
Outline
UPAK
G
1
2
3
4
D
1. Gate
2. Drain
3. Source
4. Drain
S
2SJ450
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V Gate to source voltage V Drain current I Drain peak current I Drain peak current I Channel dissipation Pch*
DSS
GSS
D
D(pulse)
DR
1
*
2
Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C
Notes: 1. PW 100 µs, duty cycle 10%
2. When using aluminium ceramic board (12.5 × 20 × 70 mm)
–60 V ±20 V –1 A –2 A –1 A 1W
2
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test conditions
Drain to source breakdown
V
(BR)DSS
voltage Gate to source breakdown
V
(BR)GSS
voltage Zero gate voltage drain current I Gate to source leak current I Gate to source cutoff voltage V Static drain to source on state
R
DSS
GSS
GS(off)
DS(on)
resistance Static drain to source on state
R
DS(on)
resistance Fowerd transfer admittance |yfs| 0.6 1.0 S ID = –0.5 A
Input capacitance Ciss 150 pF VDS = –10 V Output capacitance Coss 72 pF VGS = 0 Reverse transfer capacitance Crss 24 pF f = 1 MHz Turn-on delay time t Rise time t Turn-off delay time t Fall time t Body to drain diode forward
V
d(on)
r
d(off)
f
DF
voltage Body to drain diode reverse
t
rr
recovery time Note: 1. Pulse Test
Marking is "UY".
–60 V ID = –10 mA, VGS = 0
±20 V IG = ±100 µA, VDS = 0
–50 µAVDS = –50 V, VGS = 0 ——±10 µAVGS = ±16 V, VDS = 0 –0.5 –1.5 V VDS = –10 V, ID = –1 mA — 0.85 1.2 ID = –0.5 A
V
= –4 V*
GS
1.1 1.9 ID = –0.3 A
V
= –2.5 V*
GS
V
= –10 V
DS
1
1
—6 —nsVGS = –10 V, ID = –0.5 A —9 —nsR
= 60
L
—50—ns —35—ns — –0.9 V IF = –1 A, VGS = 0
100 ns IF = –1 A, VGS = 0
diF/dt = 50A/µs
2SJ450
3
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