HF-LPB1
25 Low Power Wi-Fi Module User Manual
HF-LPB125
Low
Power
W
i-Fi
Module User Manual
Overview of Characteristic
Support IEE
Based on Self-developed High Cost SOC
E802.11b/g/n Wireless Standards
V1.0
Ultra-Low-Power for Battery Applications with Excellent Power Save Scheme
Support UART/GPIO Data Communication Interface
Support Work As STA/APMode
Support Smart Link Function (APP program provide)
Support Wireless and Remote Firmware Upgrade Function
Support Internal Antenna Option
Single +5V Power Supply, +5V UART Voltage.
Smallest Size: 41.3mm x 24.1mm x 6mm, 2x4 Pin 2.54mm pin header or 4 Pin 2.5mm
Header
FCC/CE Certificated
Shanghai
High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) -1-
HF-LPB
125 Low Power Wi-Fi Module User Manual
TABLE OF
LISTOF
LIST OF TABLES
HISTORY.................................................................................................................................................................5
1. PRODUCT OVERVIEW
2. PACKAGE INFORMATION
FIGURES
1.1. General Description
1.1.1 Device Features
1.1.2 Device Paremeters
1.1.3 Key Application
1.2. Hardware Introduction
1.2.1. Pins Definition
1.2.2. Electrical Characteristics
1.2.3. Mechanical Size
1.2.4. Order Information
1.3. Typical Application
2.1. Recommended Reflow Profile
2.2. Device Handling Instruction (Module IC SMT Preparation)
2.3. Shipping Information(TBD)
.................................................................................................................................................
..................................................................................................................................................
............................................................................................................................
.............................................................................................................................
..............................................................................................................................
.........................................................................................................................
...............................................................................................................................
........................................................................................................................
.................................................................................................................................
...............................................................................................................
...........................................................................................................................
.........................................................................................................................
............................................................................................................................
..................................................................................................................
........................................................................................................
.............................................................................................................
CONTENTS
....................................................
10
11
11
12
12
12
13
3
4
6
6
6
7
7
8
8
9
APPENDIX E: CONTACT INFORMATION
...............................................................................................
16
Shangh
ai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) -2-
HF-LPB
125 Low Power Wi-Fi Module User Manual
LIST OF F
gu
re 1. HF-LPB125 Pins Map
Fi
Figure 2. HF-LPB125 Mechanical Dimension
Figure 3. HF-LPB125 Order Information
Figure 4. Reflow Soldering Profile
Figure 5. Shipping Information
IGURES
........................................................................................................................
.......................................................................................................
..................................................................................................................
........................................................................................................................
..............................................................................................
8
10
11
12
13
Shangh
ai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) -3-
HF-LPB
125 Low Power Wi-Fi Module User Manual
OF TABLES
LIST
Table 1 HF
Table 2 HF-LPB125 Pins Definition
Table 11 Reflow Soldering Parameter
-LPB125 Module Technical Specifications
.................................................................................
................................................................................................................
............................................................................................................
7
8
12
Shangh
ai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) -4-
HF-LPB
125 Low Power Wi-Fi Module User Manual
HISTORY
Ed.
V1.0 03
02-2016 First Version.
-
Shangh
ai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) -5-
HF-LPB1
25 Low Power Wi-Fi Module User Manual
1. PRODUCT OVERVIEW
1.1. Ge
The HF-LPB125 is
which provide a wireless interface to any equipment with a Serial/SPI interface for data transfer.HF-
LPB125 integrate MAC, baseband processor, RF transceiver with power amplifier in hardware and all
Wi-Fi protocol and configuration functionality and networking stack, in embedded firmware to make a
fully self-contained 802.11b/g/n Wi-Fi solution for a variety of applications.
The HF-LPB125 employs the world's lowest power consumption embedded architecture. It has been
optimized for all kinds of client applications in the home automation, smart grid, handheld device,
personal medical application and industrial control that have lower data rates, and transmit or receive
data on an infrequent basis.
The HF-LPB125 integrates all Wi-Fi functionality into a low-profile, 41.3mm x 24.1mm x 6mm SMT
module package that can be easily mounted on main PCB with application specific circuits. Also,
module provides built-in antenna option.
1.1.1 Device Features
Single stream Wi-Fi @ 2.4 GHz with support for WEP security mode as well as WPA/WPA2
Based on Self-developed High Cost Performance MCU
Ultra-low-power operation with all kinds of power-save modes.
Includes all the protocol and configuration functions for Wi-Fi connectivity.
Support STA/AP Mode
Support Smart Link Function
Support Wireless and Remote Firmware Upgrade Function
Integrated PCB antenna or I-PEX antenna connector options.
Compact surface mount module 41.3mm x 24.1mm x 6mm.
Full IPv4 stack.
Low power RTOS and drivers.
CE/FCC Certified.
RoHS compliant.
