
Overview
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USB 3.0 charging data port

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HP Z2 Mini Entry, back view

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HP Z2 Mini Performance, back view

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HP Z2 Mini Entry, Internal View
SATA HDD/SSD (9.5mm 2.5”)

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HP Z2 Mini Performance, Internal View
SATA HDD/SSD (9.5mm 2.5”)
GPU heatsink (underneath HDD/SSD cage)

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Preinstalled:
Windows 10 Pro 64
1
Windows 7 Professional 64 (available through downgrade rights from Windows 10 Pro)
2
HP Linux® -ready
Red Hat® Enterprise Linux Workstation (1 year paper license available; Preinstall not
available)
Supported:
Red Hat® Enterprise Linux Desktop 6.7, 7.2
SUSE Linux® Enterprise Desktop 11 SP4, 12 SP1
Notes: For detailed OS/hardware support information for Linux, see:
http://www.hp.com/support/linux_hardware_matrix
1. Not all features are available in all editions or versions of Windows. Systems may require
upgraded and/or separately purchased hardware, drivers, software or BIOS update to take
full advantage of Windows functionality. Windows 10 is automatically updated, which is
always enabled. ISP fees may apply and additional requirements may apply over time for
updates. See http://www.windows.com
2. This system is preinstalled with Windows 7 Professional software and also comes with a
license and media for Windows 10 Pro software. You may only use one version of the
Windows software at a time. Switching between versions will require you to uninstall one
version and install the other version. You must back up all data (files, photos, etc.) before
uninstalling and installing operating systems to avoid loss of your data.

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Intel® Turbo
Boost
Technology1
Featuring
Intel® vPro™
Technology
Z2 Mini G3 Performance base unit
Intel® Xeon® processor
E3-1245v5
Intel® Xeon® processor
E3-1225v5
Intel® CoreTM i7-6700
processor
Intel® CoreTM i5-6500
processor
Intel® CoreTM i3-6100
processor
Z2 Mini G3 Entry base unit
Intel® CoreTM i7-6700
processor
Intel® CoreTM i5-6500
processor
Intel® CoreTM i3-6100
processor
1
The specifications shown in this column represent the maximum turbo frequency with one core active. Turbo boost stepping occurs in 100MHz
increments. Processors that do not have turbo functionality are denoted as N/A.
NOTES:
Integrated Intel® HD graphics P530 is supported on all Intel® Xeon® E3 processors
Intel® Xeon® E3, Intel Core i3 and Intel Pentium processors can support either ECC or non-ECC memory; Intel® Core™ i5/i7
processors only support non-ECC memory.
* Multicore is designed to improve performance of certain software products. Not all customers or software applications will
necessarily benefit from use of this technology. Performance and clock frequency will vary depending on application workload and
your hardware and software configurations. Intel’s numbering is not a measurement of higher performance.
Space grey with black chrome accents
The Z2 Mini G3 can either be placed flat on the desktop or mounted behind a display* or under a desk.
* Additional HP Hardware is needed for the VESA Mount for the display.
Expansion Slots
(see system board section
for more details)
1 80mm M.2 slot (PCIe Gen3 x4)
1 30mm M.2 slot (PCIe Gen3 x1)*
* For WLAN/BT M.2 module only
Expansion Bays (see
system board section for
more details)
1 internal 2.5" bay (for For SATA HDDs & SSDs only only)
Front I/O

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1 USB 3.0 Charging Data Port, 1 USB 3.0 data port, combo headset/microphone port
Z2 Mini Entry: 3 DisplayPort™ (DP 1.2) outputs from Intel® HD graphics, 2 USB 3.0 ports, 1 serial port
(optional), RJ-45 (LoM)
Z2 Mini Performance1: 4 DisplayPort™ (DP 1.2) outputs from NVIDIA® Quadro® M620 graphics, 2 USB
3.0 ports, 2 USB 3.1 G1 Type-C™ ports, 1 serial port (optional),RJ-45 (LoM)
NOTE 1: Capable of supporting 6 displays. 6 display solution is achieved using a combination of Intel®
HD graphics and NVIDIA Quadro® graphics is ONLY supported on Windows 10.
Chassis Dimensions
(H x W x D)
Standard desktop orientation: 58 x 216 x216 mm (2.28 x 8.5 x 8.5 in)
Exact weights depend upon configuration;
Minimum Weight: 2.04 kg (4.50 lb)
Typical Weight*: 2.08 kg (4.59 lb)
Maximum Weight: 2.11 kg (4.65 lb)
Max Supported Weight (desktop orientation): 35 kg (77 lb)
* Configured with 1 2.5" hard drive, 1 PCIe SSD, WLAN module, 2 DIMMs and 1 NVIDIA® Quadro® graphics
card
Operating: 40° to 95°F (5° to 35°C)
Non-operating: -40° to 140°F (-40° to 60°C)
Notes: Derate the maximum operating temperature by one degree C (1.8 degrees F) for every 305m
(1,000 ft) altitude over 1,524m (5,000 ft).
Operating: 8% to 85%
Non-operating: 8% to 90%
Maximum Altitude
(non-pressurized)
Operating: 3,000 m (10,000 ft)
Non-operating: 9,100 m (30,000 ft).
Z2 Mini G3 Entry:
135W 88% Efficiency at 115Vac
Z2 Mini G3 Performance:
200W 89% Efficiency at 230Vac
NOTES: Customers placing their system in an enclosure should design their solution to accommodate
the size of the external power supply for the Z2 Mini
2 SODIMM slots, supporting up to 32GB ECC/non-ECC, DDR4 2133 MT/s
The CPUs determine the speed at which the memory is clocked. If a 2133 MT/s capable CPU is used in the system, the maximum
speed the memory will run at is 2133 MT/s regardless of the specified speed of the memory.
Note: Transfer rates up to 2133 MT/s
Workstation ISV
Certifications
See the latest list of certifications at
http://www.hp.com/united-states/campaigns/workstations/partnerships.html

