Hayes Microcomputer Products RCV56HCF User Manual

RCV56HCF
PCI/CardBus Modem Designer's Guide

(Preliminary)

ROCKWELL PROPRIETARY INFORMATION.

DISSEMINATION OR USE OF THIS INFORMATION IS NOT PERMITTED WITHOUT THE

WRITTEN PERMISSION OF ROCKWELL INTERNATIONAL.

Order No. 1129

Rev. 1, August 19, 1997

RCV56HCF PCI/CardBus Modem Designer’s Guide

NOTICE

Information furnished by Rockwell International Corporation is believed to be accurate and reliable. However, no
responsibility is assumed by Rockwell International for its use, nor any infringement of patents or other rights of third parties
which may result from its use. No license is granted by implication or otherwise under any patent rights of Rockwell
International other than for circuitry embodied in Rockwell products. Rockwell International reserves the right to change
circuitry at any time without notice. This document is subject to change without notice.

K56flex is a trademark of Lucent Technologies and Rockwell International.
MNP 10EC and DigiTalk are trademarks of Rockwell International.
MNP is a trademark of Microcom Systems, Inc.
VoiceView is a registered trademark of Radish Communications, Inc.
Hayes is a trademark of Hayes Microcomputer Products, Inc.

ii

ROCKWELL PROPRIETARY INFORMATION

1129

RCV56HCF PCI/CardBus Modem Designer’s Guide

Table of Contents

1. INTRODUCTION .............................................................................................................................................1-1

1.1 SUMMARY................................................................................................................................................. 1-1

1.2 FEATURES................................................................................................................................................1-1

1.3 TECHNICAL OVERVIEW ...........................................................................................................................1-7

1.3.1 General Description..........................................................................................................................1-7

1.3.2 Operating Modes..............................................................................................................................1-7

Data/Fax Modes..............................................................................................................................1-7

AudioSpan Modes...........................................................................................................................1-7

Host-Controlled DSVD Mode (ISDN and SP Models) .......................................................................1-7

Voice/Audio Mode (V Models)..........................................................................................................1-7

Speakerphone Mode (ISDN and SP Models)...................................................................................1-8

Synchronous Access Mode (SAM)...................................................................................................1-8

1.3.3 Host-Controlled Modem Software......................................................................................................1-8

1.3.4 Downloadable Modem Data Pump Firmware.....................................................................................1-8

1.3.5 Hardware Interfaces .........................................................................................................................1-8

2. TECHNICAL SPECIFICATIONS......................................................................................................................2-1

2.1 ESTABLISHING DATA MODEM CONNECTIONS.......................................................................................2-1

Dialing............................................................................................................................................. 2-1

Modem Handshaking Protocol.........................................................................................................2-1

Call Progress Tone Detection..........................................................................................................2-1

Answer Tone Detection ...................................................................................................................2-1

Ring Detection............................................................................................................................... ..2-1

Billing Protection.............................................................................................................................. 2-1

Connection Speeds.........................................................................................................................2-1

Automode .......................................................................................................................................2-1

2.2 DATA MODE..............................................................................................................................................2-1

Speed Buffering (Normal Mode) ...................................................................................................... 2-1

DTE-to-Modem Flow Control ...........................................................................................................2-1

Escape Sequence Detection............................................................................................................2-1

GSTN Cleardown (K56flex, V.34, V.32 bis, V.32).............................................................................2-1

Fall Forward/Fallback (K56flex, V.34/V.32 bis/V.32).........................................................................2-2

Retrain............................................................................................................................................2-2

2.3 ERROR CORRECTION AND DATA COMPRESSION.................................................................................2-2

V.42 Error Correction ......................................................................................................................2-2

MNP 2-4 Error Correction................................................................................................................2-2

V.42 bis Data Compression.............................................................................................................2-2

MNP 5 Data Compression...............................................................................................................2-2

2.4 MNP 10EC™ ENHANCED CELLULAR CONNECTION...............................................................................2-2

2.5 FAX CLASS 1 OPERATION .......................................................................................................................2-2

2.6 VOICE/AUDIO MODE ................................................................................................................................2-2

2.6.1 Online Voice Command Mode........................................................................................................... 2-3

2.6.2 Voice Receive Mode.........................................................................................................................2-3

2.6.3 Voice Transmit Mode........................................................................................................................2-3

2.6.4 Tone Detectors................................................................................................................................. 2-3

2.6.5 Speakerphone Modes.......................................................................................................................2-3

SIMULTANEOUS AUDIO/VOICE AND DATA (A

2.7

2.8 HOST-BASED DSVD MODE......................................................................................................................2-3

2.9 FULL-DUPLEX SPEAKERPHONE (FDSP) MODE......................................................................................2-3

2.10 VOICEVIEW.............................................................................................................................................2-3

2.11 CALLER ID...............................................................................................................................................2-4

2.12 WORLD CLASS COUNTRY SUPPORT....................................................................................................2-4

2.12.1 Programmable Parameters.............................................................................................................2-4

2.12.2 Blacklist Parameters.......................................................................................................................2-4

2.13 DIAGNOSTICS.........................................................................................................................................2-4

UDIOSPAN

)..........................................................................2-3

1129

ROCKWELL PROPRIETARY INFORMATION

iii

RCV56HCF PCI/CardBus Modem Designer’s Guide

2.13.1 Commanded Tests..........................................................................................................................2-4

2.13.2 Power On Reset Tests....................................................................................................................2-4

2.14 LOW POWER SLEEP MODE...................................................................................................................2-4

3. HARDWARE INTERFACE...............................................................................................................................3-1

3.1 HARDWARE SIGNAL PINS AND DEFINITIONS.........................................................................................3-1

3.2 ELECTRICAL,SWITCHING,AND ENVIRONMENTAL CHARACTERISTICS...............................................3-18

3.2.1 Power and Maximum Ratings..........................................................................................................3-18

3.2.2 PCI Bus..........................................................................................................................................3-19

3.2.3 MDP...............................................................................................................................................3-20

3.3 INTERFACE TIMING AND WAVEFORMS................................................................................................3-22

3.3.1 PCI Bus Timing...............................................................................................................................3-22

3.3.2 Serial EEPROM Timing...................................................................................................................3-22

3.3.3 External Device Bus Timing ............................................................................................................3-23

3.3.4 IOM-2 Interface ..............................................................................................................................3-25

4. DESIGN CONSIDERATIONS .......................................................................................................................... 4-1

4.1 PC BOARD LAYOUT GUIDELINES............................................................................................................4-1

4.1.1 General Principles.............................................................................................................................4-1

4.1.2 Component Placement......................................................................................................................4-1

4.1.3 Signal Routing ..................................................................................................................................4-2

4.1.4 Power...............................................................................................................................................4-3

4.1.5 Ground Planes..................................................................................................................................4-4

4.1.6 Crystal Circuit...................................................................................................................................4-4

4.1.7 VC_L1 and VREF Circuit...................................................................................................................4-4

4.1.8 Telephone and Local Handset Interface............................................................................................4-5

4.1.9 Optional Configurations..................................................................................................................... 4-5

4.1.10 MDP Specific..................................................................................................................................4-5

4.2 CRYSTAL/OSCILLATOR SPECIFICATIONS..............................................................................................4-5

4.3 OTHER CONSIDERATIONS ...................................................................................................................... 4-5

4.4 PACKAGE DIMENSIONS........................................................................................................................... 4-8

5. SOFTWARE INTERFACE................................................................................................................................5-1

5.1 PCI C

5.2 BASE ADDRESS REGISTER.....................................................................................................................5-3

5.3 SERIAL EEPROM INTERFACE..................................................................................................................5-4

6. COMMAND SET..............................................................................................................................................6-1

ONFIGURATION REGISTERS

5.1.1 Vendor ID Field.................................................................................................................................5-1

5.1.2 Device ID Field ................................................................................................................................ .5-1

5.1.3 Command Register...........................................................................................................................5-2

5.1.4 Status Register................................................................................................................................. 5-2

5.1.5 Revision ID Field...............................................................................................................................5-3

5.1.6 Class Code Field...............................................................................................................................5-3

5.1.7 Latency Timer Register.....................................................................................................................5-3

5.1.8 Header Type Field ............................................................................................................................5-3

5.1.9 CIS Pointer Register.........................................................................................................................5-3

5.1.10 Subsystem Vendor ID and Subsystem ID Registers........................................................................5-3

5.1.11 Interrupt Line Register ....................................................................................................................5-3

5.1.12 Interrupt Pin Register......................................................................................................................5-3

5.1.13 Min Grant and Max Latency Registers..................................................................................... ........5-3

....................................................................................................................5-1

iv

ROCKWELL PROPRIETARY INFORMATION

1129

RCV56HCF PCI/CardBus Modem Designer’s Guide

List of Figures

Figure 1-1. RCV56HCF System Overview..........................................................................................................................1-4

Figure 1-2. RCV56HCF Hardware Configuration Block Diagram.........................................................................................1-5

Figure 1-3. Typical Audio Signal Interface (U.S.)..............................................................................................................1-10

Figure 3-1. RCV56HCF Interface Signals...........................................................................................................................3-2

Figure 3-2. Bus Interface 176-Pin TQFP Hardware Interface Signals .................................................................................3-3

Figure 3-3. Bus Interface 176-Pin TQFP Pin Signals..........................................................................................................3-4

Figure 3-4. MDP 144-Pin TQFP Hardware Interface Signals............................................................................................3-11

Figure 3-5. MDP 144-Pin TQFP Pin Signals.....................................................................................................................3-12

Figure 3-6. Waveforms - Serial EEPROM Interface..........................................................................................................3-22

Figure 3-7. Waveforms - External Device Bus Interface...................................................................................................3-24

Figure 3-8. Waveforms - IOM-2 Interface.........................................................................................................................3-25

Figure 4-1. Package Dimensions - 144-Pin TQFP.............................................................................................................. 4-8

Figure 4-2. Package Dimensions - 176-Pin TQFP.............................................................................................................. 4-9

1129

ROCKWELL PROPRIETARY INFORMATION

v

RCV56HCF PCI/CardBus Modem Designer’s Guide

List of Tables

Table 1-1. Modem Models and Functions ..........................................................................................................................1-3

Table 1-2. Typical Signal Routing - Voice Mode...............................................................................................................1-11

Table 1-3. Relay Positions - VoiceView Mode ..................................................................................................................1-11

Table 3-1. Bus Interface 176-Pin TQFP Pin Signals...........................................................................................................3-5

Table 3-2. Bus Interface Pin Signal Definitions...................................................................................................................3-7

Table 3-3. MDP Pin Signals - 144-Pin TQFP....................................................................................................................3-13

Table 3-4. MDP Pin Signal Definitions..............................................................................................................................3-15

Table 3-5. Current and Power Requirements ...................................................................................................................3-18

Table 3-6. Maximum Ratings........................................................................................................................................... 3-18

Table 3-7. PCI Bus DC Specifications for 3.3V Signaling..................................................................................................3-19

Table 3-8. PCI Bus AC Specifications for 3.3V Signaling..................................................................................................3-19

Table 3-9. MDP Digital Electrical Characteristics..............................................................................................................3-20

Table 3-10. Analog Electrical Characteristics ...................................................................................................................3-21

Table 3-11. Timing - Serial EEPROM Interface................................................................................................................3-22

Table 3-12. Timing - External Device Bus Interface............................................................................. .............................3-23

Table 3-13. Timing - IOM-2 Interface...............................................................................................................................3-25

Table 4-1. Modem Pin Noise Characteristics......................................................................................................................4-3

Table 4-2. Crystal Specifications - Surface Mount..............................................................................................................4-6

Table 4-3. Crystal Specifications - Through Hole................................................................................................................4-7

Table 5-1. PCI Configuration Registers..............................................................................................................................5-1

Table 5-2. Command Register............................................................................................................................... ............5-2

Table 5-3. Status Register.................................................................................................................................................5-2

Table 5-4. BIF Address Map..............................................................................................................................................5-3

Table 5-5. EEPROM Configuration Data............................................................................................................................ 5-4

Table 6-1. Command Set Summary - Functional Use Sort .................................................................................................6-1

Table 6-2. Command Set Summary - Alphanumeric Sort...................................................................................................6-4

vi

ROCKWELL PROPRIETARY INFORMATION

1129

RCV56HCF PCI/CardBus Modem Designer’s Guide

1. INTRODUCTION

1.1 SUMMARY

The Rockwell RCV56HCF-PCI Host-Controlled Modem Device Family supports high speed analog data, high speed fax,
ISDN, DSVD, AudioSpan, speakerphone, audio/voice, and VoiceView operation. It operates with PSTN or ISDN telephone
lines in the U.S. and world-wide and is offered in several device models (see Table 1-1).

The modem device set consists of PC PCI bus interface (BIF) and modem data pump (MDP) hardware available in two thin
quad flat packs (TQFPs). Host-controlled modem software is also provided.

Operating with +3.3V power, this device set supports 32-bit host applications in such designs as embedded motherboards,
PCI half cards, and CardBus cards.

Figure 1-1 illustrates the general structure of the RCV56HCF software and the interface to the RCV56HCF hardware. Figure
1-2 illustrates the major hardware interfaces supported by each model.

The RCV56HCF employs a downloadable architecture so that the user can update MDP executable code.
Using K56flex technology, the RCV56HCF can receive data at speeds up to 56 kbps from a digitally connected K56flex-

compatible central site modem, such as a Rockwell RC56CSM modem. K56flex modems take advantage of the PSTN which
is primarily digital except for the client modem to central office local loop and are ideal for applications such as remote
access to an Internet service provider (ISP), on-line service, or corporate site. The RCV56HCF can send data at speeds up
to V.34 rates.

In V.34 data mode, the modem operates at line speeds up to 33600 bps. Error correction (V.42/MNP 2-4) and data
compression (V.42 bis/MNP 5) maximize data transfer integrity and boost average data throughput. Non-error-correcting
mode is also supported.

AudioSpan (analog simultaneous audio/voice and data) operation supports a data rate with audio of 4.8 kbps.
SP models support position independent, full-duplex speakerphone (FDSP), as well as digital simultaneous voice and data

(DSVD) with speech coding per ITU-T G.729 Annex A with interoperable G.729 Annex B, and SIG DigiTalk DSVD.
The modem supports fax Group 3 send and receive rates up to 28800 bps and T.30 protocol.
V.80 and Rockwell Video Ready compatible synchronous access modes support host-controlled communication protocols, e.

g., H.324 video conferencing.
In voice/audio mode, PCM coding and decoding at 8000 Hz sample rate allows efficient digital storage of voice/audio. This

mode supports digital telephone answering machine, voice annotation, and audio recording/playback applications.
AccelerATor kits and reference designs are available to minimize application design time and costs.
This designer's guide describes the modem hardware capabilities and identifies the supporting commands. Commands and

parameters are defined in the RCVHCF Command Reference Manual (Order No. 1118).

1.2 FEATURES

•

Data modem

−

K56flex, 33.6 kbps, 31.2 kbps, V.34, V.32 bis, V.32, V.22 bis, V.22A/B, V.23, and V.21; Bell 212A and 103

−

V.42 LAPM and MNP 2-4 error correction

−

V.42 bis and MNP 5 data compression

−

V.25 ter (Annex A) and EIA 602 command set

•

Fax modem send and receive rates up to 28800 bps

−

ITU-T V.34 fax*, V.17, V.29, V.27 ter, and V.21 ch 2

−

EIA/TIA 578 Class 1, Class 1.0 (T.31) fax

•

ISDN BRI support (option)*

−

PC Bus support 2B+D channels

−

IOM-2 interface to external U or S/T transceiver

−

Simultaneous transfer of B1, B2, D channels (144 kbps; 64 kbps x 2, 16 kbps)

−

V.34, DSVD, FDSP, audio functions over B channel

1129

ROCKWELL PROPRIETARY INFORMATION

1-1

RCV56HCF PCI/CardBus Modem Designer’s Guide

•

AudioSpan (simultaneous audio/voice and data)*

−

ITU-T V.61 modulation (4.8 kbps data plus audio)

−

Handset, headset, or half-duplex speakerphone

•

ITU-T V.70 DSVD (option)

−

ITU-T G.729 Annex A with interoperable G.729 Annex B

−

SIG (special interest group) DigiTalk DSVD

−

Voice/silence detection and handset echo cancellation

−

Handset, headset, or half-duplex speakerphone

•

Full-duplex speakerphone (FDSP) mode

−

Over PSTN or ISDN B channel (option)

−

Switching to/from data, fax, DSVD and VoiceView

−

Microphone gain and muting

−

Speaker volume control and muting

−

Adaptive line and acoustic echo cancellation

−

Loop gain control, transmit and receive path AGC

−

Acoustic echo cancellation concurrent with DSVD

−

Noise suppression

−

Room monitor

•

V.80 and Rockwell Video Ready synchronous access modes support host-controlled communication protocols

−

H.324 interface support

•

V.8/V.8bis and supporting AT commands (V.25 ter with Annex A)

•

Data/Fax/VoiceView/Voice call discrimination

•

Voice, telephony, audio, VoiceView

−

Voice (8-bit µ-Law compression/decompression)

−

TIA-695 command set

−

VoiceView alternating voice and data (option)

−

8-bit linear and 8-bit µ-Law record/playback

−

8.0 kHz, 11.025 kHz, 22.050 kHz and 44.1 kHz (down sampled to 11.025)

−

Handset, acoustic, line echo cancellation

−

Music on hold from host or analog hardware input

−

TAM support with concurrent DTMF detect, ring detect and caller ID

•

World-class operation (option)

−

Call progress, blacklisting, multiple country support

•

Integrated internal hybrid

•

Caller ID and distinctive ring detect

•

Modem and audio paths concurrent across PCI bus

•

Single profile stored in host

•

System compatibilities

−

Windows 95 and Windows NT operating systems

−

Microsoft's PC 97 Design Initiative compliant

−

Unimodem/V compliant

•

32-bit PCI Local Bus interface

−

Conforms to the PCI Local Bus Specification, Production Version, Revision 2.1

−

PCI Bus Mastering interface to the MDP

−

CardBus support with 512-byte RAM for CIS

−

33 MHz PCI clock support

•

Device packages:

−

Bus Interface in 176-pin TQFP

−

MDP in 144-pin TQFP

•

+3.3V operation

* See Note 6 in Table 1-1.

1-2

ROCKWELL PROPRIETARY INFORMATION

1129

RCV56HCF PCI/CardBus Modem Designer’s Guide

Table 1-1. Modem Models and Functions

Supported Functions

Marketing

Model Number

RCV56HCF/ISDN Y Y Y Y –
RCV56HCFW/ISDN Y Y Y Y Y
RCV56HCF/SP Y Y – Y –
RCV56HCFW/SP Y Y – Y Y
RC56HCF Y – – – –
RC56HCFW Y – – – Y

Notes:

1. The two-device set manufacturing part numbers are:

2

. Lege

3. Model options:

4. Supported functions (Y = Supported; – = Not supported):

5. Provides ISDN functionality with the addition of a U or S/T transceiver device.

6. Initial production does not include support for ISDN, V.34 fax, and AudioSpan.

1

PCI Bus Interface in 176-pin TQFP: 11229-XX.
MDP in 144-pin TQFP: R6776-XX.

nd:

Y = Function supported.
– = Function not supported.

SP Speakerphone and DSVD.
V Voice, audio, and VoiceView.
W World-class (W-class).

FDSP Full-duplex speakerphone.
DSVD Digital simultaneous voice and data.
Voice/Audio Voice and audio functions.
VoiceView VoiceView alternating voice and data.
W-Class World-class functions supporting multiple country requirements.

