Hewlett Packard 4WA12EA Product Data Sheet

QuickSpecs

HP Engage One All-In-One system

Overview

c05573243 — DA – 16012 Worldwide — Version 13 — October 31, 2018

Page 1

HP Engage One AiO System , Models 141, 143, & 145

FRONT VIEW

14-inch diagonal display panel (wide-aspect ratio); FHD 1920 x 1080 resolution Projected Capacitive Touch Screen

HP Engage One AiO System Integrated MSR

HP Engage One AiO System Integrated Column Printer

Recessed Power Button

Choice of 2 Engage One I/O Connectivity Bases

QuickSpecs

HP Engage One All-In-One system

Overview

c05573243 — DA – 16012 Worldwide — Version 13 — October 31, 2018

Page 2

REAR VIEW

HP Engage One AiO System Top Mount 2x20 Customerfacing Display (CFD)

Choice of 2 Engage One AIO System I/O Connectivity Bases

Rotate/Tilt Stand (Fixed Position Stand Available)

QuickSpecs

HP Engage One All-In-One system

Overview

c05573243 — DA – 16012 Worldwide — Version 13 — October 31, 2018

Page 3

HP Engage One AIO System

Basic I/O Connectivity Base (Rear/Side View)

Basic I/O Connectivity Base components

Cash drawer jack

USB Type-C™ port

Power connector

RJ-45 network jack

USB Type-C™ power port

Security cable slot

Powered serial ports (3)

10.

MicroSD card reader

USB 2.0 ports (4)

11.

Headset jack

USB 3.0 ports (2)

IMPORTANT: To avoid damage to the computer, DO NOT plug a telephone cable into the cash drawer jack.

QuickSpecs

HP Engage One All-In-One system

Overview

c05573243 — DA – 16012 Worldwide — Version 13 — October 31, 2018

Page 4

Advanced I/O Connectivity Base* (Rear/Side View)

Advanced I/O Connectivity Base components

Cash drawer jack

USB 3.0 ports (4)

Powered USB 12 V ports (2)

USB Type-C™ port

Powered USB 24 V port

RJ-45 network jack

Power connector

10.

Security cable slot

USB Type-C™ power port

11.

MicroSD card reader

Powered serial ports (2)

12.

Headset jack

IMPORTANT: To avoid damage to the computer, DO NOT plug a telephone cable into the cash drawer jack.

* Available November 2017

QuickSpecs

HP Engage One All-In-One system

Overview

c05573243 — DA – 16012 Worldwide — Version 13 — October 31, 2018

Page 5

Component Breakdown

Head unit: Choice of Model 141 (Intel® Celeron® 3965U), 143 (Intel® Core™ i3 - 7100U) or 145 (Intel® i5 -7300U)*

Stability Base Plate

Fixed Position or Swivel & Tilt stand or No Stand Option

Connectivity Base: 2 Options based on I/O requirements

Optional Integrated Printer or Stand Spacer

QuickSpecs

HP Engage One All-In-One system

Overview

c05573243 — DA – 16012 Worldwide — Version 13 — October 31, 2018

Page 6

Not shown: Stand connects through a Single USB-C™ Cable with secure latching to connectivity base (Refer to page xxx)

Stand Options

HP Engage One AiO System Rotate/Tilt Stand with Integrated Column Printer

HP Engage One AiO System Fixed Position Stand

HP Engage One AiO System Rotate/Tilt Stand

NOTE: The stands are shown on a Stability Base Plate.

Stand Configurations

HP Engage One AiO System No Stand Option - Display Head Only (Includes 100mm VESA Mounting Bracket)

HP Engage One AiO System Fixed Position Stand with Stability Base Plate

QuickSpecs

HP Engage One All-In-One system

Overview

c05573243 — DA – 16012 Worldwide — Version 13 — October 31, 2018

Page 7

HP Engage One AiO System Fixed Position Stand Counter Mount -No Base Plate-includes Counter Mounting Bracket

HP Engage One AiO System Rotate/Tilt Stand with Stability Base Plate

HP Engage One AiO System Rotate/Tilt Counter Mount No Base Plate/includes Counter Mounting Bracket

HP Engage One AiO System Rotate/Tilt Stand with Integrated Printer and Stability Base Plate

HP Engage One AiO System Rotate/Tilt Stand with Integrated Printer and No Base Plateincludes counter mount

NOTE:The mounting bracket requires an 80 mm hole in the countertop. The thickness of the countertop must be 10mm to 50 mm.