Supported Components
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Intel® Xeon® processor E3-1200 v5 family
Intel® Xeon® E3-1225 v5 3.3 2133 4C CPU1
Intel® Xeon® E3-1245 v5 3.5 2133 4C CPU1
6th generation Intel® Core™ processor family
Intel® Core i7-6700 3.4 2133 4C CPU3
Intel® Core i5-6500 3.2 2133 4C CPU3
6th generation Intel® Core™ i3/Pentium processor family
Intel® Core™ i3-6100 3.7 2133 2C CPU2
NOTE 1: Only supported on Z2 Mini Performance Base Unit
NOTE 2: These processor support either ECC or non-ECC memory
NOTE 3: These processors support only non-ECC memory
NOTE: Intel® Integrated Graphics P530 for Xeon® processors supports workstation-specific graphics
drivers for improved compatibility and performance on select professional applications, compared to
Intel® HD Graphics 530.
HP DreamColor Z24x Professional Display
HP DreamColor Z27x Professional Display
HP Z22n Narrow Bezel IPS Display
HP Z23n Narrow Bezel IPS Display
HP Z24n Narrow Bezel IPS Display
HP Z24nf Narrow Bezel IPS Display
HP Z24nq Narrow Bezel IPS Display
HP Z24s IPS UHD 4K Display
HP Z25n Narrow Bezel IPS Display
HP Z27n Narrow Bezel IPS Display
HP Z27n Narrow Bezel IPS Display
Supported by all Operating Systems available from HP
Screen Size Diagonally Measured
500GB SATA 7200 rpm 6Gb/s SFF HDD
1TB SATA 7200 rpm 6Gb/s SFF HDD

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PCIe SSDs for HP Workstations
HP Z Turbo Drive G2 256GB MLC (Z2 Mini)
HP Z Turbo Drive G2 256GB TLC (Z2 Mini)
HP Z Turbo Drive G2 512GB MLC (Z2 Mini)
* PCIe card installed in standard PCIe x4 slot
** Installed in native M.2 slot on Z2 Mini motherboard
The HP Z Turbo Drive G2 (NVMe) is not supported with Windows 7 32-bit.
NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows 10)
of system disk is reserved for system recovery software.
Integrated Intel® HD Graphics (Z2)
Graphics DisplayPort™
Cable Adapters
HP DisplayPort™ To DVI-D Adapter
HP DisplayPort™ To VGA Adapter
HP DisplayPort™ to Dual Link DVI Adapter
NVIDIA® Quadro® M620 2GB Graphics1
NOTE 1: Only offered on Z2 Mini Performance base unit
NOTE: Intermixing integrated Intel® HD graphics and discrete graphics cards in order to drive more than
three displays can be enabled using the Computer (F10) Setup Utility. However, HP recommends using
only discrete graphics when four or more displays are required to be supported. 6 display solution is
achieved using a combination of Intel® HD graphics and NVIDIA Quadro® graphics is ONLY supported on
Windows 10.

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DDR4-2400 ECC Unbuffered SODIMMs - CTO
HP 8GB (1x8GB) DDR4-2400 ECC RAM
HP 16GB (2x8GB) DDR4-2400 ECC RAM
HP 32GB (2x16GB) DDR4-2400 ECC RAM
DDR4-2400 non-ECC Unbuffered SODIMMs - CTO
HP 4GB (1x4GB) DDR4-2400 nECC RAM
HP 8GB (2x4GB) DDR4-2400 nECC RAM
HP 8GB (1x8GB) DDR4-2400 nECC RAM
HP 16GB (2x8GB) DDR4-2400 nECC RAM
HP 32GB (2x16GB) DDR4-2400 nECC RAM
NOTES: Intel® Xeon® E3, Intel® CoreTM i3 and Intel® Pentium® processors can support either ECC or non-
ECC memory; Intel® CoreTM i5/i7 processors only support non-ECC memory.
Two channels of DDR4 memory are supported. To realize full performance at least one DIMM must be
inserted into each channel.
The CPUs determine the speed at which the memory is clocked. If a 2133 MT/s capable CPU is used in
the system, the maximum speed the memory will run at is 2133 MT/s regardless of the specified speed
of the memory.
Transfer rates up to 2133 MT/s with Intel Skylake processors.
DDR4-2400 ECC Unbuffered DIMMs - AMO
HP 8GB (1x8GB) DDR4-2400 ECC RAM
HP 16GB (1x16GB) DDR4-2400 ECC RAM
HP 4GB (1x4GB) DDR4-2400 non-ECC RAM
HP 8GB (1x8GB) DDR4-2400 non-ECC RAM
HP 16GB (1x16GB) DDR4-2400 non-ECC RAM
NOTE: Only unbuffered DDR4 DIMMs are supported.
Multimedia and Audio
Devices
Integrated Realtek HD ALC221-VB Audio
Optical and Removable
Storage
HP SlimTray Optical Drives
HP External Ultra-Slim DVD-RW Drive

