hilscher COM-CA-CCS, COM-CA-DNS, COM-CA-DNM, COM-CA-EN, COM-CA-EIS Design Manual

...

Design Guide

COM-C

Communication Module

Hilscher Gesellschaft für Systemautomation mbH

www.hilscher.com

Introduction 2/64

Table of Contents

1 Introduction.............................................................................................................................................4

1.1 About this Document......................................................................................................................4

1.2 List of Revisions .............................................................................................................................6

1.3 Technical Features.........................................................................................................................8

1.4 Legal Notes ..................................................................................................................................10

1.4.1 Copyright ......................................................................................................................................... 10

1.4.2 Important Notes............................................................................................................................... 10

1.4.3 Exclusion of Liability ........................................................................................................................ 11

1.4.4 Warranty.......................................................................................................................................... 11

1.4.5 Export Regulations .......................................................................................................................... 11

2 Type of COM-C Modules......................................................................................................................12

2.1 Mechanical Dimensions ...............................................................................................................13

2.1.1 Common Mechanical Dimensions for COM-C Modules .................................................................. 13

2.1.2 Mechanical Dimensions of COM-C Modules ................................................................................... 14

2.2 Type of Connector........................................................................................................................20

2.3 Mounting of COM-C Modules ......................................................................................................22

2.4 Designation of the COM-C...........................................................................................................28

2.5 Meaning of the Rotary Switch ......................................................................................................29

3 Host Interface .......................................................................................................................................30

3.1 COM Pinning of the System Bus Connector X1 ..........................................................................31

3.2 COM-CA-SCEB Pinning of the System Bus Connector X1.........................................................33

3.3 Signal Overview and Pinning of the Fieldbus Connector X2 on COM-CN ..................................35

3.3.1 Fieldbus Connector X2 for AS-Interface-Master.............................................................................. 35

3.3.2 Fieldbus Connector X2 for CANopen-Master/-Slave ....................................................................... 36

3.3.3 Fieldbus Connector X2 for DeviceNet-Master/-Slave ...................................................................... 37

3.3.4 Fieldbus Connector X2 for PROFIBUS-Master/-Slave .................................................................... 38

3.3.5 Fieldbus Connector X2 for Ethernet ................................................................................................ 39

3.3.6 Fieldbus Connector X2 for CC-Link-Slave....................................................................................... 40

3.4 Signals of the Host Interface........................................................................................................41

3.4.1 Power Supply of the COM-C Modules............................................................................................. 41

3.4.2 RESET Signal ................................................................................................................................. 41

3.4.3 The Dual-port Memory Bus of COM ................................................................................................ 41

3.4.4 Address Bus and Data Bus ............................................................................................................. 42

3.4.5 Dual-Port Memory Control Lines ..................................................................................................... 42

3.4.6 Interrupt Line to the Host System .................................................................................................... 43

3.4.7 Busy Line to the Host System.......................................................................................................... 43

3.4.8 Interfacing to the Dual-Port Memory of COM-C............................................................................... 43

3.4.9 Timing Diagram of COM-C .............................................................................................................. 44

3.4.10 Interfacing to the Dual-Port Memory for COM-CA-SCEB ................................................................ 46

3.4.11 Timing Diagram of COM-CA-SCEB................................................................................................. 46

3.5 Integration a COM-C Module into a Host System........................................................................47

4 LEDs ......................................................................................................................................................48

4.1 LEDs for COM Modules ...............................................................................................................49

4.1.1 Ethernet........................................................................................................................................... 49

4.1.2 EtherNet/IP Adapter (Slave) ............................................................................................................ 49

4.1.3 AS-Interface Master......................................................................................................................... 50

4.1.4 CANopen Master............................................................................................................................. 51

4.1.5 CANopen Slave............................................................................................................................... 51

4.1.6 CC Link Slave.................................................................................................................................. 52

4.1.7 DeviceNet Master............................................................................................................................ 53

