HBM MX840B, MX440B, MX430B, MX238B, MX460B Operating Manual
...
Operating Manual
English
Quantum
X
Hottinger Baldwin Messtechnik GmbH
Im Tiefen See 45
D-64239 Darmstadt
Tel. +49 6151 803-0
Fax +49 6151 803-9100
info@hbm.com
www.hbm.com
Mat.: 7-2002.3031
DVS: I3031-14.0 HBM: public
09.2016
E Hottinger Baldwin Messtechnik GmbH.
Subject to modifications.
All product descriptions are for general information only.
They are not to be understood as a guarantee of quality or
durability.
English
1 Safety instructions 8........................................
2 Electro magnetic conformity 15...............................
3 Markings used 17............................................
3.1 The markings used in this document 17..........................
3.2 Symbols on the device 18......................................
4 Introduction 19..............................................
4.1 About the QuantumX documentation 19.........................
4.2 The QuantumX family 20......................................
4.3 Module overview/transducer technologies 24.....................
4.4 Digitalization and signal path 25................................
4.5 Synchronization 26............................................
5 Software 35.................................................
5.1 MX Assistant 35..............................................
5.2 catman®AP 37...............................................
5.3 LabVIEW® driver / library 38...................................
5.4 Driver for Microsoft® Visual Studio .NET 39......................
5.5 Other drivers 39..............................................
5.6 Firmware update via Ethernet 40................................
6 Mechanical 41...............................................
6.1 Mounting case clips on modules 42.............................
6.2 Connecting housings 45.......................................
6.3 Mounting the housing with CASEFIT 47..........................
6.4 BPX001/BPX002 backplane 47.................................
6.4.1 Connection 49................................................
6.4.2 Backplane BPX001 50.........................................
6.4.3 Backplane BPX002 52.........................................
6.4.4 Mounting the modules 52......................................
6.4.5 Backplane with Ethernet connection 56..........................
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6.4.6 Backplane with IEEE1394b FireWire connection 57...............
6.4.7 System layout with several backplanes 58........................
7 Connecting individual QuantumX modules 59.................
7.1 Connecting the supply voltage 59...............................
7.2 Connection to host PC or data recorder 62.......................
7.2.1 Single Ethernet connection 62..................................
7.2.2 Multiple Ethernet connection with PTP synchronization 63..........
7.2.3 Multiple Ethernet connection and FireWire synchronization 64......
7.2.4 Connecting one or more QuantumX modules to the PC 65.........
7.2.5 Firmware update via Ethernet 73................................
7.2.6 Connection via FireWire (IEEE 1394b) 74........................
7.2.7 Setting up FireWire 1394b on the PC 75.........................
7.2.8 Multiple FireWire connection 77.................................
7.2.9 Layout with data recorder CX22B‐W 78..........................
7.2.10 Output measurement signals to CAN bus (MX840B) 79............
7.2.11 Output measurement signals to CAN bus (MX471B) 79............
7.2.12 Output of signals with standardized voltage in real time (MX878B
or MX879B) 80...............................................
7.2.13 Output signals in real time via EtherCAT® and in parallel
via Ethernet 81...............................................
7.2.14 QuantumX in the FireWire group 82.............................
7.2.15 Optical FireWire connection 85.................................
8 Modules and transducers 87.................................
8.1 General information 87........................................
8.1.1 Shielding design 87...........................................
8.1.2 Active transducer connection 89................................
8.1.3 TEDS 91....................................................
8.1.4 Background calibration / autoadjustment 94......................
8.2 MX840/A/B universal amplifier 96...............................
8.2.1 MX840B pin assignment 98....................................
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8.2.2 MX840B status display 100.....................................