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Actual speeds may vary. Does not permit copying of commercially available DVD movies or other
copyright protected materials. Intended for creation and storage of your original material and other
lawful uses. Double Layer discs can store more data than single layer discs. However, double-layer discs
burned with this drive may not be compatible with many existing single-layer DVD drives and players.
With Blu-ray, certain disc, digital connection, compatibility and/or performance issues may arise, and do
not constitute defects in the product. Flawless playback on all systems is not guaranteed. In order for
some Blu-ray titles to play, they may require a DVI or HDMI digital connection and your display may
require HDCP support. HD-DVD movies cannot be played on this workstation.
Networking and
Communications
Integrated Intel® I219LM PCIe GbE Controller (Intel®
vPro™ with Intel AMT 11.0)
Intel® 8265 Wireless LAN (802.11ac) and Bluetooth® 4.2
Module
NOTE 1: The integrated network connection is required to support Intel® vPro™ Technology.
NOTE 2: If AMT is provisioned, then network teaming with the integrated LAN port is not possible.
NOTE 3: "Gigabit" Ethernet indicates compliance with IEEE standard 802.3ab for Gigabit Ethernet, and
does not connote actual operating speed of 1 Gb/sec. For high speed transmission, connection to a
Gigabit Ethernet server and network infrastructure is required.
Racking and Physical
Security
HP USB 1000dpi Laser Mouse
HP USB CCID SmartCard Keyboard
HP USB Business Slim Keyboard
HP Wireless Business Slim Keyboard
Z2 Mini Arm/Wall VESA Mount Solution
Z2 Mini Z Display VESA Mount Solution - Current Displays
Z2 Mini Z Display VESA Mount Solution - Legacy Displays
* Current: "n" displays. This mounting kit supports the following displays:
Z22n/Z23n/Z24n/Z25n/Z27n.
** Legacy: "I" displays. This mounting kit supports the following displays: Z24i/Z27i/Z30i.

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HP Remote Graphics Software (RGS) 7.1
HP PC Hardware Diagnostics UEFI
HP Client Security Software
NOTE 1: Supports, and preinstalled with Windows 10 only. Also available as a free download from
http://www.hp.com/go/performanceadvisor
NOTE 2: Windows OS only
Windows 7 Professional 64(available through downgrade rights from Windows 10 Pro 64)
Red Hat® Enterprise Linux® (RHEL) Workstation - Paper License (1yr)
See http://www.microsoft.com/windows/windows-7/for support details.
See http://www.redhat.com/rhel/desktop/

System Technical Specifications
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Entry: 200mm x 200mm (7.9 x 7.9 inches)
Performance: 200mm x 200mm (7.9 x 7.9 inches)
DMI link between CPU & PCH: Performance comparable to PCIe Gen3 x4
2 SODIMM DDR4 memory slots
DDR4, UDIMM (Unbuffered), ECC & non-ECC
Non-Interleaved for single channel. Interleaved when both channels are populated.
2133MHz DDR4 for Skylake processors; pre-enabled for 2400 MHz DDR4
ECC available on data
*Requires ECC DIMMs to be installed, as well as a CPU that supports ECC
Memory Configuration
(Supported)
4GB, 8GB and 16GB non-ECC/ 8GB and 16GB ECC unbuffered DIMMs are supported.
ECC and non-ECC memory DIMMs cannot be mixed on the same system.
Maximum memory capacities assume 64-bit operating systems, such as Windows® 7 Professional 64Bit or Red Hat Linux 64-bit.
Supported Drive
Interfaces
Integrated (1) Serial ATA interfaces (6Gb/s SATA).
Intel® HD Graphics 530 (on Core™ i3/i5/i7-6xxx processors);
Intel® HD Graphics P530 for Xeon® E3 processors based on Unified
Memory Architecture (UMA).
A region of system memory is reserved and dedicated to the graphics
display.
Support for Microsoft DirectX 12.1, OpenGL 4.4 and OpenCL 2.0 on Intel®
HD Graphics P530.
(3) DP 1.2 graphics ports integrated on motherboard; Supports up to
three simultaneous displays across DP outputs.
Max. resolution supported: 4096x2160 @60Hz
Integrated Ethernet PHY Connection I219LM. Management capabilities:
WOL, PXE 2.1 and AMT 11.0
1 rear port (configurable option)

System Technical Specifications
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Side I/O:
2 USB 3.0 Type-A
2 USB 3.0 Type-A
2 USB 3.1 G1 Type-C™ (Z2 Mini Performance only)
Yes; supports CTIA headset
Yes
Additional CPU/GFX Cooler (Z2 Mini Performance only)
Front Control
Panel/Speaker Header
CMOS Battery Holder Lithium
Integrated Trusted
Platform Module
Yes, single DC-in jack for external power supplies
Power Switch, Power LED
& Hard Drive LED Header
1. The power and failure LED are combined in the front power switch.
2. The HDD LED & DC-in LED are combined within one port on the Rear I/O. The LED will be lit once the
AC power is plugged in. As soon as the system is booted up, the LED will function as a standard HDD
activity LED.
Z2 Mini G3 Entry: 135W, 88% efficiency, wide-ranging, active PFC Power Supply
Z2 Mini G3 Performance: 200W, 89% efficiency, wide-ranging, active PFC Power Supply
The Z2 Mini PSU Efficiency Report can be found at this link: TBD
Operating Line Frequency
Range
Z2 Mini G3 Entry: 1.9A @ 90Vac
Z2 Mini G3 Performance: 2.9A @ 90Vac
Typical: TBD btu/hr (TBD kcal/hr)
Maximum: TBD btu/hr (TBD kcal/hr)
ENERGY STAR® qualified
(Config Dependent)
FEMP Standby Power
Compliant
Yes, with Wake-on-LAN disabled: <1W in S5- Power Off
Surge Tolerant Full
Ranging Power Supply