K56flex,

V.34 Fax

6

Voice/Audio/

VoiceView/

AudioSpan

6

5,6 Full-duplex

ISDN

Speakerphone

(FDSP)

and DSVD

W-Class

1129

ROCKWELL PROPRIETARY INFORMATION

1-3

RCV56HCF PCI/CardBus Modem Designer’s Guide

PC Software

Win32-based

communications

application

Modem Hardware

on Motherboard

or Plug-in Module

Win16-based

communications

application

Communications Stack

RC56HCF

Serial Port Driver*

MS-DOS

application

(MS-DOS Box)

Win95

RCV56HCF

Modem Device Set Hardware

Bus

Interface

(BIF)*

Modem

Data Pump

(MDP)*

Win32
NDIS

application

RC56HCF

WAN Miniport Driver*

* Rockwell supplied

1123F1 SO

Figure 1-1. RCV56HCF System Overview

1-4

ROCKWELL PROPRIETARY INFORMATION

1129

RCV56HCF PCI/CardBus Modem Designer’s Guide

RC56HCF MODEM DEVICE SET

BUS

INTERFACE

(BIF)

MODEM

DATA PUMP

(MDP)

DAA AND TELEPHONE
HANDSET INTERFACE

TELEPHONE
HANDSET*

TELEPHONE
LINE

a. Data/Fax - PSTN Configuration (RC56HCF and RC56HCFW)

VOICE*

TXA
RXA
CID*

OH

RING

RCV56HCF MODEM DEVICE SET

BUS

INTERFACE

(BIF)

MODEM

DATA PUMP

(MDP)

b. Data/Fax/Voice/Speakerphone, SVD - PSTN Configuration (RCV56HCF/SP and RCV56HCFW/SP)

HOST

INTERFACE

HOST

INTERFACE

* OPTIONAL USE (SUPPORTED BY MODEL HARDWARE AND SOFTWARE).

* OPTIONAL USE (SUPPORTED BY MODEL HARDWARE AND SOFTWARE).

MICROPHONE

SPEAKER

AUDIO

INTERFACE

SPKR

MIC

TXA
RXA
CID*

OH
RING
LCS*

VOICE*

DAA AND TELEPHONE
HANDSET INTERFACE

TELEPHONE
HANDSET
(OPTIONAL)

TELEPHONE
LINE

DC

FEED

Figure 1-2. RCV56HCF Hardware Configuration Block Diagram

1129

ROCKWELL PROPRIETARY INFORMATION

1-5

RCV56HCF PCI/CardBus Modem Designer’s Guide

ISDN

U OR S/T

INTERFACE

RCV56HCF MODEM DEVICE SET

BUS

INTERFACE

(BIF)

MODEM

DATA PUMP

(MDP)

ISDN LINE

c. Data/Fax/Voice/Speakerphone, SVD/ISDN - PSTN and ISDN Configuration (RCV56HCF/ISDN and RCV56HCFW/ISDN)

MICROPHONE*

SPEAKER*

AUDIO
INTERFACE
(OPTIONAL)

SPKR*

MIC*

ISDN

U OR S/T

INTERFACE

RCV56HCF MODEM DEVICE SET

BUS

INTERFACE

(BIF)

MODEM

DATA PUMP

(MDP)

TELEPHONE

HANDSET INTERFACE

(OPTIONAL)

ISDN LINE

d. Data/Fax/Voice/Speakerphone, SVD/ISDN - ISDN Only Configuration (RCV56HCF/ISDN and RCV56HCFW/ISDN)

TELEPHONE
HANDSET 2

RING*

LCS*

DC

FEED

TELEPHONE
HANDSET 1

RING*

LCS

DC

FEED

* OPTIONAL USE (SUPPORTED BY MODEL HARDWARE AND SOFTWARE).

MD189F1 CONF

HOST

INTERFACE

HOST

INTERFACE

* OPTIONAL USE (SUPPORTED BY MODEL HARDWARE AND SOFTWARE).

TXA

RXA

CID*

OH
RING
LCS*

VOICE*

DAA AND TELEPHONE
HANDSET INTERFACE

TELEPHONE
HANDSET
(OPTIONAL)

TELEPHONE
LINE

DC

FEED

Figure 1-2. RCV56HCF Hardware Configuration Block Diagram (Continued)

1-6

ROCKWELL PROPRIETARY INFORMATION

1129

RCV56HCF PCI/CardBus Modem Designer’s Guide

1.3 TECHNICAL OVERVIEW

1.3.1 General Description

The RCV56HCF Device Set provides the processing core for a complete system design featuring data/fax modem, DSVD,
AudioSpan, speakerphone, voice/audio, and VoiceView depending on specific model (Table 1-1). Note: RCV56HCF Device
Set refers to the family of single device modem models listed in Table 1-1.

The modem is the full-featured, self-contained data modem/fax modem/DSVD/voice/audio/speakerphone solution. Dialing,
call progress, telephone line interface, AudioSpan, DSVD, speakerphone, voice/audio, and VoiceView functions are
supported and controlled through the command set.

The modem hardware connects to the host PC via a PCI bus interface. The OEM adds a crystal circuit, telephone line
interface, telephone interface (optional), audio interface (optional), and ISDN interface (optional) to complete the system.

1.3.2 Operating Modes

Data/Fax Modes
In K56flex mode, the modem can receive data from a digital source using a K56flex -compatible central site modem (e.

g., Rockwell RC56CSM) over the digital telephone network portion of the PSTN at line speeds up to 56 kbps. Asymmetrical
data transmission supports sending data at V.34 rates. This mode can fall back to full-duplex V.34 mode, and to slower rates
as supported by line conditions.

In V.34 data modem mode, the modem can also operate in 2-wire, full-duplex, asynchronous modes at line rates up to
33600 bps. Data modem modes perform complete handshake and data rate negotiations. Using V.34 modulation to optimize
modem configuration for line conditions, the modem can connect at the highest data rate that the channel can support from
33600 bps to 2400 bps with automatic fallback. Automode operation in V.34 is provided in accordance with PN3320 and in
V.32 bis in accordance with PN2330. All tone and pattern detection functions required by the applicable ITU or Bell standard
are supported.

In fax modem modes, the modem fully supports Group 3 facsimile send and receive speeds of 28800, 14400, 12000, 9600,
7200, 4800, or 2400 bps. Fax modes support Group 3 fax requirements. Fax data transmission and reception performed by
the modem are controlled and monitored through the fax EIA-578 Class 1 command interface. Full HDLC formatting, zero
insertion/deletion, and CRC generation/checking are provided.

Both transmit and receive fax data are buffered within the modem. Data transfer to and from the DTE is flow controlled by
XON/XOFF and RTS/CTS.

AudioSpan Modes
AudioSpan provides full-duplex analog simultaneous audio/voice and data over a single telephone line at a data rate with

audio of 4800 bps using V.61 modulation. AudioSpan can send any type of audio waveform, including music. Data can be
sent with or without error correction. The audio/voice interface can be in the form of a headset, handset, or microphone and
speaker (half-duplex speakerphone). Handset echo cancellation is provided.

Host-Controlled DSVD Mode (ISDN and SP Models)
ISDN and SP models support host-controlled DSVD. A microphone and a speaker are required.

ITU-T interoperable G.729 and G.729 Annex A with interoperable G.729 Annex B Operation.

supports speech coding at an average bit rate significantly lower than 8.0 kbps.

SIG DigiTalk.

Voice/Audio Mode (V Models)
Voice/Audio Mode features include 8-bit linear and 8-bit µ-Law coding/decoding, tone detection/generation and call

discrimination, concurrent DTMF detection, and 8-bit monophonic audio data encoding at 11.025 kHz or 8000 Hz.
Voice/Audio Mode is supported by three submodes:

1. Online Voice Command Mode supports connection to the telephone line or a voice/audio I/O device (e.g., microphone,
speaker, or handset).

2. Voice Receive Mode supports recording voice or audio data input at the MIC_M pin, typically from a
microphone/handset or the telephone line.

3. Voice Transmit Mode supports playback of voice or audio data to the TXA1_L1/TXA2_L1 output, typically to a
speaker/handset or to the telephone line.

Speech coding is performed at 8.5 kbps.

Voice activity detection

1129

ROCKWELL PROPRIETARY INFORMATION

1-7

RCV56HCF PCI/CardBus Modem Designer’s Guide

Speakerphone Mode (ISDN and SP Models)
The speakerphone mode features an advanced proprietary speakerphone algorithm which supports full-duplex voice

conversation with both acoustic and line echo cancellation. Parameters are constantly adjusted to maintain stability with
automatic fallback from full-duplex to pseudo-duplex operation. The speakerphone algorithm allows position independent
placement of microphone and speaker.

The speakerphone mode provides hands-free full-duplex telephone operation under host control. The host can separately
control volume, muting, and AGC in microphone and speaker channels.

Synchronous Access Mode (SAM)
V.80 and Rockwell Video Ready synchronous access modes between the modem and the host/DTE are provided for host-

controlled communication protocols, e.g., H.324 video conferencing applications.
Voice-call-first (VCF) before switching to a videophone call is also supported.

1.3.3 Host-Controlled Modem Software

Host-controlled modem software performs processing of general modem control, command sets, fax Class 1, AudioSpan,
DSVD, speakerphone, voice/audio/TAM, error correction, data compression, and operating system interface functions.
Configurations of the modem software are provided to support modem models listed in Table 1-1.

Binary executable modem software is provided for the OEM.

1.3.4 Downloadable Modem Data Pump Firmware

Binary executable code controlling MDP operation is downloaded as required during operation.

1.3.5 Hardware Interfaces

1.3.5.1 PCI Bus Host Interface

The Bus Interface conforms to the PCI Local Bus Specification, Production Version, Revision 2.1, June 1, 1995. It is a
memory slave (burst transactions) and a bus master for PC host memory accesses (burst transactions). Configuration is by
PCI configuration protocol.

The following interface signals are supported:

•

Address and data

−

32 bidirectional Address/Data (AD[31-0]; bidirectional

−

Four Bus Command and Byte Enable (CBE [3:0]), bidirectional

−

Bidirectional Parity (PAR); bidirectional

•

Interface control

−

Cycle Frame (FRAME#); bidirectional

−

Initiator Ready (IRDY#); bidirectional

−

Target Ready (TRDY#); bidirectional

−

Stop (STOP#); bidirectional

−

Initialization Device Select (IDSEL); input

−

Device Select (DEVSEL#); bidirectional

•

Arbitration

−

Request (REQ#); output

−

Grant (GRANT#); input

•

Error reporting

−

Parity Error ((PERR#); bidirectional

−

System Error ; bidirectional

•

Interrupt

−

Interrupt A (INTA#); output

•

System

−

Clock (PCICLK); input

−

Reset (PCIRST#); input

−

Clock Running (CLKRUN#); input

1-8

ROCKWELL PROPRIETARY INFORMATION

1129

RCV56HCF PCI/CardBus Modem Designer’s Guide

1.3.5.2 Serial EEPROM Interface

A serial EEPROM is required to store the Maximum Latency, Minimum Grant, Device ID, Vendor ID, Subsystem ID, and
Subsystem Vendor ID parameters for the PCI Configuration Space Header.
Microchip 93LC66B, Atmel AT93C66,
line from the EEPROM (SROMIN), a serial data output line to the EEPROM (SROMOUT), Clock to the EEPROM
(SROMCLK), and chip select to the EEPROM (SROMCS).

1.3.5.3 Audio Interface

One Speaker output (SPKROUT_M) is provided for an optional OEM-supplied speaker circuit. Two microphone inputs are
supported: one for Voice Microphone input (MIC_V) and one for Music Microphone input (MIC_M), e.g., music-on-hold.

The MIC_V and SPKROUT_M lines connect to the handset and speaker to support functions such as AudioSpan headset
and speakerphone modes, FDSP, telephone emulation, microphone voice record, speaker voice playback, and call progress
monitor.

The MIC_M input can accept an external audio signal to support the music-on-hold function and routes it to the telephone
line. If music-on-hold function is not required, the microphone signal can be connected to the MIC_M input to support
telephone emulation mode.

The Speaker output (SPKROUT_M) carries the normal speakerphone audio or reflects the received analog signals in the
modem.

1.3.5.4 Telephone Line/Telephone/Audio Interface

The Telephone Line/Telephone/Audio Signal Interface can support a 3-relay telephone line interface (Figure 1-3). Signal
routing for Voice mode is shown in Table 1-2. Relay positions for VoiceView are shown in Table 1-3.

The following signals are supported:

•

A single-ended Receive Analog input (RXA_L1) and a differential Transmit Analog output (TXA1_L1 and TXA2_L1) to the
telephone line.

•

Off-hook (OH_L1#), Caller ID (CID_L1#), and Voice (VOICE_L1#) relay control outputs.

•

A Ring Indicate (IRING_L1) input.

•

A Loop Current Sense (LCS) input.

•

An input from the telephone microphone (TELIN_L1) and an output to the telephone speaker (TELOUT_L1 ) are supported
in AudioSpan modes. These lines connect voice record/playback and AudioSpan audio to the local handset.

or equivalent 256 x 16 serial EEPROM. The interface signals are: a serial data input

The EEPROM is programmable by the PC via the BIF.

The serial EEPROM interface connects to an

1129

ROCKWELL PROPRIETARY INFORMATION

1-9

RCV56HCF PCI/CardBus Modem Designer’s Guide

LCS_L1#

IRING_L1#

VOICE#

OH_L1#

CID_L1#

VC_L1

RCV56HCF

MODEM
DEVICE

TXA1_L1
TXA2_L1

RXA_L1

TELOUT_L1

TELIN_L1

MIC_M

MIC_V

SPKROUT_M

HYBRD

&

XFRMR

CALLID
RELAY

TELEPHONE LINE/TELEPHONE HANDSET

SSI

&

BRDGE

OH

RELAY

HANDSET

HYBRID

VOICE
RELAY

CUR
SRC

INTERFACE CIRCUIT

BIAS

SOUNDUCER

(OPTIONAL)

AUDIO/HEADPHONE

INTERFACE CIRCUIT

Figure 1-3. Typical Audio Signal Interface (U.S.)

AMP/

SURG
PROT

RNG
DET

TEL LINE

TEL HANDSET

LCS

MICROPHONE

HEADPHONE

1123F1-3 AIF 3R-US

1-10

ROCKWELL PROPRIETARY INFORMATION

1129

RCV56HCF PCI/CardBus Modem Designer’s Guide

Table 1-2. Typical Signal Routing - Voice Mode

+VLS=

Command

0 Modem on hook. Phone connected to Line . . No No Yes
1 Modem connected to Line. RXA_L1 TXA1/2_L1 Yes Yes No
2 Modem connected to Handset TELIN_L1 TELOUT_L1 No Yes Yes
3 Modem connected to Line and Handset RXA_L1 TXA Yes No No
4 Modem connected to Speaker SPKROUT_M No No Yes
5 Modem connected to Line and Speaker RXA_L1 TXA1/2_L1, SPKROUT_M Yes Yes No
6 Modem connected to Microphone MIC_V . No No Yes
7 Speaker and Mic. routed to Line via Modem RXA_L1, MIC_M TXA1/2_L1, SPKROUT_M Yes Yes No
8 Modem connected to Speaker . SPKROUT_M No No Yes
9 Modem connected to Line and Speaker RXA_L1 TXA1/2_L1, SPKROUT_M Yes Yes No
10 Speaker and Mic. routed to Line via Modem RXA_L1, MIC_M TXA1/2_L1, SPKROUT_M Yes Yes No
11 Modem connected to Microphone MIC_V . No No Yes
12 Speaker and Mic. routed to Line via Modem RXA_L1, MIC_M TXA1/2_L1, SPKROUT_M Yes Yes No
13 Speaker and Mic. routed to Line via Modem RXA_L1, MIC_M TXA1/2_L1, SPKROUT_M Yes Yes No
14 Modem connected to Headset MIC_V SPKROUT_M No No Yes
15 Speaker and Mic. routed to Line via Modem

Description Input Selected Output Selected OH_L1#

RXA_L1, MIC_M TXA1/2_L1, SPKROUT_M

Output

Activated

Yes Yes No

VOICE#

Output

Activated

CID_L1#

Output

Activated

Table 1-3. Relay Positions - VoiceView Mode

2-Relay DAA

Off-Hook Relay (OH_L1)

Activated

Stage Function

1 On-hook No No
2a Detected tone - on-hook No No
2b Detected tone - off-hook for handset and speakerphone Yes No

3 Off-hook Yes Yes

Voice Relay (VOICE#)

Activated

1129

ROCKWELL PROPRIETARY INFORMATION

1-11

RCV56HCF PCI/CardBus Modem Designer’s Guide

This page is intentionally blank.

1-12

ROCKWELL PROPRIETARY INFORMATION

1129

RCV56HCF PCI/CardBus Modem Designer’s Guide

2. TECHNICAL SPECIFICATIONS

2.1 ESTABLISHING DATA MODEM CONNECTIONS

Dialing

DTMF Dialing.

complies with Bell Publication 47001.

Pulse Dialing.
Blind Dialing.

Modem Handshaking Protocol
If a tone is not detected within the time specified in the S7 register after the last digit is dialed, the modem aborts the call

attempt.
Call Progress Tone Detection

Ringback, equipment busy, and progress tones can be detected in accordance with the applicable standard.
Answer Tone Detection

Answer tone can be detected over the frequency range of 2100 ± 40 Hz in ITU-T modes and 2225 ± 40 Hz in Bell modes.
Ring Detection

A ring signal can be detected from a TTL-compatible square wave input (frequency is country-dependent).

DTMF dialing using DTMF tone pairs is supported in accordance with ITU-T Q.23. The transmit tone level

Pulse dialing is supported in accordance with EIA/TIA-496-A.

The modem can blind dial in the absence of a dial tone if enabled by the X0, X1, or X3 command.

Billing Protection
When the modem goes off-hook to answer an incoming call, both transmission and reception of data are prevented for a

period of time determined by country requirement to allow transmission of the billing signal.
Connection Speeds

Data modem line connection can be selected using the +MS command in accordance with V.25 ter. The +MS command
selects modulation, enables/disables automode, and selects transmit and receive minimum and maximum line speeds.

Automode
Automode detection can be enabled by the +MS command to allow the modem to connect to a remote modem in

accordance with V.25 ter.

2.2 DATA MODE

Data mode exists when a telephone line connection has been established between modems and all handshaking has been
completed.

Speed Buffering (Normal Mode)
Speed buffering allows a DTE to send data to, and receive data from, a modem at a speed different than the line speed. The

modem supports speed buffering at all line speeds.
DTE-to-Modem Flow Control

If the modem-to-line speed is less than the DTE-to-modem speed, the modem supports XOFF/XON or RTS/CTS flow control
with the DTE to ensure data integrity.

Escape Sequence Detection
The “+++” escape sequence can be used to return control to the command mode from the data mode. Escape sequence

detection is disabled by an S2 Register value greater than 127.
GSTN Cleardown (K56flex, V.34, V.32 bis, V.32)

Upon receiving GSTN Cleardown from the remote modem in a non-error correcting mode, the modem cleanly terminates the
call.

1129

ROCKWELL PROPRIETARY INFORMATION

2-1

RCV56HCF PCI/CardBus Modem Designer’s Guide

Fall Forward/Fallback (K56flex, V.34/V.32 bis/V.32)
During initial handshake, the modem will fallback to the optimal line connection within K56flex/V.34/V.32 bis/V.32 mode

depending upon signal quality if automode is enabled by the +MS command.
When connected in K56flex/V.34/V.32 bis/V.32 mode, the modem will fall forward or fallback to the optimal line speed within

the current modulation depending upon signal quality if fall forward/fallback is enabled by the %E1 command.
Retrain

The modem may lose synchronization with the received line signal under poor line conditions. If this occurs, retraining may
be initiated to attempt recovery depending on the type of connection.

