HIT 2SJ399 Datasheet

2SJ399
Silicon P-Channel MOS FET
Application
Low frequency power switching
Features
Low on-resistance
Low drive current
4 V gate drive device can be driven from 5 V source
Suitable for low signal load switch.
ADE-208-267
1st. Edition
Outline
MPAK
G
3
1
2
D
1. Source
2. Gate
3. Drain
S
2SJ399
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V Gate to source voltage V Drain current I Drain peak current I Body to drain diode reverse drain current I
DSS
GSS
D
D(pulse)
DR
1
*
Channel dissipation Pch 150 mW Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C
Notes: 1. PW 100 µs, duty cycle 10%
2. Marking is “ZF–”
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test conditions
Drain to source breakdown
V
(BR)DSS
voltage Gate to source breakdown
V
(BR)GSS
voltage Gate to source leak current I Zero gate voltage drain current I Gate to source cutoff voltage V Static drain to source on state
R
GSS
DSS
GS(off)
DS(on)
resistance
Input capacitance Ciss 1.1 pF VDS = –10 V Output capacitance Coss 22.3 pF VGS = 0 Reverse transfer capacitance Crss 0.17 pF f = 1 MHz Turn-on delay time t Rise time t Turn-off delay time t Fall time t
d(on)
r
d(off)
f
–30 V ID = –100 µA, VGS = 0
±20 V IG = ±100 µA, VDS = 0
——±2µAVGS = ±16 V, VDS = 0 ——–1µAVDS = –30 V, VGS = 0 –1.0 –2.0 V ID = –10 µA, VDS = –5 V — 2.7 5.0 ID = –20 mA
2.0 3.0 ID = –10 mA
530 ns ID = –0.1 A — 2170 ns VGS = –10 V — 7640 ns RL = 100 7690 ns PW = 5 µs
–30 V ±20 V –0.2 A –0.4 A –0.2 A
V
= –4 V*
GS
V
= –10 V*
GS
1
1
2
2SJ399
Maximum Channel Dissipation Curve
200
150
100
50
Channel Power Dissipation Pch (mW)
0
50 100 150 200
Ambient Temperature Ta (°C)
Typical Output Characteristics
–2.0
Pulse Test
–1.6
D
–1.2
–5 V
–4.5 V
Maximum Safe Operation Area
–1
1 ms
PW =
10 ms
D
–0.3
–0.1
DC Operation
–0.03
–0.01
Drain Current I (A)
–0.003
Operation in this area is limited by R
DS(on)
Ta = 25 °C
–0.001
–0.1 –0.3 –1 –3 –10 –30 –100
Drain to Source Voltage V (V)
Typical Transfer Characteristics
–0.5
V = –10 V
DS
–0.4
D
-0.3
DS
–0.8
Drain Current I (A)
–0.4
0
–2 –4 –6 –8 –10
Drain to Source Voltage V (V)
–4 V
–3.5 V
–3 V
–2.5 V
V = –2 V
GS
DS
-0.2
Drain Current I (A)
–0.1
75 °C
25 °C
Ta = –25 °C
0 –1–2–3–4–5
Gate to Source Voltage V (V)
GS
3
2SJ399
Drain to Source Saturation Voltage vs.
Gate to Source Voltage
–0.5
–0.4
DS(on)
V (V)
–0.3
–0.2
–0.1
I = –0.05 A
D
Drain to Source Saturation Voltage
0
–4 –8 –12 –16 –20
Gate to Source Voltage V (V)
Static Drain to Source on State Resistance
vs. Temperature
5
I = –0.2 A
4
DS(on)
R ( )
3
V = –4 V
GS
D
–0.1 A
–0.2 A
–0.1 A
GS
–0.05 A
I = –0.2 A
D
Static Drain to Source on State Resistance
vs. Drain Current
100
50
DS(on)
20
Ta = 25 °C Pulse Test
R ( )
10
5
V = –4 V
GS
2
Drain to Source On State Resistance
1
–0.01 –0.02 –0.05 –0.1 –0.2 –0.5 –1
Drain Current I (A)
–10 V
D
Forward Transfer Admittance vs.
Drain Current
1
fs
0.5 Ta = –25 °C
0.2
75 °C
0.1
25 °C
2
1
V = –10 V
GS
0
Static Drain to Source on State Resistance
–40 0 40 80 120 160
Case Temperature Tc (°C)
4
–0.1 A
–0.05 A
0.05
0.02
V = –10 V
DS
Pulse Test
Forward Transfer Admittance |y | (S)
0.01
–0.01 –0.02 –0.05 –0.1 –0.2 –0.5 –1
Drain Current I (A)
D
Typical Capacitance vs. Drain to Source Voltage
100
50 20
10
5 2
1
Capacitance C (pF)
0.5
0.2
0.1 –10 –20 –30 –40 –50
0
Drain to Source Voltage V (V)
Coss
Ciss
Crss
–0.5
–0.4
DR
–0.3
V = 0
GS
f = 1 MHz
DS
Reverse Drain Current vs.
Source to Drain Voltage
–10 V
10000
5000
2000
1000
500
t
d(off)
t
d(on)
t
f
t
r
Switching Time t (ns)
Switching Characteristics
V = –10 V
200
GS
PW = 5 µs
100
–0.1 –0.2 –0.5 –1 –2 –5
Drain Current I (A)
D
Pulse Test
V = 0
GS
2SJ399
–0.2
–5 V
–0.1
Reverse Drain Current I (A)
0
–0.4 –0.8 –1.2 –1.6 –2.0
Source to Drain Voltage V (V)
SD
5
Unit: mm
3 – 0.4
+ 0.10 – 0.05
0.95
1.9 ± 0.2
2.95 ± 0.2
0.95
0.65
+ 0.2
1.5 ± 0.15
0.65
0.3
+ 0.2
– 0.6
2.8
– 0.1
1.1
+ 0.10
0.16
– 0.06
0 – 0.1
Hitachi Code JEDEC EIAJ Weight
(reference value)
MPAK — Conforms
0.011 g
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document.
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3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail­safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
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Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
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