HPE ProLiant XL170r Gen10 Server
Maintenance and Service Guide
Abstract
This guide describes identification and maintenance procedures, diagnostic tools, specifications, and
requirements for hardware components and software. This guide is for an experienced service technician.
Hewlett Packard Enterprise assumes you are qualified in the servicing of computer equipment, trained in
recognizing hazards in products, and are familiar with weight and stability precautions.
Part Number: 879103-007
Published: December 2019
Edition: 7
Copyright 2017-2019 Hewlett Packard Enterprise Development LP
Notices
The information contained herein is subject to change without notice. The only warranties for Hewlett Packard Enterprise
products and services are set forth in the express warranty statements accompanying such products and services.
Nothing herein should be construed as constituting an additional warranty. Hewlett Packard Enterprise shall not be liable
for technical or editorial errors or omissions contained herein.
Confidential computer software. Valid license from Hewlett Packard Enterprise required for possession, use, or copying.
Consistent with FAR 12211 and 12212, Commercial Computer Software, Computer Software Documentation, and
Technical Data for Commercial Items are licensed to the U.S. Government under vendor's standard commercial license.
Links to third-party websites take you outside the Hewlett Packard Enterprise website. Hewlett Packard Enterprise has no
control over and is not responsible for information outside the Hewlett Packard Enterprise website.
Acknowledgments
Intel® and Xeon® are trademarks of Intel Corporation in the U.S. and other countries.
microSD is a trademark or a registered trademark of SD-3D in the United States, other countries of both.
Page 3
Contents
Illustrated parts catalog...................................................................................................7
Air bale spare part......................................................................................................................................................................................7
System components.......................................................................................................................................................................................................7
System battery spare part..................................................................................................................................................................... 10
System board assembly spare parts................................................................................................................................................ 11
System cable spare parts........................................................................................................................................................................11
Server options.................................................................................................................................................................................................................12
Media Module adapter spare parts...................................................................................................................................................14
HPE Trusted Platform Module
SUV cable spare part.................................................................................................................................................................................15
Server warnings and cautions..............................................................................................................................................................25
Power down the server............................................................................................................................................................................ 27
Remove the server from the chassis................................................................................................................................................28
Remove the air
Remove the bayonet board...................................................................................................................................................................29
Remove the secondary riser blank....................................................................................................................................................30
Remove the secondary riser cage......................................................................................................................................................31
Remove the primary riser blank..........................................................................................................................................................32
Remove the primary riser cage........................................................................................................................................................... 33
Install the primary riser blank.............................................................................................................................................................. 34
Install the primary riser cage................................................................................................................................................................35
Install the secondary riser blank.........................................................................................................................................................35
Install the secondary riser cage.......................................................................................................................................................... 36
Install the bayonet board........................................................................................................................................................................37
Install the air bale.....................................................................................................................................................................................39
Install the server into the chassis...................................................................................................................................................... 40
Power up the server...................................................................................................................................................................................40
Selecting an advanced fan cooling method.................................................................................................................................41
Disconnecting and replacing the SUV cable.................................................................................................................................................41
Removing and replacing the bayonet boards..............................................................................................................................................41
Removing and replacing an expansion board..............................................................................................................................................42
Removing and replacing an HPE InfiniBand HDR/Ethernet 200 GB 1-port 940QSFP56 x16 adapter and
Removing and replacing a Smart Array controller....................................................................................................................................50
Removing and replacing the primary riser board...................................................................................................................................... 51
Removing and replacing the secondary riser board................................................................................................................................ 52
Removing and replacing the M.2 SSD riser board.....................................................................................................................................54
Removing and replacing a Media Module adapter....................................................................................................................................56
Removing and replacing a DIMM.......................................................................................................................................................58
Removing and replacing an HPE Persistent Memory module............................................................................................................59
Configuring the server for HPE Persistent Memory...............................................................................................................60
Removing and replacing the system board...................................................................................................................................................62
Removing the system board.................................................................................................................................................................62
Replacing the system board................................................................................................................................................................. 64
Re-entering the server serial number and product ID and selecting an advanced fan cooling
System battery replacement..................................................................................................................................................................................67
System battery information.................................................................................................................................................................. 67
Removing and replacing the system battery..............................................................................................................................68
UEFI System Utilities.................................................................................................................................................................................................. 71
Selecting the boot mode ........................................................................................................................................................................71
USB support.....................................................................................................................................................................................................................74
External USB functionality.....................................................................................................................................................................74
Serial number/iLO information pull tab......................................................................................................................................... 76
Rear panel LEDs and buttons................................................................................................................................................................................77
Server UID LED.............................................................................................................................................................................................78
Front panel LED power fault codes..................................................................................................................................................78
System board components..................................................................................................................................................................................... 79
System maintenance switch descriptions.....................................................................................................................................80
Processor, heatsink, and socket components.............................................................................................................................83
Bayonet port numbering.......................................................................................................................................................................................... 84
Temperature requirements.....................................................................................................................................................................................96
List of components with temperature requirements...............................................................................................................................97
Thermal limitations for components in systems with the Enhanced Processor Performance
Acronyms and abbreviations......................................................................................128
6
Page 7
Illustrated parts catalog
Mechanical components
Hewlett Packard Enterprise continually improves and changes product parts. For complete and current supported parts
information, see the Hewlett Packard Enterprise PartSurfer website.
ItemDescription
1Air bale spare part
Air bale spare part
Customer self repair: Mandatory
Description
Air bale879858-001
System components
Hewlett Packard Enterprise continually improves and changes product parts. For complete and current supported parts
information, see the Hewlett Packard Enterprise PartSurfer website.
Spare part number
Illustrated parts catalog
7
Page 8
ItemDescription
1Small bayonet board spare part
2Large bayonet board spare part
3
4Heatsink spare parts
5System battery spare part
6DIMM spare parts
7System board assembly spare parts
8System cable spare parts*
*Not shown
First-generation Intel Xeon Scalable Processor spare parts
Second-generation Intel Xeon Scalable Processor spare parts
Bayonet board spare parts
Customer self repair: Optional
Description
Large bayonet board879855-001
Small bayonet board879845-001
Spare part number
Processor spare parts
First-generation Intel Xeon Scalable Processor spare parts
HPE IB HDR PCIe G3 Auxiliary card with 150 mm cable kitP10330-001
Ethernet adapter spare part
Customer self repair: Optional
Description
HPE Ethernet 100Gb 1P 842QSFP28 Adapter877697-001
Smart Array controller spare parts
Customer self repair: Optional
Description
HPE Smart Array E208i-p Controller836266-001
HPE Smart Array E208e-p Controller836267-001
HPE Smart Array P408i-p Controller836269-001
HPE Smart Array P408e-p Controller836270-001
Media Module adapter spare parts
Customer self repair: Optional
Description
Media Module Ethernet 10Gb 2P 568FLR-MMT Adapter879848-001
Media Module Ethernet 1Gb 2P 368FLR-MMT Adapter872161-001
Spare part number
Spare part number
Spare part number
Media Module Ethernet 10Gb 2P 568FLR-MMSFP+ Adapter872162-001
HPE Trusted Platform Module 2.0 spare part
Customer self repair: No
14
Illustrated parts catalog
Page 15
DescriptionSpare part number
HPE Trusted Platform Module Gen 10, TAA872159-001
SUV cable spare part
Customer self repair: Mandatory
DescriptionSpare part number
36-pin SUV cable416003-001
For more information on the removal and replacement procedures, see Disconnecting and replacing the SUV cable.
OPA adapter cable spare kit
Customer self repair: Optional
DescriptionSpare part number
•OPA adapter sideband cable
•OPA adapter IFP cable
Smart Array controller cable spare part
Customer self repair: Optional
Description
•Onboard S100i SR Gen10 controller SATA cable
•Type-p controller Mini-SAS cable for the primary riser slot 1
•Type-p controller Mini-SAS cable for the secondary riser slot 2
P01290-001
Spare part number
879853-001
Illustrated parts catalog15
Page 16
Customer self repair
Hewlett Packard Enterprise products are designed with many Customer Self Repair (CSR) parts to minimize repair time
and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period Hewlett Packard
Enterprise (or Hewlett Packard Enterprise service providers or service partners) identifies that the repair can be
accomplished by the use of a CSR part, Hewlett Packard Enterprise will ship that part directly to you for replacement.
There are two categories of CSR parts:
•Mandatory—Parts for which customer self repair is mandatory. If you request Hewlett Packard Enterprise to replace
these parts, you will be charged for the travel and labor costs of this service.
•Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If,
however, you require that Hewlett Packard Enterprise replace them for you, there may or may not be additional
charges, depending on the type of warranty service designated for your product.
NOTE: Some Hewlett Packard Enterprise parts are not designed for customer self repair. In order to satisfy the customer
warranty, Hewlett Packard Enterprise requires that an authorized service provider replace the part. These parts are
identified as "No" in the Illustrated Parts Catalog.
Based on availability and where geography permits, CSR parts will be shipped for next business day delivery. Same day or
four-hour delivery may be oered at an additional charge where geography permits. If assistance is required, you can call
the Hewlett Packard Enterprise Support Center and a technician will help you over the telephone. Hewlett Packard
Enterprise specifies in the materials shipped with a replacement CSR part whether a defective part must be returned to
Hewlett Packard Enterprise. In cases where it is required to return the defective part to Hewlett Packard Enterprise, you
must ship the defective part back to Hewlett Packard Enterprise within a defined period of time, normally five (5) business
days. The defective part must be returned with the associated documentation in the provided shipping material. Failure to
return the defective part may result in Hewlett Packard Enterprise billing you for the replacement. With a customer self
repair, Hewlett Packard Enterprise will pay all shipping and part return costs and determine the courier/carrier to be used.
For more information about the Hewlett Packard Enterprise CSR program, contact your local service provider. For the
North American program, go to the Hewlett Packard Enterprise CSR website.
Parts only warranty service
Your Hewlett Packard Enterprise Limited Warranty may include a parts only warranty service. Under the terms of parts
only warranty service, Hewlett Packard Enterprise will provide replacement parts free of charge.
For parts only warranty service, CSR part replacement is mandatory. If you request Hewlett Packard Enterprise to replace
these parts, you will be charged for the travel and labor costs of this service.
Réparation par le client (CSR)
Les produits Hewlett Packard Enterprise comportent de nombreuses pièces CSR (Customer Self Repair = réparation par le
client) afin de minimiser les délais de réparation et faciliter le remplacement des pièces défectueuses. Si pendant la
période de diagnostic, Hewlett Packard Enterprise (ou ses partenaires ou mainteneurs agréés) détermine que la
réparation peut être
deux catégories de pièces CSR :
•Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à Hewlett Packard
Enterprise de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.
•Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour
permettre au client
remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre
produit.
eectuée à l'aide d'une pièce CSR, Hewlett Packard Enterprise vous l'envoie directement. Il existe
d'eectuer lui-même la réparation. Toutefois, si vous demandez à Hewlett Packard Enterprise de
16
Customer self repair
Page 17
REMARQUE: Certaines pièces Hewlett Packard Enterprise ne sont pas conçues pour permettre au client d'eectuer lui-
même la réparation. Pour que la garantie puisse s'appliquer, Hewlett Packard Enterprise exige que le remplacement de la
pièce soit eectué par un Mainteneur Agréé. Ces pièces sont identifiées par la mention "Non" dans le Catalogue illustré.