The modem initiates a retrain if line quality becomes unacceptable if enabled by the %E command. The modem continues to
retrain until an acceptable connection is achieved, or until 30 seconds elapse resulting in line disconnect.

2.3 ERROR CORRECTION AND DATA COMPRESSION

V.42 Error Correction
V.42 supports two methods of error correction: LAPM and, as a fallback, MNP 4. The modem provides a detection and

negotiation technique for determining and establishing the best method of error correction between two modems.
MNP 2-4 Error Correction

MNP 2-4 is a data link protocol that uses error correction algorithms to ensure data integrity. Supporting stream mode, the
modem sends data frames in varying lengths depending on the amount of time between characters coming from the DTE.

V.42 bis Data Compression
V.42 bis data compression mode operates when a LAPM or MNP connection is established.
The V.42 bis data compression employs a “string learning” algorithm in which a string of characters from the DTE is encoded

as a fixed length codeword. Two dictionaries, dynamically updated during normal operation, are used to store the strings.
MNP 5 Data Compression

MNP 5 data compression mode operates during an MNP connection.
In MNP 5, the modem increases its throughput by compressing data into tokens before transmitting it to the remote modem,

and by decompressing encoded received data before sending it to the DTE.

2.4 MNP 10EC™ ENHANCED CELLULAR CONNECTION

A traditional landline modem, when used for high-speed cellular data transmission, typically encounters frequent signal
interference and degradation in the connection due to the characteristics of the analog cellular network. In this case, cellular­specific network impairments, such as non-linear distortion, fading, hand-offs, and high signal-to-noise ratio, contribute to an
unreliable connection and lower data transfer performance. Implementations relying solely on protocol layer methods, such
as MNP 10, generally cannot compensate for the landline modem's degraded cellular channel performance.

The modem achieves higher cellular performance by implementing enhanced cellular connection techniques at both the
physical and protocol layers, depending on modem model. The modem enhances the physical layer within the modulation by
optimizing its responses to sudden changes in the cellular connection. The MNP 10EC protocol layer implemented in the
modem software improves data error identification/correction and maximizes data throughput by dynamically adjusting speed
and packet size based on signal quality and data error performance.

2.5 FAX CLASS 1 OPERATION

Facsimile functions operate in response to fax class 1 commands when +FCLASS=1.
In the fax mode, the on-line behavior of the modem is different from the data (non-fax) mode. After dialing, modem operation

is controlled by fax commands. Some AT commands are still valid but may operate differently than in data modem mode.
Calling tone is generated in accordance with T.30.

2.6 VOICE/AUDIO MODE

Voice and audio functions are supported by the Voice Mode. Voice Mode includes three submodes: Online Voice Command
Mode, Voice Receive Mode, and Voice Transmit Mode.

2-2

ROCKWELL PROPRIETARY INFORMATION

1129

RCV56HCF PCI/CardBus Modem Designer’s Guide

2.6.1 Online Voice Command Mode

This mode results from the connection to the telephone line or a voice/audio I/O device (e.g., microphone, speaker, or
handset) through the use of the +FCLASS=8 and +VLS commands. After mode entry, AT commands can be entered without
aborting the connection.

2.6.2 Voice Receive Mode

This mode is entered when the +VRX command is active in order to record voice or audio data input at the RXA_L1 pin,
typically from a microphone/handset or the telephone line.

Received analog voice samples are converted to digital form and compressed for reading by the host. AT commands control
the codec bits-per-sample rate.

Received analog mono audio samples are converted to digital form and formatted into 8-bit unsigned linear or µ-Law PCM
format for reading by the host. AT commands control the bit length and sampling rate. Concurrent DTMF/tone detection is
available.

2.6.3 Voice Transmit Mode

This mode is entered when the +VTX command is active in order to playback voice or audio data to the TXA1_L1 output,
typically to a speaker/handset or to the telephone line. Digitized audio data is converted to analog form then output to the
TXA1_L1 output.

2.6.4 Tone Detectors

The tone detector signal path is separate from the main received signal path thus enabling tone detection to be independent
of the configuration status. In Tone Mode, all three tone detectors are operational.

2.6.5 Speakerphone Modes

Speakerphone modes are selected in voice mode with the following commands:

Speakerphone ON/OFF (+VSP).
Microphone Gain (+VGM)=<gain>.

unsigned octet where values greater than 128 indicate a gain larger than nominal and values smaller than 128 indicate a
gain smaller than nominal.

Speaker Gain (+VGS=<gain>).

octet where values greater than 128 indicate a gain larger than nominal and values smaller than 128 indicate a gain smaller
than normal.

This command turns the Speakerphone function ON (+VSP = 1) or OFF (+VSP = 0).

This command sets the microphone gain of the Speakerphone function. <gain> is an

This command sets the speaker gain of the Speakerphone function. <gain> is an unsigned

2.7 SIMULTANEOUS AUDIO/VOICE AND DATA (AudioSpan)

The modem can operate in AudioSpan Mode if the remote modem is also configured for AudioSpan Mode operation.
AT commands are used to select the AudioSpan Mode, to enable automatic AudioSpan modulation selection or select a

specific AudioSpan modulation, and to enable AudioSpan data burst operation.
V.61 modulation supports 4800 bps data speed with audio, and a data-only speed of 4800 bps.
The AudioSpan audio interface defaults to the local handset connected to the modem and can be configured to interface

through the modem microphone and speaker pins to support use of a headset or a speakerphone.

2.8 HOST-BASED DSVD MODE

Host-based DSVD operation is enabled by the -SSE or -SMS command. In Host-based DSVD Mode, the modem supports
the transfer of data and voice occurs simultaneously during a data connection.

2.9 FULL-DUPLEX SPEAKERPHONE (FDSP) MODE

The modem operates in FDSP mode when +FCLASS=8 and +VSP=1 (see 2.6.5).
In FDSP Mode, speech from a microphone or handset is converted to digital form, shaped, and output to the telephone line

through the line interface circuit. Speech received from the telephone line is shaped, converted to analog form, and output to
the speaker or handset. Shaping includes both acoustic and line echo cancellation.

2.10 VOICEVIEW

Voice and data can be alternately sent and received in a time-multiplexed fashion over the telephone line whenever the
+FCLASS=80 command is active. This command and other VoiceView commands embedded in host communications

1129

ROCKWELL PROPRIETARY INFORMATION

2-3

RCV56HCF PCI/CardBus Modem Designer’s Guide

software control modem operation. Most VoiceView commands use an extended syntax starting with the characters "-S",
which signifies the capability to switch between voice and data.

2.11 CALLER ID

Caller ID can be enabled/disabled using the +VCID command. When enabled, caller ID information (date, time, caller code,
and name) can be passed to the DTE in formatted or unformatted form. Inquiry support allows the current caller ID mode
and mode capabilities of the modem to be retrieved from the modem.

2.12 WORLD CLASS COUNTRY SUPPORT

The W-class models include functions which support modem operation in multiple countries. The following capabilities are
provided in addition to the data modem functions previously described. Country dependent parameters are included in the
.INF file for customization by the OEM.

2.12.1 Programmable Parameters

The following parameters are programmable:

•

Dial tone detection levels and frequency ranges.

•

DTMF dialing transmit output level, DTMF signal duration, and DTMF interdigit interval parameters.

•

Pulse dialing parameters such as make/break times, set/clear times, and dial codes.

•

Ring detection frequency range.

•

Blind dialing disable/enable.

•

The maximum, minimum, and default carrier transmit level values.

•

Calling tone, generated in accordance with V.25, may also be disabled.

•

Call progress frequency and tone cadence for busy, ringback, congested, dial tone 1, and dial tone 2.

•

Answer tone detection period.

•

On-hook/off-hook, make/break, and set/clear relay control parameters.

2.12.2 Blacklist Parameters

The modem can operate in accordance with requirements of individual countries to prevent misuse of the network by limiting
repeated calls to the same number when previous call attempts have failed. Call failure can be detected for reasons such as
no dial tone, number busy, no answer, no ringback detected, voice (rather than modem) detected, and key abort (dial
attempt aborted by user). Actions resulting from such failures can include specification of minimum inter-call delay, extended
delay between calls, and maximum numbers of retries before the number is permanently forbidden ("blacklisted"). Up to 20
such numbers may be tabulated. The blacklist parameters are programmable.

2.13 DIAGNOSTICS

2.13.1 Commanded Tests

Diagnostics are performed in response to &T commands per V.54.

Analog Loopback (&T1 Command).

DTE.

Analog Loopback with Self Test (&T8 Command).

is sent to the modem. An error detector within the modem checks for errors in the string of reversals.

Remote Digital Loopback (RDL) (&T6 Command).

data back to the local DTE.

Remote Digital Loopback with Self Test (&T7 Command).

to the remote modem, which loops the data back to the local modem.

Local Digital Loopback (&T3 Command).

in the local modem. Data from the local DTE is looped back to the local DTE (path 1) and data received from the remote
modem is looped back to the remote modem (path 2).

Data from the local DTE is sent to the modem, which loops the data back to the local

An internally generated test pattern of alternating 1s and 0s (reversals)

Data from the local DTE is sent to the remote modem which loops the

An internally generated pattern is sent from the local modem

When local digital loop is requested by the local DTE, two data paths are set up

2.13.2 Power On Reset Tests

Upon power on, an MDP test is performed. If the MDP is not operational, an error indication is generated.

2.14 LOW POWER SLEEP MODE

When not being used, the MDP is placed in a low power state.

2-4

ROCKWELL PROPRIETARY INFORMATION

1129

RCV56HCF PCI/CardBus Modem Designer’s Guide

3. HARDWARE INTERFACE

3.1 HARDWARE SIGNAL PINS AND DEFINITIONS

The RCV56HCF (PCI) functional interface signals are shown in Figure 3-1.
The Bus Interface hardware interface signals are shown by major interface in Figure 3-2.
The Bus Interface pin assignments for the 176-pin TQFP are shown Figure 3-3 and are listed Table 3-1.
The Bus Interface hardware interface signals are defined in Table 3-2.
The MDP hardware interface signals are shown by major interface in Figure 3-4.
The MDP pin assignments for the 144-pin TQFP are shown in Figure 3-5 and are listed in Table 3-3.
The MDP hardware interface signals are defined in Table 3-4.

1129

ROCKWELL PROPRIETARY INFORMATION

3-1

RCV56HCF PCI/CardBus Modem Designer’s Guide

PCI

BUS

28.224 MHZ
CRYSTAL

CIRCUIT

256 x 16

PCI

SERIAL

EEPROM

VDD
AVDD

GND
GND
AGND
AGND
AGND

AD[31:0]

CBE0#
CBE1#
CBE2#
CBE3#
PCICLK
PCIRST#
FRAME#
IDSEL
DEVSEL#
IRDY#
TRDY#
PAR
REQ#
GNT#
INTA#
STOP#
PERR#
SERR#

XIN

XOUT

SROMCLK
SROMCS
SROMIN
SROMOUT

VDD
AVDD_IA

GND
GND_IA
AGND
AGND_V1
AGND_M1

RCV56HCF

BUS INTERFACE

(176-TQFP)

[11229]

AND

RCV56HCF

MDP

(144-PIN TQFP)

[R6776]

OH_L1#
CID_L1#
VOICE#
MUTE_L1#
IRING_L1#
LCS_L1#
RH_L1#
USED_L1
LCS_H1#
ORING_H1
LCS_H2#
ORING_H2

I/O[4:0]

TELIN_L1
TELOUT_L1
RXA_L1
TXA1_L1
TXA2_L1
VC_L1

SPKROUT_M
MIC_M
MIC_V

IOM_FRAME
IOM_CLK
IOM_DD
IOM_DU

DA[4:0]

DD[7:0]

DRD#
DWR#
ISDN_CS#
ISDN_INT#
DRESET
DRESET#

UNIVERSAL

DAA AND

TELEPHONE

INTERFACE

AUDIO

INTERFACE

ISDN

U OR S/T

INTERFACE

(OPTIONAL)

3-2

Figure 3-1. RCV56HCF Interface Signals

ROCKWELL PROPRIETARY INFORMATION

MD189F2 ISF

1129

RCV56HCF PCI/CardBus Modem Designer’s Guide

27pF

28.224 MHz

PCI

BUS

EEPROM

NC

5%

27pF

5%

GND

VDD

132

XIN

1M

131

XOUT

27

PCICLK

25

PCIRST#

62

FRAME#

46

IDSEL

66

DEVSEL#

63

IRDY#

64

TRDY#

86

CBE0#

73

CBE1#

61

CBE2#

43

CBE3#

98

AD0

97

AD1

96

AD2

95

AD3

92

AD4

91

AD5

90

AD6

89

AD7

85

AD8

84

AD9

81

AD10

80

AD11

79

AD12

78

AD13

75

AD14

74

AD15

59

AD16

58

AD17

57

AD18

56

AD19

53

AD20

52

AD21

51

AD22

50

AD23

42

AD24

41
40
37
36
35
34
32
72
30
29
24
67
68
69
13
10
11
12
19
20
21
22
23

2
3
6
7

8
14
15
45

151
152
153
160
162
174
175

1K

31

1K

9

PCI BUS INTERFACE

AD25
AD26
AD27
AD28
AD29
AD30
AD31
PAR
REQ#
GNT#
INTA#
STOP#
PERR#
SERR#
SROMCLK
SROMCS
SROMIN
SROMOUT
NC
NC
NC
NC
NC
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED

CLKRUN#

CARDBUS#

176-TQFP

[11229]

MODEM_CS#

MODEM_IRQ

M_STROBE

V_STROBE

M_TXCLK

M_TX

M_RXCLK

M_RX

WKRES#

SI_FRAME

SI_CLK

SI_DD
SI_DU

M_CLK

L85CLK

M_RXOUT

M_SCLK

M_CTRL

M_TXSIN

V_RXOUT

V_SCLK

V_CTRL

V_TXSIN

OH_L1#

CID_L1#

VOICE#
MUTE_L1#
IRING_L1#

LCS_L1#

RH_L1#

USED_L1
LCS_H1#

ORING_H1

LCS_H2#

ORING_H2

I/O0
I/O1
I/O2
I/O3
I/O4
DA0
DA1
DA2
DA3
DA4
DD0
DD1
DD2
DD3
DD4
DD5
DD6
DD7

DRD#

DWR#

DRESET#

DRESET
ISDN_CS#
ISDN_INT#

VIO1
VIO2

VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD

VGG1

GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND

113
135
106
105
108
136
107
103
102
100
101
147
130
144
145
143
148
146
141
140
142
138
139
167
166
165
164
170
171
161
173
172
163
174
162
158
157
156
155
154
118
117
116
115
114
128
127
126
125
124
123
122
121
111
112
104
137

16
17

44
47

5
26
38
49
55
70
76
88
94

110
119
149
168

83

1

133
134

4
18

176

28
33
39
48
54
60
65
71
77
82
87
93
99

109
120
129
150
159
169

MDP

DAA

MDP AND
ISDN U OR S/T
INTERFACE

ISDN U OR S/T
INTERFACE

3.3 V

VDD

GND

MD189F3 11221HS-176TQFP

1129

Figure 3-2. Bus Interface 176-Pin TQFP Hardware Interface Signals

ROCKWELL PROPRIETARY INFORMATION

3-3

VDD
RESERVED
RESERVED

GND

VDD
RESERVED
RESERVED
RESERVED
CARDBUS#

SROMCS

SROMIN

SROMOUT

SROMCLK
RESERVED
RESERVED

ISDN_CS#

ISDN_INT#

GND

INTA#

PCIRST#

VDD

PCICLK

GND

GNT#

REQ#

CLKRUN#

AD31

GND
AD30
AD29
AD28
AD27

VDD

GND
AD26
AD25
AD24

CBE3#

VIO1

RCV56HCF PCI/CardBus Modem Designer’s Guide

GND

RESERVED

LCS_H2#

USED_L1

LCS_H1#

LCS_L1#

IRING_L1#

GND

VDD

OH_L1#

CID_L1#

VOICE#

MUTE_L1#

ORING_H1

ORING_H2

RH_L1#

RESERVED

GND

I/O0

I/O1

I/O2

I/O3

I/O4

RESERVED

RESERVED

RESERVED

GND

VDD

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

M_RX

MODEM_IRQ

VGG1

VDD

176

175

174

173

172

171

170

169

168

167

166

165

164

163

162

161

160

159

158

157

156

155

154

153

152

151

150

149

148

147

146

145

144

143

142

141

140

139

138

137

136

135

134

133

1
2
3
4
5
6
7
8

9
10
11
12
13
14
15
16
17
18

NC

19

NC

20

NC

21

NC

22

NC

23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44

45

46

47

48

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

64

65

66

67

68

69

70

71

72

73

74

75

76

77

78

79

80

81

82

83

84

85

86

87

132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100

XIN
XOUT
MODEM_CLK
GND
DD0
DD1
DD2
DD3
DD4
DD5
DD6
DD7
GND
VDD
DA0
DA1
DA2
DA3
DA4
MODEM_CS#
DWR#
DRD#
VDD
GND
M_RXCLK
WKRES#
M_TXCLK
M_TX
DRESET#
SI_FRAME
SI_CLK
SI_DU
SI_DD