4.1.8 DeviceNet Slave.............................................................................................................................. 53

4.1.9 InterBus Slave ................................................................................................................................. 54

4.1.10 PROFIBUS DP Master .................................................................................................................... 55

4.1.11 PROFIBUS DP Slave ...................................................................................................................... 55

4.1.12 SERCOS (optical)............................................................................................................................ 56

5 Device Address ....................................................................................................................................57

6 Diagnostic Interface.............................................................................................................................58

6.1 Diagnostic Interface RS232C.......................................................................................................58

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7 Technical Data......................................................................................................................................59

7.1 Product Tests ...............................................................................................................................61

8 Appendix...............................................................................................................................................63

8.1 List of Tables................................................................................................................................63

8.2 List of Figures...............................................................................................................................63

8.2.1 Contacts .......................................................................................................................................... 64

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1 Introduction

1.1 About this Document

All OEM piggyback Modules of Hilscher GmbH are called COM (Communication Modules). These

Modules provide a universal and easy to use fieldbus interface for integration on various host systems. Through the set of standard application interfaces and the same board dimensions in each COM family it is easy to switch between the different fieldbus systems, e.g. PROFIBUS DP, InterBus, CANopen, DeviceNet or Ethernet by changing the Module.

This manual describes only the hardware part of the Modules. The general application interface is common to all our COM Modules and CIF PC cards described in our Toolkit-Manual and the fieldbus related details are defined in our Protocol Interface Manuals.

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A new generation of communication Modules exists named COMX Modules and offer beside fieldbus communication also Real-Time Ethernet communication. The application interface is different (not compatible) compared to COM Modules. The COMX Modules are described in an own manual now. The following two tables give a comparison of both COM and COMX Modules.

Comparison COM and COMX Modules

Basic differences between COM-C and COMX-C

COM-C COMX-C

Processor EC1 netX

Host Interface 8 Bit 8 / 16 Bit

Dual-Port Memory size 2 KByte or 8 KByte 16 KByte

USB Interface No Yes

Table 1: Basic differences between COM and COMX

Comparison of supported protocols for COM-C and COMX-C

COM-C COMX-C

AS-Interface Master supported in preparation

CANopen Master supported supported

CANopen Slave supported supported

CC-Link Slave supported supported

CompoNet Slave - in preparation

DeviceNet Master supported supported

DeviceNet Slave supported supported

InterBus Slave supported not supported by netX technology

PROFIBUS DP Master supported supported

PROFIBUS DP Slave supported supported

SERCOS II supported not supported by netX technology

EtherCAT Master - supported

EtherCAT Slave - supported

EtherNet/IP Scanner (Master) - supported

EtherNet/IP Adapter (Slave) supported supported

Open Modbus/TCP supported supported

POWERLINK Controlled Node - supported

PROFINET IO RT Controller - supported

PROFINET IO RT Device - supported

SERCOS III Master - supported

SERCOS III Slave - supported

Table 2: Comparison of supported protocols for COM and COMX

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1.2 List of Revisions

Rev Date Name Revision

7 2009-10-01 H. Hentsch COMX-CA-DP, COMX-CN-DP, COMX-CA-CO, COMX-CN-CO, COMX-CA-CO,

COMX-CN-CO, COMX-CA-CCS and COMX-CN-CCS added Chapter 1 restructured Table

Basic differences between COM and COMX and Comparison of supported

protocols for COM and COMX added.