8.3 MX440B universal amplifier 101..................................
8.4 MX410B highly dynamic universal amplifier 103....................
8.4.1 MX410B pin assignment 104....................................
8.4.2 MX410B status display 106.....................................
8.5.1 MX430B pin assignment 108....................................
8.5.2 MX430B status display 109.....................................
8.6.1 MX238B pin assignment 111....................................
8.6.2 MX238B status display 112.....................................
8.7 MX460B frequency amplifier 113.................................
8.7.1 MX460B pin assignment 114....................................
8.7.2 MX460B status display 116.....................................
8.8 MX1609KB and MX1609TB thermocouple amplifier 117............
8.8.1 Thermocouple with TEDS functionality (RFID) 119.................
8.8.2 MX1609 status display 121......................................
8.9 MX471B CAN module 122......................................
8.9.1 General information 122........................................
8.9.2 MX471B pin assignment 124....................................
8.9.3 LEDs status display 125........................................
8.9.4 Receiving CAN messages 126...................................
8.10 MX1601B amplifier 127.........................................
8.10.1 MX1601B pin assignment 128...................................
8.10.2 MX1601B status display 130....................................
8.11 MX1615B amplifier 132.........................................
8.11.1 MX1615B pin assignment 134...................................
8.11.2 MX1615B status display 136....................................
9 Transducer connection 138....................................
9.1 Full bridge, SG 138............................................
9.2 Full bridge, inductive 139.......................................
9.3 Full bridge, piezoresistive 140...................................
9.4 Half bridge, SG 141............................................
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9.5 Half bridge, inductive 142.......................................
9.6 Quarter bridge, SG 143.........................................
9.7 Adapter quarter bridge, SG 144..................................
9.8 Connecting transducers with double shield technique 145...........
9.9 Potentiometric transducers 146..................................
9.10 LVDT transducers 147..........................................
9.11 Current-fed piezoelectric transducer (ICP/IEPE) 148...............
9.12 Electrical voltage 100 mV 150...................................
9.13 DC voltage sources 10 V 151....................................
9.14 DC voltage sources 60 V 152....................................
9.15 Voltage sources up to 300 V (CAT II) 153.........................
9.16 DC current sources 20 mA 154..................................
9.17 DC current sources 20 mA - voltage-fed 155.......................
9.18 Ohmic resistance (e.g. PTC, NTC, KTY, …) 156...................
9.19 Resistance thermometer PT100, PT1000 157......................
9.20 Thermocouples 158............................................
9.21 Frequency, differential, without directional signal 161...............
9.22 Frequency, differential, with directional signal 162..................
9.23 Frequency, single-pole, with directional signal 163..................
9.24 Encoder and pulse encoder, differential 164.......................
9.25 Encoder and pulse encoder, single-pole 165.......................
9.26 Rotary encoder and pulse generator, single pole with static
directional signal 166...........................................
9.27 Absolute value encoder with SSI protocol 167.....................
9.28 Passive inductive encoder (Pickups, Crankshaft sensor) 169........
9.29 Measurement of rotational speed, Crankshaft sensor (digital, TTL) 170
9.30 PWM - Pulse width, pulse duration, period duration 171.............
9.31 PWM - Pulse width, pulse duration, period duration, single-pole 172..
9.32 CAN bus 173..................................................
10 Functions and outputs 175....................................
10.1 MX410B and MX430B 176......................................
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10.2 MX460B 179..................................................
10.3 MX878B 180..................................................
10.4 MX879B Multi‐I/O module 188...................................
10.5 MX471B 194..................................................
11 FAQ 195.....................................................
12 Accessories 199..............................................
12.1 System accessories 209........................................
12.1.1 BPX001 backplane 209.........................................
12.1.3 Housing connection elements 211................................
12.2 Voltage supply 211.............................................
12.2.1 Power pack NTX001 211.......................................
12.2.2 Supply cable 212..............................................
12.3 IEEE1394b FireWire 213........................................
12.3.1 IEEE1394b FireWire cable (module-to-module; IP67) 213...........
12.3.2 Connection cable (PC to module) 213............................
12.3.3 Connection cable (PC to hub) 214................................
12.4 General information 215........................................
12.4.1 Plug kit with TEDS chip 215.....................................
12.4.2 Port saver Sub-HD 15-pin 215...................................
12.4.3 Adapter D-Sub-HD 15-pin to D-Sub 15-pin 216....................
12.5 Accessories for MX840B, MX440B 217...........................
12.5.1 Cold junction for thermocouples 217..............................
12.6 SubHD15 to BNC adapter 218...................................
12.7 SCM-HV accessories 219.......................................
12.8 SCM-SG120/350 quarter bridge adapter 220......................
12.9 MX1609/KB/TB accessories 221.................................
12.9.1 Thermo-connector with integrated RFID chip 221...................
13 Support 222..................................................
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Safety instructions
1 Safety instructions
Notice
The safety instructions described here also apply to the
power pack NTX001 and the active backplane BPX001
and BPX002.
Appropriate use
A module with connected transducers is to be used
exclusively for measurement tasks and Test tasks. Use
for any purpose other than the above is deemed to be
non-designated, inappropriate use.