99

GND

98

AD0

97

AD1

96

AD2

95

AD3

94

VDD

93

GND

92

AD4

91

AD5

90

AD6

89

AD7

88

3-4

VIO2

IDSEL

RESERVED

GND

VDD

AD23

AD22

AD21

AD20

GND

VDD

AD19

AD18

AD17

AD16

GND

CBE2#

IRDY#

FRAME#

GND

TRDY#

STOP#

DEVSEL#

PERR#

SERR#

VDD

GND

PAR

CBE1#

Figure 3-3. Bus Interface 176-Pin TQFP Pin Signals

ROCKWELL PROPRIETARY INFORMATION

AD15

AD14

VDD

GND

AD13

AD12

AD11

AD10

GND

VDD

AD9

AD8

VDD

GND

CBE0#

MS189F4-BIF-PO-176TQFP

1129

RCV56HCF PCI/CardBus Modem Designer’s Guide

Table 3-1. Bus Interface 176-Pin TQFP Pin Signals

Pin Signal Label I/O

1 VDD P PWR To 3.3V 89 AD7 I/O I/Opts PCI Bus: AD7
2 RESERVED I It To GND 90 AD6 I/O I/Opts PCI Bus: AD6
3 RESERVED I It To GND 91 AD5 I/O I/Opts PCI Bus: AD5
4 GND G GND Ground 92 AD4 I/O I/Opts PCI Bus: AD4
5 VDD P PWR To 3.3V 93 GND G GND Ground
6 RESERVED O Ot2 NC 94 VDD P PWR To 3.3V
7 RESERVED O Ot2 NC 95 AD3 I/O I/Opts PCI Bus: AD3
8 RESERVED O Ot2 NC 96 AD2 I/O I/Opts PCI Bus: AD2
9 CARDBUS# I PWR VCC through 10KΩ for PCI 97 AD1 I/O I/Opts PCI Bus: AD1
10 SROMCS O Ot2 SROM Chip Select 98 AD0 I/O I/Opts PCI Bus: AD0
11 SROMOUT O Ot2 SROM Data Out 99 GND G GND Ground
12 SROMIN I It SROM Data In 100 SI_DD I It MDP: SI Data Downstream
13 SROMCLK O Ot2 SROM Clock 101 SI_DU O Ot2 MDP: SI Data Upstream
14 RESERVED O Ot2 NC 102 SI_CLK I/O It/Ot MDP: SI Clock
15 RESERVED I It To GND 103 SI_FRAME I/O It/Ot MDP: SI Frame
16 ISDN_CS# O Ot2 ISDN: CS# or NC 104 DRESET# O Ot2 DB: DRESET#
17 ISDN_INT# I It ISDN: IRQ or to GND 105 M_TX O Ot2 MDP: M_TX
18 GND G GND Ground 106 M_TXCLK I It MDP: M_RXCLK
19 NC I Itpd NC 107 WKRES# O Ot12 Wakeup Reset
20 NC I It NC 108 M_RXCLK I It MDP: M_RXCLK
21 NC I It NC 109 GND G GND Ground
22 NC O Ot4ts NC 110 VDD P PWR To 3.3V
23 NC I It NC 111 DRD# O Ot2 DB: DRD#
24 INTA# O Opod PCI Bus: INTA# 112 DWR# O Ot2 DB: DWR#
25 PCIRST# I Ip PCI Bus: PCIRST# 113 MODEM_CS# O Ot2 MDP: CS#
26 VDD P PWR To 3.3V 114 DA4 O Ot2 DB: DA4
27 PCICLK I Ip PCI Bus: PCICLK 115 DA3 O Ot2 DB: DA3
28 GND G GND Ground 116 DA2 O Ot2 DB: DA2
29 GNT# I Ipts PCI Bus: GNT# 117 DA1 O Ot2 DB: DA1
30 REQ# O Opts PCI Bus: REQ# 118 DA0 O Ot2 DB: DA0
31 CLKRUN# I It GND through 1K 119 VDD P PWR To 3.3V
32 AD31 I/O I/Opts PCI Bus: AD31 120 GND G GND Ground
33 GND G GND Ground 121 DD7 I/O It/Ot2 DB: DD7
34 AD30 I/O I/Opts PCI Bus: AD30 122 DD6 I/O It/Ot2 DB: DD6
35 AD29 I/O I/Opts PCI Bus: AD29 123 DD5 I/O It/Ot2 DB: DD5
36 AD28 I/O I/Opts PCI Bus: AD28 124 DD4 I/O It/Ot2 DB: DD4
37 AD27 I/O I/Opts PCI Bus: AD27 125 DD3 I/O It/Ot2 DB: DD3
38 VDD P PWR To 3.3V 126 DD2 I/O It/Ot2 DB: DD2
39 GND G GND Ground 127 DD1 I/O It/Ot2 DB: DD1
40 AD26 I/O I/Opts PCI Bus: AD26 128 DD0 I/O It/Ot2 DB: DD0
41 AD25 I/O I/Opts PCI Bus: AD25 129 GND G GND Ground
42 AD24 I/O I/Opts PCI Bus: AD24 130 MODEM_CLK O Ot2 MDP:XTLI
43 CBE3# I/O I/Opts PCI Bus: CBE3# 131 XOUT O Ot2 Crystal Output
44 VIO1 P PWR To VIO 132 XIN I It Crystal Input
45 RESERVED I Itpd NC 133 VDD P PWR To 3.3V
46 IDSEL I Ip PCI Bus: IDSEL 134 VGG1 P PWR To VDD or 3.3V
47 VIO2 P PWR To VIO 135 MODEM_IRQ I It MDP: IRQ#
48 GND G GND Ground 136 M_RX I It MDP: M_RX
49 VDD P PWR To 3.3V 137 MSWRESET O Ot2 NC
50 AD23 I/O I/Opts PCI Bus: AD23 138 RESERVED O Ot2 NC
51 AD22 I/O I/Opts PCI Bus: AD22 139 RESERVED O Ot NC
52 AD21 I/O I/Opts PCI Bus: AD21 140 RESERVED I It To GND
53 AD20 I/O I/Opts PCI Bus: AD20 141 RESERVED I It2 To GND
54 GND G GND Ground 142 RESERVED I It To GND
55 VDD P PWR To 3.3V 143 RESERVED I It To GND
56 AD19 I/O I/Opts PCI Bus: AD19 144 RESERVED I It2 To GND
57 AD18 I/O I/Opts PCI Bus: AD18 145 RESERVED I It To GND
58 AD17 I/O I/Opts PCI Bus: AD17 146 RESERVED O Ot2 NC
59 AD16 I/O I/Opts PCI Bus: AD16 147 RESERVED O Ot2 NC
60 GND G GND Ground 148 RESERVED O Ot2 NC
61 CBE2# I/O I/Opts PCI Bus: CBE2# 149 VDD P PWR To 3.3V
62 FRAME# I/O I/Opsts PCI Bus: FRAME# 150 GND G GND Ground
63 IRDY# I/O I/Opsts PCI Bus: IRDY# 151 RESERVED I Itpd NC
64 TRDY# I/O I/Opsts PCI Bus: TRDY# 152 RESERVED I/O It/Ot12 To 3.3V through 47K

I/O Type

1

Interface Pin Signal Label I/O

I/O Type

1

Interface

1129

ROCKWELL PROPRIETARY INFORMATION

3-5

RCV56HCF PCI/CardBus Modem Designer’s Guide

Table 3-1. Bus Interface 176-Pin TQFP Pin Signals

Pin Signal Label I/O

65 GND G GND Ground 153 RESERVED I/O It/Ot12 To 3.3V through 47K
66 DEVSEL# I/O I/Opsts PCI Bus: DEVSEL# 154 I/O4 I/O It/Ot12 DAA: Reserved
67 STOP# I/O I/Opsts PCI Bus: STOP# 155 I/O3 I/O It/Ot12 DAA: Reserved
68 PERR# I/O I/Osts PCI Bus: PERR# 156 I/O2 I/O It/Ot12 DAA: Reserved
69 SERR# I/O I/Opod PCI Bus: SERR# 157 I/O1 I/O It/Ot12 DAA: Reserved
70 VDD P PWR To 3.3V 158 I/O0 I/O It/Ot12 DAA: Reserved
71 GND G GND Ground 159 GND G GND Ground
72 PAR I/O I/Opts PCI Bus: PAR 160 RESERVED I/O It/Ot12 To 3.3V through 47K
73 CBE1# I/O I/Opts PCI Bus: CBE1# 161 RH_L1# O Ot12 HS: RH
74 AD15 I/O I/Opts PCI Bus: AD15 162 ORING_H2 O Ot12
75 AD14 I/O I/Opts PCI Bus: AD14 163 ORING_H1 O Ot12 Ring Output Handset
76 VDD P PWR To 3.3V 164 MUTE_L1# O Ot12 DAA: Mute Relay
77 GND G GND Ground 165 VOICE# O Ot12 DAA: Voice Relay
78 AD13 I/O I/Opts PCI Bus: AD13 166 CID_L1# O Ot12 DAA: Caller ID Relay
79 AD12 I/O I/Opts PCI Bus: AD12 167 OH_L1# O Ot12 DAA: Off-Hook Relay
80 AD11 I/O I/Opts PCI Bus: AD11 168 VDD P PWR To 3.3V
81 AD10 I/O I/Opts PCI Bus: AD10 169 GND G GND Ground
82 GND G GND Ground 170 IRING_L1# I It DAA: Ring Indicate
83 VDD P PWR To 3.3V 171 LCS_L1# I It DAA: Line Current Sense
84 AD9 I/O I/Opts PCI Bus: AD9 172 LCS_H1# I It HS: Line Current Sense

85 AD8 I/O I/Opts PCI Bus: AD8 173 USED_L1 I It
86 CBE0# I/O I/Opts PCI Bus: CBE0# 174 LCS_H2# I It DAA: Line Current Sense
87 GND G GND Ground 175 RESERVED I It To 3.3V through 47K
88 VDD P PWR To 3.3V 176 GND G GND Ground
Notes:

1. I/O types:
I/Opod Input/Output, PCI, open drain (PCI type =o/d)
I/Opsts Input/Output, PCI, sustained tristate (PCI type = s/t/s)
I/Opts Input/Output, PCI, tristate (PCI type = t/s)
Ip Input, PCI, totem pole (PCI type = in)
Ipts Input, PCI (PCI type = t/s)
It Input, TTL
It2 Input, TTL, 2 mA
Itpd Input, TTL, internal pull-down
It/Ot Input, TTL/Output, TTL
It/Ot12 Input, TTL/Output, TTL, 12 mA
Opod Output, PCI, open drain (PCI type =o/d)
Opts Output, PCI, tristate (PCI type = t/s)
Ot Output, TTL
Ot2 Output, TTL, 2 mA
Ot4 Output, TTL, 4 mA
Ot12 Output, TTL, 12 mA

2. NC = No external connection allowed (may have internal connection).

3. Interface Legend:
MDP = Modem Data Pump

I/O Type

1

Interface Pin Signal Label I/O

I/O Type

1

Interface

Handset

3-6

ROCKWELL PROPRIETARY INFORMATION

1129

RCV56HCF PCI/CardBus Modem Designer’s Guide

Table 3-2. Bus Interface Pin Signal Definitions

Label I/O Type Signal Name/Description

SYSTEM

XIN,
XOUT

VDD PWR
GND GND

CARDBUS# It

VGG1 PWR
VIO PWR

PCICLK Ip

CLKRUN# Ip,

PCIRST# Ip

AD[31:0] I/Opts

CBE[3:0]# I/Opts

PAR I/Opts

FRAME# I/Opsts

IRDY# I/Opsts

TRDY# I/Opsts

STOP# I/Opsts

IDSEL Ip

DEVSEL# I/Opsts

TRDY# I/Opts

GNT# I/Opts

It
Ot2

(in)

(in, o/d,
s/t/s)

(in)

(t/s)

(t/s)

(t/s)

(s/t/s)

(s/t/s)

(s/t/s)

(s/t/s)

(in)

(s/t/s)

(t/s)

(t/s)

Crystal In and Crystal Out.

Digital Supply Voltage.
Digital Ground.

CardBus Interface Select.

VCC through 1K ohm.

I/O Voltage Tolerance Reference.
I/O Signaling Voltage Source.

PCI Bus Clock.

Clock Running.

to request starting or speeding up CLK. Connect to GND through 1KΩ for PCI designs.

PCI Bus Reset.

signals to a consistent state.

Multiplexed Address and Data.

Bus Command and Bus Enable.

During the address phase of a transaction, C/BE[3:0]# define the bus command. During the data phase,
C/BE[3:0]# are used as Byte Enables.

Parity.

write data phases; the Bus Interface drives PAR for read data phases.

Cycle Frame.

Initiator Ready.

data phase of the transaction. IRDY# is used in conjunction with TRDY#.

Target Ready.

the transaction. TRDY# is used in conjunction with IRDY#.

STOP# is asserted to indicate the Bus Interface is requesting the master to stop the current

Stop.

transaction.

Initialization Device.

Device Select.

target of the current access. As an input, DEVSEL# indicates whether any device on the bus has been
selected.

Reques

GNT# is used to indicate to the agent that access to the bus has been granted.

Grant.

Connect to digital ground.

The PCICLK (PCI Bus CLK signal) input provides timing for all transactions on PCI.

CLKRUN# is an input used to determine the status of CLK and an open drain output used

PCIRST# (PCI Bus RST# signal) is used to bring PCI-specific registers, sequencers, and

Parity is even parity across AD[31::00] and C/BE[3::0]#. The master drives PAR for address and

FRAME# is driven by the current master to indicate the beginning and duration of an access.

IRDY# is used to indicate the initiating agent’s (bus master’s) ability to complete the current

TRDY# is used to indicate s the Bus Interface’s ability to complete the current data phase of

When actively driven, DEVSEL# indicates the driving device has decoded its address as the

t. TRDY# is used to indicate to the arbiter that this agent desires use of the bus.

Connect XIN and XOUT to a 28.224 MHz external crystal circuit.

Connect to 3.3V.

Selects CardBus (low) or PCI Bus (high) drive strength. For PCI Bus, connect to

Connect to VCC.

Connect to 3.3V.

PCI BUS INTERFACE

Address and Data are multiplexed on the same PCI pins.

Bus Command and Byte Enables are multiplexed on the same PCI pins.

IDSEL input is used as a chip select during configuration read and write transactions.

1129

ROCKWELL PROPRIETARY INFORMATION

3-7

RCV56HCF PCI/CardBus Modem Designer’s Guide

Table 3-2. Bus Interface Pin Signal Definitions (Cont’d)

Label I/O Type Signal Name/Description

PCI BUS INTERFACE (CONTINUED)

PERR# I/Opsts

(s/t/s)

SERR# Ood

(o/d)

INTA# Ood

(o/d)

SROMCLK Ot2
SROMCS Ot2
SROMIN It
SROMOUT Ot2

OH_L1# Ot12

CID_L1# Ot12

VOICE# Ot12

MUTE_L1# Ot12

IRING_L1# It

LCS_L1# It
RH_L1# It

USED_L1 Ot12

LCS_H1# It
ORING_H1 Ot12
LCS_H2# It
ORING_H2 Ot12
I/O0-I/O4 It/Ot12

Parity Error.

System Error.

the Special Cycle command, or any other system error where the result will be catastrophic.

Interrupt A.

SERIAL EEPROM INTERFACE (NMC93C56 OR EQUIVALENT)
Serial ROM Shift Clock.
Serial ROM Chip Select.
Serial ROM Instruction, Address, and Data In.
Serial ROM Device Status and Data Out.

Off-Hook Relay Control.

polarity of this output is configurable.

Caller ID Relay Control.

polarity of this output is configurable.

Voice Relay Control.

output is configurable.

Mute Relay Control.

of this output is configurable.

Ring Indicate.

output of an optoisolator or equivalent. The idle state (no ringing) output of the ring detect circuit should be
low.

Line Current Sense.
Remote Hangup.

remote modem/telephone has released the line (gone on-hook).

Extension Offhook.

extension phone.

Line Current Sense Handset 1.
Ring Output Handset 1.
Line Current Sense Handset 2.
Ring Output Handset 2.
Reserved.

PERR# is used for the reporting of data parity errors.

SERR# is an open drain output asserted to report address parity errors, data parity errors on

INTA# is an open drain output asserted to request an interrupt.

Connect to SROM SK input.

Connect to SROM CS input.

Connect to SROM DO output.

Connect to SROM DI input.

DAA INTERFACE

Output (typically active low) used to control the normally open off-hook relay. The

Output (typically active low) used to control the normally open Caller ID relay. The

Output (typically active low) used to control the normally open. The polarity of this

Output (typically active low) used to control the normally open mute relay. The polarity

A high-going edge used to initiate presence of a ring frequency. Typically connected to the

Active low input used to indicate handset off-hook status.

Active low input used to indicate hangup of the remote modem or telephone, i.e. the

Active high input used to indicate the telephone line is in use by the local handset or an

Active low input used to indicate off-hook status from handset 1.

Active high output used to indicate ring signal to handset 1.

Active low input used to indicate off-hook status from handset 2.

Active high output used to indicate ring signal to handset 2.

3-8

ROCKWELL PROPRIETARY INFORMATION

1129

RCV56HCF PCI/CardBus Modem Designer’s Guide

Table 3-2. Bus Interface Pin Signal Definitions (Cont’d)

Label I/O Type Signal Name/Description

MDP INTERFACE

DA0-DA4 Ot2
DD0-DD7 It/Ot12
DRD# Ot2

DWR# Ot2
DRESET# Ot2
WKRES# Ot12
MODEM_CS# Ot2

MODEM_IRQ It

MODEM_CLK Ot2
M_TXCLK It
M_TX Ot2
M_RXCLK It
M_RX It
SI_FRAME It/Ot
SI_CLK It/Ot
SI_DD It
SI_DU Ot2

Device Bus Address Lines 0-4.
Device Bus Data Line 0-7.
Device Bus Read Enable.
Device Bus Write Enable.
External Device Active Low Reset.
Wakeup Reset.
MDP Data Pump Chip Select.
MDP Interrupt Request.

MDP IRQ pin.

Modem Clock.
Modem Transmit Clock.
Modem Transmit Data.
Modem Receive Clock.
Modem Receive Data.
SI Frame.
SI Clock.
SI Data Downstream.
SI Data Upstream.

Active low wake input. Connect to the MDP WKRES# pin.

Output clock for MDP. Connect to MDP XTLI pin.

Connect to MDP M_RX pin.

8 kHz frame sync; rising edge starts frame. Connect to MDP SI_FRAME pin.

Connect to MDP SI_CLK pin.

Connect to MDP SI_DD pin.

Connect to MDP SI_DU pin.

Connect to the MDP RS0-RA4 pins, respectively.

Connect to the MDP D0-D7 pins, respectively.

Connect to the MDP READ# pin.

Connect to the MDP WRITE# pin.

Connect to the MDP RESET1# and RESET2# pins.

MODEM_CS# output low selects the MDP. Connect to the MDP CS# pin.

MODEM_IRQ is the active low interrupt request from the MDP. Connect to the

Connect to MDP M_TXCLK pin.

Connect to MDP M_TX pin.

Connect to MDP M_RXCLK pin.

1129

ROCKWELL PROPRIETARY INFORMATION

3-9

RCV56HCF PCI/CardBus Modem Designer’s Guide

Table 3-2. Bus Interface Pin Signal Definitions (Cont’d)

Label I/O Type Signal Name/Description

ISDN INTERFACE (NON-ISDN MODELS)

DA0-DA3 Ot2

DD0-DD7 It/Ot12

DRD# Ot2

DWR# Ot2
ISDN_CS# Ot2

ISDN_INT It
DRESET# Ot2

Device Bus Address Lines 0-3.
Device Bus Data Line 0-7.
Read Enable.
Write Enable.
ISDN Chip Select.

Connect to the MDP only

Connect to the MDP only

Leave open.

ISDN Interrupt Request.
External Device Active Low Reset.

ISDN INTERFACE (ISDN MODELS)

DA0-DA3 Ot2

DD0-DD7 It/Ot12

DRD# Ot2

DWR# Ot2
ISDN_CS# Ot2

ISDN_INT It
DRESET# Ot2

Notes:

1. I/O types:
I/Opod Input/Output, PCI, open drain (PCI type =o/d)
I/Opsts Input/Output, PCI, sustained tristate (PCI type = s/t/s)
I/Opts Input/Output, PCI, tristate (PCI type = t/s)
Ip Input, PCI, totem pole (PCI type = in)
Ipts Input, PCI (PCI type = t/s)
It Input, TTL
It2 Input, TTL, 2 mA
Itpd Input, TTL, internal pull-down
It/Ot Input, TTL/Output, TTL
It/Ot12 Input, TTL/Output, TTL, 12 mA
Opod Output, PCI, open drain (PCI type =o/d)
Opts Output, PCI, tristate (PCI type = t/s)
Ot Output, TTL
Ot2 Output, TTL, 2 mA
Ot4 Output, TTL, 4 mA
Ot12 Output, TTL, 12 mA

2. NC = No external connection allowed (may have internal connection).

3. Interface Legend:
MDP = Modem Data Pump

Device Bus Address Lines 0-3.
Device Bus Data Line 0-7.
Read Enable.
Write Enable.
ISDN Chip Select.

Connect to the ISDN interface device RD# pin.

Connect to the ISDN interface device WR# pin.

Connect to the ISDN interface device CS# pin.

ISDN Interrupt Request.
External Device Active Low Reset.

Connect to the MDP only

Connect to the MDP only

Connect to GND.

Leave open.

Connect to the ISDN interface device A0-A3 pins, respectively.

Connect to the ISDN interface device D0-D7 pins, respectively.

Connect to the ISDN interface device INT# pin.

Connect to the ISDN interface device RESET# pin.