System Technical Specifications
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(withstands power
surges up to 2000V)
Z2 Mini Configuration
#1
ENERGY STAR
QUALIFIED
1x Intel® Xeon® E3-1245v5 3.5 8M GT2 4C
32GB (2x16GB) DDR4-2400 ECC SO-DIMM
1x 1TB 7200 RPM SATA HDD / 1x Z Turbo Drive G2 512GB PCIe 1st SSD
Energy Consumption
(Watts)
Heat Dissipation
(Btu/hr)
1x Intel® Xeon® E3-1225v5 3.3 8M GT2 4C
HP 8GB (2x4GB) DDR4-2400 ECC SO-DIMM
Energy Consumption
(Watts)

System Technical Specifications
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Heat Dissipation
(Btu/hr)
Z2 Mini Configuration
#3
ENERGY STAR
QUALIFIED
1x Intel® Core™ i7-6700 3.4 8M 4C
32GB (2x16GB) DDR4-2400 nECC SO-DIMM
1x 1TB 7200 RPM SATA HDD / 1x Z Turbo Drive G2 512GB PCIe 1st SSD
Energy Consumption
(Watts)
Heat Dissipation
(Btu/hr)
Z2 Mini Configuration
#4
ENERGY STAR
QUALIFIED
1x Intel® Core™ i3-6100 3.7 3M 2C
32GB (2x16GB) DDR4-2400 nECC SO-DIMM
1x 1TB 7200 RPM SATA HDD / 1x Z Turbo Drive G2 512GB PCIe 1st SSD
Energy Consumption
(Watts)

System Technical Specifications
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Heat Dissipation
(Btu/hr)
1x Intel® Core™ i3-6100 3.7 3M 2C
4GB (1x4GB) DDR4-2400 nECC SO-DIMM
Energy Consumption
(Watts)
Heat Dissipation
(Btu/hr)

System Technical Specifications
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Declared Noise Emissions
(Entry-level and High-end
configurations)
System Configuration
(Entry level)
Environmental
Requirements
Operating: 40° to 95° F (5° to 35° C)
Non-operating: -40° to 140° F (-40° to 60° C)
Operating: 8% to 85% RH, non-condensing
Non-operating: 8% to 90% RH, non-condensing
Operating: 10,000 feet (3,000 m)
Non-operating: 30,000 feet (9,100 m)
Shock
Operating: ½-sine: 40g, 2-3ms
Non-operating:
½-sine: 160 cm/s, 2-3ms (~100g)
square: 422 cm/s, 20g
Vibration
Operating random: 0.5g (rms), 5-300 Hz
Non-operating random: 2.0g (rms), 10-500 Hz
Notes: Values represent individual shock events and do not indicate
repetitive shock events. Values do not indicate continuous vibration.
Above 5,000 ft (1524 m) altitude, maximum operating temperature is derated by 1.8° F (1° C) per 1,000 ft (305 m) elevation increase

System Technical Specifications
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Physical Security and Serviceability
Tool-less
Includes system board and memory information
Hard Drives
HDD cage requires the use of a screwdriver to remove the HDD
M.2 module requires a screwdriver to service and replace.
Tool-less, except for the processor heatsink.
Color-coordinated Cables
and Connectors
Dual Color Power and HD
LED on Front of Computer
The Power LED is on the front of the system, but the HDD LED is located on the Rear of the system
Configuration Record SW
Over-Temp Warning on
Screen
Consists of an operating system DVD (OSDVD) and a driver DVD (DRDVD). OSDVD restores the original
operating system. DRDVD will provide all drivers for the system. The DRDVD may also contain
applications that originally shipped with the system for optional installation. Applications can also be
obtained from HP.com. OSDVD and DRDVD are orderable with the system and available from HP
Support.
Dual Function Front
Power Switch
Yes, causes a fail-safe power off when held for 4 seconds (default) or 15 seconds (can be configured by
F10 BIOS setup\Advanced\System Options\Power button override)
Yes, Kensington Cable Lock (optional): Locks top cover from being opened and secures chassis to
furniture to prevent theft
3 mm x 7 mm slot at rear of system
Serial, Parallel, USB,
Audio, Network,
Enable/Disable Port
Control
Yes, enables or disables serial, USB, audio, and network ports (parallel port is not supported on the Z2
Mini G3)
Removable Media
Write/Boot Control
Yes, prevents ability to boot from removable media on supported devices (and can disable writes to
media)
Yes, prevents an unauthorized person from booting up the workstation
Setup Password
Yes, prevents an unauthorized person from changing the workstation configuration