QuickSpecs

HP Engage One All-In-One system

Overview

c05573243 — DA – 16012 Worldwide — Version 13 — October 31, 2018

Page 8

At A Glance

• Align Model to preferred solution

o Model 141: Anti-glare WLED SVA 300-nit panel or Anti-glare WLED UWVA 500-nit panel with FHD 1920 x 1080

resolution and an Intel® Celeron® 3965U 2.2GHz 2M 2133 2C6 processor

o Model 143: Anti-glare WLED UWVA 500-nit panel with FHD 1920 x 1080 resolution and an Intel® Core™ i3 -

7100U 2.40GHz 3M 2133 2C6 processor*

o Model 145: Anti-glare WLED UWVA 500-nit panel with FHD 1920 x 1080 resolution and an Intel® i5 -7300U

2.60GHZ 3MB 2133 2C6 processor*

• Select color of system and periferials

o Ebony Black o Ceramic White

• Long lifecycle performance All-in-One (AiO) Retail System for retail and hospitality markets Choice of operator display:

o 14”diagonal Wide Aspect ratio Projected Capacitive display; Full HD SVA 1920 x 1080 Resolution, Anti-glare o 14”diagonal Wide Aspect ratio Projected Capacitive display; Full HD UWVA 1920 x 1080 Resolution, Anti-glare*

• Processor choices:

o Intel® Core™ i5-7300U with vPro

(2.6GHz, 3M Cache, 2 Cores)*

o Intel® Core™ i3-7100U (2.4GHz 3M Cache, 2 Cores)* o Intel® Core™ Celeron® 3965U (2.2GHz, 2M Cache, 2 Cores)

• Operating System choices:

o Windows 10 Professional 64-bit o Windows 10 IoT Enterprise 2016 LTSB 64-bit o FreeDOS 2.0

• Connectivity Base Choices

o HP Basic I/O Connectivity Base o HP Advanced I/O Connectivity Base o HP USB-C Mini Dock

• Integrated peripheral options (can also be purchased and installed separately except for the HP Engage One AiO System

MSR & HP HP Engage One AiO System Column Printer which are configurable options):

o HP Engage One MSR o HP Engage One Column Printer o HP Engage One Fingerprint Reader o HP Engage One Top Mount 2x20 CFD

• Industry-standard 100mm VESA mounting pattern allows for flexible use without the optional stand (Mounting hardware

sold separately)

• Choice of Fixed Position Stand, Rotate/Tilt Stand that allows for 10° angle adjustability & 180-degree rotation left or

right, or no stand (display – head unit only) which includes 100mm VESA Mounting Bracket

• (2) Two DDR4 Memory Slots (32 GB Maximum)

• Realtek RTL8153 Ethernet Connection

• Intel & Realtek WLAN Options

• Trusted Platform Module (TPM 2.0)

• HP BIOSphere with HP Sure Start technology

• (1) M.2 drive bay

• Cable Management Features

• ENERGY STAR® certified, EU Compliant, RoHS2 Compliant, EPEAT® Gold

• Basic Retail I/O connectivity Base: 120W, 88% efficient, active PFC (external)

• Advanced Retail I/O connectivity Base: 180W, 89% efficient, active PFC (external)

• Display Head unit Only 65W, 89% efficient at 20V, active PFC (external)

• Standard Warranty Options – 90/90/90, 1/1/1, 3/3/3; Plus Optional Care Packs

1. vPRO is only supported on model 145 (Intel Core i5 processor) in wireless mode, when configured with the Intel WLAN 8265 with vPRO Card

NOTE: See important legal disclosures for all listed specs in their respective features sections.

QuickSpecs

HP Engage One All-In-One system

Standard and Configurable Components

c05573243 — DA – 16012 Worldwide — Version 13 — October 31, 2018

Page 9

OPERATING SYSTEM

Preinstalled

Windows 10 Professional 64-bit Windows 10 IoT Enterprise 2016 LTSB 64-bit FreeDOS 2.0

Certified

SuSE Linux® 12 SP3**

NOTE: In accordance with Microsoft’s support policy, HP does not support the Windows 8 or Windows 7 operating system on products configured with Intel® 7th generation and forward processors or provide any Windows 8 or Windows 7 drivers on http://www.support.hp.com

* Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately purchased hardware, drivers, software or BIOS update to take full advantage of Windows functionality. Windows 10 is automatically updated, which is always enabled. ISP fees may apply and additional requirements may apply over time for updates. See http://www.microsoft.com

** SUSE YES Certification is planned for late CY17 on a single platform configuration. More information about SUSE YES certification on https://www.suse.com/partners/ihv/yes/

The following features are not supported by SUSE Linux Enterprise Desktop:

• Power Management features

• Multi-touch capabilities

• Systems configured with Linux do not qualify for ENERGY STAR

PROCESSORS

Model 143 & 145***

• Intel® Core™ i5-7300U with vPro

1,2

(2.6GHz, 3M Cache, 2 Cores)

• Intel® Core™ i3-7100U (2.4GHz 3M Cache, 2 Cores)

Model 141

• Intel® Core™ Celeron® 3965U (2.2GHz, 2M Cache, 2 Cores)

NOTE: Core™ i5 Turbo Boost technology – performance can be increased through the BIOS

*NOTE: In accordance with Microsoft’s support policy, HP does not support the Windows 8 or Windows 7 operating system on products configured with Intel® 7th generation and forward processors or provide any Windows 8 or Windows 7 drivers on http://www.support.hp.com

**Note: Multi-Core is designed to improve performance of certain software products. Not all customers or software applications will necessarily benefit from use of this technology. Performance and clock frequency will vary depending on application workload and your hardware and software configurations. Intel’s numbering, branding and/or naming is not a measurement of higher performance.