Figure Block Diagram of the COMX-C Modules and explaining text added Section Mechanical Dimensions of COM-A Modules: M0400272 (update),

M0900141 (new)

Section Mechanical Dimensions of COM-B Modules: M0400282 (update),

M0900151 (new), M0400291 (kept) Section

M0200373 (update), M0200463 (kept), M0300632 (update), M0400353 (update), M0400363 (update), M0600172 (update), M0900161 (new)

Section M0600121 (new), M0900102 (new), M0200402 (kept)

Section Section : SYNC Signals added

Section Signal Overview and Pinning of the Fieldbus Connector X2 on COM-CN:

Added that Pin 21 is used for isolation

Section Timing Diagram of the COMX-C: Both tables updated and notes ex-

panded

Section LEDs divided into LEDs for COM and LEDs for COMX Subsections in LEDs for COMX Modules updated respectively added

Section

8 2009-10-27 H. Hentsch Section Diagnostic Interface USB:: USB interface circuit modified

Temperature range for COMX Modules. -20 … 65°C

9 2009-11-11 H. Hentsch Section Fieldbus Connector X2 for Real-Time Ethernet:

- LED names changed to COM0 and COM1

- Figure 6 with example added Section LEDs:

- Figure 14: Example how to connect the LEDs COMX-CN Fieldbus and

- Figure 15: Example how to connect the LEDs COMX-CN-RE added Section LEDs for COMX Modules with references to signal COM0 and COM1 for

all Real-Time Ethernet protocols

Table 3: List of Revisions (Part 1)

Mechanical Dimensions of COM-C Modules:

Mounting of COM-C Modules: M0500081 (new), M0100084 (update),

Mounting of COM-C Modules expanded (4 bolt types)

Technical Data: New modules added

Continued on next page.

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Rev Date Name Revision

10 2010-07-13 H. Hentsch Table 2: Comparison of supported protocols for COM and COMX updated:

CANopen Slave, PROFIBUS DP Slave and DeviceNet Slave for COMX-C supported

Table 9: Available COMX-C Modules updated with COMX-C for Fieldbus Slaves Table 7: Usage of Bolt for COM Modules updated Designation of the COM-C expanded

Section Fieldbus Connector X2 for CANopen-Master/-Slave: COMX-CN-COS

added Section

Section Fieldbus Connector X2 for PROFIBUS-Master/-Slave: Note 2 added Section Diagnostic Interface USB: Note removed, because firmware now supports

USB

Table 74: Hardware Revision of COMX Modules with new USB Interface updated Table 75: Hardware Revision of COMX Modules with old USB Interface updated

German text replaced by English text in the following drawings: M0500081, M0500084, M0600121, M0900141, M0900151, M0400353

Section SERCOS III Slave, CANopen Slave, DeviceNet Slave and PROFIBUS

DP Slave added with LED Description Table 38: Technical Data – Operating Condition: COMX-Cx-COS, COMX-Cx-DNS

and COMX-Cx-DPS added

11 2011-03-20 H. Hentsch Section Mechanical Dimensions of COM-C Modules:

M0200373 updated to M0200374, M0200463 updated to M0200464. Tolerance of PCB thickness is 1.00 mm (-0,0 +0,2)

Section

12 2011-06-10 R. Göbel

H. Hentsch

Table 4: List of Revisions (Part 2)

Separation of documents for COM and COMX. This manual contains the description for COM. COM-A and COM-B removed as they are to be discontinued. Section Mechanical Dimensions of COM-C Modules: Section updated, M0200374

updated, M0300632 updated Table 5: COM-CA-EIS and COM-CN-EIS added

Section Meaning of the Rotary Switch added

Fieldbus Connector X2 for DeviceNet-Master/-Slave: COMX-CN-DNS

Fieldbus Connector X2 for PROFIBUS-Master/-Slave: COMX-CN-DPS

Fieldbus Connector X2 for CANopen-Master/-Slave: Note 2 added

Type of Connector: Headline ‘Cheaper version’ set to right position

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1.3 Technical Features

Common Technical Features for COM-C

 Small footprint for the host connector with 50 mil grid

 Solid mechanical assembly and a massive connection to earth ground by metal blocks spe-

cial design for the requirements of the Modules with fieldbus connector

 Two dowels for exact mounting of the Module on the host board

 Metal blocks can easily modified for special customer requirements

 Front panel can be mounted on the metal blocks that the modules have always the same

front size and covers the fieldbus connector

 Easy to use dual-port memory interface, with additional serial and diagnostic interface

 Host interface is designed for 16 KByte address space of the dual-port memory with 8 bit bus

width.