In the interests of safety, the module should only be
operated as described in the Operating Manuals. It is
also essential to comply with the legal and safety
requirements for the application concerned during use.
The same applies to the use of accessories.
Before commissioning the module for the first time, you
must first run a project planning and risk analysis that
takes into account all the safety aspects of automation
technology. This particularly concerns personal and
machine protection.
Additional safety precautions must be taken in plants
where malfunctions could cause major damage, loss of
data or even personal injury. In the event of a fault, these
precautions establish safe operating conditions.
This can be done, for example, by mechanical
interlocking, error signaling, limit value switches, etc.
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Safety instructions
Notice
The module must not be connected directly to a power
supply system. The supply voltage must be 10 V … 30 V
(DC).
General dangers of failing to follow the safety
instructions
Every module is a state of the art device and as such is
failsafe. The module may give rise to residual dangers if
it is inappropriately installed and operated by untrained
personnel. Any person instructed to carry out installation,
commissioning, maintenance or repair of the modules
must have read and understood the Operating Manuals
and in particular the technical safety instructions.
The scope of supply and performance of the modules
only covers a small area of measurement technology. In
addition, equipment planners, installers and operators
should plan, implement and respond to the safety
engineering considerations of measurement technology
in such a way as to minimize residual dangers. On-site
regulations must be complied with at all times. There
must be reference to the residual dangers connected
with measurement technology. After making settings and
carrying out activities that are password-protected, you
must make sure that any controls that may be connected
remain in safe condition until the switching performance
of the module has been tested.
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Safety instructions
Conditions on site
For modules in the housing with degree of protection
IP20:
S Protect the modules from dirt and moisture or the ef
fects of weather such as rain, snow, etc.
S The permissible relative humidity at 31
(non-condensing); linear reduction to 50% at 40
o
C is 80%
o
C.
S Make sure that the side ventilation openings are not
covered.
For all modules:
S Do not expose the modules to direct sunlight.
S Please observe the permissible maximum ambient
temperatures stated in the specifications.
S Ensure there is adequate ventilation for installation in
the BPX001 backplane.
Maintenance and cleaning
The modules are maintenance-free. Please note the
following points when cleaning the housing:
S Before cleaning, disconnect all connections.
S Clean the housing with a soft, slightly damp (not wet!)
cloth. Never use solvent as this could damage the
labeling or the housing.
S When cleaning, ensure that no liquid gets into the
module or connections.
Outputs
Particular attention must be paid to safety when using the
digital, analog or CAN bus outputs of a module. Ensure
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Safety instructions
that status or control signals cannot initiate any actions
that may pose a danger to persons or the environment.
Product liability
In the following cases, the protection provided for the
device may be adversely affected. Liability for device
functionality then passes to the operator:
S The device is not used in accordance with the operat
ing manual.
S The device is used outside the field of application de
scribed in this section.
S The operator makes unauthorized changes to the
device.
Warning signs and danger symbols
Important instructions for your safety are specifically
identified. It is essential to follow these instructions in
order to prevent accidents and damage to property.
Quantum
Safety instructions are structured as follows:
WARNING
Type of danger
Consequences of non-compliance
Averting the danger
S Warning sign: draws attention to the danger
S Signal word: indicates the severity of the danger
(see table below)
S Type of danger: identifies the type or source of the
danger
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Safety instructions
S Consequences:describes the consequences of non-
compliance
S Defense: indicates how the danger can be avoided/
bypassed.
Danger classes as per ANSI
Warning sign, signal word Meaning
WARNING
CAUTION
Note
This marking warns of a potentially dangerous situ
ation in which failure to comply with safety require
ments may result in death or serious physical injury.
This marking warns of a potentially dangerous situ
ation in which failure to comply with safety require
ments may result in slight or moderate physical injury.
This marking draws your attention to a situation in
which failure to comply with safety requirements may
lead to damage to property.
Working safely
The supply connection, as well as the signal and sensor
leads, must be installed in such a way that
electromagnetic interference does not adversely affect
device functionality (HBM recommendation: "Greenline
shielding design", downloadable from the Internet at
http://www.hbm.com/Greenline).
Automation equipment and devices must be covered
over in such a way that adequate protection or locking
against unintentional actuation is provided (e.g. access
checks, password protection, etc.).