System Technical Specifications
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NIC LEDs (integrated)
(Green & Amber)
A T-15 Torx or flat blade screwdriver is needed to remove the CPU heatsink before the CPU can be
removed. CPU removal is tool-less
Power Supply Diagnostic
LED
Yes; this is located on the Rear of the chassis and combined with the HDD LED.
When the PSU adapter is plugged in, and the unit is powered off, the Power OK LED will glow.
Yes, white (normal), red (fault)
Yes, on the side of the chassis
System/Emergency ROM
Flash Recovery
Recovers corrupted system BIOS.
Cooling Solution
Air cooled forced convection
Z2 Mini Entry & Performance CPU blower solution: 11.1 mm x 65mm x 82.1mm
Z2 Mini Performance GPU blower solution: 29mm x 103.6mm x 102.2mm
Z2 Mini G3 Entry: Single system blower
Z2 Mini G3 Performance: Dual system blower
HP PC Hardware
Diagnostics UEFI
HP PC Hardware Diagnostics (UEFI) enables hardware level testing outside the operating system on
many components. The diagnostics can be invoked by pressing F2 at POST, and is available as a
download from HP Support.
The Kensington lock slot on the chassis serves this purpose
Advanced Configuration and Power Management Interface (ACPI).
• Allows the system to wake from a low power mode.
• Controls system power consumption, making it possible to place individual cards and peripherals in a
low-power or powered-off state without affecting other elements of the system
Trusted Platform Module
Chip
Yes, all M.2 modules are retained by a single screw
Diagnostic Power Switch
LED on board
Yes
Clear Password Jumper

System Technical Specifications
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Yes: Z2 Min iG3 Entry
Yes: Z2 Mini G3 Performance
Standard BIOS 32-bit Service Directory Proposal v0.4
Full BIOS support for PCI Express through industry standard interfaces.
ATAPI Removable Media Device BIOS Specification Version 1.0.
BIOS Boot Specification v1.01.
Provides more control over how and from what devices the workstation will boot.
WMI is Microsoft's implementation of Web-Based Enterprise Management (WBEM) for Windows. WMI is
fully compliant with the Distributed Management Task Force (DMTF) Common Information Model (CIM)
and WBEM specifications.
Users can define a specific day-of-week and time for the system to power on.
ROM Based Computer
Setup Utility (F10)
Review and customize system configuration settings controlled by the BIOS.
System/Emergency ROM
Flash Recovery with
Video
Recovers system BIOS in corrupted Flash ROM.
Saves BIOS settings to USB flash device in human readable file. Repset.exe utility can then replicate
these settings on machines being deployed without entering Computer Configuration Utility (F10
Setup).
System Management BIOS 2.7.1, for system management information.
Disables the ability to boot from removable media on supported devices.
Alerts management console if memory is removed or changed.
Monitors the temperature state within the chassis. Three modes:
• NORMAL - normal temperature ranges.
• ALERTED - excessive temperatures are detected. Raises a flag so action can be taken to avoid
shutdown or provide for a smoother system shutdown.
• SHUTDOWN - excessive temperatures are encountered. Automatically shuts down the computer
without warning before hardware component damage occurs.
Provides secure, fail-safe ROM image management from a central network console.
Updates can be performed before starting the OS.
Updates can be periodically scheduled.

System Technical Specifications
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ACPI (Advanced
Configuration and Power
Management Interface)
Allows the system to enter and resume from low power modes (sleep states).
Enables an operating system to control system power consumption based on the dynamic workload.
Makes it possible to place individual cards and peripherals in a low-power or powered-off state without
affecting other elements of the system.
Supports ACPI 4.0 for full compatibility with 64-bit operating systems.
A user-defined string stored in non-volatile memory that is displayed in the BIOS splash screen.
Remote Wakeup/Remote
Shutdown
System administrators can power on, restart, and power off a client computer from a remote location.
ASF 2.0 Compliant
Instantly Available PC
(Suspend to RAM - ACPI
sleep state S3)
Allows for very low power consumption with quick resume time.
Remote System
Installation via F12 (PXE
2.1) (Remote Boot from
Server)
Allows a new or existing system to boot over the network and download software, including the
operating system.
Reports the system BIOS revision level in Computer Configuration Utility (F10 Setup). Version is
available through an industry standard interface (SMBIOS) so that management SW applications can
use and report this information.
System board revision
level
Allows management SW to read revision level of the system board.
Revision level is digitally encoded into the HW and cannot be modified.
Start-up Diagnostics
(Power-on Self-Test)
Assesses system health at boot time with selectable levels of testing.
Auto Setup when new
hardware installed
System automatically detects addition of new hardware.
Keyboard-less Operation
The system can be booted without a keyboard.
Common BIOS image supports System Configuration Utility (F10 Setup) menus in 12 languages with
local keyboard mappings.
The user or IT administrator to set a unique tag string in non-volatile memory.
Allows I/O slot parameters (option ROM enable/disable) to be configured individually.
Control parameters are set according to detected hardware configuration for optimal acoustics.
(Pre-video) critical errors are reported via beeps and blinks on the power LED.
Digitally and
Cryptographically Signed
BIOS
Helps to prevent the installation of unauthorized versions of a BIOS (a rogue BIOS) from a virus,
malware, or other code that could lead to compromised system security, data access, physical service,
or even system board replacement.