Les pièces CSR sont livrées le jour ouvré suivant, dans la limite des stocks disponibles et selon votre situation
géographique. Si votre situation géographique le permet et que vous demandez une livraison le jour même ou dans les 4
heures, celle-ci vous sera facturée. Pour toute assistance, appelez le Centre d’assistance Hewlett Packard Enterprise pour
qu’un technicien vous aide au téléphone Dans les documents envoyés avec la pièce de rechange CSR, Hewlett Packard
Enterprise précise s'il est nécessaire de lui retourner la pièce défectueuse. Si c'est le cas, vous devez le faire dans le délai
indiqué, généralement cinq (5) jours ouvrés. La pièce et sa documentation doivent être retournées dans l'emballage fourni.
Si vous ne retournez pas la pièce défectueuse, Hewlett Packard Enterprise se réserve le droit de vous facturer les coûts de
remplacement. Dans le cas d'une pièce CSR, Hewlett Packard Enterprise supporte l'ensemble des frais d'expédition et de
retour, et détermine la société de courses ou le transporteur à utiliser.
Pour plus d'informations sur le programme CSR de Hewlett Packard Enterprise, contactez votre Mainteneur Agrée local.
Pour plus d'informations sur ce programme en Amérique du Nord, consultez le site
Service de garantie "pièces seules"
Votre garantie limitée Hewlett Packard Enterprise peut inclure un service de garantie "pièces seules". Dans ce cas, les
pièces de rechange fournies par Hewlett Packard Enterprise ne sont pas facturées.
Dans le cadre de ce service, la réparation des pièces CSR par le client est obligatoire. Si vous demandez à Hewlett Packard
Enterprise de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.
Riparazione da parte del cliente
Web Hewlett Packard Enterprise.
Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti difettose, i prodotti
Hewlett Packard Enterprise sono realizzati con numerosi componenti che possono essere riparati direttamente dal cliente
(CSR, Customer Self Repair). Se in fase di diagnostica Hewlett Packard Enterprise (o un centro di servizi o di assistenza
Hewlett Packard Enterprise) identifica il guasto come riparabile mediante un ricambio CSR, Hewlett Packard Enterprise lo
spedirà direttamente al cliente per la sostituzione. Vi sono due categorie di parti CSR:
•Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne
Hewlett Packard Enterprise, deve sostenere le spese di spedizione e di manodopera per il servizio.
•Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti progettati per
questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad Hewlett Packard Enterprise, potrebbe dover
sostenere spese addizionali a seconda del tipo di garanzia previsto per il prodotto.
NOTA: alcuni componenti Hewlett Packard Enterprise non sono progettati per la riparazione da parte del cliente. Per
rispettare la garanzia, Hewlett Packard Enterprise richiede che queste parti siano sostituite da un centro di assistenza
autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti.
In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giorno lavorativo
seguente. La consegna nel giorno stesso o entro quattro ore è
caso di necessità si può richiedere l'assistenza telefonica di un addetto del centro di supporto tecnico Hewlett Packard
Enterprise. Nel materiale fornito con una parte di ricambio CSR, Hewlett Packard Enterprise specifica se il cliente deve
restituire dei component. Qualora sia richiesta la resa ad Hewlett Packard Enterprise del componente difettoso, lo si deve
spedire ad Hewlett Packard Enterprise entro un determinato periodo di tempo, generalmente cinque (5) giorni lavorativi. Il
componente difettoso deve essere restituito con la documentazione associata nell'imballo di spedizione fornito. La
mancata restituzione del componente può comportare la fatturazione del ricambio da parte di Hewlett Packard Enterprise.
Nel caso di riparazione da parte del cliente, Hewlett Packard Enterprise sostiene tutte le spese di spedizione e resa e
sceglie il corriere/vettore da utilizzare.
oerta con un supplemento di costo solo in alcune zone. In
aida la riparazione ad
Per ulteriori informazioni sul programma CSR di Hewlett Packard Enterprise, contattare il centro di assistenza di zona. Per
il programma in Nord America fare riferimento al sito Web.
Customer self repair
17
Page 18
Servizio di garanzia per i soli componenti
La garanzia limitata Hewlett Packard Enterprise può includere un servizio di garanzia per i soli componenti. Nei termini di
garanzia del servizio per i soli componenti, Hewlett Packard Enterprise fornirà gratuitamente le parti di ricambio.
Per il servizio di garanzia per i soli componenti è obbligatoria la formula CSR che prevede la riparazione da parte del
cliente. Se il cliente invece richiede la sostituzione ad Hewlett Packard Enterprise dovrà sostenere le spese di spedizione e
di manodopera per il servizio.
Customer Self Repair
Hewlett Packard Enterprise Produkte enthalten viele CSR-Teile (Customer Self Repair), um Reparaturzeiten zu minimieren
und höhere Flexibilität beim Austausch defekter Bauteile zu ermöglichen. Wenn Hewlett Packard Enterprise (oder ein
Hewlett Packard Enterprise Servicepartner) bei der Diagnose feststellt, dass das Produkt mithilfe eines CSR-Teils repariert
werden kann, sendet Ihnen Hewlett Packard Enterprise dieses Bauteil zum Austausch direkt zu. CSR-Teile werden in zwei
Kategorien unterteilt:
•Zwingend—Teile, für die das Customer Self Repair-Verfahren zwingend vorgegeben ist. Wenn Sie den Austausch
dieser Teile von Hewlett Packard Enterprise vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für
diesen Service berechnet.
•Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer Self
Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von Hewlett Packard Enterprise vornehmen lassen
möchten, können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche
Kosten anfallen.
HINWEIS: Einige Hewlett Packard Enterprise Teile sind nicht für Customer Self Repair ausgelegt. Um den
Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem Hewlett Packard Enterprise Servicepartner ersetzt
werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet.
CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag geliefert. Für bestimmte
Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen einen Aufpreis verfügbar. Wenn Sie
Hilfe benötigen, können Sie das Hewlett Packard Enterprise Support Center anrufen und sich von einem Mitarbeiter per
Telefon helfen lassen. Den Materialien von Hewlett Packard Enterprise, die mit einem CSR-Ersatzteil geliefert werden,
können Sie entnehmen, ob das defekte Teil an Hewlett Packard Enterprise zurückgeschickt werden muss. Wenn es
erforderlich ist, das defekte Teil an Hewlett Packard Enterprise zurückzuschicken, müssen Sie dies innerhalb eines
vorgegebenen Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen. Das defekte Teil muss mit der
zugehörigen Dokumentation in der Verpackung zurückgeschickt werden, die im Lieferumfang enthalten ist. Wenn Sie das
defekte Teil nicht zurückschicken, kann Hewlett Packard Enterprise Ihnen das Ersatzteil in Rechnung stellen. Im Falle von
Customer Self Repair kommt Hewlett Packard Enterprise für alle Kosten für die Lieferung und Rücksendung auf und
bestimmt den Kurier-/Frachtdienst.
Weitere Informationen über das Hewlett Packard Enterprise Customer Self Repair Programm erhalten Sie von Ihrem
Servicepartner vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der
Enterprise Website unter.
Parts-only Warranty Service (Garantieservice ausschließlich für Teile)
Ihre Hewlett Packard Enterprise Garantie umfasst möglicherweise einen Parts-only Warranty Service (Garantieservice
ausschließlich für Teile). Gemäß den Bestimmungen des Parts-only Warranty Service stellt Hewlett Packard Enterprise
Ersatzteile kostenlos zur Verfügung.
Für den Parts-only Warranty Service ist das CSR-Verfahren zwingend vorgegeben. Wenn Sie den Austausch dieser Teile
von Hewlett Packard Enterprise vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen Service
berechnet.
Hewlett Packard
Reparaciones del propio cliente
Los productos de Hewlett Packard Enterprise incluyen muchos componentes que el propio usuario puede reemplazar
(Customer Self Repair, CSR) para minimizar el tiempo de reparación y ofrecer una mayor flexibilidad a la hora de realizar
18
Customer self repair
Page 19
sustituciones de componentes defectuosos. Si, durante la fase de diagnóstico, Hewlett Packard Enterprise (o los
proveedores o socios de servicio de Hewlett Packard Enterprise) identifica que una reparación puede llevarse a cabo
mediante el uso de un componente CSR, Hewlett Packard Enterprise le enviará dicho componente directamente para que
realice su sustitución. Los componentes CSR se clasifican en dos categorías:
•Obligatorio—Componentes cuya reparación por parte del usuario es obligatoria. Si solicita a Hewlett Packard
Enterprise que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento
y de mano de obra de dicho servicio.
•Opcional—Componentes cuya reparación por parte del usuario es opcional. Estos componentes también están
diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que Hewlett Packard Enterprise
realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía
correspondiente al producto.
NOTA: Algunos componentes de Hewlett Packard Enterprise no están diseñados para que puedan ser reparados por el
usuario. Para que el usuario haga valer su garantía, Hewlett Packard Enterprise pone como condición que un proveedor de
servicios autorizado realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra "No" en
el catálogo ilustrado de componentes.
Según la disponibilidad y la situación geográfica, los componentes CSR se enviarán para que lleguen a su destino al
siguiente día laborable. Si la situación geográfica lo permite, se puede solicitar la entrega en el mismo día o en cuatro
horas con un coste adicional. Si precisa asistencia técnica, puede llamar al Centro de asistencia técnica de Hewlett Packard
Enterprise y recibirá ayuda telefónica por parte de un técnico. Con el envío de materiales para la sustitución de
componentes CSR, Hewlett Packard Enterprise especificará si los componentes defectuosos deberán devolverse a Hewlett
Packard Enterprise. En aquellos casos en los que sea necesario devolver algún componente a Hewlett Packard Enterprise,
deberá hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes defectuosos
deberán devolverse con toda la documentación relacionada y con el embalaje de envío. Si no enviara el componente
defectuoso requerido, Hewlett Packard Enterprise podrá cobrarle por el de sustitución. En el caso de todas sustituciones
que lleve a cabo el cliente, Hewlett Packard Enterprise se hará cargo de todos los gastos de envío y devolución de
componentes y escogerá la empresa de transporte que se utilice para dicho servicio.
Para obtener más información acerca del programa de Reparaciones del propio cliente de Hewlett Packard Enterprise,
póngase en contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite
página web de Hewlett Packard Enterprise CSR.
Servicio de garantía exclusivo de componentes
La garantía limitada de Hewlett Packard Enterprise puede que incluya un servicio de garantía exclusivo de componentes.
Según las condiciones de este servicio exclusivo de componentes, Hewlett Packard Enterprise le facilitará los
componentes de repuesto sin cargo adicional alguno.
Para este servicio de garantía exclusivo de componentes, es obligatoria la sustitución de componentes por parte del
usuario (CSR). Si solicita a Hewlett Packard Enterprise que realice la sustitución de estos componentes, tendrá que
hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.
Customer Self Repair
Veel onderdelen in Hewlett Packard Enterprise producten zijn door de klant zelf te repareren, waardoor de reparatieduur
tot een minimum beperkt kan blijven en de flexibiliteit in het vervangen van defecte onderdelen groter is. Deze
onderdelen worden CSR-onderdelen (Customer Self Repair) genoemd. Als Hewlett Packard Enterprise (of een Hewlett
Packard Enterprise Service Partner) bij de diagnose vaststelt dat de reparatie kan worden uitgevoerd met een CSRonderdeel, verzendt Hewlett Packard Enterprise dat onderdeel rechtstreeks naar u, zodat u het defecte onderdeel
daarmee kunt vervangen. Er zijn twee categorieën CSR-onderdelen:
la
Customer self repair
19
Page 20
•Verplicht—Onderdelen waarvoor reparatie door de klant verplicht is. Als u Hewlett Packard Enterprise verzoekt deze
onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening gebracht.
•Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn ontworpen voor
reparatie door de klant. Als u echter Hewlett Packard Enterprise verzoekt deze onderdelen voor u te vervangen,
kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product.