When devices are working in a network, these networks
must be designed in such a way that malfunctions in
individual nodes can be detected and shut down.
Safety precautions must be taken both in terms of
hardware and software, so that a line break or other
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Safety instructions
interruptions to signal transmission, e.g. via the bus
interfaces, do not cause undefined states or loss of data
in the automation device.
Error messages should only be acknowledged once the
cause of the error is removed and no further danger
exists.
Conversions and modifications
The module must not be modified from the design or
safety engineering point of view except with our express
agreement. Any modification shall exclude all liability on
our part for any resultant damage.
In particular, any repair or soldering work on
motherboards (exchanging components) is prohibited.
When exchanging complete modules, use only original
parts from HBM.
The module is delivered from the factory with a fixed
hardware and software configuration. Changes can only
be made within the possibilities documented in the
manuals.
Quantum
Qualified personnel
Important
This device is only to be installed and used by qualified
personnel strictly in accordance with the specifications
and with the safety rules and regulations which follow.
Qualified persons means persons entrusted with the
installation, fitting, commissioning and operation of the
product who possess the appropriate qualifications for
their function. This module is only to be installed and
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Safety instructions
used by qualified personnel, strictly in accordance with
the specifications and the safety rules and regulations.
This includes people who meet at least one of the three
following requirements:
S Knowledge of the safety concepts of automation tech
nology is a requirement and as project personnel, you
must be familiar with these concepts.
S As automation plant operating personnel, you have
been instructed how to handle the machinery and are
familiar with the operation of the modules and techno
logies described in this documentation.
S As commissioning engineers or service engineers,
you have successfully completed the training to qual
ify you to repair the automation systems. You are also
authorized to activate, ground and label circuits and
equipment in accordance with safety engineering
standards.
It is also essential to comply with the legal and safety
requirements for the application concerned during use.
The same applies to the use of accessories.
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2 Electro magnetic conformity
Additional information about the relevant EMC standards
EN 61326-1 / EN61326-2-x.
These standards define emissions limits and immunity
requirements for different environments.
Emissions requirements are defined for the following en
vironments:
- Industrial (Class A) or
- Residential / Laboratory (Class B).
The standard refers to CISPR 11:2009+A1:2010.
Immunity requirements are defined for the following envi
ronments:
- Controlled electro-magnetic (lowest requirements)
- Basic or
Electro magnetic conformity
Quantum
- Industrial (highest requirements).
The modules listed in the declaration of conformity com
ply with the requirements for the following environments:
Emissions: Class A
Immunity: Industrial environment
The QuantumX series and its modules are intended for
use in an industrial environment. When used in
residential or commercial environments, additional ar
rangements may be required to limit electro-magnetic
emissions.
An example is voltage supply of the modules by battery.
In this case please wrap the power supply cable
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Electro magnetic conformity
(KAB271-3) around the inductive coil included in the
package four times.
ODU plug
When the NTX001 power supply from HBM is used, the
system complies with Emissions: Class B without the
necessity to carry out the meaasure described above.
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Markings used
3 Markings used
3.1 The markings used in this document
Important instructions for your safety are specifically
identified. It is essential to follow these instructions, in
order to prevent damage.
Symbol Meaning
Note
CAUTION
Important
Tip
Device -> New Bold text indicates menu items, as well as dialog and
Sampling rate, 500 Bold text in italics indicates inputs and input fields in
Emphasis
See …
This marking draws your attention to a situation in
which failure to comply with safety requirements may
lead to damage to property.
This marking warns of a potentially dangerous situ
ation in which failure to comply with safety require
ments may result in slight or moderate physical injury.
This marking draws your attention to important in
formation about the product or about handling the
product.
This marking indicates application tips or other in
formation that is useful to you.
window titles in the user interfaces. Arrows between
menu items indicate the sequence in which the
menus and sub-menus are opened.
the user interfaces.
Italics are used to emphasize and highlight text and
identify references to sections, diagrams, or external
documents and files.
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Markings used
3.2 Symbols on the device
CE marking
CE marking enables the manufacturer to guarantee that
the product complies with the requirements of the
relevant EC directives (the Declaration of Conformity can
be found on the HBM website (www.hbm.com) under
HBMdoc).
Statutory waste disposal mark
In accordance with national and local environmental
protection and material recovery and recycling
regulations, old devices that can no longer be used must
be disposed of separately and not with normal household
garbage.