 3.3 V power supply reduce power consumption

 Available in extended temperature specification

With the COM-C we have a much more compact form factor and additional technical features as the already established COM Modules.

 Extremely compact size 30 x 70 mm

 Available with angled and without fieldbus connector

 All fieldbus connectors are placed on one side, which is the edge side on the host board to

reserves space

 2.5 mm space below the Module available for SMD components on the host board

Now you can have only one type of base board (for each COM family) on stock and you can mount the requested fieldbus interface short before shipment to the customer. This gives much more flexibility and saves money even if you have same mechanical constraints (for each COM family) in comparison to our existing COM Modules. Therefore we have Modules with angled, straight and without fieldbus connectors:

 COM-CA COM-C Modules with angled fieldbus connector

 COM-CN COM-C Modules without fieldbus connector

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Description of COM Modules

All COM-C have a powerful processor and a complete fieldbus interface including isolated drivers and the connector according to the standard. The slave modules have additional rotary switches to set up the station address.

All boards require only a single stabilized 3.3 Voltage. All other voltages are created by DC/DC converter on the COM-C Module.

The access to the COM-C Module is through the dual-port memory which can be easily integrated as a static memory device. It has a non multiplexed 8 bit data bus with several control lines to the host system. Between the COM-C Module and the host system it is possible to generate interrupts for data handling.

Generally the firmware and the configuration data are stored permanently in FLASH memory by loading the data through the dual port memory or the serial diagnostic line.

Figure 1: Block Diagram of the COM-C Modules

Note: The COM-CA-SCEB has only the special communication interface chip SERCON 816

on board. Programming of this chip must be done directly from the host application. The description of the communication interface chip SERCON 816 can be get from the ‘SERCOS International’.

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1.4 Legal Notes

1.4.1 Copyright

The images, photographs and texts in the accompanying material (user manual, accompanying texts, documentation, etc.) are protected by German and international copyright law as well as international trade and protection provisions. You are not authorized to duplicate these in whole or in part using technical or mechanical methods (printing, photocopying or other methods), to manipulate or transfer using electronic systems without prior written consent. You are not permitted to make changes to copyright notices, markings, trademarks or ownership declarations. The included diagrams do not take the patent situation into account. The company names and product descriptions included in this document may be trademarks or brands of the respective owners and may be trademarked or patented. Any form of further use requires the explicit consent of the respective rights owner.

1.4.2 Important Notes

The user manual, accompanying texts and the documentation were created for the use of the products by qualified experts, however, errors cannot be ruled out. For this reason, no guarantee can be made and neither juristic responsibility for erroneous information nor any liability can be assumed. Descriptions, accompanying texts and documentation included in the user manual do not present a guarantee nor any information about proper use as stipulated in the contract or a warranted feature. It cannot be ruled out that the user manual, the accompanying texts and the documentation do not correspond exactly to the described features, standards or other data of the delivered product. No warranty or guarantee regarding the correctness or accuracy of the information is assumed.

We reserve the right to change our products and their specification as well as related user manuals, accompanying texts and documentation at all times and without advance notice, without obligation to report the change. Changes will be included in future manuals and do not constitute any obligations. There is no entitlement to revisions of delivered documents. The manual delivered with the product applies.

Hilscher Gesellschaft für Systemautomation mbH is not liable under any circumstances for direct, indirect, incidental or follow-on damage or loss of earnings resulting from the use of the information contained in this publication.