OPMERKING: Sommige Hewlett Packard Enterprise onderdelen zijn niet ontwikkeld voor reparatie door de klant. In
verband met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen.
Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".
Afhankelijk van de leverbaarheid en de locatie worden CSR-onderdelen verzonden voor levering op de eerstvolgende
werkdag. Levering op dezelfde dag of binnen vier uur kan tegen meerkosten worden aangeboden, indien dit mogelijk is
gezien de locatie. Indien assistentie is gewenst, belt u het Hewlett Packard Enterprise Support Center om via de telefoon
ondersteuning van een technicus te ontvangen. Hewlett Packard Enterprise vermeldt in de documentatie bij het
vervangende CSR-onderdeel of het defecte onderdeel aan Hewlett Packard Enterprise moet worden geretourneerd. Als
het defecte onderdeel aan Hewlett Packard Enterprise moet worden teruggezonden, moet u het defecte onderdeel binnen
een bepaalde periode, gewoonlijk vijf (5) werkdagen, retourneren aan Hewlett Packard Enterprise. Het defecte onderdeel
moet met de bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het
defecte onderdeel niet terugzendt, kan Hewlett Packard Enterprise u voor het vervangende onderdeel kosten in rekening
brengen. Bij reparatie door de klant betaalt Hewlett Packard Enterprise alle verzendkosten voor het vervangende en
geretourneerde onderdeel en kiest Hewlett Packard Enterprise zelf welke koerier/transportonderneming hiervoor wordt
gebruikt.
Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma van Hewlett
Packard Enterprise. Informatie over Service Partners vindt u op de Hewlett Packard Enterprise website.
Garantieservice "Parts Only"
Het is mogelijk dat de Hewlett Packard Enterprise garantie alleen de garantieservice "Parts Only" omvat. Volgens de
bepalingen van de Parts Only garantieservice zal Hewlett Packard Enterprise kosteloos vervangende onderdelen ter
beschikking stellen.
Voor de Parts Only garantieservice is vervanging door CSR-onderdelen verplicht. Als u Hewlett Packard Enterprise
verzoekt deze onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening
gebracht
Reparo feito pelo cliente
Os produtos da Hewlett Packard Enterprise são projetados com muitas peças para reparo feito pelo cliente (CSR) de
modo a minimizar o tempo de reparo e permitir maior flexibilidade na substituição de peças com defeito. Se, durante o
período de diagnóstico, a Hewlett Packard Enterprise (ou fornecedores/parceiros da Hewlett Packard Enterprise) concluir
que o reparo pode ser efetuado pelo uso de uma peça CSR, a Hewlett Packard Enterprise enviará a peça diretamente ao
cliente. Há duas categorias de peças CSR:
•Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a Hewlett Packard Enterprise substitua
essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.
•Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo
cliente. No entanto, se desejar que a Hewlett Packard Enterprise as substitua, pode haver ou não a cobrança de taxa
adicional, dependendo do tipo de serviço de garantia destinado ao produto.
OBSERVAÇÃO: Algumas peças da Hewlett Packard Enterprise não são projetadas para o reparo feito pelo cliente. A fim
de cumprir a garantia do cliente, a Hewlett Packard Enterprise exige que um técnico autorizado substitua a peça. Essas
peças estão identificadas com a marca "No" (Não), no catálogo de peças ilustrado.
Conforme a disponibilidade e o local geográfico, as peças CSR serão enviadas no primeiro dia útil após o pedido. Onde as
condições geográficas permitirem, a entrega no mesmo dia ou em quatro horas pode ser feita mediante uma taxa
adicional. Se precisar de auxílio, entre em contato com o Centro de suporte técnico da Hewlett Packard Enterprise para
20
Customer self repair
Page 21
que um técnico o ajude por telefone. A Hewlett Packard Enterprise especifica nos materiais fornecidos com a peça CSR de
reposição se a peça com defeito deve ser devolvida à Hewlett Packard Enterprise. Nos casos em que isso for necessário, é
preciso enviar a peça com defeito à Hewlett Packard Enterprise, você deverá enviar a peça com defeito de volta para a
Hewlett Packard Enterprise dentro do período de tempo definido, normalmente em 5 (cinco) dias úteis. A peça com
defeito deve ser enviada com a documentação correspondente no material de transporte fornecido. Caso não o faça, a
Hewlett Packard Enterprise poderá cobrar a reposição. Para as peças de reparo feito pelo cliente, a Hewlett Packard
Enterprise paga todas as despesas de transporte e de devolução da peça e determina a transportadora/serviço postal a
ser utilizado.
Para obter mais informações sobre o programa de reparo feito pelo cliente da Hewlett Packard Enterprise, entre em
contato com o fornecedor de serviços local. Para o programa norte-americano, visite o site da Hewlett Packard
Enterprise.
Serviço de garantia apenas para peças
A garantia limitada da Hewlett Packard Enterprise pode incluir um serviço de garantia apenas para peças. Segundo os
termos do serviço de garantia apenas para peças, a Hewlett Packard Enterprise fornece as peças de reposição sem cobrar
nenhuma taxa.
No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a Hewlett Packard Enterprise substitua
essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.
Customer self repair21
Page 22
22Customer self repair
Page 23
Customer self repair23
Page 24
24Customer self repair
Page 25
Removal and replacement procedures
Required tools
The following tools might be required to perform some procedures:
•T-10 Torx screwdriver
•T-15 Torx screwdriver
•T-30 Torx screwdriver
•Phillips No. 1 screwdriver
Safety considerations
Before performing service procedures, review all the safety information.
Preventing electrostatic discharge
To prevent damaging the system, be aware of the precautions you must follow when setting up the system or handling
parts. A discharge of static electricity from a finger or other conductor may damage system boards or other staticsensitive devices. This type of damage may reduce the life expectancy of the device.
Procedure
•Avoid hand contact by transporting and storing products in static-safe containers.
•Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.
•Place parts on a grounded surface before removing them from their containers.
•Avoid touching pins, leads, or circuitry.
•Always be properly grounded when touching a static-sensitive component or assembly.
Server warnings and cautions
WARNING: This server is heavy. To reduce the risk of personal injury or damage to the equipment:
•Observe local occupational health and safety requirements and guidelines for manual material handling.
•Get help to lift and stabilize the product during installation or removal, especially when the product is not
fastened to the rails. Hewlett Packard Enterprise recommends that a minimum of two people are required for all
rack server installations. If the server is installed higher than chest level, a third person may be required to help
align the server.
•Use caution when installing the server in or removing the server from the rack; it is unstable when not fastened
to the rails.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system
components to cool before touching them.
Removal and replacement procedures25
Page 26
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power
cord to remove power from the server. The front panel Power On/Standby button does not completely shut o
system power. Portions of the power supply and some internal circuitry remain active until AC/DC power is
removed.
WARNING: To reduce the risk of fire or burns after removing the energy pack:
•Do not disassemble, crush, or puncture the energy pack.
•Do not short external contacts.
•Do not dispose of the energy pack in fire or water.
After power is disconnected, battery voltage might still be present for 1s to 160s.
AVERTISSEMENT: Pour réduire les risques d'incendie ou de brûlures après le retrait du module batterie :
•N'essayez pas de démonter, d'écraser ou de percer le module batterie.
•Ne court-circuitez pas ses contacts externes.
•Ne jetez pas le module batterie dans le feu ou dans l'eau.
Après avoir déconnecté l'alimentation, une tension peut subsister dans la batterie durant 1 à 160 secondes.
CAUTION: Protect the server from power fluctuations and temporary interruptions with a regulating
uninterruptible power supply. This device protects the hardware from damage caused by power surges and voltage
spikes and keeps the system in operation during a power failure.
CAUTION: Do not operate the server for long periods with the access panel open or removed. Operating the server
in this manner results in improper airflow and improper cooling that can lead to thermal damage.
Rack warnings
WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that:
•The leveling jacks are extended to the floor.
•The full weight of the rack rests on the leveling jacks.
•The stabilizing feet are attached to the rack if it is a single-rack installation.
•The racks are coupled together in multiple-rack installations.
•Only one component is extended at a time. A rack may become unstable if more than one component is
WARNING: To reduce the risk of personal injury or equipment damage when unloading a rack:
•At least two people are needed to safely unload the rack from the pallet. An empty 42U rack can weigh as much
•Never stand in front of the rack when it is rolling down the ramp from the pallet. Always handle the rack from
extended for any reason.
as 115 kg (253 lb), can stand more than 21 m (7 ft) tall, and might become unstable when being moved on its
casters.
both sides.
26Removal and replacement procedures
Page 27
WARNING: To reduce the risk of personal injury or damage to the equipment, adequately stabilize the rack before
extending a component outside the rack. Extend only one component at a time. A rack may become unstable if
more than one component is extended.
WARNING: When installing a server in a telco rack, be sure that the rack frame is adequately secured at the top and
bottom to the building structure.
Preparation procedures
To access some components and perform certain service procedures, you must perform one or more of the following
procedures:
•Power down the server
Remove the server from the chassis
•
•Remove the air bale
•Remove the bayonet board
Remove the secondary riser blank
•
•Remove the secondary riser cage
Remove the primary riser blank
•
•Remove the primary riser cage
•Power up the server
Power down the server
Before powering down the server for any upgrade or maintenance procedures, perform a backup of critical server data
and programs.
IMPORTANT: When the server is in standby mode, auxiliary power is still being provided to the system.
To power down the server, use one of the following methods:
•Press and release the Power On/Standby button.
This method initiates a controlled shutdown of applications and the OS before the server enters standby mode.
•Press and hold the Power On/Standby button for more than 4 seconds to force the server to enter standby mode.
This method forces the server to enter standby mode without properly exiting applications and the OS. If an
application stops responding, you can use this method to force a shutdown.
•Use a virtual power button selection through iLO 5.
This method initiates a controlled remote shutdown of applications and the OS before the server enters standby
mode.
Before proceeding, verify that the server is in standby mode by observing that the system power LED is amber.
Removal and replacement procedures
27
Page 28
Remove the server from the chassis
CAUTION: To prevent improper cooling and thermal damage, do not operate the chassis unless all bays are
populated with a component or a blank.
CAUTION: To avoid damage to the server or server blank:
•Always support the bottom of the server or server blank when removing it from the chassis.
•Do not use the release lever to carry the server or server blank.
Procedure
1. Power down the server.
2. Disconnect all peripheral cables from the server.
3. Remove the server from the chassis:
a. Loosen the release lever thumbscrew.
Open the release lever.
b.
Use the release lever to pull the server out of the chassis.
c.
Remove the air bale
CAUTION: For proper cooling, do not operate the server without the
installed.
Procedure
Power down the server.
1.
2. Disconnect all peripheral cables from the server.
28
Removal and replacement procedures
bales, expansion slot covers, or blanks
Page 29
3. Remove the server from the chassis.
4. Remove the air bale.
Remove the bayonet board
Prerequisites
Before you perform this procedure, make sure that you have a T-10 Torx screwdriver available.
Procedure
Power down the server.
1.
Disconnect all peripheral cables from the server.
2.
Remove the server from the chassis.
3.
Remove the air bale.
4.
Remove the bayonet board:
5.
Remove the screws securing the cover to the bayonet board.
a.
b. Remove the screws securing the cover to the server tray, and then remove the cover.
Removal and replacement procedures
29
Page 30
c. Disconnect the bayonet board cables, and then remove the bayonet board.
Remove the secondary riser blank
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless either riser blank or
riser cage is installed.
Prerequisites
Before you perform this procedure, make sure that you have a T-10 Torx screwdriver available.
Procedure
1. Power down the server.
2. Disconnect all peripheral cables from the server.
30
Removal and replacement procedures
Page 31
3. Remove the server from the chassis.
4. Remove the secondary riser blank.
Remove the secondary riser cage
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless either riser blank or
riser cage is installed.