3-10

ROCKWELL PROPRIETARY INFORMATION

1129

BIF

VDD

NC

VAA

GND

AGND

NC

RCV56HCF PCI/CardBus Modem Designer’s Guide

33

NC

141
143

130

144

100

111

107
137
138

140

109
121
132

105
142
101
110
114
115
116
117
118
119
120
126
131
135
136

67

11
12
64
65
66

10
69
68
32
86

72

97
98

99

77
76
71

79

74

50
23
37

52
60
84

51

14
18
19
21
31
49

15
16
17
41
70
81
83

XTLI
XTLO

CS#
IRQ
RS0
RS1
RS2
RS3
RS4
D0

1

D1

3

D2

4

D3

6

D4

8

D5

9

D6
D7
READ#
WRITE#
RESET2#
RESET1#

WKRES#

SI_FRAME
SI_CLK
SI_DD
SI_DU

M_TX
M_TXCLK
M_RXCLK
M_RX

VDD
VDD
VDD
VDD
RESERVED
NC

AVDD
AVAA
AVDD

GND
GND
GND
GND
GND
GND
VSUB

AGND
AGND
AGND
AGNDV
AGNDM
AGND

NC
NC
NC
NC
NC
NC
NC
NC
NC
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED

MODEM

DATA PUMP

(MDP)

144-TQFP

[R6776]

RESERVED
RESERVED
RESERVED
RESERVED

TELIN_L1

SPKROUT_M

TELOUT_L1

RXA_L1
TXA1_L1
TXA2_L1

VC_L1

VREF

PLLVDD

PLLGND

MIC_M

MIC_V

MICBIAS

MCLKIN

MTXSIN

MRXOUT

MSTROBE

MSCLK

MCNTRLSIN

SR1IO

IA1CLK

SA1CLK

SR4IN
SR4OUT
CLKOUT
SR3OUT

SR3IN

SA2CLK
SR2CLK

SR2IO

VCNTRLSIN

VSCLK

VSTROBE

VRXOUT

VTXSIN
VCLKIN

SLEEPO

IASLEEP

IOM_FRAME

IOM_CLK

IOM_DD
IOM_DU

MK5
MK4

SET3V#

RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED

128
127

112

106

103

104

113

124

133

134
108

129
125

122
123

102

139

78

20
24
22
30
25
26
28
27

13

61

33
29
34

43
44
46
47
45
42

94
93
89
87
91
88
90

73

58
55
53
54
56
57

59

95
96
62

85

40

5
2

82
63

7

92
75
80
36
48
35
38
39

0.1

MODEM_CLK

MODEM_CS#
MODEM_IRQ
DA0
DA1
DA2
DA3
DA4
DD0
DD1
DD2
DD3
DD4
DD5
DD6
DD7
DRD#
DWR#

DRESET#

WKRES#

SI_FRAME
SI_CLK
SI_DD
SI_DU

M_TX
M_TXCLK
M_RXCLK
M_RX

VAA

NC
GND

GND

DAA

10

10

AUDIO CIRCUIT

ISDN
U OR S/T
INTERFACE

NC

MD189F5 MDPHI

0.1 CER

0.1 CER
FERRITE BEAD

1129

Figure 3-4. MDP 144-Pin TQFP Hardware Interface Signals

ROCKWELL PROPRIETARY INFORMATION

3-11

RESERVED

RESERVED

RESERVED

RS0
RS1

PLLVDD

AGND

AGND
AGND

TELIN_L1

AGNDV

TELOUT_L1

AVAA

SPKROUT_M

TXA1_L1
TXA2_L1

VREF

VC_L1

MIC_V
RXA_L1
AGNDM

RESET2#

MIC_M

MICBIAS

RESERVED

SPKMD

RCV56HCF PCI/CardBus Modem Designer’s Guide

D0

XTLONCXTLINCRESERVED

144

D1

D2
D3

D4

D5
D6
D7

NC
NC
NC

143

1
2
3
4
5
6
7
8

9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36

37

38

142

39

141

40

140

VDD

VDD

RESERVED

RESERVED

RESERVED

MK4

GND

RESERVED

IRQ

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

IOM_DU

RESERVED

RESERVED

GND

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

SLEEPO

RESERVED

M_RX

RESERVED

GND

139

138

137

136

135

134

133

132

131

130

129

128

127

126

125

124

123

122

121

120

119

118

117

116

115

114

113

112

111

110

109

108

RESERVED

107

VDD

106

SR1IO

105

NC

104

SR2IO

103

SA2CLK

102

RESERVED

101

RESERVED

100

SI_DD

99

SI_DU

98

SI_CLK

97

SI_FRAME

96

IOM_CLK

95

IOM_FRAME

94

IA1CLK

93

SA1CLK

92

RESERVED

91

CLKOUT

90

SR3IN

89

SR4IN

88

SR3OUT

87

SR4OUT

86

RESET1#

85

MK5

84

GND

83

NC

82

RESERVED

81

NC

80

RESERVED

79

VDD

78

RESERVED

77

M_TX

76

M_TXCLK

75

RESERVED

74

RESERVED

73

41

42

43

44

45

46

47

48

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

64

65

66

67

68

69

70

71

SR2CLK

72

AVDD

RESERVED

NC

~SET3V

RESERVED

MCLKIN

MTXSIN

MCTRLSIN

MSCLK

MRXOUT

AGND

MSTROBE

RESERVED

AVDD

VSUB

GND

VSTROBE

VSCLK

VRXOUT

VTXSIN

VCLKIN

VCTRLSIN

GND

IASLEEP

IOM_DD

PLLGND

RESERVED

Figure 3-5. MDP 144-Pin TQFP Pin Signals

RS2

RS3

RS4

CS#

READ#

WRITE#

NC

M_RXCLK

WKRES#

MS181F6 PO-MDP144T

3-12

ROCKWELL PROPRIETARY INFORMATION

1129

RCV56HCF PCI/CardBus Modem Designer’s Guide

Table 3-3. MDP Pin Signals - 144-Pin TQFP

Pin Signal Label I/O

1 D1 IA/OB BIF: DD1 73 SR2CLK DI To VSCLK (55)
2 RESERVED NC 74 RESERVED NC
3 D2 IA/OB BIF: DD2 75 RESERVED NC
4 D3 IA/OB BIF: DD3 76 M_TXCLK OA BIF: M_TXCLK
5 RESERVED NC 77 M_TX IA BIF: M_TX
6 D4 IA/OB BIF: DD4 78 RESERVED NC
7 SYCLK OA Controller 79 VDD PWR VCC
8 D5 IA/OB BIF: DD5 80 RESERVED NC
9 D6 IA/OB BIF: DD6 81 NC NC
10 D7 IA/OB BIF: DD7 82 RESERVED NC
11 RS0 IA BIF: DA0 83 NC NC
12 RS1 IA BIF: DA0 84 GND GND DGND
13 PLLVDD PLL To VAA and to AGND

14 AGND GND AGND 86 RESET1# IA BIF: DRESET#
15 NC NC 87 SR4OUT DI To MTXSIN (44)
16 NC NC 88 SR3OUT DI To VTXSIN (56)
17 NC NC 89 SR4IN DI To MRXOUT (46)
18 AGND GND AGND 90 SR3IN DI To VRXOUT (54)
19 AGND GND AGND 91 CLKOUT DI To MCLKIN (43) & VCLKIN

20 TELIN_L1 I(DA) DAA 92 RESERVED NC
21 AGNDV GND AGND 93 SA1CLK DI To MSTROBE (47)
22 TELOUT_L1 O(DD) DAA 94 IA1CLK DI To MSCLK (45)
23 AVAA PWR VAA 95 IOM_FRAME IA/OB ISDN: FSC
24 SPKROUT_M O(DF) Audio Circuit 96 IOM_CLK IA/OB ISDN: DCL
25 TXA1_L1 O(DD) DAA 97 SI_FRAME IA/OB BIF: SI_FRAME
26 TXA2_L1 O(DD) DAA 98 SI_CLK IA/OB BIF: SI_CLK
27 VREF REF VC_L1 through capacitors 99 SI_DU IA BIF: SI_DU
28 VC_L1 REF AGND through capacitors 100 SI_DD OA BIF: SI_DD
29 MIC_V I(DA) Audio Circuit 101 RESERVED NC
30 RXA_L1 I(DA) DAA 102 RESERVED NC
31 AGNDM GND AGND 103 SA2CLK DI To VSTROBE (53)
32 RESET2# IA BIF: DRESET# 104 SR2IO DI To VCNTRLSIN (58)
33 MIC_M I(DA) Audio Circuit 105 NC NC
34 MICBIAS Audio Circuit 106 SR1IO DI To MCNTRLSIN (42)
35 RESERVED NC 107 VDD PWR VCC
36 SPKMD OA Sounducer 108 RESERVED NC
37 AVDD PWR VCC 109 GND GND DGND
38 RESERVED NC 110 RESERVED NC
39 RESERVED NC 111 M_RX OA BIF: M_RX
40 SET3V# IA To GND 112 RESERVED NC
41 NC NC 113 SLEEPO DI To IASLEEP (59)
42 MCNTRLSIN DI To SR1IO (106) 114 RESERVED NC
43 MCLKIN DI To CLKOUT (91) 115 RESERVED NC
44 MTXSIN DI To SR4OUT (87) 116 RESERVED NC
45 MSCLK DI To IA1CLK (94) 117 RESERVED NC
46 MRXOUT DI To SR4IN (89) 118 RESERVED NC
47 MSTROBE DI To SA1CLK (93) 119 RESERVED NC
48 RESERVED NC 120 RESERVED NC
49 AGND GND AGND 121 GND GND DGND
50 AVDD PWR VCC 122 YCLK OA NC
51 VSUB GND AGND 123 XCLK OA NC
52 GND GND DGND 124 IOM_DU OA ISDN: DIN
53 VSTROBE DI To SA2CLK (103) 125 RESERVED NC
54 VRXOUT DI To SR3IN (90) 126 RESERVED NC
55 VSCLK DI To SR2CLK (73) 127 RESERVED NC
56 VTXSIN DI To SR3OUT (88) 128 RESERVED NC
57 VCLKIN DI To CLKOUT (91) 129 RESERVED NC
58 VCNTRLSIN DI To SR2IO (104) 130 IRQ IA BIF: MODEM_IRQ
59 IASLEEP DI To SLEEPO (113) 131 RESERVED NC
60 GND GND DGND 132 GND GND DGND

Type

1

through 0.1 µF

Interface

3

Pin Signal Label I/O

85 MK5 IA PLL Circuit Strap Option; NC

Type

1

(57)

Interface

1129

ROCKWELL PROPRIETARY INFORMATION

3-13

RCV56HCF PCI/CardBus Modem Designer’s Guide

Table 3-3. MDP Pin Signals - 144-Pin TQFP (Continued)

Pin Signal Label I/O

61 PLLGND PLL To AGND 133 MK4 IA PLL Circuit Strap Option;

62 IOM_DD IA ISDN: DOUT 136 RESERVED NC
63 RESERVED NC 135 RESERVED NC
64 RS2 IA BIF: DA02 136 RESERVED NC
65 RS3 IA BIF: DA03 137 VDD PWR VCC
66 RS4 IA BIF: DA04 138 VDD PWR VCC
67 ~CS IA BIF: MODEM_CS# 139 RESERVED NC
68 DWR# IA BIF: DRD# 140 VTH2 IA VDD through 10K
69 DRD# IA BIF: DWR# 141 XTLI I BIF: L85CLK
70 NC NC 142 NC NC
71 M_RXCLK OA BIF: M_RXCLK 143 XTLO O NC
72 WKRES# OA BIF: WKRES# 144 D0 IA/OB BIF: DD0

Notes:

1. I/O types:
IA, IB = Digital input; OA, OB = Digital output (see Table 3-9).
I(DA) = Analog input; O(DD), O(DF) = Analog output (see Table 3-10).
DI = Device interconnect.

2. NC = No external connection allowed (may have internal connection).

3. Interface Legend:
MDP = Modem Data Pump
BIF = Bus Interface Device
ISDN = ISDN U or S/T interface device.

Type

1

Interface3 Pin Signal Label I/O

Type

1

Interface

GND

Ω

3-14

ROCKWELL PROPRIETARY INFORMATION

1129

RCV56HCF PCI/CardBus Modem Designer’s Guide

Table 3-4. MDP Pin Signal Definitions

Label I/O Type Signal/Definition

OVERHEAD SIGNALS

XTLI I
XTLO O
VDD,

AVDD
AVAA PWR
GND GND
AGND GND
SET3V# IA

RS0–RS4 IA
D0-D7 IA/OA
READ# IA
WRITE# IA
RESET1#,

RESET2#
WKRES# OA
CS# IA
IRQ OA

M_TXCLK OA
M_TX IA
M_RXCLK OA
M_RX OA
SI_FRAME IA/OB
SI_CLK IA/OB
SI_DD OA
SI_DU IA

IOM_FRAME IA/OB

IOM_CLK IA/OB
IOM_DD IA
IOM_DU OA

IOM_FRAME IA/OB

IOM_CLK IA/OB
IOM_DD IA
IOM_DU OA

PWR

IA

Crystal Int.
Crystal Out.
Digital Power Supply.

Analog Power Supply.
Digital Ground.
Analog Ground.
Set 3.3V Analog Reference.

Address Lines 0-4.
Data Line 0-7.
Read Enable.
Write Enable.
External Device Active Low Reset.

Wakeup Reset.
Chip Select.
Interrupt Request.

MODEM_IRQ pin.

Modem Transmit Clock.
Modem Transmit Data.
Modem Receive Clock.
Modem Receive Data.
ISDN Frame.
ISDN Clock.
ISDN Data Downstream.
ISDN Data Upstream.

ISDN Frame Synchronization Clock.

channel in time-slot 0 is marked. Connect to the ISDN device FSC pin.

ISDN Clock.
ISDN Data Downstream.
ISDN Data Upstream.

ISDN Frame Synchronization Clock.

channel in time-slot 0 is marked. Connect to the ISDN device FSC pin.

ISDN Clock.
ISDN Data Downstream.
ISDN Data Upstream.

Connect the BIF MODEMCLK pin through a 33 Ω resistor.

Leave open.

To +3.3V and digital circuits power supply filter.

To +3.3V and analog circuits power supply filter.

Connect to digital ground.

Connect to analog ground.

Connect to digital ground.

BIF TO MDP INTERFACE

Connect to the BIF DA0–DA4 pins, respectively.

Connect to the BIF DD0-DD7 pins, respectively.
Connect to BIF DRD# pin.
Connect to BIF DWR# pin.

Connect to the BIF DRESET# pin.

Active low wake-up output. Connect to the BIF WKRES# pin.

CS# output low selects the MDP. Connect to the BIIF MODEM_CS# pin.

MODEM_IRQ is the active low interrupt request from the MDP. Connect to the BIF

Connect to BIF M_TXCLK pin.
Connect to BIF M_TX pin.
Connect to BIF M_RXCLK pin.

Connect to BIF M_RX pin.

8 kHz frame sync; rising edge starts frame. Connect to BIF SI_FRAME pin.

1.536 MHz clock. Connect to BIF SI_CLK pin.
Connect to BIF SI_DD pin.

Connect to BIF SI_DU pin.

MDP TO SIEMENS PSB2186 S/T INTERFACE

8 kHz frame sync; rising edge starts frame. The start of the B1

1.536 MHz clock. Connect to the ISDN device DCL pin.

IOM data input synchronous to IOM_CLK. Connect to the ISDN device DOUT pin.

IOM data output synchronous to IOM_CLK. Connect to the ISDN device DIN pin.

MDP TO SIEMENS PSB21910 U INTERFACE

8 kHz frame sync; rising edge starts frame. The start of the B1

1.536 MHz clock. Connect to the ISDN device DCL pin.

IOM data input synchronous to IOM_CLK. Connect to the ISDN device DOUT pin.

IOM data output synchronous to IOM_CLK. Connect to the ISDN device DIN pin.

1129

ROCKWELL PROPRIETARY INFORMATION

3-15

RCV56HCF PCI/CardBus Modem Designer’s Guide

Table 3-4. MDP Signal Definitions (Cont'd)

Label I/O Type Signal Name/Description

TELEPHONE LINE/TELEPHONE/AUDIO INTERFACE SIGNALS AND REFERENCE VOLTAGE

TXA1_L1
TXA2_L1

RXA_L1 I(DA)

TELOUT_L1 O(DF)

TELIN_L1 I(DA)

MIC_M I(DA)
MIC_V I(DA)
SPKROUT_M O(DF)

VREF REF

VC_L1 REF

PLLVDD PLL
PLLGND PLL
MK4, MK5 IA

SPKMD OA

O(DF)

Transmit Analog 1 and 2.

phase with each other. Each output can drive a 300 Ω load.

Receive Analog.

external hybrid circuit. The input impedance is > 70k Ω.

Telephone Handset Analog Output.

speaker interface circuit. TELOUT_L1 can drive a 300 Ω load.

Telephone Handset Analog Input.

microphone interface circuit. The input impedance is > 70k Ω.

Modem Microphone Input.
Voice Microphone Input.
Modem Speaker Analog Output.

The SPKROUT_M on/off and three levels of attenuation are controlled by bits in DSP RAM. When the speaker
is turned off, the SPKROUT_M output is clamped to the voltage at the VC_L1 pin. The SPKROUT_M output
can drive an impedance as low as 300 ohms. In a typical application, the SPKROUT_M output is an input to
an external LM386 audio power amplifier.

High Voltage Reference.

(ceramic) in parallel.

Low Voltage Reference.

0.1 µF (ceramic) in parallel.

PLLVDD Connection.
PLLGND Connection.
PLL Circuit Strap Option.

PLL circuit.

Modem Speaker Digital Output.

to TTL high or low level by an internal comparator to create a PC Card (PCMCIA)-compatible signal.

RXA_L1 is a single-ended receive data input from the telephone line interface or an optional

The TXA1_L1 and TXA2_L1 outputs are differential outputs 180 degrees out of

TELOUT_L1 is a single-ended analog output to the telephone handset

TELIN_L1 is a single-ended analog input from the telephone handset

MIC_M is a single-ended microphone input. The input impedance is > 70k Ω.

MIC_V is a single-ended microphone input. The input impedance is > 70k Ω.

The SPKROUT_M analog output reflects the received analog input signal.

Connect to VC_L1 through 10 µF (polarized, + terminal to VREF) and 0.1 µF

Connect to analog ground through 10 µF (polarized, + terminal to VC_L1) and

Connect to VAA and to AGND through 0.1 µF.

Connect to AGND.

Connect MK4 to digital ground and leave MK5 open in order to enable the internal

The SPKMD digital output reflects the received analog input signal digitized

3-16

ROCKWELL PROPRIETARY INFORMATION

1129

RCV56HCF PCI/CardBus Modem Designer’s Guide

Table 3-4. MDP Signal Definitions (Cont'd)

Label I/O Type Signal Name/Description

MODEM INTERCONNECT/NO CONNECT

GPO0 DI To M_RXCLK
SLEEPO DI To IASLEEP
IASLEEP DI To SLEEPO
MSCLK DI To IA1CLK
CLKOUT DI To MCLKIN & VCLKIN
SR1IO DI To MCTRLSIN
SR3IN DI To MRXOUT
IA1CLK DI To MSCLK
SA1CLK DI To MSTROBE
SR4OUT DI To MTXSIN
MCLKIN DI To CLKOUT
VCLKIN DI To CLKOUT
MSTROBE DI To SA1CLK
VSTROBE DI To SA2CLK
MCTRLSIN DI To SR1IO
VSCLK DI To SR2CLK
VCTRLSIN DI To SR2IO
MRXOUT DI To SR3IN
VTXSIN DI To SR3OUT
VRXOUT DI To SR4IN
MTXSIN DI To SR4OUT
SR2IO DI To VCTRLSIN
SR4IN DI To VRXOUT
SR2CLK DI To VSCLK
SA2CLK DI To VSTROBE
SR3OUT DI To VTXSIN
RESERVED Reserved Function. May be connected to internal circuit. Leave open.