Electrostatically sensitive components
Components marked with this symbol can be damaged
beyond repair by electrostatic discharge. Please observe
the handling instructions for components exposed to the
risk of electrostatic discharge.
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4 Introduction
4.1 About the QuantumX documentation
The QuantumX family documentation consists of
S a printed quick start guide for initial start-up
S the data sheets in PDF format
S This operating manual in PDF format
S the operating manual for the EtherCAT®
S the operating manual for data recorder CX22B-W and
S the operating manual for the MX403B and MX809B
S the operating instructions for the Signal Conditioning
Introduction
1)
/ Ethernet
gateway CX27 in PDF format
CX22B data recorders
modules for safe measurement at high potential
Modules (SCM)
- High-voltage signal conditioned SCM-HV
(300 V CAT II)
- Quarter bridge adapter SCM-SG-120 / -350 for
connecting SGs individually
S the product descriptions for accessories
S a comprehensive online help with index and easy
search options which is available after the installation
of a software package (e.g. QuantumX Assistant, cat
man®EASY). Information about module and channel
configuration can also be found here.
These documents can be found
S on the QuantumX system CD supplied with the device
1)
EtherCAT® is a registered brand and patented technology, licensed by Beckhoff Automation
GmbH, Germany
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Introduction
S After installation of the QuantumX Assistant on the
hard drive of your PC, which can be reached through
the Windows start menu
S Up-to date versions are always available from our In
ternet site at www.hbm.com/hbmdoc
4.2 The QuantumX family
The QuantumX family is a modular measurement system
for universal applications. The modules can be individu
ally combined and intelligently connected according to
the measurement task. Distributed operation makes it
possible to position individual modules close to the meas
uring points, resulting in short sensor lines.
The QuantumX family consists of the following
modules:
S MX840B Universal amplifier
The module has 8 universal inputs and supports more
than 15 transducer technologies.
S MX440B Universal amplifier
Like the MX840B, but with 4 inputs (connections 5-8
of MX840B, without CAN).
S MX410B Highly dynamic universal amplifier
The module has 4 universal inputs and supports com
monly used transducer technologies (at a sampling
rate of up to 96,000 measured values per channel per
second).
S MX430B QuantumX precision bridge measurement
module. The module has 4 inputs and supports full
bridge SG-based transducers with an accuracy class
of 100 ppm.
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Introduction
S MX238B Precision full bridge amplifier
The module has 2 full bridge SG inputs with an accu
racy of 25 ppm.
S MX460B Digital module (counter, frequency, timer)
The module has 4 individually configurable inputs for
connecting HBM torque measurement shafts (T12,
T40, T10), rotational speed sensors, crankshaft sen
sors with gap (TDC sensor), pulse width modulated
signals - PWM
S MX471B CAN module
The module has 4 CAN bus nodes that can be con
figured for receiving and sending messages. The
module supports the CCP and xCP-on-CAN protocols
on up to 2 channels.
S MX1601B Analog amplifier (standardized voltage /
current, IEPE)
The module has 16 individually configurable inputs for
standardized voltage or current measurement or for
connecting current-fed piezoelectric transducers
(IEPE / ICP(R) ).
S MX1615B SG bridge amplifier
The module has 16 individually configurable inputs for
SGs in quarter, half and full bridge circuits. Bridge
excitation voltage DC or carrier frequency (1200 Hz).
S MX1609KB Thermocouple amplifier
The module has 16 inputs for type K thermocouples.
S MX1609TB Thermocouple amplifier
The module has 16 inputs for type K thermocouples.
S MX809B Thermo measurement module
The module has 8 inputs for measurement of tempe
ratures with thermocouples or electrical cell voltages
up to 5 V at a potential up to 1000 V in energy storage
systems. General measurement categories: 600 V
CAT II, 300 V CAT III.
The module and entire production have been certified
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Introduction
by VDE, and stand for maximum safety when working
with dangerous voltages.
S MX403B voltage module
The module has 4 inputs with lab connectors for
voltage measurement (1000 V CAT II, 600 V CAT III).
The module and entire production have been certified
by VDE, and stand for maximum safety when working
with dangerous voltages.
Notice
When using the modules MX403B or MX809B, please
refer to the separate operating manual, document num
ber A3757.
S CX22B or CX22B-W (WLAN) Data recorder
The module is used for local recording of measure
ment data.
S CX27B EtherCAT®/Ethernet gateway
The module is used to connect QuantumX modules to
the EtherCAT® fieldbus or the Ethernet.