***Available November 2017

1. vPRO is only supported on model 145 (Intel Core i5 processor) in wireless mode, when configured with the Intel WLAN 8265 with vPRO Card

QuickSpecs

HP Engage One All-In-One system

Standard and Configurable Components

c05573243 — DA – 16012 Worldwide — Version 13 — October 31, 2018

Page 10

2. Some functionality of vPro, such as Intel Active management technology and Intel Virtualization technology, requires additional 3rd party software in order to run. Availability of future "virtual appliances" applications for Intel vPro technology is dependant on 3rd party software providers. Compatibility with future "virtual appliances is yet to be determined.

QuickSpecs

HP Engage One All-In-One system

Standard and Configurable Components

c05573243 — DA – 16012 Worldwide — Version 13 — October 31, 2018

Page 11

CORE™ vPRO™ PROCESSORS

INTEL® 7th GENERATION CORE™ vPRO™ PROCESSORS

The HP Engage One AiO System Retail System features this technology, and includes processors that are part of the Intel® Stable Image. Platform Program (SIPP) designed to ensure the stability promise inherent in the value proposition of the HP Engage One AiO System Retail System. This makes these models the most stable, secure, and manageable platforms available to retailers today.

Intel® Advanced Management Technology (AMT) v11.6+ – An advanced set of remote management features and functionality which provides network administrators the latest and most effective tools to remotely discover, heal, and protect networked client systems regardless of the system's health or power state. AMT 11.6+ includes the following advanced management functions:

• Power Management (on, off, reset)

• Hardware Inventory (includes BIOS and firmware revisions

• Hardware Alerting

• Agent Presence

• System Defense Filters

• SOL/USBR

• Cisco NAC/SDN Support

• ME Wake-on-LAN

• DASH 1.1 compliance

• IPv6 Support

• Fast Call for Help - a client inside or outside the firewall may initiate a call for help via BIOS screen,

periodic connections, or alert triggered connection

• Remote Scheduled Maintenance - pre-schedule when the PC connects to the IT or service provider console

for maintenance. Remote PCs can get required patches, be inventoried, etc. by connecting to their IT console or Service Provider when it's convenient.

• Remote Alerts - automatically alert IT or service provider if issues arise

• Access Monitor - Provides oversight into Intel® AMT actions to support security requirements

• PC Alarm Clock

• Microsoft NAP Support

• Host-based set-up and configuration

• Management Engine (ME) firmware roll back

• Wireless AMT functionality on Desktop (WoDT)

• Enhanced KVM resolution

*Some functionality of this technology, such as Intel Active management technology and Intel Virtualization technology, requires additional 3rd party software in order to run. Availability of future "virtual appliances" applications for Intel

vPro™ technology is dependent on 3rd party software providers. Compatibility with future "virtual appliances” is yet to be

determined.

** Intel® Active Management Technology requires an Intel® AMT-enabled chipset, network hardware and software, as well as connection with a power source and a corporate network connection. Setup requires configuration by the purchaser and may require scripting with the management console or further integration into existing security frameworks to enable certain functionality. It may also require modifications of implementation of new business processes.

CHIPSET

Intel® Multi-Chip Package – MCP

QuickSpecs

HP Engage One All-In-One system

Standard and Configurable Components

c05573243 — DA – 16012 Worldwide — Version 13 — October 31, 2018

Page 12

HP BIOS

Key features of the HP BIOS include:

• Deployment and manageability – HP BIOS provides several technologies that help integrate the HP Engage One

AiO System G1 Retail System into a business environment, such as PXE, remote configuration, remote control, and F10 Setup support for 14 languages.

• Update your BIOS via the cloud or standardize on a BIOS version hosted on Enterprise network.

• Select models feature either Intel® Standard Manageability or Intel® Core™ vPro™

Processor Technology.

• Stability – HP BIOS supports the HP stable product roadmap by releasing only critical BIOS changes to the factory

and advanced change notification.

• UEFI specification 2.5

• Absolute Persistence agent – For tracking and tracing services, available in select countries, separate software

and purchase of a subscription is required.

• Thermal and power management – The HP BIOS provides and enables thermal and power management

technologies so component temperatures are managed for high reliability and to assist in operating the HP Engage One AiO system in any retail environment.

• Acoustic performance – Industry leading acoustic emissions across the range of operating conditions.

• Serviceability – HP BIOS provides diagnostic and detailed service information.

• Upgrades and recovery – HP BIOS provides numerous ways to update the HP Engage One AIO System, using a

host-based Windows application, various remote deployment tools (HP Client Manager, HP Software Support Manager, scheduled network updates, and fail-safe recovery. In addition, the HP Engage One AiO System system supports management tools for replicating BIOS settings throughout the Enterprise, either host-based software (HP BIOS Configuration Utility), 3rd party remote management tools such as SCCM, or manually using USB.

• HP BIOS uses PKI signing of the BIOS for trusted BIOS upgrades and recovery.