Prerequisites
Before you perform this procedure, make sure that you have a T-10 Torx screwdriver available.
Procedure
Power down the server.
1.
Disconnect all peripheral cables from the server.
2.
Remove the server from the chassis.
3.
Remove the air bale.
4.
Remove the bayonet board.
5.
6. If an expansion board with internal cabling is installed on the riser cage, disconnect these internal cables from the
expansion board.
7. Disconnect all cables from the riser board.
8. Remove the secondary riser cage.
Removal and replacement procedures
31
Page 32
Remove the primary riser blank
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless either riser blank or
riser cage is installed.
Prerequisites
Before you perform this procedure, make sure that you have a T-10 Torx screwdriver available.
Procedure
Power down the server.
1.
Disconnect all peripheral cables from the server.
2.
Remove the server from the chassis.
3.
If a secondary riser cage is installed, remove the bayonet board.
4.
Do one of the following:
5.
•Remove the secondary riser blank.
Remove the secondary riser cage.
•
6. Remove the primary riser blank.
32
Removal and replacement procedures
Page 33
Remove the primary riser cage
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless either riser blank or
riser cage is installed.
Prerequisites
Before you perform this procedure, make sure that you have a T-10 Torx screwdriver available.
Procedure
Power down the server.
1.
Disconnect all peripheral cables from the server.
2.
Remove the server from the chassis.
3.
Remove the air bale.
4.
If a secondary riser option is installed, remove the bayonet board.
5.
Do one of the following:
6.
Remove the secondary riser blank.
•
•Remove the secondary riser cage.
7. If an expansion board with internal cabling is installed on the riser cage, disconnect these internal cables from the
expansion board.
8. Disconnect all cables from the riser board.
9. Remove the primary riser cage.
Removal and replacement procedures
33
Page 34
Install the primary riser blank
Prerequisites
Before you perform this procedure, make sure that you have a T-10 Torx screwdriver available.
Procedure
Install the primary riser blank.
1.
2. Do one of the following:
•Install the secondary riser blank.
•Install the secondary riser cage.
3. If removed,
34
Removal and replacement procedures
install the bayonet board.
Page 35
4. Install the server into the chassis.
5. Connect all peripheral cables to the server.
6.
Power up the server.
Install the primary riser cage
Prerequisites
Before you perform this procedure, make sure that you have a T-10 Torx screwdriver available.
Procedure
1. Install the primary riser cage. Make sure that the riser board is firmly seated in its system board the connector.
Do one of the following:
2.
Install the secondary riser blank.
•
•Install the secondary riser cage.
If removed, install the bayonet board.
3.
4. If removed,
5. Install the air bale.
Install the server into the chassis.
6.
7. Connect all peripheral cables to the server.
8. Power up the server.
install the bayonet board.
Install the secondary riser blank
Prerequisites
Before you perform this procedure, make sure that you have a T-10 Torx screwdriver available.
Removal and replacement procedures
35
Page 36
Procedure
1. Install the secondary riser blank.
Install the server into the chassis.
2.
Connect all peripheral cables to the server.
3.
Power up the server.
4.
Install the secondary riser cage
Prerequisites
Before you perform this procedure, make sure that you have a T-10 Torx screwdriver available.
Procedure
Install the secondary riser cage. Make sure that the riser board is firmly seated in its system board connectors.
1.
36
Removal and replacement procedures
Page 37
2. Install the bayonet board.
Install the air bale.
3.
Install the server into the chassis.
4.
Connect all peripheral cables to the server.
5.
Power up the server.
6.
Install the bayonet board
Prerequisites
Before you perform this procedure, make sure that you have a T-10 Torx screwdriver available.
Procedure
Install the bayonet board:
1.
Connect all the bayonet board cables.
a.
Install the bayonet board. Make sure that the board is firmly seated in the connector.
b.
Removal and replacement procedures
37
Page 38
c. Install the bayonet board cover, and then install the screws to secure it to the server tray.
Install the screws to secure the cover to the bayonet board.
d.
38
Removal and replacement procedures
Page 39
2. Install the air bale.
Install the server into the chassis.
3.
Connect all peripheral cables to the server.
4.
Power up the server.
5.
Install the air bale
Procedure
Install the air bale.
1.
2. Install the server into the chassis.
3. Connect all peripheral cables to the server.
Power up the server.
4.
Removal and replacement procedures
39
Page 40
Install the server into the chassis
CAUTION: To avoid damage to the server or server blank:
•Always support the bottom of the server or server blank when removing it from the chassis.
•Do not use the release lever to carry the server or server blank.
Procedure
1. Slide the server into the chassis.
2. Close the release lever.
3. Tighten the release lever thumbscrew.
Connect all peripheral cables to the server.
4.
Power up the server.
5.
Power up the server
The SL/XL chassis firmware initiates an automatic power-up sequence when the servers are installed. If the default setting
is changed, use one of the following methods to power up each server:
•Use a virtual power button selection through iLO 5.
•Press and release the Power On/Standby button.
When the server goes from standby mode to full power mode, the server power LED changes from amber to green.
40
Removal and replacement procedures
Page 41
Selecting an advanced fan cooling method
Procedure
1. During the server startup sequence, press the F9 key to access System Utilities.
2. From the System Utilities screen, select System Configuration > BIOS/Platform Configuration (RBSU) > Advanced
Options > Fan and Thermal Options > Thermal Configuration.
3. Select one of the advanced fan cooling method:
•Enhanced CPU Cooling
•Maximum Cooling
4. Press F10 to save the configuration.
Disconnecting and replacing the SUV cable
Procedure
Disconnect the peripheral devices connected to the SUV cable.
1.
Disconnect the SUV cable:
2.
Press and hold both sides of the SUV connector.
a.
Disconnect the cable from the SUV port.
b.
To replace the component, reverse the removal procedure.
Removing and replacing the bayonet boards
CAUTION: Before replacing a DIMM, expansion board, or other similar PCA components due to a perceived
hardware error, make sure first that the component is firmly seated in the slot. Do not bend or flex circuit boards
when reseating components.
Prerequisites
Before you perform this procedure, make sure that you have a T-10 Torx screwdriver available.
Removal and replacement procedures
41
Page 42
Procedure
1. Power down the server.
2. Disconnect all peripheral cables from the server.
Remove the server from the chassis.
3.
4. Remove the air bale.
5. Remove the bayonet board.
6. Separate the small bayonet boards from the large bayonet board.
To replace the component, reverse the removal procedure.
Removing and replacing an expansion board
CAUTION: Before replacing a DIMM, expansion board, or other similar PCA components due to a perceived
hardware error, make sure first that the component is firmly seated in the slot. Do not bend or flex circuit boards
when reseating components.
Prerequisites
Before you perform this procedure, make sure that you have a T-10 and T-15 Torx screwdrivers available.
Procedure
1. Power down the server.
2. Disconnect all peripheral cables from the server.
Remove the server from the chassis.
3.
4. If a secondary PCIe riser cage is installed, remove the bayonet board.
5. If replacing the expansion board installed in slot 1, do one of the following:
42
Removal and replacement procedures
Page 43
•Remove the secondary riser cage
•Remove the primary riser cage
6. If the expansion board has internal cabling, disconnect these internal cables from the expansion board.
7. Remove an expansion board.
•Primary riser cage
•Secondary riser cage
8. If you do not intend to replace the expansion board, install the riser slot blank.
•Primary riser cage
Removal and replacement procedures
43
Page 44
•Secondary riser cage
To replace the component, reverse the removal procedure.
Removing and replacing an HPE InfiniBand HDR/Ethernet 200 GB 1port 940QSFP56 x16 adapter and auxiliary card
An HPE InfiniBand HDR/Ethernet 200 GB 1-port 940QSFP56 x16 adapter is installed in slot 1 and auxiliary card is
installed in slot 2.
Prerequisites
Before you perform this procedure, make sure that you have the following items available:
•T-15 Torx screwdriver
•Phillips No. 2 screwdriver
Procedure
1.Power down the server.
2.Remove all power:
44
Removal and replacement procedures
Page 45
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
3.Disconnect all peripheral cables from the server.
4.Remove the server from the chassis.
5.Remove the air bale.
6.Remove the bayonet board.
7.Remove the secondary riser cage.
8.Remove the auxiliary card from slot 2.
Retain the secondary riser retention cover and screw for future use.
Disconnect the cables from the auxiliary card:
9.
Open the retention clip and slide it away from the connectors.
a.
Gently pull the top corner of the cable latch door upwards.
b.
Disconnect the black and white cables from the auxiliary card.
c.
Remove the primary riser cage.
10.
11. Remove the adapter from slot 1.
Removal and replacement procedures
45
Page 46
Retain the screw for future use.
12. To disconnect the cables from the adapter, repeat step 9.
To replace the component:
1.If installed, remove the full-height bracket from the adapter.
Retain the full-height bracket and screws for future use.
Install the low-profile bracket provided in the kit on the adapter and the auxiliary card.
2.
46
Removal and replacement procedures
Page 47
3.Thread the two cables provided in the kit together using the cable retention clip on either ends of the cables. Ensure
that the clip posts are pointing towards the cable ends.
CAUTION: The white and black cables from the auxiliary card connect to the adapter board ports labeled
WHITE CABLE and BLACK CABLE, respectively. The cable latch door must be open when connecting the
cables. Close the cable latch door after connecting the cable.
4.Install the cables on the adapter:
a. Connect the cable.
b. Close the cable latch door until it clicks into place.
Removal and replacement procedures
47
Page 48
CAUTION: The connector pins are fragile and easily damaged. To avoid damaging the connector pins, do not
use excessive force when connecting the cables.
Push the clip down and slide the cable retention clip on the adapter.
5.
6.Install the adapter in slot 1.
48
Removal and replacement procedures
Page 49
7.Install the primary riser cage.
8.Thread the cables through the second retention clip.
Connect the cables to the auxiliary card.
9.
10. Install the auxiliary card in slot 2.
Install the secondary riser cage.
11.
Install the bayonet board.
12.
13. Install the air bale.
14. Install the server into the chassis.
15. Connect all peripheral cables to the server.
16. Connect all power:
a. Connect each power cord to the server.
b. Connect each power cord to the power source.
17. Power up the server.
Removal and replacement procedures
49
Page 50
Removing and replacing a Smart Array controller
CAUTION: Before replacing the component due to a perceived hardware error, make sure first that the component
is firmly seated in the slot. Do not bend or flex circuit boards when reseating components.
Prerequisites
•Before you perform this procedure, ensure that you have T-15 Torx screwdriver is available.
•Determine if there are temperature requirements for the component. For more information, see
requirements.
•Depending on the chassis configuration and the component being installed in the server, it might be necessary to limit
the number of drives installed in the chassis. For more information, see List of components with temperature
requirements.
Procedure
Power down the server.
1.
Disconnect all peripheral cables from the server.
2.
Remove the server from the chassis.
3.
Remove the air bale.
4.
If a secondary PCIe riser cage is installed, remove the bayonet board.
5.
Do one of the following:
6.
•Remove the secondary riser blank.
Remove the secondary riser cage.
•
If replacing the expansion board installed in slot 1, remove the primary PCIe riser cage.
7.
Temperature
Disconnect the Mini-SAS cable and controller backup power cable from the controller.
8.
Remove the Smart Array controller from the PCIe riser cage.
9.
•Secondary PCIe riser cage
50
Removal and replacement procedures
Page 51
•Primary PCIe riser cage
To replace the component, reverse the removal procedure.
Removing and replacing the primary riser board
CAUTION: Before replacing a DIMM, expansion board, or other similar PCA components due to a perceived
hardware error, make sure first that the component is firmly seated in the slot. Do not bend or flex circuit boards
when reseating components.