S MX878B Analog output module
The module has 8 scalable voltage outputs ("10 V)
that can be assigned with a system signal or a source
signal. Signals can also be calculated in real time.
S MX879B Multi‐I/O module
The module has 8 scalable voltage outputs and 32
configurable digital inputs/outputs. Signals can also be
calculated in real time.
All modules have the following in common:
S Supply voltage range 10 … 30 V DC (nominal rated
voltage 24 V DC)
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Introduction
S Configurable Ethernet interface for data communica
tion with an operating PC
S 2 IEEE1394b FireWire interfaces
- For optional voltage supply
- For optional data communication with a PC
- For automatic time synchronization of the modules
- For real-time transfer of measurement data
between the modules
S Connector for installation on a backplane (not applic
able for ultra-robust variants)
S Status LEDs for displaying general system and chan
nel states
S A factory calibration certificate is stored on each amp
lifier, which can be read by the QuantumX Assistant.
S AutoBoot (module configurations are retained)
With amplifiers, the following applies for each
measurement channel:
S Galvanic isolation (signal inputs/outputs, voltage sup
ply, communication)
S Configurable supply voltage for active sensors
S Support for TEDS2) technology (read, write)
S Configurable sampling rate
S Configurable digital filter (Bessel, Butterworth)
S configurable scaling
Sensors assigned using the sensor database can be cal
ibrated via the channel and written back into the sensor
database.
2)
TEDS = Transducer Electronic Data Sheet
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Introduction
4.3 Module overview/transducer technologies
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Introduction
See data sheets for precise technical specifications. The
pin assignments can be found in the following chapters.
4.4 Digitalization and signal path
Data rate
QuantumX measurement modules with the suffix B, like
the MX840B, for instance, have decimal data rates such
as 600, 1200, ....19,200 S/sec available, in addition to
classic data rates such as 500, 1000, .... 100,000 S/sec.
When there are several modules in a group, the selected
data rate domains must be identical. Catman® or MX
Assistent software allows toggling the sample rate do
main, e.g. From „Classic“ to „Decimal“.
Signal paths
Synchronizing the acquisition of all channels allows sig
nal analysis of all recorded measurement data at the
same time.
Quantum
It often happens that some sensor signals should be
made available in real time, in parallel with the data ana
lysis of highfrequency signals (e.g. 100 kS/sec per chan
nel), i.e. deterministically, with a moderate data rate (e.g.
1 kS/sec or 1 ms control loop) and with a minimum
latency time (e.g. max. 1 ms).
To do this, the modules need to be connected with each
other via the FireWire bus and the signals need to be
made available "isochronously", for example, to be com
puted and/or output via another module (analog, CAN,
EtherCAT).
To give this parallel operation optimum support, each
QuantumX measurement channel generates two signals.
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Introduction
The maximum isochronous data rate per channel is ap
prox. 5 kS/sec (125 μs clock pulse on the FireWire bus).
Scaling
QuantumX supports the following types of scaling:
S Two points (2‐point / y=mx+b)
S Table (multi-point) supported from MX840B, MX440B,
MX1609/KB/TB, MX809B
S Polynomial, supported from MX840B, MX440B,
MX440B, MX430B, MX238B
The 16-channel modules (MX1601B and MX1615B) as
well as modules MX410B and MX460B only support twopoint scaling.
4.5 Synchronization
If measurement signals need to be referenced over time
with each other for processing and analysis, they must
be recorded synchronously.
All QuantumX modules can be synchronized among
themselves. This ensures simultaneous measurement on
all channels. All the analog-digital converter rates, meas
uring rates and bridge excitation voltages are therefore
also synchronized.
Synchronization methods:
Synchronisation via Ethernet IEEE1588:2008 (PTPv2)
When modules, for example, MX840B are set to this syn
chronization mode and z.B. untereinander mit einem
PTP-fähigen Switch connected using a switch with PTP
capability, they automatically synchronize with each other
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Introduction
or a Grandmaster Clock. Transparent Clock (TC) mode
is supported here.
The following setup parameters are available:
S Time delay: End2End (E2E) or Peer2Peer (P2P)
S Transport protocol: IPv4 or IPv6
Modules that do not support this mode, such as MX840A
can be connected via FireWire to the adjacent module
with PTPv2, and included in the synchronization (auto
matic clock distribution).