Additional HP BIOS Features:

• Power-On password – Helps prevent an unauthorized user from powering on the system.

• Administrator password – Also known as the setup password, this helps prevent unauthorized changes to the

system configuration. If the administrator password is not known, the BIOS version cannot be changed and changes cannot be made to BIOS settings using F10 setup or under the OS.

• Advanced Configuration and Power Interface (ACPI) – Represents a significant innovation in power and

configuration management, allowing operating systems and applications to manage power based on activity and usage. The HP Engage One AiO System Retail System uses ACPI to provide power conservation features.

• S5 Max Power Savings setting supports EU Lot6 requirement and allows the computer to power down below .5W

in S5 (when turned off). When S5 Max Power Savings feature is enabled power to slots is turned off along with WOL functionality and USB Charging ports.

• When the S5 Maximum Power Savings feature is enabled, only the power button will turn on the system. Other

wake sources such as Wake on LAN are powered off and do not function.

Sure Start

• BIOS Integrity checking – Sure Start protection ensures that only trusted BIOS code is executed and not rootkits,

viruses and malware. Verification is done upon boot up, shutdown and while on.

• Sure Start is set by default to automatically repair the BIOS if corrupted or compromised but is policy driven for

better manageability.

• Protecting beyond BIOS – Integrity checking and repair is extended to other data that should be protected such as

network configuration parameters (network name), platform specific information (i.e. system IDs) and other code the system needs to boot.

• Audit enabled – System Audit via Sure Start Event Logs capture data such as incident, repair date and time for

troubleshooting and investigating.

QuickSpecs

HP Engage One All-In-One system

Standard and Configurable Components

c05573243 — DA – 16012 Worldwide — Version 13 — October 31, 2018

Page 13

Security

• HP Engage One AiO System Biometric Fingerprint Reader (optional)

• Bolt to counter mechanism

• VESA mounting

• HP Engage One AiO System Keyed Cable Lock

• HP BIOSphere with SureStart Gen 3

• Device Guard

• Credential Guard and password protection

• Trusted Platform Module TPM 2.0 Embedded Security Chip (SLB9670 - Common Criteria EAL4+ Certified)

• Drive lock

• USB enable/disable (via BIOS)

• Power-on password (via BIOS)

• Setup password (via BIOS)

• Tamper Resistant Screw affixed on stand of the system unit, used to secure display head to stand without Quick

Release

1. vPRO is only supported on model 145 (Intel Core i5 processor) in wireless mode, when configured with the Intel WLAN

8265 with vPRO Card

2. Microsoft Device Guard and Credential Guard are available with Windows 10 IoT Enterprise 2016 delivered from HP or to

customers with a volume license to use Windows 10 Enterprise. Microsoft Device Guard and Credential Guard are not available with Windows 10 Pro. The installation of Windows 10 Enterprise and Microsoft Device Guard and Credential Guard are available through HP Configuration & Deployment Services.

NOTE: BIOS supports configuration on ports for the Engage One Basic I/O Connectivity Base and Engage One Advanced I/O Connectivity Base. The functionality is not supported with other products.

QuickSpecs

HP Engage One All-In-One system

Standard and Configurable Components

c05573243 — DA – 16012 Worldwide — Version 13 — October 31, 2018

Page 14

SOFTWARE

HP Client Management Solutions (available for free download from hp.com/go/easydeploy)

HP BIOSphere with Sure Start Generation 3.02

HP Support Assistant

Device Guard1

Credential Guard1

1. Microsoft Device Guard and Credential Guard are available with Windows 10 IoT Enterprise 2016 delivered from HP or to

2. HP Sure Start Gen3 is available on products equipped with Intel® 7th generation processors.

GRAPHICS

Intel® HD Graphics (integrated)

Integrated Graphics

Intel Integrated HD Graphics 610 (Celeron, Model 141); Intel Integrated HD Graphics 620 (Core i3, Model 143, Core i5, Model 145)

DisplayPort

Multimode capable; supports HDCP, Display Port Audio (2 streams), HBR2 link rates and MultiStream Technology for a maximum of 3 displays (including the integrated panel)

Memory

The BIOS has options for selecting the dedicated memory size of 128MB, 256MB or 512MB

Additional memory is allocated for graphics as needed using Intel's Dynamic Video Memory Technology (DVMT), to provide an optimal balance between graphics and system memory use.

Maximum Graphics Memory

Windows 10

>4 GB

Note: the actual amount of maximum graphics memory can be less than the amounts listed above depending upon your computer’s configuration.

