HIT 2SJ363 Datasheet

2SJ363
Silicon P-Channel MOS FET
Application
Low frequency power switching
Features
Low on-resistance
Low drive current
4 V gate drive device can be driven from 5 V source
UPAK
G
1
2
3
4
D
1. Gate
2. Drain
3. Source
4. Drain
S
2SJ363
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V Gate to source voltage V Drain current I Drain peak current I Body to drain diode reverse drain current I Channel dissipation Pch*
DSS
GSS
D
D(pulse)
DR
1
*
2
Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C
Notes: 1. PW 100 µs, duty cycle 10%
2. Value on the alumina ceramic board (12.5×20×0.7 mm)
3. Marking is “PY”.
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test conditions
Drain to source breakdown
V
(BR)DSS
voltage Gate to source breakdown
V
(BR)GSS
voltage Gate to source leak current I Zero gate voltage drain current I Gate to source cutoff voltage V Static drain to source on state R
GSS
DSS
GS(off)
DS(on)
resistance 0.35 0.45 ID = –1 A, VGS = –10 V* Forward transfer admittance |yfs| 1.4 2.0 S ID = –1 A, VDS = –10 V* Input capacitance Ciss 2.1 pF VDS = –10 V, VGS = 0, Output capacitance Coss 100 pF f = 1 MHz Reverse transfer capacitance Crss 0.25 pF Turn-on delay time t Rise time t Turn-off delay time t Fall time t
d(on)
r
d(off)
f
–30 V ID = –10 mA, VGS = 0
±20——V I
——±5µAVGS = ±16 V, VDS = 0 ——–1µAVDS = –24 V, VGS = 0 –1.0 –2.0 V ID = –100 µA, VDS = –10 V — 0.6 0.75 ID = –1 A, VGS = –4 V*
1.65 µsI —8 —µsR 25.9 µs — 14.9 µs
–30 V ±20 V –2 A –4 A –2 A 1W
= ±10 µA, VDS = 0
G
= –1 A, VGS = –10 V,
D
= 30
L
1
1
1
2
2.0
1.5
Maximum Channel Power
Dissipation Curve
D
–10
–3
–1
Maximum Safe Operation Area
100 µs
1 ms
PW =
10 ms
DC Operation
2SJ363
1.0
0.5
(on the aluminam ceramic board)
Channel Power Dissipation Pch (W)
0
50 100 150 200
Ambient Temperature Ta (°C)
Typical Output Characteristics
–4.5 V
–4 V
–2.0
–1.6
D
–3.5 V
–3 V
Pulse Test
–1.2
–2.5 V
–0.8
Drain Current I (A)
–0.4
–2 V
–0.3
–0.1
Operation in
Drain Current I (A) –0.03
this area is limited by R
DS(on)
Ta = 25 °C
–0.01
–0.1 –0.3 –1 –3 –10 –30 –100
Drain to Source Voltage V (V)
DS
Typical Transfer Characteristics
–5
–4
Ta = –25 °C
D
–3
–2
Drain Current I (A)
–1
V = –10 V
DS
25 °C
75 °C
V = –1.5 V
GS
0
–2 –4 –6 –8 –10
Drain to Source Voltage V (V)
DS
0 –1–2–3–4–5
Gate to Source Voltage V (V)
GS
3
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