Prerequisites
Before you perform this procedure, make sure that you have a T-15 Torx screwdriver available.
Procedure
Power down the server.
1.
2. Disconnect all peripheral cables from the server.
Remove the server from the chassis.
3.
4. Remove the bayonet board.
Removal and replacement procedures
51
Page 52
5. Do one of the following:
•Remove the secondary riser blank.
•
Remove the secondary riser cage.
Remove the primary riser cage.
6.
7. If installed, remove the expansion board from the riser board.
8. If present, disconnect the storage controller backup power cable from the riser board.
9. Remove the primary riser board.
To replace the component, reverse the removal procedure.
Removing and replacing the secondary riser board
CAUTION: Before replacing a DIMM, expansion board, or other similar PCA components due to a perceived
hardware error, make sure first that the component is firmly seated in the slot. Do not bend or flex circuit boards
when reseating components.
Prerequisites
Before you perform this procedure, make sure that you have a T-15 Torx screwdriver available.
Procedure
1. Power down the server.
2. Disconnect all peripheral cables from the server.
Remove the server from the chassis.
3.
4. Remove the bayonet board.
Remove the secondary riser cage.
5.
52
Removal and replacement procedures
Page 53
6. If installed, remove all expansion boards from the riser board.
7. If present, disconnect the storage controller backup power cables from the riser board.
8. Remove the riser board.
•Secondary riser board for processor 1
•Secondary riser board for processor 2
•FlexibleLOM riser board
Removal and replacement procedures
53
Page 54
To replace the component, reverse the removal procedure.
Removing and replacing the M.2 SSD riser board
CAUTION: Before replacing a DIMM, expansion board, or other similar PCA components due to a perceived
hardware error, make sure first that the component is firmly seated in the slot. Do not bend or flex circuit boards
when reseating components.
Prerequisites
Before you perform this procedure, make sure that you have a T-15 Torx and Phillips No.1 screwdrivers available.
Procedure
Power down the server.
1.
Disconnect all peripheral cables from the server.
2.
Remove the server from the chassis.
3.
Remove the air bale.
4.
5. Remove the M.2 SSD riser board:
a. Remove the riser board screw.
b. Carefully disengage the latch from the riser board post.
c. Remove the M.2 SSD riser board.
54
Removal and replacement procedures
Page 55
6. Remove all installed M.2 SSDs from the riser board.
If you do not intend to replace the M.2 SSD riser board, install the DIMM guard.
7.
Removal and replacement procedures
55
Page 56
To replace the component, reverse the removal procedure.
Removing and replacing a Media Module adapter
CAUTION: Before replacing a DIMM, expansion board, or other similar PCA components due to a perceived
hardware error, make sure first that the component is firmly seated in the slot. Do not bend or flex circuit boards
when reseating components.
Prerequisites
Before you perform this procedure, make sure that you have a T-15 Torx screwdriver available.
Procedure
Power down the server.
1.
Disconnect all peripheral cables from the server.
2.
Remove the server from the chassis.
3.
If a secondary PCIe riser cage is installed, remove the bayonet board.
4.
Do one of the following:
5.
Remove the secondary riser blank.
•
•Remove the secondary riser cage.
6. Do one the following:
•Remove the primary riser blank.
Remove the primary riser cage.
•
7. Remove the Media Module screws.
56
Removal and replacement procedures
Page 57
8. Remove the Media Module adapter.
If you do not intend to replace the adapter, install the Media Module blank.
9.
Removal and replacement procedures
57
Page 58
To replace the component, reverse the removal procedure.
DIMM-processor compatibility
The installed processor determines the type of DIMM that is supported in the server:
•First-generation Intel Xeon Scalable processors support DDR4-2666 DIMMs.
•Second-generation Intel Xeon Scalable processors support DDR4-2666 DIMMs or DDR4-2933 DIMMs.
Mixing DIMM types is not supported. Install either all DDR4-2666 DIMMs or all DDR4-2933 DIMMs in the server.
Removing and replacing a DIMM
CAUTION: Before replacing a DIMM, expansion board, or other similar PCA components due to a perceived
hardware error, make sure first that the component is firmly seated in the slot. Do not bend or flex circuit boards
when reseating components.
Procedure
Power down the server.
1.
2. Disconnect all peripheral cables from the server.
Remove the server from the chassis.
3.
Remove the air bale.
4.
5. Remove the DIMM.
58
Removal and replacement procedures
Page 59
To replace the component, reverse the removal procedure.
For DIMM configuration information, see the Hewlett Packard Enterprise website (https://www.hpe.com/docs/arm-
population-rules).
Removing and replacing an HPE Persistent Memory module
For specific population and configuration information, see the memory population guidelines on the Hewlett Packard
Enterprise website (
HPE Persistent Memory modules are supported only in servers with second-generation Intel Xeon Scalable processors
installed.
Configuring the server for HPE Persistent Memory
After installing HPE Persistent Memory modules, configure the server for HPE Persistent Memory.
IMPORTANT: Always follow recommendations from your software application provider for high-availability best
practices to ensure maximum uptime and data protection.
A number of configuration tools are available, including:
•UEFI System Utilities—Access System Utilities through the Remote Console to configure the server by pressing the F9
key during POST.
•iLO RESTful API—Use the iLO RESTful API through tools such as the RESTful Interface Tool (ilorest) or other thirdparty tools.
•HPE Persistent Memory Management Utility—The HPE Persistent Memory Management Utility is a desktop
application used to configure the server for HPE Persistent Memory, as well as evaluate and monitor the server
memory configuration layout.
For more information, see the HPE Persistent Memory User Guide on the Hewlett Packard Enterprise website (https://
Observe the relocation guidelines when doing the following:
60
Removal and replacement procedures
Page 61
•When relocating HPE Persistent Memory modules to another DIMM slot on the server.
•When relocating HPE Persistent Memory modules to another server.
•When reinstalling HPE Persistent Memory modules after replacing the server system board.
IMPORTANT: When data must be preserved, Hewlett Packard Enterprise strongly recommends that you perform a
manual backup of all user data on the HPE Persistent Memory modules before changing the goal configuration or
performing relocation procedures.
Requirements for relocating HPE Persistent Memory modules or a set of HPE Persistent Memory modules when the
data must be preserved
•The destination server hardware must match the original server hardware configuration.
•All System Utilities settings in the destination server must match the original System Utilities settings in the original
server.
•If HPE Persistent Memory modules are used with Persistent Memory Interleaving set to Enabled in the original
server, do the following:
◦Install the HPE Persistent Memory modules in the same DIMM slots in the destination server.
◦Install the entire interleaved set (all the DIMMs and HPE Persistent Memory modules on the processor) on the
destination server.
If any of the requirements cannot be met during relocation, do the following:
◦Manually back up the persistent memory data before relocating HPE Persistent Memory modules to another
server.
◦Relocate the HPE Persistent Memory modules to another server.
◦Sanitize all HPE Persistent Memory modules on the new server before using them.
Requirements for relocating encrypted HPE Persistent Memory modules or a set of HPE Persistent Memory modules
when the data must be preserved
•If HPE Persistent Memory modules are encrypted with local key management, either manually retrieve the HPE
Persistent Memory module passwords from the server (user-generated passwords only) or export a password file to a
USB key.
Hewlett Packard Enterprise recommends exporting the password file to a USB key.
•Follow the requirements for relocating HPE Persistent Memory modules or a set of HPE Persistent Memory modules
when the data must be preserved.
•Do one of the following:
◦If HPE Persistent Memory modules are encrypted with local key management, either manually enter the HPE
Persistent Memory module passwords in the System Utilities or import the password file from the USB key.
◦If HPE Persistent Memory modules are encrypted with remote key management, enroll the HPE iLO in the key
management server to provide access to the data on the HPE Persistent Memory modules.
For more information, see the HPE Persistent Memory User Guide on the Hewlett Packard Enterprise website (
www.hpe.com/info/persistentmemory-docs).
Removal and replacement procedures
https://
61
Page 62
Requirements for relocating HPE Persistent Memory modules or a set of HPE Persistent Memory modules when the
data does not have to be preserved
•Move the HPE Persistent Memory modules to the new location and sanitize all HPE Persistent Memory modules after
installing them to the new location.
•Observe the DIMM and HPE Persistent Memory module population guidelines.
•Observe the process for removing an HPE Persistent Memory module.
•Observe the process for installing an HPE Persistent Memory module.
•Review and configure the system settings for HPE Persistent Memory.
For more information, see the HPE Persistent Memory User Guide on the Hewlett Packard Enterprise website (https://
www.hpe.com/info/persistentmemory-docs).
HPE Persistent Memory module sanitization
Media sanitization is defined by NIST SP800-88 Guidelines for Media Sanitization (Rev 1, Dec 2014) as "a general term
referring to the actions taken to render data written on media unrecoverable by both ordinary and extraordinary means."
The specification defines the following levels:
•Clear: Overwrite user-addressable storage space using standard write commands; might not sanitize data in areas not
currently user-addressable (such as bad blocks and over-provisioned areas).
•Purge: Overwrite or erase all storage space that might have been used to store data using dedicated device sanitize
commands, such that data retrieval is "infeasible using state-of-the-art laboratory techniques."
•Destroy: Ensure that data retrieval is "infeasible using state-of-the-art laboratory techniques" and render the media
unable to store data (such as disintegrate, pulverize, melt, incinerate, or shred).
HPE Persistent Memory supports the purge level using a cryptographic erase technique and an overwrite technique.
HPE ProLiant and HPE Synergy Gen10 server products support sanitizing HPE Persistent Memory modules during POST.
Use the HPE RESTful Interface Tool or UEFI System Utilities to schedule sanitization on the next boot.
For more information, see the following sections in the HPE Persistent Memory User Guide on the Hewlett Packard
Enterprise website (https://www.hpe.com/info/persistentmemory-docs):
•Sanitization policies
•Sanitization guidelines
NIST SP800-88 Guidelines for Media Sanitization (Rev 1, Dec 2014) is available for download from the NIST website
(https://nvlpubs.nist.gov/nistpubs/SpecialPublications/NIST.SP.800-88r1.pdf).
Removing and replacing the system board
Removing the system board
Prerequisites
•Take note of the following:
62
Removal and replacement procedures
Page 63
◦The slot locations in which each memory module is installed. These components must be installed in the same
locations on the new system board.
◦The port numbers and cable connections between the system board and the secondary riser board.
•Before you perform this procedure, make sure that you have a T-15 and T-30 Torx screwdrivers available.
Procedure
1.Power down the server.
2.Disconnect all peripheral cables from the server.
3.Remove the server from the chassis.
Remove the bayonet board.
4.
5.Do one of the following:
•Remove the secondary riser blank.
•Remove the secondary riser cage.
Do one the following:
6.
•Remove the primary riser blank.
Remove the primary riser cage.
•
If installed, remove the Media Module adapter.
7.
If installed, remove the M.2 SSD riser board.
8.
If present,
9.
Remove the DIMMs from the system board.
10.
Remove the processor heatsink assembly:
11.
a.
b.
disconnect the S100i SR Gen10 controller SATA X-cable.
Allow the heatsink to cool.
Loosen the heatsink nuts in the order specified by the label on the heatsink.
Removal and replacement procedures
63
Page 64
c. Lift the processor heatsink assembly and move it away from the system board.
d. Turn the assembly over and place it on a work surface with the processor facing up.
Install the dust cover.
e.
Remove the system board.
12.
Replacing the system board
Prerequisites
Before you perform this procedure, make sure that you have a T-15 and T-30 Torx screwdrivers available.
Procedure
1.Install the system board.