1129

ROCKWELL PROPRIETARY INFORMATION

3-17

RCV56HCF PCI/CardBus Modem Designer’s Guide

3.2 ELECTRICAL,SWITCHING,AND ENVIRONMENTAL CHARACTERISTICS

3.2.1 Power and Maximum Ratings

The current and power requirements are listed in Table 3-5.
The absolute maximum ratings are listed in Table 3-6.

Table 3-5. Current and Power Requirements

Current Power

Mode

Bus Interface (11229) fIN = 28.224 MHz

Operating

Modem Data Pump (R6776) fIN = 28.224 MHz

Operating 58 68 191 245
Sleep 1.8 — 5.9 —

Total

MDP Operating
MDP Sleep

Notes:

Operating voltage: VDD = 3.3V ± 0.3V.
Test conditions: VDD = 3.3 VDC for typical values; VDD = 3.6 VDC for maximum values.

Typical

Current (mA)

145 186 479 670

203 254 670 915
147 — 485 —

Maximum

Current (mA)

Typical

Power (mW)

Maximum

Power (mW) Notes

Table 3-6. Maximum Ratings

Parameter Symbol Limits Units

Supply Voltage V
Input Voltage V
Operating Temperature Range T
Storage Temperature Range T
Analog Inputs V
Voltage Applied to Outputs in High Impedance (Off) State V
DC Input Clamp Current I
DC Output Clamp Current I
Static Discharge Voltage (25°C) V
Latch-up Current (25°C) I

TRIG

DD

IN

A

STG

IN
HZ
IK

OK

ESD

-0.5 to +4.6 V

-0.5 to (VCC +0.5) V

-0 to +70 °C

-55 to +125 °C

-0.3 to (VAA+ 0.3) V

-0.5 to (VCC + 0.5) V
±20 mA
±20 mA

±2500 V

±400 mA

3-18

ROCKWELL PROPRIETARY INFORMATION

1129

RCV56HCF PCI/CardBus Modem Designer’s Guide

3.2.2 PCI Bus

Table 3-7 summarizes the PCI DC specifications for 3.3V signaling.
Table 3-8 summarizes the PCI AC specifications for 3.3V signaling.

Table 3-7. PCI Bus DC Specifications for 3.3V Signaling

Symbol Parameter Condition Min Max Units Notes

Vcc Supply Voltage 3.0 3.6 V
Vih Input High Voltage 0.5Vcc Vcc +0.5 V
Vil Input Low Voltage -0.5 0.3Vcc V
Vipu Input Pull-up Voltage 0.7VCC V
Iil Input Low Leakage Current 0<Vin <2Vcc ±10
Voh Output High Voltage Iout = -0.5 mA 0.9Vcc V
Vol Output Low Voltage Iout = 1.5 mA 0.1Vcc V
Cin Input Pin Capacitance 10 pF
Cclk CLK Pin Capacitance 5 12 pF
CIDSEL IDSEL Pin Capacitance 8 pF
Lpin Pin Inductance 20 nH

Table 3-8. PCI Bus AC Specifications for 3.3V Signaling

Symbol Parameter Condition Min Max Units Notes

IOH(AC) Switching Current High 0<Vout <0.3Vcc -12Vcc mA

0.3Vcc<Vout <0.9Vcc -17.1(Vout -Vout) mA

0.7Vcc<Vout <Vcc Equation C

(Test Point) Vout = 0.7Vcc -32Vcc mA

IOL(AC) Switching Current Low Vout > Vout>0.6Vcc 16Vcc mA

0.6Vcc>Vout> 0.1Vcc Vout /0.023 mA

0.18Vcc>Vout >0 Equation D

(Test Point) Vout = 0.18Vcc 38Vcc mA
Icl Low Clamp Current -3 < Vin ≤−1 -25+(Vin +1)/0.015 mA
Ich High Clamp Current Vcc+4 > Vin > Vcc+1 25+(Vin -Vcc +1)/0.015 mA
slew r Output Rise Slew Rate 0.2Vcc - 0.6Vcc load 1 5 V / ns
slew f Output Fall Slew Rate 0.6Vcc - 0.2Vcc load 1 5 V / ns

Notes:

Equation C: Ioh = (0.98/Vcc) * (Vout - Vcc) * (Vout + 0.4Vcc) for Vcc > Vout > 0.7Vcc.
Equation D: Iol = (256/Vcc) * Vout * (Vcc - Vout) for 0V < Vout < 0.18Vcc.
See PCI Bus Specification for complete details.

A

µ

1129

ROCKWELL PROPRIETARY INFORMATION

3-19

RCV56HCF PCI/CardBus Modem Designer’s Guide

3.2.3 MDP

The MDP digital electrical characteristics for the hardware interface signals are listed in Table 3-9.
The MDP analog electrical characteristics for the hardware interface signals are listed in Table 3-10.

Table 3-9. MDP Digital Electrical Characteristics

Parameter Symbol Min. Typ. Max. Units

Input High Voltage V

Type IA 2.0 – VCC + 0.3
Type IE – 4.0 – Note 2.

Input High Current I

Type IB – – 40

Input Low Voltage V

Type IA –0.3 – 0.8
Type IE – 1.0 – Note 2.

Input Low Current I
Input Leakage Current I
Output High Voltage V

Type OA 2.4 – – I
Type OB 2.4 – – I

Output Low Voltage V

Type OA – – 0.4 I

Type OB – – 0.4 I
Three-State (Off) Current I
Capacitive Load C

Types IA and ID – 10

Type IB – 20
Capacitive Drive C

Types OA and OB – 10
Circuit Type

Type IA TTL

Type IB TTL with pull-up

Type ID ~RES

Types OA and OB TTL with 3-state

Notes:

1. Test Conditions: VCC = 3.3V ±0.3V, TA = 0°C to 70°C, (unless otherwise stated).

Output loads: Data bus (D0-D7), address bus (A0-A15), chip selects,

2. Type IE inputs are centered approximately 2.5 V and swing 1.5 V

3. Type OE outputs provide oscillator feedback when operating with an external crystal.

IH

IH

IL

IL
IN

OH

OL

TSI

L

D

DRD#, and DWR# loads = 70 pF + one TTL load.
Other = 50 pF + one TTL load.

– – -40 µA

PEAK

±2.5 µADC VIN = 0 to 3.3V, VCC = 3.6 V

±10 µADC VIN = 0 V to VCC

in each direction.

VDC

µA VIN= 3.6 V, VCC = 3.6 V

VDC

VDC

LOAD
LOAD

VDC

LOAD
LOAD

pF

pF

Test Conditions

= – 100 µA
= 0 mA

= 1.6 mA
= 0.8 mA

1

3-20

ROCKWELL PROPRIETARY INFORMATION

1129

RCV56HCF PCI/CardBus Modem Designer’s Guide

Table 3-10. Analog Electrical Characteristics

Name Type Characteristic Value

RXA_L1, I (DA) Input Impedance > 70K
TELIN_L1 AC Input Voltage Range 1.1 VP-P**

Reference Voltage +2.5 VDC
TXA1_L1 O (DD) Minimum Load 300
TXA2_L1 Maximum Capacitive Load 0 µF
TELOUT_L1 Output Impedance 10

AC Output Voltage Range 2.2 VP-P

Reference Voltage +2.5 VDC

DC Offset Voltage ± 200 mV
MIC_M I (DA) Input Impedance > 70K
MIC_V Maximum AC Input Voltage 1.7 VP-P

Reference Voltage* +2.5 VDC
SPKROUT_M O (DF) Minimum Load 300

Maximum Capacitive Load 0.01 µF

Output Impedance 10

AC Output Voltage Range 1.1 VP-P

Reference Voltage +2.5 VDC

DC Offset Voltage ± 20 mV
* Reference Voltage provided internal to the device.

** Corresponds to 2.2 VP-P at Tip and Ring.

Ω

Ω

Ω

Ω

Ω

Ω

1129

ROCKWELL PROPRIETARY INFORMATION

3-21

RCV56HCF PCI/CardBus Modem Designer’s Guide

3.3 INTERFACE TIMING AND WAVEFORMS

3.3.1 PCI Bus Timing

The PCI interface timing conforms to the PCI Local Bus Specification, Production Version, Revision 2.1, June 1, 1995.

3.3.2 Serial EEPROM Timing

The serial EEPROM interface timing is listed in Table 3-11 and is shown in Figure 3-6.

Table 3-11. Timing - Serial EEPROM Interface

Symbol Parameter Min Typ. Max Units Test Condition

t

CSS

t

CSH

t

DOS

t

DOH

t

PD0

t

PD1

t

DF

t

SV

t

SKH

t

SKL

Chip select setup 400 500 – ns
Chip select hold 400 500 – ns
Data output setup 400 500 – ns
Data output hold 400 500 – ns
Data input delay – – 400 ns
Data input delay – – 400 ns
Data input disable time – – 100 ns
Status valid – – 100 ns
Clock high 500 – – ns
Clock low 500 – – ns

SROMCS (CS)

SROMCLK (SK)

SROMOUT (DI)

SROMIN (DO) (READ)

SROMIN (DO) (PROGRAM)

t

CSS

t

SKL

t

PD1

t

DOS

t

SV

t

DOH

t

PD0

t

SKH

Figure 3-6. Waveforms - Serial EEPROM Interface

t

CSH

t

DF

t

DF

1123F3-7 EEPROM

3-22

ROCKWELL PROPRIETARY INFORMATION

1129

RCV56HCF PCI/CardBus Modem Designer’s Guide

3.3.3 External Device Bus Timing

The external Device Bus timing is listed in Table 3-12 and illustrated in Figure 3-7.

Table 3-12. Timing - External Device Bus Interface

Symbol Description Min. Typ. Max. Units Test Conditions

Read

t

AS

t

AH

t

CSS

t

CSH

t

RW

t

RDA

t

RDH

t

AS

t

AH

t

CSS

t

CSH

t

WW

t

WDS

t

RDH

Address setup
Address hold
Chip select setup
Chip select hold
Read pulse width
Read data access
Read data hold

Address setup
Address hold
Chip select setup
Chip select hold
Write pulse width
Write data setup
Write data hold

40
10

40
108 – 144 ns
150 – – ns

––36ns
0––ns

40

10

40
108 – 144 ns
150 – – ns

36 – – ns

36 – 72 ns

––
––
––

Write

––
––
––

ns
ns
ns

ns
ns
ns

1129

ROCKWELL PROPRIETARY INFORMATION

3-23

RCV56HCF PCI/CardBus Modem Designer’s Guide

DA0 - DA4

ISDN_CS#

DRD#

DD0-DD7

t

AS

t

CSS

t

AS

t

RDA

t

RW

Read data valid

a. Read

t

AH

t

t

RDH

t

AH

CSH

DA0 - DA4

ISDN_CS#

DWR#

DD0-DD7

t

CSS

t

WW

t

WDS

t

t

WDH

CSH

Write data valid

a. Write

Figure 3-7. Waveforms - External Device Bus Interface

1123F3-8 EB

3-24

ROCKWELL PROPRIETARY INFORMATION

1129

RCV56HCF PCI/CardBus Modem Designer’s Guide

3.3.4 IOM-2 Interface

The interface timing is listed in Table 3-13 and shown in Figure 3-8.

Table 3-13. Timing - IOM-2 Interface

Symbol Parameter Min Typ. Max Units Test Condition

t

r, tf

t

DCL

t

wH, twL

t

sD

t

hD

t

dF

t

hF

t

dDC

t

dDF

Notes:

1. 768 bps.

Data clock (DCL) and frame
sync (FSC) rise/fall

––30nsC

= 25 pF

L

Data clock period (note 1) 565 651 735 ns CL = 25 pF
Data clock pulse width high/low

200 310 420 ns

(note 1)
Data setup 32 – – ns

Data hold 32 – – ns
Frame advance 0 65 130 ns CL = 25 pF
Frame hold 20 – – ns CL = 25 pF
Data delay clock – 20 100 ns CL = 150 pF
Data delay frame – – 150 ns CL = 150 pF

IOM_CLK (DCL)

IOM_FRAME (FSC)

IOM_DD (DD)
IOM_DU (DU)

IOM_CLK (DCL)

IOM_FRAME (FSC)

IOM_DU (DU)

IOM_DD (DD)

t

dF

t

dDC

Bit N Bit 0

t

DCL

t

r

t

wH

t

dDF

t

f

Detail a

t

wL

t

hF

Bit 0

Bit 1 Bit 2

t

sD

t

hD

1129

Detail a

Figure 3-8. Waveforms - IOM-2 Interface

ROCKWELL PROPRIETARY INFORMATION

1123F3-9

3-25

RCV56HCF PCI/CardBus Modem Designer’s Guide

This page is intentionally blank.

3-26

ROCKWELL PROPRIETARY INFORMATION

1129

RCV56HCF PCI/CardBus Modem Designer’s Guide

4. DESIGN CONSIDERATIONS

Good engineering practices must be followed when designing a printed circuit board (PCB) containing the modem device.
This is especially important considering the high data bit rate, high fax rate, record/play of analog speech and music audio,
and full-duplex speakerphone operation. Suppression of noise is essential to the proper operation and performance of the
modem and interfacing audio and DAA circuits.

Two aspects of noise in an OEM board design containing the modem device set must be considered: on-board/off-board
generated noise that can affect analog signal levels and analog-to-digital conversion (ADC)/digital-to-analog conversion
(DAC), and on-board generated noise that can radiate off-board. Both on-board and off-board generated noise that is
coupled on-board can affect interfacing signal levels and quality, especially in low level analog signals. Of particular concern
is noise in frequency ranges affecting modem and audio circuit performance.

On-board generated electromagnetic interference (EMI) noise that can be radiated or conducted off-board is a separate, but
equally important, concern. This noise can affect the operation of surrounding equipment. Most local governing agencies
have stringent certification requirements that must be met for use in specific environments. In order to minimize the
contribution of the circuit design and PCB layout to EMI, the designer must understand the major sources of EMI and how to
reduce them to acceptable levels.

Proper PC board layout (component placement and orientation, signal routing, trace thickness and geometry, etc.),
component selection (composition, value, and tolerance), interface connections, and shielding are required for the board
design to achieve desired modem performance and to attain EMI certification. In addition, design layout should meet
requirements stated in the PCI Bus Specification, Section 4.4, Expansion Board Specification, as well as other applicable
sections.

All the aspects of proper engineering practices are beyond the scope of this designer's guide. The designer should consult
noise suppression techniques described in technical publications and journals, electronics and electrical engineering text
books, and component supplier application notes. Seminars addressing noise suppression techniques are often offered by
technical and professional associations as well as component suppliers.

The following guidelines are offered to specifically help achieve stated modem performance, minimize audible noise for audio
circuit use, and to minimize EMI generation.

4.1 PC BOARD LAYOUT GUIDELINES

4.1.1 General Principles

1. Provide separate digital, analog, and DAA sections on the board.

2. Keep digital and analog components and their corresponding traces as separate as possible and confined to defined
sections.

3. Keep high speed digital traces as short as possible.

4. Keep sensitive analog traces as short as possible.

5. Provide proper power supply distribution, grounding, and decoupling.

6. Provide separate digital ground, analog ground, and chassis ground (if appropriate) planes.

7. Provide wide traces for power and critical signals.

8. Position digital circuits near the host bus connection and position the DAA circuits near the telephone line connections.

4.1.2 Component Placement

1. From the system circuit schematic,
a) Identify the digital, analog, and DAA circuits and their components, as well as external signal and power

connections.
b) Identify the digital, analog, mixed digital/analog components within their respective circuits.
c) Note the location of power and signals pins for each device (IC).

2. Roughly position digital, analog, and DAA circuits on separate sections of the board. Keep the digital and analog
components and their corresponding traces as separate as possible and confined to their respective sections on the
board. Typically, the digital circuits will cover one-half of the board, analog circuits will cover one-fourth of the board, and
the DAA will cover one-fourth of the board.
and status signals routed through it. A DAA section is also governed by local government regulations covering subjects
such as component spacing, high voltage suppression, and current limiting.

NOTE:

While the DAA is primarily analog in nature, it also has many control

1129

ROCKWELL PROPRIETARY INFORMATION

4-1

RCV56HCF PCI/CardBus Modem Designer’s Guide

3. Once sections have been roughly defined, place the components starting with the connectors and jacks.
a) Allow sufficient clearance around connectors and jacks for mating connectors and plugs.
b) Allow sufficient clearance around components for power and ground traces.
c) Allow sufficient clearance around sockets to allow the use of component extractors.

4. First, place the mixed analog/digital components (e.g., modem device, A/D converter, and D/A converter).
a) Orient the components so pins carrying digital signals extend onto the digital section and pins carrying analog

signals extend onto the analog section as much as possible.

b) Position the components to straddle the border between analog and digital sections.

5. Place all analog components.
a) Place the analog circuitry, including the DAA, on the same area of the PCB.
b) Place the analog components close to and on the side of board containing the TXA1_L1, TXA2_L1, RXA_L1,

VC_L1, and VREF signals.

c) Avoid placing noisy components and traces near TXA1_L1, TXA2_L1, RXA_L1, VC_L1, and VREF lines.

6. Place active digital components/circuits and decoupling capacitors.
a) Place digital components close together in order to minimize signal trace length.
b) Place 0.1 µF decoupling (bypass) capacitors close to the pins (usually power and ground) of the IC they are

decoupling. Make the smallest loop area possible between the capacitor and power/ground pins to reduce EMI.

c) Place host bus interface components close to the edge connector in accordance with the applicable bus interface

standard, e.g., the PCI Bus Specification.

d) Place crystal circuits as close as possible to the devices they drive.

7. Provide a “connector” component, usually a zero ohm resistor or a ferrite bead at one or more points on the PCB to
connect one section’s ground to another.

4.1.3 Signal Routing

1. Route the modem signals to provide maximum isolation between noise sources and noise sensitive inputs. When layout
requirements necessitate routing these signals together, they should be separated by neutral signals. The noise source,
neutral, and noise sensitive pins are listed in Table 4-1.

2. Keep digital signals within the digital section and analog signals within the analog section. (Previous placement of
isolation traces should prevent these traces from straying outside their respective sections.) Route the digital traces
perpendicular to the analog traces to minimize signal cross coupling.

3. Provide isolation traces (usually ground traces) to ensure that analog signals are confined to the analog section and
digital traces remain out of the analog section. A trace may have to be narrowed to route it though a mixed analog/digital
IC, but try to keep the trace continuous.

a) Route an analog isolation ground trace, at least 50 mil to 100 mil wide, around the border of the analog section; put

on both sides of the PCB.

b) Route a digital isolation ground trace, at least 50 mil to 100 mil wide, and 200 mil wide on one side of the PCB

edge, around the border of the digital section.

4. Keep host interface signals (e.g., AEN, IOR#, IOW#, HRESET) traces at least 10 mil thick (preferably 12 - 15 mil).

5. Keep analog signal (e.g., the TXA1_L1, TXA2_L1, RXA_L1, TELIN_L1, TELOUT_L1 , MIC_M, MIC_V, and
SPKROUT_M) traces at least 10 mil thick (preferably 12 - 15 mil).

6. Keep all other signal traces as wide as possible, at least 5 mil (preferably 10 mil).Route the signals between
components by the shortest possible path (the components should have been previously placed to allow this).

7. Route the traces between bypass capacitors to IC pins, at least 25 mil wide; avoid vias if possible.

8. Gather signals that pass between sections (typically low speed control and status signals) together and route them
between sections through a path in the isolation ground traces at one (preferred) or two points only. If the path is made
on one side only, then the isolation trace can be kept contiguous by briefly passing it to the other side of the PCB to
jump over the signal traces.

9. Avoid right angle (90 degree) turns on high frequency traces. Use smoothed radiuses or 45 degree corners.

4-2

ROCKWELL PROPRIETARY INFORMATION

1129

RCV56HCF PCI/CardBus Modem Designer’s Guide

10. Minimize the number of through-hole connections (feedthroughs/vias) on traces carrying high frequency signals.

11. Keep all signal traces away from crystal circuits.

12. Distribute high frequency signals continuously on a single trace rather than several traces radiating from one point.