System Technical Specifications
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Master Boot Record
Protection
A feature in the HP BIOS that prevents changes and/or infections to the Master Boot Record. Useful in
protecting from viruses.
Boot Block Emergency
Recovery Mode (BIOS
Recovery)
The HP BIOS offers a write-protected boot block ROM that provides recovery from a failed flashing of
the computer BIOS. This special recovery mode prevents the system from becoming unusable or
“bricked” when a BIOS update is interrupted.
Industry Standard
Specification Support
Revision Supported by the BIOS
UEFI Specification
Revision
Advanced Configuration and Power Management Interface, Version 4.0
Alert Standard Format Specification, Version 2.0
- Enhanced Disk Drive Specification Version 1.1
- BIOS Enhanced Disk Drive Specification Version 3.0
PCI Express Base Specification, Revision 2.0;
PCI Express Base Specification, Revision 3.0.
POST Memory Manager Specification, Version 1.01
- Serial ATA Specification, Revision 1.0a
- Serial ATA II: Extensions to Serial ATA 1.0, Revision 1.0a
- Serial ATA II Cables and Connectors Volume 2 Gold
- SATA-IO SATA Revision 3.0 Specification
PC SDRAM Serial Presence Detect (SPD) Specification, Revision 1.2B
Trusted Computing Group TPM Specification Version 2.0
Universal Serial Bus Revision 1.1 Specification
Universal Serial Bus Revision 2.0 Specification
Universal Serial Bus Revision 3.0 Specification

System Technical Specifications
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Social and Environmental Responsibility
Eco-Label Certifications &
Declarations
This product is low halogen except for power cords, cables and peripherals. Service parts obtained
after purchase may not be Low Halogen.
ENERGY STAR® (energy-saving features available on selected configurations –Windows® only)
US Federal Energy Management Program (FEMP)
China Energy Conservation Program (CECP)
IT ECO declaration
The battery in this product complies with EU Directive 2006/66/EC
Battery size: CR2032 (coin cell)
Battery type: Lithium Metal
The battery in this product does not contain:
Mercury greater than 5ppm by weight
Cadmium greater than 10ppm by weight
Lead greater than 40ppm by weight
Restricted Material Usage
This product meets the material restrictions specified in HP's General Specification for the
Environment. http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf
HP Inc. is committed to compliance with all applicable environmental laws and regulations, including
the European Union Restriction of Hazardous Substances (RoHS) Directive. HP's goal is to exceed
compliance obligations by meeting the requirements of the RoHS Directive on a worldwide basis.
This product is low halogen except for power cords, cables and peripherals, as well as the following
customer-configurable internal components: Creative Recon3D PCIe Audio Card is not Low Halogen.
Service parts obtained after purchase may not be Low Halogen.
End-of-Life Management
and Recycling
HP Inc. offers end-of-life HP product return and recycling programs in many geographic areas. To
recycle your product, please go to: http://www.hp.com/recycle or contact your nearest HP sales office.
Products returned to HP will be recycled, recovered or disposed of in a responsible manner. This
product is greater than 90% recyclable by weight when properly disposed of at end of life.
HP Inc. Corporate
Environmental
Information
For more information about HP's commitment to the environment:
Living Progress Report http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www.hp.com/hpinfo/globalcitizenship/environment/productdesign/ecolabels.html
ISO 14001 certificates:
http://www.hp.com/hpinfo/globalcitizenship/environment/operations/envmanagement.html
This HP product is designed to comply with the Waste Electrical and Electronic Equipment
(WEEE) Directive - 2002/96/EC.
Plastic parts weighing over 25 grams used in the product are marked per ISO 11469 and
ISO1043.
This product is >90% recycle-able when properly disposed of at end of life
EPEAT® Gold registered in the U.S. EPEAT registration varies by country. See
http://www.epeat.net for registration status by country.
HP Workstation product packaging meets the HP General Specification for the Environment at
http://www.hp.com/hpinfo/globalcitizenship/society/gen_specifications.html
Does not contain restricted substances listed in HP Standard 011-1 General Specification for
the Environment

System Technical Specifications
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Does not contain ozone-depleting substances (ODS)
Does not contain heavy metals (lead, mercury, cadmium or hexavalent chromium) in excess of
100 ppm sum total for all heavy metals listed
Maximizes the use of post-consumer recycled content materials in packaging materials
All packaging material is recyclable
All packaging material is designed for ease of disassembly
Reduced size and weight of packages to improve transportation fuel efficiency
Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards
formatting
Cushions made from fabricated recycled expanded-polyethylene (EPE) or recycled expandedpolypropylene (EPP). May also be made from recycled molded paper-pulp (MPP).
Carton made from corrugated fiberboard with at least 25% recycled content.

System Technical Specifications
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Intel® Active Management
Technology (AMT)
The HP Z2 Mini G3 workstation supports Intel® vPro™ technology when purchased with a vPro™
technology capable CPU: Intel® Xeon® processor family or 6th Generation Intel® Core™ i5/i7 processors
with Intel® VT-d/VT-x and Intel® TXT technology.
Remote Manageability
Software Solutions
Visit: http://www.hp.com/go/easydeploy
Visit: http://www.hp.com/go/ssm
Service, Support, and
Warranty
Program to proactively communicate Product Change Notifications (PCNs) and Customer
Advisories by email to customers, based on a user-defined profile.
PCNs provide advance notification of hardware and software changes to be implemented in the
factory providing time to plan for transition.
Customer Advisories provide concise, effective problem resolution, greatly reducing the need
to call technical support.