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1.4.3 Exclusion of Liability

The software was produced and tested with utmost care by Hilscher Gesellschaft für Systemautomation mbH and is made available as is. No warranty can be assumed for the performance and flawlessness of the software for all usage conditions and cases and for the results produced when utilized by the user. Liability for any damages that may result from the use of the hardware or software or related documents, is limited to cases of intent or grossly negligent violation of significant contractual obligations. Indemnity claims for the violation of significant contractual obligations are limited to damages that are foreseeable and typical for this type of contract.

It is strictly prohibited to use the software in the following areas:

 for military purposes or in weapon systems;

 for the design, construction, maintenance or operation of nuclear facilities;

 in air traffic control systems, air traffic or air traffic communication systems;

 in life support systems;

 in systems in which failures in the software could lead to personal injury or injuries leading to

death.

We inform you that the software was not developed for use in dangerous environments requiring fail-proof control mechanisms. Use of the software in such an environment occurs at your own risk. No liability is assumed for damages or losses due to unauthorized use.

1.4.4 Warranty

Although the hardware and software was developed with utmost care and tested intensively, Hilscher Gesellschaft für Systemautomation mbH does not guarantee its suitability for any purpose not confirmed in writing. It cannot be guaranteed that the hardware and software will meet your requirements, that the use of the software operates without interruption and that the software is free of errors. No guarantee is made regarding infringements, violations of patents, rights of ownership or the freedom from interference by third parties. No additional guarantees or assurances are made regarding marketability, freedom of defect of title, integration or usability for certain purposes unless they are required in accordance with the law and cannot be limited. Warranty claims are limited to the right to claim rectification.

1.4.5 Export Regulations

The delivered product (including the technical data) is subject to export or import laws as well as the associated regulations of different counters, in particular those of Germany and the USA. The software may not be exported to countries where this is prohibited by the United States Export Administration Act and its additional provisions. You are obligated to comply with the regulations at your personal responsibility. We wish to inform you that you may require permission from state authorities to export, re-export or import the product.

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2 Type of COM-C Modules

The following table shows an overview about the availability of the different COM-C Modules.

Module Fieldbus / Protocol Type Connector

COM-CA-ASM AS-Interface Master angled

COM-CA-COS CANopen Slave angled

COM-CA-COM CANopen Master angled

COM-CA-CCS CC-Link Slave angled

COM-CA-DNS DeviceNet Slave angled

COM-CA-DNM DeviceNet Master angled

COM-CA-EN Ethernet angled

COM-CA-EIS EtherNet/IP Slave angled

COM-CA-IBS INTERBUS Slave angled

COM-CA-DPS PROFIBUS DP Slave angled

COM-CA-DPM PROFIBUS DP Master angled

COM-CA-SCEB SERCOS angled

COM-CN-ASM AS-Interface Master No

COM-CN-COS CANopen Slave No

COM-CN-COM CANopen Master No

COM-CN-CCS CC-Link Slave No

COM-CN-DNS DeviceNet Slave No

COM-CN-DNM DeviceNet Master No

COM-CN-EN Ethernet No

COM-CN-EIS EtherNet/IP Slave No

COM-CN-DPS PROFIBUS DP Slave No

COM-CN-DPS\NR (NR = No Rotary switch)

COM-CN-DPM PROFIBUS DP Master No

Table 5: Available COM-C Modules

PROFIBUS DP Slave No

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2.1 Mechanical Dimensions

2.1.1 Common Mechanical Dimensions for COM-C Modules

After mounting the COM-CA Module parallel at a basis board the rotary switches, LEDs and the fieldbus connector are on the top side and are angled to the basis board. The edge of all front elements are in one layer which is 2.5 mm ahead of the edge of printed circuit board of the COM Module.

The COM-CN Module has to be used if the mechanical dimensions or order of the LEDs, switches and fieldbus connector doesn't fit. In that case you have to place these components directly on the motherboard and feed the signals to the connector X2 of the COM-CN Module.

Note Please take care on the isolation distance, because the optical isolation interface is on

the Module! Especially for 12 MBit PROFIBUS the distance should as be less as possible. For Ethernet, the signal traces should run parallel and should have the same length. Please refer at the fieldbus standards for further information!