Single supply – 5V operation.
neral Description
a fully self-contained small form-factor, single stream, 802.11b/g/n Wi-Fi module,
Shanghai
High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) -6-
HF-LPB1
1.1.2De
25 Low Power Wi-Fi Module User Manual
v
ice Paremeters
Table 1 HF-LPB125 Module Technical Specifications
Class Item Parameters
Certification FCC/CE
Wireless standard 802.11 b/g/n
Frequency range 2.412GHz-2.462G
802.11b: +16 +/-2dBm (@11Mbps)
Wir
eless
Parameters
smit Power
Tran
802.11g: +14 +/-2dBm (@54Mbps)
802.11n: +13 +/-2dBm (@HT20, MCS7)
802.11b: -93 dBm (@11Mbps ,CCK)
Receiver Sensitivity
802.11g: -85 dBm (@54Mbps, OFDM)
802.11n: -82 dBm (@HT20, MCS7)
Hz
Hardware
Parameters
Software
Parameters
Antenna Option
Data Interface
Internal:On-board PCB antenna
UART
GPIO
Operating Voltage 4.75~6V
Peak [Continuous TX]: ~300mA
Operating Current
Normal [WiFi ON/OFF, DTIM=100ms]:
Average. ~12mA, Peak: 300mA
Operating Temp.
Storage Temp.
-20℃-85℃
-40℃- 125℃
Dimensions and Size 41.3mm x 24.1mm x 6mm
External Interface
2x4 pin 2.54mm PIN or 4pin 2.5mm
header
Network Type STA /AP
Security Mechanisms WEP/WPA-PSK/WPA2-PSK
Encryption WEP64/WEP128/TKIP/AES
Update Firmware Local Wireless, Remote
Customization Support SDK for application develop
Network Protocol IPv4, TCP/UDP/HTTP
User Configuration
AT+instruction set. Android/ iOS
Smart Link APP tools
1.1.3Ke
Application
y
Remote equipment monitoring
Asset tracking and telemetry
Security
Industrial sensors and controls
Home automation
Medical devices
Shanghai
High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) -7-
PB125 Low Power Wi-Fi Module User Manual
A
HF-L
Hardware Introduction
1.2.
1.2.1.
Pins Definition
Figure 1
Table 2 HF-LPB125 Pins Definition
Pin Desc
1 +5V Power DVDD Power 5V@250m
2Gr
3 UART0 UART0_RX I,PU 5V, GPIO19. No connect if not
4 UART0 UART0_TX O,PU 5V, GPIO20. No connect if not
5 Multi-Function nReload I,PU 3.3V, GPIO2. Detailed
6 Module Reset EXT_RESETn I,PU 3.3V, “Low” effective reset input.
7 GPIO GPIO5 I/O 3.3V I/O, UART1_TXD debug
8 GPIO GPIO6 I/O 3.3V I/O, UART1_RXD debug
ribtion
ound GNDPower
. HF-LPB125 Pins Map
Name
Net
Signal
pe
Ty
Commen
functions see <Notes>
output
No connect if not use.
No connect if not use.
ts
use.
use.
input
Shang
hai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) -8-
PB125 Low Power Wi-Fi Module User Manual
HF-L
tes>
<No
Module Pin4 must be high when bootup.
nReload Pin (Button) function：
Wh
1.
en this pin is set to “low” during module boot up, the module will enter wireless
firmware and config upgrade mode. This mode is used for customer manufacture.
(See Appendix D to download software tools for customer batch configuration and
upgrade firmware during mass production)
2. After module is powered up, short press this button ( “Low” < = 2s ) to make the
module go into “Smart Link “ config mode, waiting for APP to set password and
other information. (See Appendix D to download SmartLink APP)
3. After module is powered up, long press this button ( “Low” >= 4s ) to make the
module recover to factory setting.
High-Flying strongly suggest customer fan out this pin to connector or button for
“Manufacture” and “ Smart Link” application.
1.2.2. Electrical Characteristics
Absolute Maximum Ratings:
Parame
ter
Co
ndition
Min. Typ.Max. Uni
Storage temperature range -40 125 °C
Maximum soldering temperature IPC/JEDEC J-STD-020 260 °C
Supply voltage 4.75 6 V
Voltage on any I/O pin 0 5/3.3 V
ESD (Human Body Model HBM) TAMB=25°C 2.5 KV
ESD (MM) TAMB=25°C 0.25 KV
Power
Parame
Supply & Power Consumption:
ter
Co
ndition
Min. Typ.Max. Uni
Operating Supply voltage 4.75 5 6 V
Supply current, peak Continuous Tx 280 mA
Supply current, IEEE PS DTIM=100ms 20 mA
t
t
Shang
hai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) -9-
PB125 Low Power Wi-Fi Module User Manual
HF-L
.
1.2.3
Mechanical Size
HF-LPB125 modules physical size （Unit: mm） as follows:
Figure 2
. HF-LPB125 Mechanical Dimension
Shang
hai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) -
10
-
PB125 Low Power Wi-Fi Module User Manual
HF-L
.
1.2.4
Base on customer detailed requirement, HF-LPB125 series modules provide different variants and
physical type for detailed application.
Order Information
Figure 3
1.3. Typ
er to HF-LPB120 user manual for detailed application and module usage.