Stable & Consistent Offerings
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As part of its commitment to hardware, software, and solution innovation, HP is proud to introduce this breakthrough platform
configuration stability to HP Workstation customers. HP Stable & Consistent Offerings are built on the foundation of a carefully
chosen set of hardware and software designed and tested to work with all HP Z Workstation platforms through their end of life.
These components and their corresponding HP Workstation platform compatibility are outlined in this section.
HP Stable & Consistent Offerings are available worldwide to all HP Workstation customers-no special programs, no additional
cost, no kidding. Simply select your hardware and software components when you customize your HP Workstation and be assured
that you'll be able to buy that same configuration throughout the lifecycle of the product.
Intel® Xeon® E3- 1225v5 3.3GHz CPU
Intel® Xeon® E3- 1245v5 3.5GHz CPU
HDD 500GB 7200RPM SATA 2.5
RAM 8GB (1x8GB) DDR4 2400 ECC Unbuffered
RAM 16GB (2x8GB) DDR4 2400 ECC Unbuffered

Technical Specifications - Processors
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Intel® Xeon® processor E3-1200 v5 family
Intel® Xeon® E3-1245 v5 3.5 2133 4C CPU
Intel® Xeon® E3-1225 v5 3.3 2133 4C CPU
Intel® Core™ i7-6700 3.4 2133 4C CPU
Intel® Core™ i5-6500 3.2 2133 4C CPU
Intel® Core™ i3-6100 3.7 2133 2C CPU

Technical Specifications - Hard Drives
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SATA Hard Drives for HP
Workstations
500GB SATA 7200 rpm
6Gb/s 3.5" HDD
Rated for 24/7/365
operation
NO
Physical Size (Height)
Serial ATA (6Gb/s), NCQ enabled
Synchronous Transfer
Rate (Maximum)
Up to 600MB/s
Operating Temperature
32° to 140° F (0° to 60° C)
1TB SATA 7200 rpm
6Gb/s SFF HDD
Rated for 24/7/365
operation
NO
Physical Size (Height)
Serial ATA (6Gb/s), NCQ enabled
Synchronous Transfer
Rate (Maximum)
32° to 140° F (0° to 60° C)
SATA SSDs for HP
Workstations
Synchronous Transfer
Rate (Maximum)
Up to 600MB/s
Operating Temperature
32° to 158° F (0° to 70° C)

Technical Specifications - Graphics
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Integrated Intel® HD
Graphics (Z2)
Integrated in select Intel® Xeon® E3, Intel® CoreTM i7, Intel® CoreTM i5, and
Intel® CoreTM i3 processors.
Check specific platform specifications for selections.
Unified Memory Architecture (UMA) frame buffer. Graphics memory is
shared with system memory. Size selectable between 32 MB to 1024 MB
via BIOS setting. Default size is 128 MB. Additional memory is allocated for
graphics as needed using Intel's Dynamic Video Memory Technology (Intel®
DVMT), to provide an optimal balance between graphics and system
memory use.
Check system platform specifications where Intel® HD Graphics are
available.
DisplayPortTM 1.2:
- up to 4096x2160 x 30 bpp @ 60Hz
- supports High Bit Rate 2 (HBR2) and Multi-Stream Transport (MST)
HDMI 2.0 output:
- up to 4096x2160 x 30 bpp @ 60Hz
Dual Link DVI(I) output:
- up to 2560 x 1600 x 32 bpp @ 60Hz
Single Link-DVI(I) output:
- up to 1920 x 1200 x 32 bpp @ 60Hz
VGA output:
- 2048 × 1536 × 32 bpp @ 85 Hz
Note: For HDMI, DVI, and VGA outputs, separate adapters required.
Shading Architecture
Available Graphics
Drivers
*Integrated graphics will depend on processor. HD content required to view HD images

Technical Specifications - Graphics
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NVIDIA® Quadro® M620
2GB Graphics
DisplayPort 1.2:
- up to 4096x2160 x 30 bpp @ 60Hz
- supports High Bit Rate 2 (HBR2) and Multi-Stream Transport (MST)
HDMI 2.0 output:
- up to 4096x2160 x 30 bpp @ 60Hz
Stereoscopic 3D display support including NVIDIA® 3D Vision™ technology,
3D DLP, Interleaved, and passive stereo
Maximum number of displays:
- 4 direct attached monitors
Maximum number of DisplayPort™ displays possible per DisplayPort™
output (Multiple displays daisy-chained from one DisplayPort™ 1.2 port
requires DisplayPort™ 1.2 MST capable displays or DP1.3 MST capable
hub):
- 4 1920x1200 @ 60 Hz
- 2 2560x1600 @ 60 Hz
- 1 4096x2160 @ 60 Hz
Maximum number of monitors across all available Quadro M620 outputs is
4.
OpenGL 4.5
DirectX 12
API support includes:
CUDA C, CUDA C++, DirectCompute 5.0, OpenCL, Java, Python, and Fortran
Available Graphics
Drivers
Microsoft Windows 10
Microsoft Windows 7
Linux - Full OpenGL implementation, complete with NVIDIA and ARB
extensions
HP qualified drivers may be preloaded or available from the HP support
Web site:
http://welcome.hp.com/country/us/en/support.html