Maximum Color Depth

32 bits/pixel

Graphics/Video API Support

7th Generation Core™ processors:

• Next Generation Intel® Clear Video Technology HD Support is a collection of video

playback and enhancement features that improve the end user's viewing experience

o Encode/transcode HD content o Playback of high definition content including Blu-ray Disc o Superior image quality with sharper, more colorful images

• DirectX Video Acceleration (DXVA) support for accelerating video processing

o Full AVC/VC1/MPEG2/HEVC HW Decode

• Advanced Scheduler 2.0, 1.0

• Windows 10, Linux OS Support

• DirectX 12.1

QuickSpecs

HP Engage One All-In-One system

Standard and Configurable Components

c05573243 — DA – 16012 Worldwide — Version 13 — October 31, 2018

Page 15

• OpenGL 4.4

• Open CL 1.2 (Intel® HD Graphics 510)

• Open CL 1.2/2.0 (Intel® HD Graphics 530)

QuickSpecs

HP Engage One All-In-One system

Standard and Configurable Components

c05573243 — DA – 16012 Worldwide — Version 13 — October 31, 2018

Page 16

Supported Display Resolutions and Refresh Rates

Note: Other resolutions may be available but are not recommended as they may not have been tested and qualified by HP

Resolution

Refresh Rates

640x480

60 Hz

800x600

60 Hz

1024x768

60 Hz

1280x720

60 Hz

1280x768

60 Hz

1360x768

60 Hz

1280x1024

60 Hz

1400x1050

60 Hz

1680x1050

60 Hz

1920x1080

60 Hz

1920x1200*

60 Hz

2048x1152*

60 Hz

2048x1280*

60 Hz

2048x1536*

60 Hz

2304x1440*

60 Hz

2560x1440*

60 Hz

3840x2160**

30 Hz

2560x1600*

60 Hz

2880x1800*

60 Hz

3200x2400*

60 Hz

4096x2160*

60 Hz

4096x2304*

60 Hz

* Only supported on displays connected to the external DisplayPort™ connector. ** 3840x2160 is not supported for Celeron series processors

QuickSpecs

HP Engage One All-In-One system

Standard and Configurable Components

c05573243 — DA – 16012 Worldwide — Version 13 — October 31, 2018

Page 17

MEMORY

Type

DDR4-2400 Memory DIMMs, Transfer rates up to 2400 MT/s

Maximum

32 GB

# of Slots

2 SODIMM

Memory Upgrades

Both slots are customer accessible / upgradeable.

• 4 GB (4 GB x 1)

• 8 GB (4 GB x 2)

• 8 GB (8 GB x 1)

• 16 GB (8 GB x 2)

• 16 GB (16 GB x 1)

• 32 GB (16 GB x 2)

System Memory Support

The HP Engage One AiO System Retail System supports DDR4 protocols with two independent, 64-bit wide channels each accessing one or two SoDIMMs.

• Two channels of non-ECC DDR4 unbuffered small outline dual in-line memory modules (SO-DIMM) with a

maximum of one DIMMs per channel

• Single-channel and dual-channel memory organization modes

• Data burst length of eight for all memory organization modes

• Memory data transfer rates of up to 2400 MT/s; actual supported data transfer rate determined by the

configured processor.

• 64-bit wide channels

• DDR4 system memory I/O voltage of 1.2V

• Theoretical maximum memory bandwidth of:

• 21.3 GB/s in dual-channel mode assuming 1333 MT/s

• 25.6 GB/s in dual-channel mode assuming 1600 MT/s

• 34.0 GB/s in dual-channel mode assuming 2133 MT/s

• 38.4 GB/s in dual-channel mode assuming 2400 MT/s

Key Benefits of DDR4 Memory:

• Dual channel configuration – HP Engage One AiO System features motherboards designed with two memory

channels instead of a single channel.

• Reduce system latencies and significantly improve your system performance with dual channel memory

configurations by utilizing the theoretical bandwidth of two memory modules instead of one.

• Expect fast start-up times with reduced delays during routine operations and system maintenance functions.

Meet everyday workloads head on, and run more programs simultaneously. Easily toggle back and forth between several open applications with noticeable speed.

NOTE: For systems configured with more than 3 GB of memory and a 32-bit operating system, all memory may not be available due to system resource requirements. Addressing memory above 4 GB requires a 64-bit operating system.

Memory modules support data transfer rates up to 2400 MT/s; actual data rate is determined by the system's configured processor. See processor specifications for supported memory data rate. CAUTION: You must shut down the Retail System and disconnect the power cord before adding or removing memory modules. Regardless of the power-on state, voltage is always supplied to the memory modules as long as the Retail System is plugged in to an active AC outlet. Adding or removing memory modules while voltage is present may cause irreparable damage to the memory modules or system board.

QuickSpecs

HP Engage One All-In-One system

Standard and Configurable Components

c05573243 — DA – 16012 Worldwide — Version 13 — October 31, 2018

Page 18

HARD DISK AND SOLID STATE STORAGE

Drive Bays

1 (one) M.2 SSD Bays

• SATA

• PCIe (NVME)

M.2 Storage:

M.2 SATA

128GB M2 SATA-3 TLC 256GB M2 SATA-3 TLC SSD 512GB M2 SATA-3 TLC SSD

512GB Turbo Drive G2 MLC SSD

NVMe

128GB TLC 6000p SSD 256GB PCIe NVMe TLC SSD 256GB TLC Pro 6000p SSD 512GB PCIe NVMe TLC SSD 512GB TLC Pro 6000p SSD 1TB PCIe-3x4 NVMe TLC SSD