64
Removal and replacement procedures
Page 65
2.Install the processor heatsink assembly:
a. Locate and align the Pin 1 indicator on the processor frame and the socket.
Align the processor heatsink assembly with the heatsink alignment posts and gently lower it down until it sits
b.
evenly on the socket.
The heatsink alignment posts are keyed. The processor will only install one way.
A standard heatsink is shown, your heatsink might look
dierent.
CAUTION: Be sure to tighten each heatsink nut fully in the order indicated. Otherwise, boot failure or
intermittent shutdowns might occur.
c. Using a T-30 Torx screwdriver, tighten the nuts until they stop.
Removal and replacement procedures
65
Page 66
3.Install all components removed from the failed system board.
Be sure to install the DIMMs in the same DIMM slots as the failed system board.
Do the following:
4.
•Install the primary PCIe riser cage.
•Install the primary PCIe riser blank.
Do the following:
5.
•Install the secondary PCIe riser cage.
•Install the secondary PCIe riser blank.
Install the bayonet board.
6.
Install the server from the chassis.
7.
Connect all peripheral cables to the server.
8.
Power up the server.
9.
Access System Utilities and:
10.
Re-enter the server serial number and product ID.
•
•If the server is using Intel Xeon Gold 6244 processors, select an advanced fan cooling method.
11. Ensure all firmware, including option cards and embedded devices, is updated to the same versions to ensure that
the latest drivers are being used.
Re-entering the server serial number and product ID and selecting an advanced fan
cooling method
After you replace the system board, the server serial number and the product ID must be configured:
66
Removal and replacement procedures
Page 67
Procedure
1.Access System Utilities. During POST, press F9.
2.On the System Utilities home screen, select System Configuration > BIOS/Platform Configuration (RBSU) >
Advanced Options > Advanced Service Options.
3.Select the Serial Number field and press Enter.
The following alert appears:
The serial number is modified by qualified service personnel and must
match the serial number located on the chassis.
4.Click OK.
5.Type the serial number and press Enter.
6.Select the Product ID field and press Enter.
The following alert appears:
Product ID is modified only by qualified personnel. This value must match
the product ID located on the chassis.
Type the product ID and press Enter.
7.
Press F10 to save the configuration.
8.
If the server is using Intel Xeon Gold 6244 processors, do the following:
9.
Select System Configuration > BIOS/Platform Configuration (RBSU) > Advanced Options > Fan and
a.
Thermal Options > Thermal Configuration.
Select one of the following advanced fan cooling method:
b.
•
Enhanced CPU Cooling
•
Maximum Cooling
Save your setting.
10.
The procedure is complete.
System battery replacement
System battery information
The server contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery that provides
power to the real-time clock. If this battery is not properly handled, a risk of the fire and burns exists. To reduce the risk of
personal injury:
•Do not attempt to recharge the battery.
•Do not expose the battery to temperatures higher than 60°C (140°F).
•Do not expose the battery to extremely low air pressure as it might lead to explosion or leakage of flammable liquid or
gas.
Removal and replacement procedures
67
Page 68
•Do not disassemble, crush, puncture, short external contacts, or dispose the battery in fire or water.
•If the server no longer automatically displays the correct date and time, then replace the battery that provides power
to the real-time clock. Under normal use, battery life is 5 to 10 years.
Removing and replacing the system battery
Procedure
1.Power down the server.
2.Disconnect all peripheral cables from the server.
3.Remove the server from the chassis.
4.Remove the air bale.
5.If a secondary riser option is installed,
6.Do one of the following:
•Remove the secondary riser blank.
Remove the secondary riser cage.
•
Remove the primary riser cage.
7.
Locate the battery on the system board.
8.
Slightly push the metal tab, and then remove the system battery from the socket.
9.
remove the bayonet board.
10. Slightly push the metal tab, and then install the new system battery in the socket.
68
Removal and replacement procedures
Page 69
11. Install the server into the chassis.
12. Connect all peripheral cables to the server.
Power up the server.
13.
Properly dispose of the old battery. For more information about proper battery disposal, contact an authorized
14.
reseller or an authorized service provider.
HPE Trusted Platform Module 2.0 Gen10 Option
The HPE Trusted Platform Module 20 Gen10 Option is not a customer-removable part.
CAUTION: If the TPM is removed from the original server and powered up on a
TPM including keys will be erased.
If you suspect a TPM board failure, leave the TPM installed and remove the system board. Contact a authorized service
provider for a replacement system board and TPM board.
dierent server, data stored in the
Removal and replacement procedures
69
Page 70
Troubleshooting
NMI functionality
An NMI crash dump enables administrators to create crash dump files when a system is hung and not responding to
traditional debugging methods.
An analysis of the crash dump log is an essential part of diagnosing reliability problems, such as hanging operating
systems, device drivers, and applications. Many crashes freeze a system, and the only available action for administrators is
to cycle the system power. Resetting the system erases any information that could support problem analysis, but the NMI
feature preserves that information by performing a memory dump before a hard reset.
To force the OS to invoke the NMI handler and generate a crash dump log, the administrator can use the iLO Virtual NMI
feature.
Troubleshooting resources
Troubleshooting resources are available for HPE Gen10 server products in the following documents:
•Troubleshooting Guide for HPE ProLiant Gen10 servers provides procedures for resolving common problems and
comprehensive courses of action for fault isolation and identification, issue resolution, and software maintenance.
•Error Message Guide for HPE ProLiant Gen10 servers and HPE Synergy provides a list of error messages and
information to assist with interpreting and resolving error messages.
•Integrated Management Log Messages and Troubleshooting Guide for HPE ProLiant Gen10 and HPE Synergy
provides IML messages and associated troubleshooting information to resolve critical and cautionary IML events.
To access the troubleshooting resources, see the Hewlett Packard Enterprise Information Library (
info/gen10-troubleshooting).
https://www.hpe.com/
70
Troubleshooting
Page 71
Diagnostic tools
Product QuickSpecs
For more information about product features, specifications, options, configurations, and compatibility, see the product
QuickSpecs on the Hewlett Packard Enterprise website (https://www.hpe.com/info/qs).
UEFI System Utilities
The UEFI System Utilities is embedded in the system ROM. Its features enable you to perform a wide range of
configuration activities, including:
•Configuring system devices and installed options.
•Enabling and disabling system features.
•Displaying system information.
•Selecting the primary boot controller or partition.
•Configuring memory options.
•Launching other preboot environments.
HPE servers with UEFI can provide:
•Support for boot partitions larger than 22 TB. Such configurations could previously only be used for boot drives when
using RAID solutions.
•Secure Boot that enables the system firmware, option card firmware, operating systems, and software collaborate to
enhance platform security.
•UEFI Graphical User Interface (GUI)
•An Embedded UEFI Shell that provides a preboot environment for running scripts and tools.
•Boot support for option cards that only support a UEFI option ROM.
Selecting the boot mode
This server provides two Boot Mode configurations: UEFI Mode and Legacy BIOS Mode. Certain boot options require that
you select a specific boot mode. By default, the boot mode is set to UEFI Mode. The system must boot in UEFI Mode to
use certain options, including:
•Secure Boot, UEFI Optimized Boot, Generic USB Boot, IPv6 PXE Boot, iSCSI Boot, and Boot from URL
•Fibre Channel/FCoE Scan Policy
NOTE: The boot mode you use must match the operating system installation. If not, changing the boot mode can impact
the ability of the server to boot to the installed operating system.
Prerequisite
When booting to UEFI Mode, leave UEFI Optimized Boot enabled.
Diagnostic tools
71
Page 72
Procedure
1. From the System Utilities screen, select System Configuration > BIOS/Platform Configuration (RBSU) > Boot
Options > Boot Mode.
2. Select a setting.
•UEFI Mode (default)—Configures the system to boot to a UEFI compatible operating system.
•Legacy BIOS Mode—Configures the system to boot to a traditional operating system in Legacy BIOS compatibility
3. Save your setting.
4. Reboot the server.
Secure Boot
Secure Boot is a server security feature that is implemented in the BIOS and does not require special hardware. Secure
Boot ensures that each component launched during the boot process is digitally signed and that the signature is validated
against a set of trusted certificates embedded in the UEFI BIOS. Secure Boot validates the software identity of the
following components in the boot process:
•UEFI drivers loaded from PCIe cards
mode.
•UEFI drivers loaded from mass storage devices
•Preboot UEFI Shell applications
•OS UEFI boot loaders
When Secure Boot is enabled:
•Firmware components and operating systems with boot loaders must have an appropriate digital signature to execute
during the boot process.
•Operating systems must support Secure Boot and have an EFI boot loader signed with one of the authorized keys to
boot. For more information about supported operating systems, see https://www.hpe.com/servers/ossupport.
You can customize the certificates embedded in the UEFI BIOS by adding or removing your own certificates, either from a
management console directly attached to the server, or by remotely connecting to the server using the iLO Remote
Console.
You can configure Secure Boot:
•Using the System Utilities options described in the following sections.
•Using the iLO RESTful API to clear and restore certificates. For more information, see the Hewlett Packard Enterprise
website (http://www.hpe.com/info/redfish).
•Using the secboot command in the Embedded UEFI Shell to display Secure Boot databases, keys, and security
reports.
Launching the Embedded UEFI Shell
Use the Embedded UEFI Shell option to launch the Embedded UEFI Shell. The Embedded UEFI Shell is a preboot
command-line environment for scripting and running UEFI applications, including UEFI boot loaders. The Shell also
provides CLI-based commands you can use to obtain system information, and to configure and update the system BIOS.
72
Diagnostic tools
Page 73
Prerequisites
Embedded UEFI Shell is set to Enabled.
Procedure
1. From the System Utilities screen, select Embedded Applications > Embedded UEFI Shell.
The Embedded UEFI Shell screen appears.
2. Press any key to acknowledge that you are physically present.
This step ensures that certain features, such as disabling Secure Boot or managing the Secure Boot certificates using
third-party UEFI tools, are not restricted.
3. If an administrator password is set, enter it at the prompt and press Enter.
The Shell> prompt appears.
4. Enter the commands required to complete your task.
5. Enter the exit command to exit the Shell.
Intelligent Provisioning
Intelligent Provisioning is a single-server deployment tool embedded in ProLiant servers and HPE Synergy compute
modules. Intelligent Provisioning simplifies server setup, providing a reliable and consistent way to deploy servers.
Intelligent Provisioning
screen, you are prompted to select whether you want to enter the Intelligent Provisioning or HPE Rapid Setup Software
mode.
NOTE: After you have selected a mode, you must reprovision the server to change the mode that launches when you boot
to F10.
Intelligent Provisioning prepares the system for installing original, licensed vendor media and Hewlett Packard Enterprisebranded versions of OS software. Intelligent Provisioning also prepares the system to integrate optimized server support
software from the Service Pack for ProLiant (SPP). SPP is a comprehensive systems software and firmware solution for
ProLiant servers, server blades, their enclosures, and HPE Synergy compute modules. These components are preloaded
with a basic set of firmware and OS components that are installed along with Intelligent Provisioning.
IMPORTANT: HPE ProLiant DX/XL servers do not support operating system installation with Intelligent
Provisioning, but they do support the maintenance features. For more information, see "Performing Maintenance" in
the Intelligent Provisioning user guide and online help.
After the server is running, you can update the firmware to install additional components. You can also update any
components that have been outdated since the server was manufactured.
To access Intelligent Provisioning:
•Press F10 from the POST screen and enter either Intelligent Provisioning or HPE Rapid Setup Software.
•From the iLO web interface using Always On. Always On allows you to access Intelligent Provisioning without
rebooting your server.