13. Provide adequate clearance (e.g., 60 mil minimum) around feedthroughs in any internal planes in the DAA circuit.

14. Eliminate ground loops, which are unexpected current return paths to the power source.

4.1.4 Power

1. Identify digital power (VDD) and analog power (AVDD) supply connections.

2. Place a 10 µF electrolytic or tantalum capacitor in parallel with a ceramic 0.1 µF capacitor between power and ground at
one or more points in the digital section. Place one set nearest to where power enters the PCB (edge connector or
power connector) and place another set at the furthest distance from where power enters the PCB. These capacitors
help to supply current surge demands by the digital circuits and prevent those surges from generating noise on the
power lines that may affect other circuits.

3. For 2-layer boards, route a 200-mil wide power trace on two edges of the same side of the PCB around the border of
the circuits using the power. (Note that a digital ground trace should likewise be routed on the other side of the board.)

4. Generally, route all power traces before signal traces.

Table 4-1. Modem Pin Noise Characteristics

Device Function Noise Source Neutral Noise Sensitive

MDP VDD, VAA 13, 27, 40, 49, 63, 85-86
144-Pin TQFP GND, DGND, AGND 16, 39, 48, 81, 99

Crystal 87-88
Control 17, 35, 56, 68
Line Interface 31-32, 37, 47, 78 25-26, 29-30, 33-34,

Speaker Interface 38 28
Serial/LED Interface 7, 10-11, 64, 66, 82 9, 12, 67, 75, 77, 79
Host Interface 1-6, 89-98 80
MDP Interconnect 8, 18-24, 41-46, 50-55, 59-60, 62
Reserved or NC 14-15, 57-58, 61, 65, 69-74, 76, 83-

84, 100

36

1129

ROCKWELL PROPRIETARY INFORMATION

4-3

RCV56HCF PCI/CardBus Modem Designer’s Guide

4.1.5 Ground Planes

1. In a 2-layer design, provide digital and analog ground plane areas in all unused space around and under digital and
analog circuit components (exclusive of the DAA), respective, on both sides of the board, and connect them such a
manner as to avoid small islands. Connect each ground plane area to like ground plane areas on the same side at
several points and to like ground plane areas on the opposite side through the board at several points. Connect all
modem DGND pins to the digital ground plane area and AGND pins to the analog ground plane area. Typically,
separate the collective digital ground plane area from the collective analog ground plane area by a fairly straight gap.
There should be no inroads of digital ground plane area extending into the analog ground plane area or visa versa.

2. In a 4-layer design, provide separate digital and analog ground planes covering the corresponding digital and analog
circuits (exclusive of the DAA), respectively. Connect all modem DGND pins to the digital ground plane and AGND pins
to the analog ground plane. Typically, separate the digital ground plane from the analog ground plane by a fairly straight
gap.

3. In a design which needs EMI filtering, define an additional “chassis” section adjacent to the bracket end of a plug-in
card. Most EMI components (usually ferrite beads/capacitor combinations) can be positioned in this section. Fill the
unused space with a chassis ground plane, and connect it to the metal card bracket and any connector shields/grounds.

4. Keep the current paths of separate board functions isolated, thereby reducing the current's travel distance. Separate
board functions are: host interface, display, digital (SRAM, EPROM, modem), and DAA. Power and ground for each of
these functions should be separate islands connected together at the power and ground source points only.

5. Connect grounds together at only one point, if possible, using a ferrite bead. Allow other points for grounds to be
connected together if necessary for EMI suppression.

6. Keep all ground traces as wide as possible, at least 25 mil to 50 mil.

7. Keep the traces connecting all decoupling capacitors to power and ground at their respective ICs as short and as direct
(i.e., not going through vias) as possible.

4.1.6 Crystal Circuit

1. Keep all traces and component leads connected to crystal input and output pins (i.e., XTLI and XTLO) short in order to
reduce induced noise levels and minimize any stray capacitance that could affect the crystal oscillator. Keep the XTLO
trace extremely short with no bends greater than 45 degrees and containing no vias since the XTLO pin is connected to
a fast rise time, high current driver.

2. Where a ground plane is not available, such as in a 2-layer design, tie the crystal capacitors ground paths using
separate short traces (as wide as possible) with minimum angles and vias directly to the corresponding device digital
ground pin nearest the crystal pins.

3. Connect crystal cases(s) to ground (if applicable).

4. Place a 100-ohm (typical) resistor between the XTLO pin and the crystal/capacitor node.

5. Connect crystal capacitor ground connections directly to GND pin on the modem device. Do not use common ground
plane or ground trace to route the capacitor GND pin to the corresponding modem GND pin.

4.1.7 VC_L1 and VREF Circuit

1. Provide extremely short, independent paths for VC_L1 and VREF capacitor connections.
a) Route the connection from the plus terminal of the 10 µF VC_L1 capacitor and one terminal of the 0.1 µF VC_L1

capacitor to the modem device VC_L1 pin (pin 24) using a single trace isolated from the trace to the VC_L1 pin
from the VREF capacitors (see step d).

b) Route the connection from the negative terminal of the 10 µF VC_L1 capacitor and the other terminal of a the 0.1

µ

F VC_L1 capacitor to a ferrite bead. The bead should typically have characteristics such as: impedance = 70 Ω at
a frequency of 100 MHz , rated current = 200 mA, and maximum resistance = 0.5 Ω. Connect the other bead
terminal to the AGND pin (pin 34) with a single trace.

c) Route the connection from the plus terminal of the 10 µF VREF capacitor and one terminal of the 0.1 µF VREF

capacitor to the modem device VREF pin (pin 25) with a single trace.

d) Route the connection from the negative terminal of 10 µF VREF capacitor and the other terminal of the 0.1 µF

VREF capacitor to the modem device VC_L1 pin (pin 24) with a single trace isolated from the trace to the VC_L1
pin from the VC_L1 capacitors (see step a).

4-4

ROCKWELL PROPRIETARY INFORMATION

1129

RCV56HCF PCI/CardBus Modem Designer’s Guide

4.1.8 Telephone and Local Handset Interface

1. Place common mode chokes in series with Tip and Ring for each connector.

2. Decouple the telephone line cables at the telephone line jacks. Typically, use a combination of series inductors, common
mode chokes, and shunt capacitors. Methods to decouple telephone lines are similar to decoupling power lines,
however, telephone line decoupling may be more difficult and deserves additional attention. A commonly used design
aid is to place footprints for these components and populate as necessary during performance/EMI testing and
certification.

3. Place high voltage filter capacitors (.001 µF @1KV) from Tip and Ring to digital ground.

4.1.9 Optional Configurations

Because fixed requirements of a design may alter EMI performance, guidelines that work in one case may deliver little or no
performance enhancement in another. Initial board design should, therefore, include flexibility to allow evaluation of optional
configurations. These optional configurations may include:

1. Chokes in Tip and Ring lines replaced with jumper wires as a cost reduction if the design has sufficient EMI margin.

2. Various grounding areas connected by tie points (these tie points can be short jumper wires, solder bridges between
close traces, etc.).

3. Develop two designs in parallel; one based on a 2-layer board and the other based on a 4-layer board. During the
evaluation phase, better performance of one design over another may result in quicker time to market.

4.1.10 MDP Specific

1. Locate the MDP device and all supporting analog circuitry, including the data access arrangement, on the same area of
the PCB.

2. Locate the analog components close to and on the side of board containing the TXA1_L1, TXA2_L1, RXA_L1,
TELIN_L1, TELOUT_L1 , MIC_M, MIC_V, and SPKROUT_M signals.

3. Avoid placing noisy components and traces near the TXA1_L1, TXA2_L1, RXA_L1, TELIN_L1, TELOUT_L1 , MIC_M,
MIC_V, and SPKROUT_M lines.

4. Route MDP modem interconnect signals by the shortest possible route avoiding all analog components.

5. Provide an RC network on the AVAA supply in the immediate proximity of the AVAA pin to filter out high frequency noise
above 115 kHz. A tantalum capacitor is recommended (especially in a 2-layer board design) for improved noise
immunity with a current limiting series resistor or inductor to the VCC supply which meets the RC filter frequency
requirements.

6. Provide a 0.1 µF ceramic decoupling capacitor to ground between the high frequency filter and the VAA pin.

7. Provide a 0.1 µF ceramic decoupling capacitor to ground between the VCC supply and the AVDD pin.

4.2 CRYSTAL/OSCILLATOR SPECIFICATIONS

Recommended surface-mount crystal specifications are listed in Table 4-2.
Recommended through-hole crystal specifications are listed in Table 4-3.

4.3 OTHER CONSIDERATIONS

The DAA design described in this designer's guide is a wet DAA, i.e., it requires line current to be present to pass the signal.
Therefore, if the modem is to be connected back-to-back by cable directly to another modem, the modems will not be able to
connect. The DAAs must be modified to operate dry, i.e., without line current, when used in this environment.

A complete schematic is available for the RCV56HCF Data/Fax Modem PCI Half Card Reference Design (TR04-D380).

1129

ROCKWELL PROPRIETARY INFORMATION

4-5

RCV56HCF PCI/CardBus Modem Designer’s Guide

Table 4-2. Crystal Specifications - Surface Mount

Characteristic Value

Rockwell Part No. 5333R02-020

Electrical

Frequency 28.224 MHz nom.
Frequency Tolerance ±50 ppm (CL = 16.5 and 19.5 pF)

Frequency Stability

vs. Temperature ±35 ppm (0°C to 70°C)

vs. Aging ±15 ppm/4 years
Oscillation Mode Fundamental
Calibration Mode Parallel resonant
Load Capacitance, C

Shunt Capacitance, C
Series Resistance, R
Drive Level 100µW correlation; 300µW max.

Operating Temperature 0°C to 70°C
Storage Temperature –40°C to 85°C

Mechanical

Dimensions (L x W x H) 7.5 x 5.2 x 1.3 mm max.
Mounting SMT
Holder Type None

18 pF nom.

L

7 pF max.

O

60 Ω max. @20 nW drive level

1

Suggested Suppliers

KDS America
ILSI America
Vectron Technologies, Inc.

Notes

1. Characteristics @ 25°C unless otherwise noted.

2. Supplier Information:
KDS America

Fountain Valley, CA 92626
[phone]

ILSI America
Kirkland, WA 98033
(206) 828 - 4886

Vectron Technologies, Inc.
Lowell, NH 03051
[phone]

Toyocom U.S.A., Inc.
Costa Mesa, CA
[phone]

4-6

ROCKWELL PROPRIETARY INFORMATION

1129

RCV56HCF PCI/CardBus Modem Designer’s Guide

Table 4-3. Crystal Specifications - Through Hole

Characteristic Value

Rockwell Part No. 333R44-011

Electrical

Frequency 28.224 MHz nom.
Frequency Tolerance ±50 ppm (CL = 16.5 and 19.5 pF)

Frequency Stability

vs. Temperature ±30 ppm (0°C to 70°C)

vs. Aging ±20 ppm/5 years
Oscillation Mode Fundamental
Calibration Mode Parallel resonant
Load Capacitance, C

Shunt Capacitance, C
Series Resistance, R
Drive Level 100µW correlation; 500µW max.

Operating Temperature 0°C to 70°C
Storage Temperature –40°C to 85°C

Mechanical

Dimensions (L x W x H) 11.05 x 4.65 x 13.46 mm max.
Mounting Through Hole
Holder Type HC-49/U

L

1

18 pF nom.
7 pF max.

O

35 Ω max. @20 nW drive level

Suggested Suppliers

KDS America
ILSI America
Vectron Technologies, Inc.

Notes

1. Characteristics @ 25°C unless otherwise noted.

2. Supplier Information:

KDS America
Fountain Valley, CA 92626
[phone]

ILSI America
Kirkland, WA 98033
(206) 828 - 4886

Vectron Technologies, Inc.
Lowell, NH 03051
[phone]

Toyocom U.S.A., Inc.
Costa Mesa, CA
[phone]

1129

ROCKWELL PROPRIETARY INFORMATION

4-7

RCV56HCF PCI/CardBus Modem Designer’s Guide

4.4 PACKAGE DIMENSIONS

The package dimensions are shown in Figure 4-1 (144-pin TQFP) and Figure 4-2 (176-pin TQFP) .

D
D1
D2

PIN 1
REF

D

D1

D2

e

b

D1

DETAIL A

0.15

0.75

0.27

0.17

Inches*

Min.

0.0630 MAX

0.0020

0.0059

0.0551 REF

0.8563

0.8760

0.7874 REF

0.6890 REF

0.0197

0.0295

0.0394 REF

0.0197 BSC

0.0067

0.0106

0.0043

0.0067

0.0031 MAX

Max.

Millimeters

Min.

1.6 MAX

0.05

1.4 REF

21.75

20.0 REF

17.5 REF

0.5

1.0 REF

0.50 BSC

0.17

0.11

0.08 MAX

Max.

22.25

Dim.

A

D1

A2

A

c

A1

L

A1
A2
D
D1
D2
L
L1
e
b
c
Coplanarity

Ref: 144-PIN TQFP (GP00-D252)

* Metric values (millimeters) should be used for
PCB layout. English values (inches) are
converted from metric values and may include
round-off errors.

L1

DETAIL A

PD-TQFP-144 (040395)

4-8

Figure 4-1. Package Dimensions - 144-Pin TQFP

ROCKWELL PROPRIETARY INFORMATION

1129

RCV56HCF PCI/CardBus Modem Designer’s Guide

1129

Figure 4-2. Package Dimensions - 176-Pin TQFP

ROCKWELL PROPRIETARY INFORMATION

4-9

RCV56HCF PCI/CardBus Modem Designer’s Guide

This page is intentionally blank.

4-10

ROCKWELL PROPRIETARY INFORMATION

1129

RCV56HCF PCI/CardBus Modem Designer’s Guide

5. SOFTWARE INTERFACE

5.1 PCI Configuration Registers

The PCI Configuration registers are located in the BIF. Table 5-1 identifies the configuration register contents that are
supported in the BIF device:

Table 5-1. PCI Configuration Registers

Bit

Offset

(Hex)

0 Device ID Vendor ID
4 Status Command
8 Class Code Revision ID

C Not Implemented Header Type Latency Timer Not Implemented
10 Base Address 0 - Memory (BIF)
14 Unused Base Address Register
18 Unused Base Address Register

1C Unused Base Address Register

20 Unused Base Address Register
24 Unused Base Address Register
28 CIS Pointer

2C Subsystem ID Subsystem Vendor ID

30 Not Implemented
34 Reserved
38 Reserved

3C Max Latency Min Grant Interrupt Pin Interrupt Line

31:24 23:16 15:8 7:0

5.1.1 Vendor ID Field

This field is read-only and is loaded from the serial EEPROM after reset events. The default value for the Vendor ID is 127a.

5.1.2 Device ID Field

This field is read-only and is loaded from the serial EEPROM after reset events.

1129

ROCKWELL PROPRIETARY INFORMATION

5-1

RCV56HCF PCI/CardBus Modem Designer’s Guide

5.1.3 Command Register

The Command Register bits are described in Table 5-2.

Table 5-2. Command Register

Bit Description

0 Controls a device’s response to I/O Space accesses. A value of 0 disables the device response. A value of

1 allows the device to respond to I/O Space accesses. State after RST# is 0.

1 Controls a device’s response to Memory Space accesses. A value of 0 disables the device response. A

value of 1 allows the device to respond to Memory Space accesses. State after RST# is 0.

2 Controls a device’s ability to act as a master on the PCI bus. A value of 0 disables the device from

generating PCI accesses. A value of 1 allows the device to behave as a bus master. State after RST# is 0.
3 Not Implemented.
4 Not Implemented.
5 Not Implemented.
6 This bit controls the device’s response to parity errors. When the bit is set, the device must take its normal

action when a parity error is detected. When the bit is 0, the device must ignore any parity errors that it

detects and continue normal operation. This bit’s state after RST# is 0.
7 This bit is used to control whether or not a device does address/data stepping. This bit is read only from the

PCI interface. It is loaded from the serial EEPROM after RST#.
8 This bit is an enable bit for the SERR# driver. A value of 0 disables the SERR# driver. A value of 1 enables

the SERR# driver. This bit’s state after RST# is 0.
9 This bit controls whether or not a master can do fast back-to-back transactions to different devices. A value

of 1 means the master is allowed to generate fast back-to-back transactions to different agents as described

in Section 3.4.2 of the PCI 2.1 specification. A value of 0 means fast back-to-back transactions are only

allowed to the same agent. This bit’s state after RST# is 0.

10-15 Reserved

5.1.4 Status Register

The Status Register bits are described in Table 5-3.
Status register bits may be cleared by writing a ‘1’ in the bit position corresponding to the bit position to be cleared. It is not

possible to set a status register bit by writing from the PCI Bus. Writing a ‘0’ has no effect in any bit position.

Table 5-3. Status Register

Bit Description

0-4 Reserved

5 Not Implemented.
6 Not Implemented.
7 Not Implemented.
8 This bit is only implemented by bus masters. It is set when three conditions are met: 1) the bus agent

asserted PERR# itself or observed PERR# asserted; 2) the agent setting the bit acted as the bus master for
the operation in which the error occurred; and 3) the Parity Error Response bit (Command Register) is set.

9-10 These bits encode the timing of DEVSEL#. These are encoded as 00 for fast, 01 for medium, and 10 for slow

(11 is reserved.) These bits are read-only and must indicate the slowest time that a device asserts DEVSEL#

for any bus command except Configuration Read and Configuration Write.
11 Not Implemented.
12 This bit must be set by a master device whenever its transaction is terminated with Target-Abort. All master

devices must implement this bit.
13 This bit must be set by a master device whenever its transaction (except for Special Cycle) is terminated with

Master-Abort. All master devices must implement this bit.
14 This bit must be set whenever the device asserts SERR#. Devices which will never assert SERR# do not

need to implement this bit.
15 This bit must be set by the device whenever it detects a parity error, even if parity error handling is disabled

(as controlled by bit 6 in the Command register).

5-2

ROCKWELL PROPRIETARY INFORMATION

1129

RCV56HCF PCI/CardBus Modem Designer’s Guide

5.1.5 Revision ID Field

Initial part hardwired to 00.

5.1.6 Class Code Field

Hardwired to 0x078000 to indicate communications controller.

5.1.7 Latency Timer Register

The Latency Timer register specifies, in units of PCI bus clocks, the value of the Latency Timer for this PCI bus master. This
register has 5 read/write bits (MSBs) plus 3 bits of hardwired zero (LSBs). The Latency Timer Register is loaded into the PCI
Latency counter each time FRAME# is asserted to determine how long the master is allowed to retain control of the PCI bus.
This register is loaded by system software. The default value for Latency Timer is 00.

5.1.8 Header Type Field

Hardwired to 00.

5.1.9 CIS Pointer Register

This register points to the CIS memory located in the BIF’s memory space.

5.1.10 Subsystem Vendor ID and Subsystem ID Registers

Subsystem Vendor ID and Subsystem ID are optional registers that are implemented in this design. Both registers are
loaded from the serial EEPROM after RST#.

5.1.11 Interrupt Line Register

The Interrupt Line register is an eight bit register that is read/write. POST software will write the value of this register as it
initializes and configures the system. The value in this register indicates which of the system interrupt controllers the device’s
interrupt pin is connected to.

5.1.12 Interrupt Pin Register

The Interrupt Pin register tells which interrupt pin the device uses. The value of this register will be 0x01, indicating that
INTA# will be used.