QuickSpecs

HP Engage One All-In-One system

Standard and Configurable Components

c05573243 — DA – 16012 Worldwide — Version 13 — October 31, 2018

Page 19

OPERATOR DISPLAY

14" Diagonal Wide-Aspect Operator Value Display (Model 141), Anti-Glare WLED SVA

Touch Technology

Projected Capacitive Touchscreen

Resolution

1920 x 1080

Aspect Ratio

16:9

Max Color

262K

Brightness

Typical 300 nits (LCM)*

Contrast Ratio

Typical 300:1*

Pixel Pitch

160.86 um x 160.86 um

Viewing Angle

Horizontal 900, Vertical 650

Response rate

10ms (Typical On/Off)

Backlight

LED

Operating Temperature range

0 to 600C (+ 600C as panel surface temperature)

14" Diagonal Wide Aspect Projective Capacitive Operator Display (Models 143 & 145), Anti-Glare WLED UWVA

Touch Technology

Projected Capacitive Touchscreen

Resolution

1920 x 1080

Aspect Ratio

16:9

Max Color

262K

Brightness

Typical 500 nits (LCM)*

Contrast Ratio

Typical 800:1

Pixel Pitch

161um x 161 um

Viewing Angle

Horizontal 1780, Vertical 1780

Response rate

25ms (Typical On / Off)

Backlight

LED Operating Temperature range

0 to 600C (+ 600C as panel surface temperature)

*NOTE: Nits is the measure of the typical brightness of the panel as specified, prior to anti-glare coating

QuickSpecs

HP Engage One All-In-One system

Technical Specifications - Audio

c05573243 — DA – 16012 Worldwide — Version 13 — October 31, 2018

Page 20

High Definition Audio*

Engage One System Audio (Realtek ALC3228)

Type

Integrated

HD Stereo Codec

ALC3228 High Definition Audio Codec

Internal Speaker Amplifier

1W amplifier for the internal speaker only.

Sampling

All DACs support 44.1k/48k/96k/192kHz sample rate All ADCs support 44.1k/48k/96k/192kHz sample rate S/PDIF-OUT support 16/20/24-bit format and 32/44.1/48/88.2/96/192kHz rate

Analog Audio

Yes

# of Channels on Line-Out

Stereo (Left & Right channels)

Internal Speaker

Yes

Advanced & Basic I/O Base (Realtek ALC4040)

Type

USB

Audio Codec

ALC4040 Audio Codec with USB to I2S audio controller and hardware active noise cancellation

Audio I/O Ports

1 headphone-out/microphone-in combo

Sampling

One I2S/PCM/TDM digital interface supports sample rates 8k, 16k, 32k, 44.1k, 48k, 96k, and 192kHz One stereo DAC supports up to 44.1, 48, and 192KHz Sample Rate, 16/24-bit One stereo ADC Input supports 44.1, 48, and 96KHz Sample Rate, 16/24-bit

Analog Audio

Yes # of Channels on Line-Out

2 External Speaker Jack

NOTE(Retail Advanced & Basic Hubs Only): Audio input ports are re-taskable as a Line-in or Microphone-in port. External speakers must be powered externally. Multi-streaming can be enabled to allow independent audio streams to be sent to/from the internal speakers and headphone/Line out jack. This allows for different audio applications to use separate audio ports on the system. For example, the Headphone jack could be used with a headphone for a communications application while the internal speakers for a multimedia application.

QuickSpecs

HP Engage One All-In-One system

Technical Specifications – Storage

c05573243 — DA – 16012 Worldwide — Version 13 — October 31, 2018

Page 21

Intel 128GB Three Layer Cell 6000p Solid State Drive

Unformatted Capacity

128 GB

Architecture

3D Tri-Level Cell (TLC) NAND

Interface

PCIe NVMe 3.0 x4

Form Factor

M.2 (80mm)

Height

Up to 1.5mm

Width

22mm

Length

80mm

Weight

Up to 40 g

Bandwidth Performance

Sustained Sequential Read:

Up to 770 MB/s

Sustained Sequential Write:

Up to 450 MB/s

Random Read

Up to 40k IOPS

Random Write

Up to 35k IOPS

Useful Drive Life

72TB written, up to 40GB/day for 5 years

Power

Power consumption:

Active: 200mW Typical Idle: 50mW Typical L1.2 Sleep 5mW Typical

Mean Time Between Failure (MTBF)

1,600,000 Hours

Environmental (all conditions, non-condensing)

Operating Temperature:

32° to 158° F (0° to 70° C)

Vibrating – Operating

2.17 GRMS (5-700Hz) Max

Vibrating – NonOperating

3.13 GRMS (5-800Hz) Max

128GB Solid State M2 SATA-3 Three Layer Cell Drive

Drive Weight

0.019 lb (8.5 g)-0.022 lb (10 g)

Capacity

128 GB

Height

0.09 in (2.23 mm)- 0.14 in (3.58 mm)

Width

0.87 in (22 mm)

Interface

ATA-8, SATA 3.0

Bandwidth Performance

Maximum Sequential Read:

500 ~ 540 MB/s

Maximum Sequential Write:

130 ~ 450 MB/s

Logical Blocks

250,069,680

Operating Temperature

32° to 158°F (0° to 70°C) [ambient temp]

Features

DIPM; TRIM; DEVSLP

Security Features

ATA Security

QuickSpecs

HP Engage One All-In-One system

Technical Specifications – Storage

c05573243 — DA – 16012 Worldwide — Version 13 — October 31, 2018

Page 22

256GB M2 SATA-3 Three Layer Cell Solid State Drive

Drive Weight

0.022 lb (10 g)

Capacity

256 GB

Height

0.09 in (2.3 mm)- 0.14 in (3.58 mm)

Width

0.87 in (22 mm)

Interface

ATA-8, SATA 3.0

Bandwidth Performance

Maximum Sequential Read:

515 ~ 540 MB/s

Maximum Sequential Write:

260 ~ 450 MB/s

Logical Blocks

500,118,192

Operating Temperature

32° to 158°F (0° to 70°C) [ambient temp]

Features

DIPM; TRIM; DEVSLP

Security Features

ATA Security

256GB PCIe NVMe Three Layer Cell Solid State Drive

Unformatted Capacity

256 GB

Architecture

Solid State Drive with TLC NAND Flash and PCIE interface.

Complies with NVMe Standard

Power Saving Modes: L1 substates support

Multi Queue support

Interface

PCI-E Gen3 x 4

Form Factor

M.2 2280

Height

3.73 mm

Width

22.00 ± 0.15 mm

Length

80.00 ± 0.15 mm

Weight

Up to 8 g

Bandwidth Performance

Sustained Sequential Read:

Up to 2600 MB/s

Sustained Sequential Write:

Up to 1000 MB/s

Power

Power consumption:

Active: Typical 6.1W; Idle: Typical 80mW L1.2: Typical 5mW

Mean Time Between Failure

(MTBF)

1,500,000 hours

Environmental (all conditions, non-condensing)

Operating Temperature:

32° to 158° F (0° to 70° C)

Relative Humidity:

5% to 95%

Shock:

1,500 G/0.5 ms

QuickSpecs

HP Engage One All-In-One system

Technical Specifications – Storage

c05573243 — DA – 16012 Worldwide — Version 13 — October 31, 2018

Page 23

Intel 256GB Three Layer Cell Pro 6000p Solid State Drive

Unformatted Capacity

256GB*

Architecture

3D Tri-Level Cell (TLC) NAND

Interface

PCIe NVMe 3.0 x4

Form Factor

M.2 22 x 80mm

Height

Up to 1.5mm

Width

22mm

Length

80mm

Weight

Up to 40 g

Bandwidth Performance

Sustained Sequential Read:

Up to 1570 MB/s

Sustained Sequential Write:

Up to 540 MB/s

Random Read:

Up to 80K IOPs

Random Write:

Up to 70K IOPs

Power

Total power consumption:

200mW (active); 50mW (idle)

Mean Time Between Failure (MTBF)

1,600,000 Hours

Useful Drive Life

144TB written, up to 80GB/day for 5 years

Environmental (all conditions, non-condensing)

Operating Temperature:

32° to 158° F (0° to 70° C)

Vibrating - Operating:

2.17 GRMS (5-700Hz) Max

Vibrating – Non-Operating

3.13 GRMS (5-800Hz) Max

* For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36 GB (for Windows 10) of system disk is reserved for the system recovery software.

512GB M2 SATA-3 Three Layer Cell Solid State Drive

Drive Weight

0.019 lb (8.5 g)- 0.02 lb (10 g)

Capacity

512 GB

Height

0.09 in (2.3 mm)- 0.14 in (3.58 mm)

Width

0.87 in (22 mm)

Interface

ATA-8, SATA 3.0

Bandwidth Performance

Maximum Sequential Read:

500 ~ 540 MB/s

Maximum Sequential Write:

440 ~ 515 MB/s

Logical Blocks

1,000,215,216

Operating Temperature

32° to 158°F (0° to 70°C) [ambient temp]

Features

ATA Security, DIPM; TRIM; DEVSLP

512GB PCIe NVMe Three Layer Cell Solid State Drive

Unformatted Capacity

512 GB

Architecture

Solid State Drive with TLC NAND Flash and PCIE interface.

Complies with NVMe Standard

Power Saving Modes: L1 substates support

Multi Queue support

QuickSpecs

HP Engage One All-In-One system

Technical Specifications – Storage

c05573243 — DA – 16012 Worldwide — Version 13 — October 31, 2018

Page 24

Interface

PCI-E Gen3 x 4

Form Factor

M.2 2280

Height

3.73 mm

Width

22.00 ± 0.15 mm

Length

80.00 ± 0.15 mm

Weight

Up to 8 g

Bandwidth Performance

Sustained Sequential Read:

Up to 2600 MB/s

Sustained Sequential Write:

Up to 1200 MB/s

Power

Power consumption:

Active: Typical 6.1W; Idle: Typical 80mW L1.2: Typical 5mW

Mean Time Between Failure (MTBF)

1,500,000 hours

Environmental (all conditions, non-condensing)