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2.1.2 Mechanical Dimensions of COM-C Modules

The COM-C Module has a board size of 30 x 70 mm. The maximum height of the components at the top side of the printed circuit board is 14.0 mm including the fieldbus connector. Keep the space of 14.0 mm above the top side free.

At the bottom side the maximum height is 4.0 mm, therefore you have 2.5 mm space for components on the host board below the Module. The power dissipation in that area should be less than 330 maw!

For further Module development please reserve additional 10 mm space behind the Module. There are a few larger fieldbus interfaces which do not fit on the small board space. In that case a second printed circuit board will be mounted on top of the Module and the 10 mm space is necessary for the connection with flex stripe between these boards.

The general dimensions of the COM-C Modules are shown on the following drawings:

 M0200374 General Mechanical dimension of COM-CA-XXX

 M0200464 Mechanical dimension of COM-CN-XXX

 M0300632 Mechanical dimension of light pipe of COM-CA-XXX

 M0400353 Mechanical dimension of Front Plate and Connector of COM-CA-XXX (part 1)

 M0400363 Mechanical dimension of Front Plate and Connector of COM-CA-XXX (part 2)

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2.2 Type of Connector

The connector X1 for the host interface is a 50 pins SMT female type with a grid of 1.27 mm. The COM-CN Modules have an additional fieldbus connector X2 with 30 pins of the same family.

The connector of the motherboard is the corresponding male type and can be ordered as follows:

In Germany FJH die Steckverbinder GmbH Hinter dem Turm 7 D-55286 Wörrstadt

Germany Tel. +49 (0) 67 32 / 93 27 -0 Fax +49 (0) 67 32 / 93 27 -27

Web: www.fjh.de

Email:

info@fjh.de

50 pin. Box header 127 KA - 050 SB 30 pin. Box header 127 KA - 030 SB

World Wide SAMTEC www.samtec.com

Cheaper version

50 pin. Connector TFM - 125 - 02 - S - D – A TFC - 125 - 02 - F - D – A 30 pin. Connector TFM - 115 - 02 - S - D – A TFC - 115 - 02 - F - D – A

Note: Datasheet of SAMTEC TFM connector see next page!

Please notice that the polarization of X1 and X2 is opposite to Pin 1!

The fieldbus connector on the Module is defined by the fieldbus standard as followed:

Fieldbus Connector Vendor

AS-Interface 2 pin, COMBICON, male

Grid 5.08 mm CANopen 9 pin, DSub, male div. Vendor DeviceNet 5 pin, COMBICON, male

Grid 5.08 mm Ethernet 8 pin, RJ45, female div. Vendor PROFIBUS 9 pin, DSub, female div. Vendor InterBus 9 pin, DSub, male, female div. Vendor CC-Link 5 pin, COMBICON, male

Grid 5.08 mm

Table 6: Connector Types

ie. PHOENIX Contact MSTBA2,5/2-5,08-G

ie. PHOENIX Contact MSTBA2,5/5-5,08G-AU

ie. PHOENIX Contact MSTBA2,5/5-G-AU

Please use the same type of connector at the motherboard if you have chosen the COM-CN Module.

COM-C | Communication Module

+ 44 hidden pages

hilscher COM-CA-CCS, COM-CA-DNS, COM-CA-DNM, COM-CA-EN, COM-CA-EIS Design Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

1 Introduction

1.1 About this Document

1.2 List of Revisions

1.3 Technical Features

1.4 Legal Notes

1.4.1 Copyright

1.4.2 Important Notes

1.4.3 Exclusion of Liability

1.4.4 Warranty

1.4.5 Export Regulations

2 Type of COM-C Modules

2.1 Mechanical Dimensions

2.1.1 Common Mechanical Dimensions for COM-C Modules

2.1.2 Mechanical Dimensions of COM-C Modules

2.2 Type of Connector