5.1.13 Min Grant and Max Latency Registers

The Min Grant and Max Latency registers are used to specify the devices desired settings for Latency Timer values. For
both registers, the value specifies a period of time in units of ¼ microsecond. Min Grant is used for specifying the desired
burst period assuming a 33 MHz clock. Min Latency specifies how often the device needs to gain access to the PCI bus.
These registers are loaded from the serial EEPROM after RST#.

5.2 BASE ADDRESS REGISTER

BIF provides a single Base Address Register. The Base Address Register is a 32 bit register that is used to access the BIF
register set. Bits 3:0 are hard-wired to 0 to indicate memory space. Bits 15-4 will be hard-wired to 0. The remaining bits (31 -

16) will be read/write. This specifies that this device requires a 64k byte address space. After reset, the Base Address
Register contains 0x00000000.

The 64k byte address space used by the BIF is divided into 4k byte regions. Each 4k byte region is used as Table 5-4.

Table 5-4. BIF Address Map

Address

[15:12]

0x0 0x0-0xfff BASIC2 Registers Buffers, control, and status registers
0x1 0x0-0xfff CIS Memory Data loaded from Serial EEPROM for Card Bus applications
0x2 0x0-0xfff DSP Scratch Pad Access to DSP scratch page registers
0x3 0x0-0xfff Reserved
0x4 0x0-0xfff Reserved
0x5-0xf 0x0-0xfff Reserved.

Address

[11:0]

Region Name Description

1129

ROCKWELL PROPRIETARY INFORMATION

5-3

RCV56HCF PCI/CardBus Modem Designer’s Guide

5.3 SERIAL EEPROM INTERFACE

The serial EEPROM interface is used to load PCI configuration parameters and CIS information (required for Card Bus
operation) after a reset occurs. The PCI configuration information to be loaded requires 10 bytes of data. The CIS
information requires 384 bytes of data. The minimum serial EEPROM size is 512 bytes (4096 bits). After the PCI reset signal
is negated, the configuration data is read from the serial EEPROM and stored in the PCI configuration registers as required,
then the CIS information is read from the serial EEPROM and stored in the internal RAM of the BIF. While the serial
EEPROM data is being read and is being loaded in the configuration registers and the CIS RAM, any PCI access that occurs
will receive a RETRY signal from the BIF device. After completion of the serial EEPROM reads, the BIF device will accept
PCI transactions.

The data stored in the serial EEPROM is in 16 bit word format. The configuration data to be read from the serial EEPROM is
shown in Table 5-5.

Table 5-5. EEPROM Configuration Data

EEPROM Address Copied to

0x0 Configuration Register Device ID
0x1 Configuration Register Vendor ID
0x2 Configuration Register Subsystem Device ID
0x3 Configuration Register Subsystem Vendor ID
0x4 (LSBs) Configuration Register Min Grant
0x4 (MSBs) Configuration Register Max Latency
Beyond 0x4 CIS RAM

5-4

ROCKWELL PROPRIETARY INFORMATION

1129

RCV56HCF PCI/CardBus Modem Designer’s Guide

6. COMMAND SET

The commands for the different models are listed by functional use in Table 6-1and alphanumerically in Table 6-2.

Table 6-1. Command Set Summary - Functional Use Sort

Configuration

Command Description Data/Fax Data/Fax/Voice Data/Fax/Voice/

Speakerphone

Generic Modem Control

Z Reset to Default Configuration X X X X
+FCLASS Select Active Service Class X X X X
&F Set to Factory-Defined Configuration X X X X
I Request Identification Information X X X X
+GMI Request Manufacturer Identification X X X X
+GMM Request Model Identification X X X X
+GMR Request Revision Identification X X X X
+GSN Request Product Serial Number Identification X X X X
+GOI Request Global Object Identification X X X X
+GCAP Request Complete Capabilities List X X X X

DTE-Modem Interface

E Command Echo X X X X
Q Result Code Suppression X X X X
V Modem Response Format X X X X
X Result Code Selection and Call Progress

Monitoring Control

&C RLSD Behavior X X X X
&D DTR Behavior X X X X
+IFC DTE-Modem Local Flow Control X X X X
+ILRR DTE-Modem Local Rate Reporting X X X X
+H Enable/Disable Video Ready Mode X X X X

XXXX

Data/Fax/Voice/

Speakerphone/

ISDN

Dial Control

D Dial X X X X
T Select Tone Dial X X X X
P Select Pulse Dial X X X X
A Answer X X X X
H Hook Control X X X X
O Return to Online Data State X X X X
L Monitor Speaker Loudness X X X X
M Monitor Speaker Mode X X X X
&G Select Guard Tone X X X X
&P Select Pulse Dial Make/Break Ratio X X X X
&V Display Current Configuration X X X X
&W Store Current Configuration X X X X

Modulation Control

+MS Modulation Selection X X X X
+MR Modulation Reporting Control X X X X

Error Control

+ES Error Control and Synchronous Mode Selection X X X X
+EB Break Handling in Error Control operation X X X X
+ESR Selective Repeat X X X X
+EFCS 32-bit Frame Check Sequence X X X X
+ER Error Control Reporting X X X X
+ETBM Call Termination Buffer Management X X X X

1129

ROCKWELL PROPRIETARY INFORMATION

6-1

RCV56HCF PCI/CardBus Modem Designer’s Guide

Table 5-1. Command Set Summary - Functional Use Sort (Cont’d)

Configuration

Command Description Data/Fax Data/Fax/Voice Data/Fax/Voice/

Speakerphone

Data Compression

+DS Data Compression X X X X
+DR Data Compression Reporting X X X X
%E Enable/Disable Line Quality Monitor and Auto-

Retrain
%L Line Signal Level X X X X
%Q Line Signal Quality X X X X

V.8 and V.8 bis

+A8E V.8 and V.8bis Operation Control X X X X
+A8M Send V.8 Menu Signals X X X X
+A8T Send V.8bis Signal and/or Message(s) X X X X

Synchronous Mode Access

+ESA Synchronous Access Mode Configuration X X X X
+ITF Transmit Flow Control Thresholds X X X X

World-Class

*B Display Blacklisted Numbers X X X X
*D Display Delayed Numbers X X X X
+GCI Country of Installation X X X X

DSVD Control

-SSE Enable/Disable DSVD X X X X

Fax Commands

+FAE Data/fax Auto Answer X X X X
+FTS Stop Transmission and Pause X X X X
+FRS Wait for Silence X X X X
+FTM Transmit Data with <MOD> Carrier X X X X
+FRM Receive Data with <MOD> Carrier X X X X
+FTH Transmit HDLC Data with <MOD> Carrier X X X X
+FRH Receive HDLC Data with <MOD> Carrier X X X X
+FAR Adaptive Reception Control X X X X
+FCL Carrier Loss Timeout X X X X
+FDD Double Escape Character Replacement

Control
+FIT DTE Inactivity Timeout X X X X
+FPR Local DTE-Modem Serial Port Rate
+FMI Manufacturer Identification - X X X
+FMM Product Identification - X X X
+FMR Version, Revision, etc. - X X X
+FLO Flow Control - X X X

S-Parameters

S0 Automatic Answer X X X X
S1 Ring Counter X X X X
S2 Escape Character X X X X
S3 Command Line Termination Character X X X X
S4 Response Formatting Character X X X X
S5 Command Line Editing Character X X X X
S6 Pause Before Blind Dialing X X X X
S7 Connection Completion Timeout X X X X
S8 Comma Dial Modifier Time X X X X
S10 Automatic Disconnect Delay X X X X
S11 DTMF Tone Duration X X X X
S12 Escape Prompt Delay (EPD) X X X X
S29 Flash Dial Modifier Time X X X X

XXXX

XXXX

Data/Fax/Voice/

Speakerphone/

ISDN

6-2

ROCKWELL PROPRIETARY INFORMATION

1129

RCV56HCF PCI/CardBus Modem Designer’s Guide

Table 5-1. Command Set Summary - Functional Use Sort (Cont’d)

Configuration

Command Description Data/Fax Data/Fax/Voice Data/Fax/Voice/

Speakerphone

Voice Commands

+VCID Caller ID (CID) - X X X
+VDID DID Feature - X X X
+VNH Automatic Hang-up Control - X X X
+VIP Voice Initialize All Parameters - X X X
+VRX Start Modem Receive (Record) - X X X
+VTS Voice Tone Send - X X X
+VTX Start Modem Transmit (Playback) - X X X
+VGR Voice Gain Receive (Record Gain) - X X X
+VGT Voice Gain Transmit (Playback Volume) - X X X
+VIT Voice Inactivity Timer (DTE/modem) - X X X
+VLS0-15 Analog Source/Destination Selection - X X X
+VRA Ringback Goes Away Timer - X X X
+VRN Ringback Never Appeared Timer - X X X
+VSD Silence Detection (QUIET & SILENCE) - X X X
+VSM Compression Method Selection - X X X
+VTD Beep Tone Duration Timer - X X X
+VDR Distinctive Ring - X X X
+VDT Control Tone Cadence Reporting - X X X
+VBT Buffer Threshold Setting - X X X
+VPR Select DTE/Modem Interface Rate - X X X

Speakerphone Commands

+VSP Speakerphone ON/OFF - - X X
+VDX Speakerphone Duplex Mode - - X X
+VLS16-19 Speakerphone Signal Control - - X X
+VGM Microphone Gain
+VGS Speaker Gain - - X X

Data/Fax/Voice/

Speakerphone/

ISDN

1129

ROCKWELL PROPRIETARY INFORMATION

6-3

RCV56HCF PCI/CardBus Modem Designer’s Guide

Table 6-2. Command Set Summary - Alphanumeric Sort

Configuration

Command Description Data/Fax Data/Fax/Voice Data/Fax/Voice/

Speakerphone

%E Enable/Disable Line Quality Monitor and Auto-

Retrain
%L Line Signal Level X X X X
%Q Line Signal Quality X X X X
&C RLSD Behavior X X X X
&D DTR Behavior X X X X
&F Set to Factory-Defined Configuration X X X X
&G Select Guard Tone X X X X
&P Select Pulse Dial Make/Break Ratio X X X X
&V Display Current Configuration X X X X
&W Store Current Configuration X X X X
*B Display Blacklisted Numbers X X X X
*D Display Delayed Numbers X X X X
+A8E V.8 and V.8bis Operation Control X X X X
+A8M Send V.8 Menu Signals X X X X
+A8T Send V.8bis Signal and/or Message(s) X X X X
+DR Data Compression Reporting X X X X
+DS Data Compression X X X X
+EB Break Handling in Error Control operation X X X X
+EFCS 32-bit Frame Check Sequence X X X X
+ER Error Control Reporting X X X X
+ES Error Control and Synchronous Mode Selection X X X X
+ESA Synchronous Access Mode Configuration X X X X
+ESR Selective Repeat X X X X
+ETBM Call Termination Buffer Management X X X X
+FAE Data/fax Auto Answer X X X X
+FAR Adaptive Reception Control X X X X
+FCL Carrier Loss Timeout X X X X
+FCLASS Select Active Service Class X X X X
+FDD Double Escape Character Replacement

Control
+FIT DTE Inactivity Timeout X X X X
+FLO Flow Control - X X X
+FMI Manufacturer Identification - X X X
+FMM Product Identification - X X X
+FMR Version, Revision, etc. - X X X
+FPR Local DTE-Modem Serial Port Rate X X X X
+FRH Receive HDLC data with <MOD> carrier X X X X
+FRM Receive Data with <MOD> carrier X X X X
+FRS Wait for Silence X X X X
+FTH Transmit HDLC data with <MOD> carrier X X X X
+FTM Transmit Data with <MOD> carrier X X X X
+FTS Stop Transmission and Pause X X X X
+GCAP Request Complete Capabilities List X X X X
+GCI Country of Installation X X X X
+GMI Request Manufacturer Identification X X X X
+GMM Request Model Identification X X X X
+GMR Request Revision Identification X X X X
+GOI Request Global Object Identification X X X X
+GSN Request Product Serial Number Identification X X X X
+H Enable/Disable Video Ready Mode X X X X

XXXX

XXXX

Data/Fax/Voice/

Speakerphone/

ISDN

6-4

ROCKWELL PROPRIETARY INFORMATION

1129

RCV56HCF PCI/CardBus Modem Designer’s Guide

Table 5-2. Command Set Summary - Alphanumeric Sort (Cont’d)

Configuration

Command Description Data/Fax Data/Fax/Voice Data/Fax/Voice/

Speakerphone

+IFC DTE-Modem Local Flow Control X X X X
+ILRR DTE-Modem Local Rate Reporting X X X X
+ITF Transmit Flow Control Thresholds X X X X
+MR Modulation Reporting Control X X X X
+MS Modulation Selection X X X X
+VBT Buffer Threshold Setting - X X X
+VCID Caller ID (CID) - X X X
+VDID DID Feature - X X X
+VDR Distinctive Ring - X X X
+VDT Control Tone Cadence Reporting - X X X
+VDX Speakerphone Duplex Mode - - X X
+VGM Microphone Gain - - X X
+VGR Voice Gain Receive (Record Gain) - X X X
+VGS Speaker Gain - - X X
+VGT Voice Gain Transmit (Playback Volume) - X X X
+VIP Voice Initialize All Parameters - X X X
+VIT Voice Inactivity Timer (DTE/modem) - X X X
+VLS Analog Source/Destination Selection - X X X
+VNH Automatic Hang-up control - X X X
+VPR Select DTE/Modem Interface Rate - X X X
+VRA Ringback Goes Away Timer - X X X
+VRN Ringback Never Appeared Timer - X X X
+VRX Start Modem Receive (Record) - X X X
+VSD Silence Detection (QUIET & SILENCE) - X X X
+VSM Compression Method Selection - X X X
+VSP Speakerphone ON/OFF - - X X
+VTD Beep Tone Duration Timer - X X X
+VTS Voice Tone Send - X X X
+VTX Start Modem Transmit (Playback) - X X X

-SSE Enable/Disable DSVD X X X X
A Answer X X X X
D Dial X X X X
E Command Echo X X X X
H Hook Control X X X X
I Request Identification Information X X X X
L Monitor Speaker Loudness X X X X
M Monitor Speaker Mode X X X X
O Return to Online Data State X X X X
P Select Pulse Dial X X X X
Q Result Code Suppression X X X X

Data/Fax/Voice/

Speakerphone/

ISDN

1129

ROCKWELL PROPRIETARY INFORMATION

6-5

RCV56HCF PCI/CardBus Modem Designer’s Guide

Table 5-2. Command Set Summary - Alphanumeric Sort (Cont’d)

Configuration

Command Description 1- Data/Fax 2- Plus Voice 3- Plus SP 5- Plus ISDN

S0 Number of Rings to Automatic Answer X X X X
S1 Ring Counter X X X X
S2 Escape Character X X X X
S3 Line Termination Character X X X X
S4 Response Formatting Character X X X X
S5 Command Line Editing Character X X X X
S6 Pause Before Blind Dialing X X X X
S7 Connection Completion Timeout X X X X
S8 Comma Dial Modifier Time X X X X
S10 Automatic Disconnect Delay X X X X
S11 DTMF Tone Duration X X X X
S12 Escape Prompt Delay (EPD) X X X X
S29 Flash Dial Modifier Time X X X X
T Select Tone Dial X X X X
V Modem Response Format X X X X
X Result Code Selection and Call Progress

Monitoring Control
Z Reset To Default Configuration X X X X

XXXX

6-6

ROCKWELL PROPRIETARY INFORMATION

1129

NOTES

(Inside Back Cover)

Headquarters

Rockwell Semiconductor Systems
4311 Jamboree Road,
P.O. Box C
Newport Beach, CA 92658-8902
Phone: [phone]
Fax: [phone]

European Headquarters

Rockwell Semiconductor Systems
S.A.R.L.
Les Taissounieres B1
Route des Dolines
Sophia Antipolis Cedex
06905 Valbonne
France
Phone: [phone]
Fax: [phone]

For more information:

Call 1-800-854-8099

International information:

Call 1-714-833-6996

URL Address:

http://www.nb.rockwell.com

E-Mail Address:

[e-mail]

©1997, Rockwell International Corporation
Printed in U.S.A.
All Rights Reserved

REGIONAL SALES OFFICES

US Southwest Office

Rockwell Semiconductor Systems
5000 Birch Street
Suite 400
Newport Beach, CA 92660
Phone: [phone]
Fax: [phone]

US Southwest Satellite Office

Rockwell Semiconductor Systems
1000 Business Center Circle
Suite 215
Thousand Oaks, CA 91320
Phone: [phone]
Fax: [phone]

US South Central Office

Rockwell Semiconductor Systems
2001 North Collins Blvd
Suite 103
Richardson, TX 75080
Phone: [phone]
Fax: [phone]

US Southeast Office

Rockwell Semiconductor Systems
900 Ashwood Parkway
Suite 400
Atlanta, GA 30338
Phone: [phone]
Fax: [phone]

US Southeast Satellite Office

Rockwell Semiconductor Systems
One Prestige Place
2600 McCormick Drive
Suite 350
Clearwater, FL 34619
Phone: [phone]
Fax: [phone]

US Northwest Office

Rockwell Semiconductor Systems
US Northwest Office
3600 Pruneridge Avenue
Suite 100
Santa Clara, CA 95051
Phone: [phone]
Fax: [phone]

US North Central Office

Rockwell Semiconductor Systems
Two Pierce Place
Chancellory Park
Suite 810
Itasca, IL 60143
Phone: [phone]
Fax: [phone]

US Northeast Office

Rockwell Semiconductor Systems
239 Littleton Road
Suite 4A
Westford, MA 01886
Phone: [phone]
Fax: [phone]

Australia

Rockwell Semiconductor Systems
Rockwell Australia Pty Limited
Suite 603, 51 Rawson Street
Epping, NSW 2121
Australia
Phone: [phone]
Fax: [phone]

Europe Mediterranean

Rockwell Semiconductor Systems
c/o Rockwell Automation S.r.l.
Via Di Vittorio, 1
20017 Mazzo Di Rho (MI)
Italy
Phone: [phone]
Fax [phone]

Europe North

Rockwell Semiconductor Systems, Ltd.
Berkshire Court
Western Road
Bracknell
Berkshire RG12 1RE
England
Phone: [phone]
Fax: [phone]

Europe South

Rockwell Semiconductor Systems
S.A.R.L.
Tour GAN
Cedex 13
92082 Paris La Defense 2
France
Phone: [phone]
Fax: [phone]

Germany

Rockwell Semiconductor Systems
Rockwell Int'l GmbH Germany
Paul-Gerhardt-Allee 50 a
81245 Munchen
Germany
Phone: [phone]
Fax: [phone]

Hong Kong

Rockwell Int'l (Asia Pacific) Ltd.
13th Floor, Suites 8-10,
Harbour Centre
25 Harbour Road
Wanchai,
Hong Kong
Phone: [phone]
Fax: [phone]

Japan

Rockwell Int'l Japan Co., Ltd.
Shimomoto Bldg
1-46-3 Hatsudai, Shibuya-ku
Tokyo, 151
Japan
Phone: [phone]
Fax: [phone]

Korea

Rockwell-Collins Int'l, Inc.
Room No. 1508
Korea Textile Centre Building
944-31, Daechi-3dong
Kangnam P.O. Box 2037
Kangnam-ku
Seoul
Korea
Phone: [phone]
Fax: [phone]

Singapore

Rockwell Semiconductor Systems
Singapore Branch
1 Kim Seng Promenade
#09-01 Great World City East Tower
Singapore 237994
Phone: [phone]
Fax: [phone]

Taiwan

Rockwell Int'l Taiwan Company, Ltd.
Room 2808 International Trade Bldg.
333, Keelung Road, Section I
Taipei,
Taiwan
10548 ROC
Phone: [phone]
Fax: [phone]

SOUD071697