Operating Temperature:

32° to 158° F (0° to 70° C)

Relative Humidity:

5% to 95%

Shock:

1,500 G/0.5 ms

512GB Turbo Drive G2 Multi-Layer Cell Solid State Drive

Drive Weight

0.02 lb (10g)

Capacity

512 GB

Height

0.09 in (2.3 mm) ~ 0.14 in (3.65 mm)

Width

0.87 in (22 mm)

Interface

PCIe NVMe Gen3X4

Bandwidth Performance

Maximum Sequential Read (128KB):

2,260 ~ 3,000 MB/s

Maximum Sequential Write (128KB):

1,500 ~ 1,600 MB/s

Logical Blocks

1,000,215,216

Operating Temperature

32° to 158°F (0° to 70°C) [ambient temp]

Features

ATA Security (Option); TRIM; L1.2

Intel 512GB Three Layer Cell Pro 6000p Solid State Drive

Unformatted Capacity

512 GB

Architecture

3D Tri-Level Cell (TLC) NAND

Interface

PCIe NVMe 3.0 x4

Form Factor

M.2 2280

Height

Up to 1.5mm

Width

.22mm

Length

80mm

Weight (typical)

Up to 10 g

Bandwidth Performance

Sustained Sequential Read:

Up to 1775 MB/s

Sustained Sequential Write:

Up to 560 MB/s

Random Read:

Up to 100k IOPS

Random Write:

Up to 90k IOPS

Power

Total power consumption:

200mW (active); 50mW (idle)

QuickSpecs

HP Engage One All-In-One system

Technical Specifications – Storage

c05573243 — DA – 16012 Worldwide — Version 13 — October 31, 2018

Page 25

Mean Time Between Failure (MTBF)

1,600,000 Hours

Useful Drive Life

288 TBW Written, up to 160GB/day for 5 Years

Environmental (all conditions, non-condensing)

Operating Temperature:

32° to 158° F (0° to 70° C)

Vibrating - Operating:

2.17 GRMS (5-700Hz) Max

Vibrating – Non-Operating

3.13 GRMS (5-800Hz) Max

1TB PCIe-3x4 NVMe Three Layer Cell Solid State Drive

Drive Weight

0.02 lb (10 g)

Capacity

1024 GB

Height

0.09 in (2.3 mm) ~ 0.14 in (3.65 mm)

Width

0.87 in (22 mm)

Interface

PCIe NVMe Gen3X4

Bandwidth Performance

Maximum Sequential Read:

2,500 ~ 3,000 MB/s

Maximum Sequential Write:

1,400~ 1,700 MB/s

Logical Blocks

2,000,409,264

Operating Temperature

32° to 158°F (0° to 70°C) [ambient temp]

Features

ATA Security (Option); TRIM; L1.2

QuickSpecs

HP Engage One All-In-One system

Technical Specifications – Networking and Communications

c05573243 — DA – 16012 Worldwide — Version 13 — October 31, 2018

Page 26

Realtek RTL8153

Connector

RJ-45

System Interface

USB 3.0

NIC Device Driver Name

PCIe GBE Ethernet Family Controller

Ethernet Features

10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14) 100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-30) 1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 8023 clauses 40) Auto-Negotiation (Automatic Speed Selection) Full Duplex Operation at all Speeds, Half Duplex operation at 10 and 100 Mbit/s IEEE 802.1p QoS (Quality of Service) Support IEEE 802.1q VLAN support IEEE 802.3x Flow Control (IEEE 802.3 clauses 31-32; configurable) IEEE 802.3az EEE (Energy Efficient Ethernet) Jumbo Frame 9K Auto MDI/MDIX Crossover cable detection

Power Management

ACPI compliant – multiple power modes Situation-sensitive features reduce power consumption Advanced link down power saving for reducing link down power consumption

Performance Features

TCP/IP/UDP Checksum Offload (configurable) Protocol Offload (ARP & NS) Large send offload and Giant send offload Receiving Side Scaling

Manageability

Wake-on-LAN from standby and hibernation (Magic Packet and Microsoft Wake-Up Frame); Wakeon-LAN from off (Magic Packet only) PXE 2.1 Remote Boot Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x, clause 30)) Comprehensive diagnostic and configuration software suite Virtual Cable Doctor for Ethernet cable status

Intel® Dual Band Wireless-AC 8265 802.11a/b/g/n/ac (2x2) WiFi and Bluetooth® 4.2 Combo (non-vPro and vPro)

Wireless LAN Standards

IEEE 802.11a IEEE 802.11b IEEE 802.11g IEEE 802.11n IEEE 802.11ac

Interoperability

Wi-Fi certified

Frequency Band

802.11b/g/n

• 2.402 – 2.482 GHz

Note:

The FCC has declared as of January 1, 2015 products that utilize passive scanning on channel 12/13 and are capable of transmitting must fully comply with requirements of 15.247 or otherwise disable those channels.

802.11a/n

• 4.9 – 4.95 GHz (Japan)

• 5.15 – 5.25 GHz

+ 58 hidden pages