Ref
ical Application
. HF-LPB125 Order Information
Shang
hai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) -
11
-
PB125 Low Power Wi-Fi Module User Manual
HF-L
2. P
ACKAGE INFORMATION
2.1. Reco
mmended Reflow Profile
Fi
gure 4. Reflow Soldering Profile
Table 11 Reflow Soldering Parameter
NO. Item Tempe
1 Reflow Time Time of above 220
rature (Degree)
Time(Se
35~55 sec
c)
2 Peak-Temp 260 max
Note:1.Recommend to supply N2 for reflow oven.
2. N2 atmosphere during reflow (O2<300ppm)
2.2. Device
1. Shelf
2. After bag is opened, devices that will be re-baked required after last baked with window time
3. Recommend to oven bake with N2 supplied
4. Recommend end to reflow oven with N2 supplied
5. Baked required with 24 hours at 125+-5℃ before rework process for two modules, one is
6. Recommend to store at ≦10% RH with vacuum packing
7. If SMT process needs twice reflow:
Note:
Handling Instruction (Module IC SMT Preparation)
life in sealed bag: 12 months, at <30℃ and <60% relative humidity (RH)
168 hours.
new module and two is board with module
(1) Top side SMT and reflow (2) Bottom side SMT and reflow
Case 1: Wifi module mounted on top side. Need to bake when bottom side processover168
hours window time, no need to bake within 168 hours
Case 2: Wifi module mounted on bottom side, follow normal bake rule before process
Window
time means from last bake end to next reflow start that has 168 hours space.
Shang
hai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) -
12
-
PB125 Low Power Wi-Fi Module User Manual
HF-L
Shipping Information(TBD)
2.3.
E BOX
TAP
S
ize: 340*340*70 mm Size: 340*340*350 mm (inside)
Fi
gure 5. Shipping Information
Note:
1tape=500pcs
1 box = 5 tapes = 5 * 500 pcs = 2500pcs
FCC STATEMENT:
This devi
conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received, including interference that may cause
Warning: Changes or modifications not expressly approved by the party responsible for compliance
could void the user's authority to operate the equipment.
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation.
This equipment generates uses and can radiate radio frequency energy and, if not installed and used
in accordance with the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation. If this
equipment does cause harmful interference to radio or television reception, which can be determined
ce complies with Part 15 of the FCC Rules. Operation is subject to the following two
undesired operation.
Shang
hai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) -
13
-
HF-LPB125 Low Power Wi-Fi Module User Manual
by turning the equipment off and on, the user is encouraged to try to correct the interference by one or
more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
FCC Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
This equipment should be installed and operated with minimum distance 20cm between the radiator &
your body.
FCC INFORMATION (additional)
OEM INTEGRATION INSTRUCTIONS:
This device is intended only for OEM integrators under the following conditions: The module must
be installed in the host equipment such that 20 cm is maintained between the antenna and users,
and the transmitter module may not be co-located with any other transmitter or antenna. The
module shall be only used with the internal antenna(s) that has been originally tested and
certified with this module. As long as 3 conditions above are met, further transmitter test will not
be required. However, the OEM integrator is still responsible for testing their end-product for any
additional compliance requirements required with this module installed (for example, digital
device emissions, PC peripheral requirements, etc.).
Validity of using the module certification:
In the event that these conditions cannot be met (for example certain laptop configurations or co-
location with another transmitter), then the FCC authorization for this module in combination with
the host equipment is no longer considered valid and the FCC ID of the module cannot be used
on the final product. In these circumstances, the OEM integrator will be responsible for re-
evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.
Shanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) -
14
-
HF-LPB125 Low Power Wi-Fi Module User Manual
End product labeling:
The final end product must be labeled in a visible area with the following: “Contains FCC ID:
2ACSVHF-LPB125”.
Information that must be placed in the end user manual:
The OEM integrator has to be aware not to provide information to the end user regarding how to
install or remove this RF module in the user's manual of the end product which integrates this
module. The end user manual shall include all required regulatory information/warning as show in
this manual.
Antenna Specification:
Type: PCB Antenna
Model: HF-LPB125
Brand: High-Flying
Gain: 3dBi
Shanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) -
15
-
HF-LPB125 Low Power Wi-Fi Module User Manual
APPENDIX E: CONTACT INFORMATION
-----------------------------------------------------------------------------------------------------------Address: Room 1002,Building 1,No.3000,Longdong Avenue,Pudong New
Area,Shanghai,China,201203
Web: www.hi-flying.com
Service Online: 400-189-3108/18616078755
Sales Contact: sales@hi-flying.com
-----------------------------------------------------------------------------------------------------------
For more information about High-Flying modules, applications, and solutions, please visit our web site
http://www.hi-flying.com/en/
<END OF DOCUMENT>
© Copyright High-Flying, May, 2011
The information disclosed herein is proprietary to High-Flying and is not to be used by or disclosed to
unauthorized persons without the written consent of High-Flying. The recipient of this document shall respect the
security status of the information.
The master of this document is stored on an electronic database and is “write-protected” and may be altered only
by authorized persons at High-Flying. Viewing of the master document electronically on electronic database
ensures access to the current issue. Any other copies must be regarded as uncontrolled copies.
Shanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) -
16
-
Loading...