Technical Specifications - Optical and Removable Storage
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HP External Ultra-Slim
DVD-RW Drive
External 9.5mm high, tray-load
Either horizontal or vertical
DVD-RAM
DVD+R
DVD+RW
DVD+R DL
DVD-R DL
DVD-R
DVD-RW
CD-R
CD-RW
8.5 GB DL or 4.7 GB standard
Access Times
Full Stroke DVD
160ms (typical for Random Stroke)
140ms (typical for Random Stroke)
Maximum Data Transfer
Rates
CD-ROM, CD-R Up to 24X
CD-RW Up to 24X
DVD-RAM Up to 8X
DVD+RW Up to 8X
DVD-RW Up to 8X
DVD+R DL Up to 8X
DVD-R DL Up to 8X
DVD-ROM Up to 8X
DVD-ROM DL Up to 8X
DVD+R Up to 8X
DVD-R Up to 8X
5 VDC ± 5%-100 mV ripple p-p
5 VDC -< 800 mA typical, <1600 mA maximum
Operating Environmental
(all conditions noncondensing)
41° to 104° F (5° to 40° C)
Maximum Wet Bulb
Temperature
Operating Systems
Supported
Windows 10 32-bit and 64-bit, Windows 8 32-bit and 64-bit, Windows 7
Professional 32-bit and 64-bit, Windows Vista Business 64*, Windows Vista
Business 32*, Windows Vista Home Basic 32*, Windows 2000, Windows XP
Professional or Windows XP Home 32*.
Red Hat Enterprise Linux(RHEL) WS4**, 5, 6 Desktop/Workstation,
Removed reference to "Novell" because of acquisition and changed product
reference to "SUSE Linux Enterprise Desktop 10 & 11",
No driver is required for this device. Native support is provided by the
operating system.
HP External Ultra-Slim DVD-RW Drive DVD Writer drive, USB 2.0 type A to
mini-B cable.
© Copyright 2016 HP Development Company, L.P.

Technical Specifications - Optical and Removable Storage
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The only warranties for HP products and services are set forth in the
express warranty statements accompanying such products and services.
Nothing herein should be construed as constituting an additional warranty.
HP shall not be liable for technical or editorial errors or omissions
contained herein. The information contained herein is subject to change
without notice.

Technical Specifications - Networking and Communications
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Integrated Intel® I219LM
PCIe GbE Controller
(Intel® vPro™ with Intel®
AMT 11.0)
Intel® I219LM GbE platform LAN connect networking controller
3 KB Tx and 3KB Rx FIFO packet buffer memory
802.1as/1588, 802.1p, 802.1Q, 802.3, 802.3ab, 802.3az, 802.3i, 802.3u,
802.3z
PCIe-based interface for active state operation (S0 state) and SMBus for
host and management traffic (Sx low power state)
Requires 3.3V (integrated regulators for core Vdc)
Full-duplex; Half-duplex (not supported for the 1000BASE-T transceiver)
10BASE-T (half-duplex) 10 Mbps
10BASE-T (full-duplex) 20 Mbps
100BASE-TX (half-duplex) 100 Mbps
100BASE-TX (full-duplex) 200 Mbps
1000BASE-T (full-duplex) 2000 Mbps
vPro, WOL, auto MDI crossover, PXE, iSCSI Boot, Muti-port teaming, RSS,
ACPI, Advanced cable diagnostic, loopback modes,
AMT 11.0 support, Circuit Breaker, VLAN, Multicast Listener Discovery
(MLD)
Intel® 8265 Wireless LAN
(802.11ac) and Bluetooth
4.2 Module
M.2 (Supports 2230 form factor; E Key) Motherboard Interface
Intel® Dual Band Wireless-AC 8260
Wireless LAN: IEEE 802.11abgn, 802.11ac, 802.11d, 802.11e, 802.11i,
802.11h, 802.11w, CCX 4.x/CCX Lite, WMM, WPA, WPA2, APS, WPS 2.0,
Protected Management Frames
Bluetooth®: Dual Mode Bluetooth® 2.1, 2.1+EDR, 3.0, 4.0, BLE, and 4.2
Bus Architecture
PCI Express Gen3 x1 and USB 2.0
Requires 3.3V ; 1.65W TDP
Wake on WLAN (in all sleep states, excluding Max Power Savings mode),
WFA Management Frame Protection (802.11w), vPro/WiAMT Not Currently
Supported, F10 BIOS Menu option to disable/enable WLAN and Bluetooth®
radios, supports seamless roaming between 802.11 wireless access points
Max PHY throughput 887 Mbps (802.11ac) for WLAN

Summary of Changes
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HP Z2 Mini Workstation
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© 2016 HP Development Company, L.P. The information contained herein is subject to change without notice. The only warranties
for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing
herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or
omissions contained herein. Intel, Intel Core, Pentium, Thunderbolt and Xeon are trademarks of Intel Corporation in the U.S. and
other countries. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United
States and/or other countries. ENERGY STAR® is a registered trademark owned by the U.S. Environmental Protection Agency.
Linux® is the registered trademark of Linus Torvalds in the U.S. and other countries. NVIDIA®, Quadro and the NVIDIA logo are
trademarks and/or registered trademarks of NVIDIA Corporation in the U.S. and other countries. Red Hat® is a registered trademark
of Red Hat, Inc. in the United States and other countries. Bluetooth is a trademark of its proprietor used by HP Inc. under license.
DisplayPort™ and the DisplayPort™ logo are trademarks owned by the Video Electronics Standards Association (VESA®) in the
United States and other countries.