The converted modules must be restarted. The system
as a whole therefore supports the classic HBM sample
rates only.
Converted modules need to be restarted. After restart,
check the system LEDs at the module front green
means synchronous.
Synchronization via IEEE1394b FireWire
All the modules are synchronized automatically when
they are connected via the IEEE1394b FireWire cable.
This is the recommended method.
Quantum
No CX27/B module present in the system and no exter
nal synchronization source available:
The module with the highest serial number (UUID) takes
over the master function.
CX27/B module present in the system and no external
synchronization source available:
If a CX27/B module is connected, it automatically
becomes the synchronization master. When starting the
system, the system time is set once to the actual time.
If QuantumX modules alone are being used, internal syn
chronization is sufficient. However, if synchronous mea
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I3031-14.0 HBM: public 27
Introduction
surements are to be performed by different measurement
systems, an external master must be used for synchro
nization.
This is also a requirement if the QuantumX modules are
a long distance away from one another and an
IEEE1394b FireWire connection would be too complex.
Synchronization with external sources
In an external synchronization source is set, the module
with the best synchronization quality automatically
becomes the master and synchronizes all modules con
nected via IEEE1394b FireWire.
If several external sources are selected, the system
decides according to the following priorities:
1. EtherCAT®
2. IRIG-B
3. NTP
Synchronization via EtherCAT®
The CX27 gateway supports the “Distributed Clocks”
expansion of EtherCAT®. The time is distributed to all
EtherCAT® nodes in an EtherCAT® group.
The CX27 module can be synchronized to the Ether
CAT® time. This will mean that all the QuantumX module
clocks are synchronized to this time.
Synchronization via an NTP server
Each QuantumX module can synchronize its internal
clock with an NTP server. The NTP time is distributed to
the other modules via IEEE1394b FireWire.
28 I3031-14.0 HBM: public Quantum
X
Introduction
It is possible to achieve accuracies of 1 ms or higher,
depending on the utilization of the network and on
whether or not a dedicated NTP master is being used.
Modules located close together should be synchronized
via IEEE1394b FireWire.
If the synchronization source for a module is changed to
NTP, the system must be restarted once. The HBM cat
man®EASY software includes an NTP software pack
age.
Parameter:
S IP address of the NTP server
S Threshold in s below which the time deviation to
NTP time is tolerated
Further information about NTP can be found at
http://www.ntp.org
Synchronization via IRIG-B
IRIG-B is a standardized time coding.
Quantum
To time-synchronize the QuantumX system, the digital or
analog modulated time signal is sent externally to any
analog voltage input of the amplifier type MX840B or
MX440B (see Assignment, section 8.2.1).
The B127 format uses analog modulation. Connection is
identical to that of a 10-V voltage sensor.
The other formats are BCD‐coded and must be con
nected analog to the sensor "Frequencies single-pole,
without directional signal", see section 9.29.
The amplifiers can record IRIG‐B signals of type B000 to
B007 and B120 to B127. All modules connected via
IEEE1394b FireWire are also automatically synchro
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I3031-14.0 HBM: public 29
Introduction
nized. The coding includes the time, year and optionally
the seconds of the day.
Comparison of synchronization mechanisms
Feature IEEE1394b
FireWire
Synchroniza
tion with
other device
types
Max. dis
tance
between
QuantumX
modules
Number of
modules to
be synchron
ized
Synchroniza
tion accuracy
Synchroniza
tion settling
time
QuantumX
only
5 m (40 m
with
IEEE1394b
FireWire ex
tender,
500 m via
optical fiber)
< 1 s < 1 s
Immediate Up to 20 s
Ethernet
(PTPv2)
QuantumX
B module
GENESIS
Cameras
100 m elec
trical and up
to a few
100 m opti
cal
24 Unlimited Unlimited CX27 re
(with recom
mended
PTPv2
switches up
to 100 ns)
(on initial
startup)
Ethernet
(NTP)
QuantumX,
MGCplus
other
interrogators
100 m elec
trical, several
km optical,
variable with
WLAN
100 s to 10
ms
Up to 30 min
during first
start, up to
2 min during
restart
EtherCAT® IRIG-B
All
EtherCAT®
nodes
100 m -
quired, un
limited
< 1 s < 1 s
Immediate Immediate
All IRIG-B
nodes
Unlimited
MX440B,
MX840B
required,
30 I3031-14.0 HBM: public Quantum
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