330 and later includes HPE Rapid Setup Software. When you launch F10 mode from the POST
Diagnostic tools
73
Page 74
HPE Insight Remote Support
Hewlett Packard Enterprise strongly recommends that you register your device for remote support to enable enhanced
delivery of your Hewlett Packard Enterprise warranty, HPE support services, or Hewlett Packard Enterprise contractual
support agreement. Insight Remote Support supplements your monitoring continuously to ensure maximum system
availability by providing intelligent event diagnosis, and automatic, secure submission of hardware event notifications to
Hewlett Packard Enterprise, which will initiate a fast and accurate resolution, based on your product’s service level.
Notifications can be sent to your authorized Hewlett Packard Enterprise Channel Partner for onsite service, if configured
and available in your country.
For more information, see Insight Remote Support and Insight Online Setup Guide for ProLiant Servers and BladeSystemc-Class Enclosures on the
Packard Enterprise Warranty, HPE support services, or Hewlett Packard Enterprise contractual support agreement.
Hewlett Packard Enterprise website. Insight Remote Support is available as part of Hewlett
USB support
Hewlett Packard Enterprise Gen10 servers support all USB operating speeds depending on the device that is connected
to the server.
External USB functionality
Hewlett Packard Enterprise provides external USB support to enable local connection of USB devices for server
administration, configuration, and diagnostic procedures.
For additional security, external USB functionality can be disabled through USB options in UEFI System Utilities.
HPE Smart Storage Administrator
HPE SSA is the main tool for configuring arrays on HPE Smart Array SR controllers. It exists in three interface formats: the
HPE SSA GUI, the HPE SSA CLI, and HPE SSA Scripting. All formats provide support for configuration tasks. Some of the
advanced tasks are available in only one format.
The diagnostic features in HPE SSA are also available in the standalone software HPE Smart Storage Administrator
Diagnostics Utility CLI.
During the initial provisioning of the server or compute module, an array is required to be configured before the operating
system can be installed. You can configure the array using SSA.
HPE SSA is accessible both oline (either through HPE Intelligent Provisioning or as a standalone bootable ISO image)
and online:
•Accessing HPE SSA in the oline environment
IMPORTANT: If you are updating an existing server in an
SSA through Service Pack for ProLiant before performing configuration procedures.
Using one of multiple methods, you can run HPE SSA before launching the host operating system. In oline mode,
users can configure or maintain detected and supported devices, such as optional Smart Array controllers and
integrated Smart Array controllers. Some HPE SSA features are only available in the oline environment, such as
setting the boot controller and boot volume.
•Accessing HPE SSA in the online environment
oline environment, obtain the latest version of HPE
74
Diagnostic tools
This method requires an administrator to download the HPE SSA executables and install them. You can run HPE SSA
online after launching the host operating system.
For more information, see HPE Smart Array SR Gen10 Configuration Guide at the Hewlett Packard Enterprise website.
Page 75
HPE InfoSight for servers
The HPE InfoSight portal is a secure web interface hosted by HPE that allows you to monitor supported devices through a
graphical interface.
HPE InfoSight for servers:
•Combines the machine learning and predictive analytics of HPE InfoSight with the health and performance monitoring
of Active Health System (AHS) and HPE iLO to optimize performance and predict and prevent problems
•Provides automatic collection and analysis of the sensor and telemetry data from AHS to derive insights from the
behaviors of the install base to provide recommendations to resolve problems and improve performance
For more information on getting started and using HPE InfoSight for servers, go to:
infosight-servers-docs.
https://www.hpe.com/info/
Diagnostic tools75
Page 76
Component identification
Rear panel components
ItemDescription
1Slot 1 PCIe3 x16 (16, 8, 4, 1)
2Slot 2 PCIe3 x16 (16, 8, 4, 1) or FlexibleLOM
3SUV port
4iLO Management Port
1
5iLO Service Port
6Media Module NIC port 2
7Media Module NIC port 1
8Serial number/iLO information pull tab
9USB 30 port
1
If the RCM module is installed on the chassis, the iLO Management Port is automatically disabled.
2
The Media Module adapter is a hardware option.
Serial number/iLO information pull tab
The serial number/iLO information pull tab is double-sided. One side shows the server serial number and the customer
asset tag label. The other side shows the default iLO account information and QR code label.
Use a mobile device to scan the QR code label to display the server mobile product page (https://www.hpe.com/qref/xl170rgen10). This page contains links to server setup information, spare part numbers, QuickSpecs, troubleshooting
resources, and other useful product links.
2
2
76
Component identification
Page 77
Rear panel LEDs and buttons
ItemDescriptionStatusDefinition
1NIC link LED
2
GreenLinked to network
ONo network link
2NIC status LED
1
Flashing greenNetwork active
ONo network activity
3Health LED
1
Solid greenNormal
Flashing greeniLO is rebooting.
Flashing amberSystem degraded
Flashing redSystem critical
4Do not remove LEDFlashing whiteDo not remove the server.
Removing the server may terminate
the current operation and cause data
loss.
OThe server can be removed.
5UID button/LED
1
Solid blueActivated
Flashing blue•1 flash per second = Remote
management or firmware upgrade
in progress
•4 flashes per second = iLO manual
soft reboot sequence initiated
•8 flashes per second = iLO manual
hard reboot sequence in progress
Table Continued
Component identification77
Page 78
ItemDescriptionStatusDefinition
ODeactivated
6Power On/Standby button and
system power LED
1
When the LEDs described in this table flash simultaneously, a power fault has occurred. For more information, see
power fault codes.
2
If the health LED indicates a degraded or critical state, review the system IML or use iLO to review the system health status.
3
Facility power is not present, power cord is not attached, no power supplies are installed, power supply failure has occurred, or the front
I/O cable is disconnected.
Server UID LED
The UID LED is used to locate a particular server when it is deployed in a dense chassis with other equipment. Activating
the UID LED helps an onsite technician to quickly identify a server for maintenance tasks.
UID button functionality
The UID button can be used to display the Server Health Summary when the server will not power on. For more
information, see the latest HPE iLO 5 User Guide on the Hewlett Packard Enterprise website.
1
Flashing greenPerforming power-on sequence
Solid amberSystem in standby
Solid greenSystem on and normal operation
ONo power present
3
Front panel LED
Front panel LED power fault codes
The following table provides a list of power fault codes, and the subsystems that are aected. Not all power faults are
used by all servers.
Subsystem
System board1 flash
Processor2 flashes
Memory3 flashes
Riser board PCIe slots4 flashes
FlexibleLOM5 flashes
Removable HPE Smart Array SR Gen10 controller6 flashes
Blinking amber4 Hz blinking amber indicates a problem with the physical
Solid greenA valid logical (data activity) link exists with no active
Blinking greenA valid logical link exists with active traic.
1
2-port adapter LEDs are shown. The 1-port adapters have only a single LED.
1
System board components
Description
link.
traic.
Component identification
79
Page 80
ItemDescription
1Primary PCIe x16 riser connector 1
2Media Module connector
3System battery
4OPA adapter sideband cable connector
5M.2 SSD riser connector
6Processor 1
7DIMM slots for processor 1
8Processor 2
9DIMM slots for processor 2
10Bayonet board connector
11Secondary PCIe x24 riser connector 4
12Secondary PCIe x24 riser connector 3
13x4 SATA port
14System maintenance switch
15x8 SATA port
16Secondary PCIe x24 riser connector 2
17TPM connector
18microSD slot
System maintenance switch descriptions
Position
1
S1
S2OReserved
S3OReserved
S4OReserved
1
S5
3
S61, 2,
DefaultFunction
O
O = iLO 5 security is enabled.
On = iLO 5 security is disabled.
O
O = Power-on password is enabled.
On = Power-on password is disabled.
O
O = No function
S7OReserved
S8—Reserved
80Component identification
On = Restore default manufacturing settings
Table Continued
Page 81
PositionDefaultFunction
S9—Reserved
S10—Reserved
S11—Reserved
S12—Reserved
1
To access the redundant ROM, set S1, S5, and S6 to On.
2
When the system maintenance switch position 6 is set to the On position, the system is prepared to restore all configuration settings to
their manufacturing defaults.
3
When the system maintenance switch position 6 is set to the On position and Secure Boot is enabled, some configurations cannot be
restored. For more information, see Secure Boot.
DIMM label identification
To determine DIMM characteristics, see the label attached to the DIMM. The information in this section helps you to use
the label to locate specific information about the DIMM.
ItemDescriptionExample
1Capacity
8 GB
16 GB
32 GB
64 GB
128 GB
2Rank
1R = Single rank
2R = Dual rank
4R = Quad rank
8R = Octal rank
Table Continued
Component identification81
Page 82
ItemDescriptionExample
3Data width on DRAM
4Memory generation
5Maximum memory speed
6CAS latency
x4 = 4-bit
x8 = 8-bit
x16 = 16-bit
PC4 = DDR4
2133 MT/s
2400 MT/s
2666 MT/s
2933 MT/s
P = CAS 15-15-15
T = CAS 17-17-17
U = CAS 20-18-18
V = CAS 19-19-19 (for RDIMM, LRDIMM)
V = CAS 22-19-19 (for 3DS TSV LRDIMM)
Y = CAS 21-21-21 (for RDIMM, LRDIMM)
Y = CAS 24-21-21 (for 3DS TSV LRDIMM)
7
For more information about product features, specifications, options, configurations, and compatibility, see the HPE DDR4
SmartMemory QuickSpecs on the Hewlett Packard Enterprise website (https://www.hpe.com/support/DDR4SmartMemoryQS).
DIMM type
R = RDIMM (registered)
L = LRDIMM (load reduced)
E = Unbuered ECC (UDIMM)
82
Component identification
Page 83
HPE Persistent Memory module label identification
ItemDescriptionExample
1Unique ID number8089-A2-1802-1234567
2Model numberNMA1XBD512G2S
3Capacity
4QR codeIncludes part number and serial number
For more information about product features, specifications, options, configurations, and compatibility, see the product
QuickSpecs on the Hewlett Packard Enterprise website (https://www.hpe.com/support/persistentmemoryQS).
128 GB
256 GB
512 GB
Processor, heatsink, and socket components
Component identification
83
Page 84
ItemDescription
1Heatsink nuts
2Processor carrier
3Pin 1 indicator
4Heatsink latch
5Alignment post
1
Symbol also on the processor and frame.
1
Bayonet port numbering
PCIe riser board components
This section identifies the riser slots compatible with specific types of expansion options supported by the server. The
following riser options are supported:
•Primary riser
•Secondary risers
•M.2 SSD riser
Primary riser board components
The primary riser function is linked to processor 1. This riser only supports low-profile expansion boards.
The cable colors in the cabling diagrams used in this chapter are for illustration purposes only. Most of the server cables
are black.
Observe the following guidelines when working with server cables.
Before connecting cables
•Note the port labels on the PCA components. Not all of these components are used by all servers:
◦System board ports
◦Drive and power supply backplane ports
◦Expansion board ports (controllers, adapters, expanders, risers, and similar boards)
•Note the label near each cable connector. This label indicates the destination port for the cable connector.
•Some data cables are pre-bent. Do not unbend or manipulate the cables.
•To prevent mechanical damage or depositing oil that is present on your hands, and other contamination, do not touch
the ends of the connectors.
When connecting cables
•Before connecting a cable to a port, lay the cable in place to verify the length of the cable.
•Use the internal cable management features to properly route and secure the cables.
•When routing cables, be sure that the cables are not in a position where they can be pinched or crimped.
•Avoid tight bend radii to prevent damaging the internal wires of a power cord or a server cable. Never bend power
cords and server cables tight enough to cause a crease in the sheathing.
•Make sure that the excess length of cables are properly secured to avoid excess bends, interference issues, and airflow
restriction.
•To prevent component damage and potential signal interference, make sure that all cables are in their appropriate
routing position before installing a new component and before closing up the server after hardware installation/
maintenance.
When disconnecting cables
•Grip the body of the cable connector. Do not pull on the cable itself because this action can damage the internal wires
of the cable or the pins on the port.
•If a cable does not disconnect easily, check for any release latch that must be pressed to disconnect the cable.
Cabling
89
Page 90
•Remove cables that are no longer being used. Retaining them inside the server can restrict airflow. If you intend to use
the removed cables later, label and store them for future use.
Smart Array cabling
Smart Array controller cables
Controller type
Embedded
controller
Type-p standup
plug‑in controller
1
The 870539-001 cable included in the 874785-B21 cable kit is for primary riser.
2
The 870540-001 cable included in the 874855-B21 cable kit is for secondary riser.
Cable kit part
number
874305-B21870527-001System boardBayonet port
874785-B21
874855-B21
1
2
Cable part
number
870539-001Controller port 1 or 2Bayonet port
870540-001
From #To port #
90Cabling
Page 91
Onboard S100i SR Gen10 controller cabling (SATA only)
Smart Array type-p controller cabling (SAS/SATA)
Smart Array type-p controller cabling in the primary riser slot
Cabling
91
Page 92
Smart Array type-p controller cabling in the secondary riser slot
Storage controller backup power cabling
Storage controller backup power cabling in the primary riser slot
92
Storage controller backup power cabling in the P1 secondary riser
Cabling
Page 93
Storage controller backup power cabling in the P2 secondary riser
Secondary riser cabling
Cabling matrix
Cable kit part numberCable part numberFrom #To port #
874304-B21870531-001
870532-001
1
The 870531-001 cable included in the 874304-B21 cable kit is a 16NVMe long cable.
2
The 870532-001 cable included in the 874304-B21 cable kit is a 16NVMe short cable.
1
2
Riser port 1 or 2Bayonet port 1 or 2
Cable colorDescription
BlueSecondary riser port 1 to bayonet port 1
OrangeSecondary riser port 2 to bayonet port 2
Cabling93
Page 94
FlexibleLOM riser cabling
OPA adapter cabling
Cable colorDescription
Blue
Orange
OPA adapter sideband cable
OPA adapter IFP cable
94Cabling
Page 95
InfiniBand and auxiliary adapter cabling
Cable colorDescription
OrangeWhite cable
BlueBlack cable
Cabling95
Page 96
Specifications
Environmental specifications
SpecificationValue
Temperature range
Operating10°C to 35°C (50°F to 95°F)
Non-operating-30°C to 60°C (-22°F to 140°F)
1
—
Relative humidity (noncondensing)
Operating8% to 90%
Non-operating
1
All temperature ratings shown are for sea level. An altitude derating of 10°C per 305 m (18°F per 1000 ft) to 3050 m (10000 ft) is
applicable. No direct sunlight allowed. Maximum rate of change is 20°C per hour (36°F per hour). The upper limit and rate of change
might be limited by the type and number of options installed.
For certain approved hardware configurations, the supported system inlet temperature range is extended:
•5°C to 10°C (41°F to 50°F) and 35°C to 40°C (95°F to 104°F) at sea level with an altitude derating of 10°C per every
175 m (18°F per every 574 ft) above 900 m (2953 ft) to a maximum of 3050 m (10000 ft).
•40°C to 45°C (104°F to 113°F) at sea level with an altitude derating of 10°C per every 125 m (18°F per every 410
ft) above 900 m (2953 ft) to a maximum of 3050 m (10000 ft).
Mechanical specifications
—
28°C (824°F), maximum wet bulb temperature
5% to 95%
387°C (1017°F), maximum wet bulb temperature
Specification
Height413 cm (163 in)
Depth6580 cm (2591 in)
Width1845 cm (727 in)
Weight (approximate values)
Weight (maximum)461 kg (1017 lb)
Weight (minimum)330 kg (727 lb)
Value
Temperature requirements
To ensure continued safe and reliable equipment operation, install or position the rack in a well-ventilated, climatecontrolled environment.
The operating temperature inside the rack is always higher than the room temperature and is dependent on the
configuration of equipment in the rack. Check the TMRA for each piece of equipment before installation.
96
Specifications
Page 97
CAUTION: To reduce the risk of damage to the equipment when installing third-party options:
•Do not permit optional equipment to impede airflow around the server or to increase the internal rack
temperature beyond the maximum allowable limits.
•Do not exceed the TMRA of manufacturer.
•The maximum inlet ambient temperature for most components installed in the server is 35°C (95°F). Some
components, however, have thermal limitations depending on the chassis model and the fan configuration. If two or
more components with temperature limitations are installed in the server, observe the lowest maximum inlet ambient
temperature.
•In most cases, the removable drive blanks are installed in empty drive bays. However, when components that have
thermal limitations are installed, it might be necessary to limit the number of drives installed in the chassis. In which
case, a combination of drive blanks and/or thermal bezel blanks is installed in the empty drive bays.
•For list of components with thermal limitations, see to the following topics:
Thermal limitations for components in systems with the Enhanced Processor Performance feature enabled
◦
◦Thermal limitations for components in systems with the Enhanced Processor Performance feature disabled
•The following drive options have drive capacities greater than or equal to 10 TB, but their thermal requirements are
the same as drives with capacities of less than 10 TB.
◦857646-B21
◦857650-B21
◦878562-B21
◦878566-B21
◦881781-B21
◦881787-B21
List of components with temperature requirements
The maximum inlet ambient temperature for most components installed in the server is 35°C (95°F). Some components,
however, are subject to thermal limitations depending on the chassis model and the fan configuration. If two or more
components with temperature requirements are installed in the server, observe the lowest maximum inlet ambient
temperature.
Thermal limitations for components in systems with the Enhanced Processor
Performance feature enabled
The Enhanced Processor Performance feature adjusts the processor settings to a more aggressive setup that can result in
increased performance, but might result in higher power consumption.
To configure this feature, from the System Utilities screen, select System Configuration > BIOS/Platform
Configuration (RBSU) > Power and Performance Options > Advanced Performance Tuning Options.
Processors
The following limitations are for the Intel Xeon Gold 6244 (G6244) processor:
Specifications
97
Page 98
•The processor does not support enhanced processor performance.
•LFF drives with drive capacities greater than or equal to 10 TB are not supported for the Apollo r2200 Gen10 Chassis
series with three drives per node.
DescriptionChassisFan configurationNumber of drives
supported by the server
Processor with a
TDP of 135 W
or more, except
G6244
Apollo r2200 Gen10
Chassis
(12 LFF backplane)
Apollo r2600 Gen10
Chassis
Redundant and
nonredundant
Redundant and
nonredundant
3 drives
3 drives
0 to 2 drives
0 to 6 drives30°C (86°F)
1
2
3
(24 SFF or 16 SFF + 8
NVMe backplane)
Apollo r2800 Gen10
Chassis
Redundant and
nonredundant
0 to 24 drives30°C (86°F)
(24 SFF backplane with
SAS expander)
Apollo r2800 Gen10
Chassis
Redundant and
nonredundant
0 to 4 drives30°C (86°F)
(16 NVMe backplane)
Intel Xeon Gold
6244
Apollo r2200 Gen10
Chassis
(12 LFF backplane)
Redundant and
nonredundant
3 drives
3 drives
0 to 2 drives
1
2
3
Maximum inlet
ambient
temperature
28°C (824°F)
Not supported
35°C (95°F)
Not supported
Not supported
Not supported
Processor with a
TDP between
115 W and 130
W
Apollo r2600 Gen10
Chassis
(24 SFF or 16 SFF + 8
NVMe backplane)
Apollo r2800 Gen10
Chassis
(24 SFF backplane with
SAS expander)
Apollo r2800 Gen10
Chassis
(16 NVMe backplane)
Apollo r2200 Gen10
Chassis
(12 LFF backplane)
Redundant and
nonredundant
Redundant and
nonredundant
Redundant and
nonredundant
Redundant and
nonredundant
0 to 6 drivesNot supported
0 to 24 drivesNot supported
0 to 4 drivesNot supported
3 drives
3 drives
0 to 2 drives
1
2
3
30°C (86°F)
Not supported
35°C (95°F)
Table Continued
98Specifications
Page 99
DescriptionChassisFan configurationNumber of drives
supported by the server
Maximum inlet
ambient
temperature
DIMMs
Apollo r2600 Gen10
Chassis
Redundant and
nonredundant
0 to 6 drives35°C (95°F)
(24 SFF or 16 SFF + 8
NVMe backplane)
Apollo r2800 Gen10
Chassis
Redundant and
nonredundant
0 to 24 drives35°C (95°F)
(24 SFF backplane with
SAS expander)
Apollo r2800 Gen10
Chassis
Redundant and
nonredundant
0 to 4 drives35°C (95°F)
(16 NVMe backplane)
1
The drive capacity must be less than 10 TB.
2
The drive capacity must be greater than or equal to 10 TB.
3
If the component is installed in server 1 or server 2, and the server is installed in the Apollo r2200 Gen10 Chassis, drive blanks must be
installed in drive bays 1-2 and 2-2. Similarly, if the component is installed in server 3 or server 4, and the server is installed in the Apollo
r2200 Gen10 Chassis, drive blanks must be installed in drive bays 3-2 and 4-2.
NOTE: In nonredundant fan configuration, 32 GB RDIMM and 64 GB LRDIMM can support up to 35°C (95°F) temperature.
NOTE: HPE Persistent Memory module does not support enhanced processor performance.
DescriptionChassisFan configurationNumber of drives
supported by the server
32 GB RDIMMApollo r2200
Gen10 Chassis
(12 LFF
backplane)
Apollo r2600
Redundant3 drives
3 drives
0 to 2 drives
Redundant0 to 6 drives35°C (95°F)
1
2
3
Maximum inlet ambient
temperature
30°C (86°F)
Not supported
35°C (95°F)
Gen10 Chassis
(24 SFF or 16
SFF + 8 NVMe
backplane)
Apollo r2800
Redundant0 to 24 drives35°C (95°F)
Gen10 Chassis
(24 SFF
backplane with
SAS expander)
Table Continued
Specifications99
Page 100
DescriptionChassisFan configurationNumber of drives
supported by the server
Maximum inlet ambient
temperature
Apollo r2800
Gen10 Chassis
(16 NVMe
backplane)
64 GB LRDIMMApollo r2200
Gen10 Chassis
(12 LFF
backplane)
Apollo r2600
Gen10 Chassis
(24 SFF or 16
SFF + 8 NVMe
backplane)
Apollo r2800
Gen10 Chassis
(24 SFF
backplane with
SAS expander)
Redundant0 to 4 drives35°C (95°F)
Redundant3 drives
3 drives
0 to 2 drives
1
2
3
Not supported
Not supported
35°C (95°F)
Redundant0 to 6 drives35°C (95°F)
Redundant0 to 24 drives35°C (95°F)
Apollo r2800
Gen10 Chassis
(16 NVMe
backplane)
128 GB LRDIMM Apollo r2200
Gen10 Chassis
(12 LFF
backplane)
Apollo r2600
Gen10 Chassis
(24 SFF or 16
SFF + 8 NVMe
backplane)
Apollo r2800
Gen10 Chassis
(24 SFF
backplane with
SAS expander)
Redundant0 to 4 drives35°C (95°F)
Redundant and
nonredundant
Redundant and
3 drives
3 drives
0 to 2 drives
0 to 6 drivesNot supported
1
2
3
Not supported
Not supported
Not supported
nonredundant
Redundant and
0 to 24 drivesNot supported
nonredundant
100Specifications
Table Continued
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.