SEMICONDUCTOR
8-29
August 1997
HIN230 thru HIN241
+5V Powered RS-232 Transmitters/Receivers
Features
• Meets All RS-232E and V.28 Specifications
• Requires Only Single +5V Power Supply
- (+5V and +12V - HIN231 and HIN239)
• HIN233 and HIN235 Require No External Capacitors
• Onboard Voltage Doubler/Inverter
• Low Power Consumption
• Low Power Shutdown Function
• Three-State TTL/CMOS Receiver Outputs
• Multiple Drivers
- ±10V Output Swing for +5V lnput
- 300Ω Power-Off Source Impedance
- Output Current Limiting
- TTL/CMOS Compatible
- 30V/µs Maximum Slew Rate
• Multiple Receivers
- ±30V Input Voltage Range
-3kΩ to 7kΩ Input Impedance
- 0.5V Hysteresis to Improve Noise Rejection
Description
The HIN230-HIN241 family of RS-232 transmitters/receivers
interface circuits meet all ElA RS-232E and V.28 specifications,
and are particularly suited for those applications where ±12V is
not available. They require a single +5V power supply (except
HIN231 and HIN239) and features onboard charge pump voltage converters which generate +10V and -10V supplies from
the 5V supply. The HIN233 and HIN235 require no external
capacitors and are ideally suited for applications where circuit
board space is critical. The family of devices offer a wide v ariety
of RS-232 transmitter/receiver combinations to accommodate
various applications (see Selection Table).
The drivers feature true TTL/CMOS input compatibility, slewrate-limited output, and 300Ω power-off source impedance.
The receivers can handle up to ±30V, and have a 3kΩ to 7kΩ
input impedance. The receivers also feature hysteresis to
greatly improve noise rejection.
Applications
• Any System Requiring RS-232 Communications Port
- Computer - Portable, Mainframe, Laptop
- Peripheral - Printers and Terminals
- Instrumentation
- Modems
Selection Table
PART
NUMBER
POWER SUPPLY
VOLTAGE
NUMBER OF
RS-232
DRIVERS
NUMBER OF
RS-232
RECEIVERS
EXTERNAL
COMPONENTS
LOW POWER
SHUTDOWN/TTL
THREE-ST ATE
NUMBER OF
LEADS
HIN230 +5V 5 0 4 Capacitors YES/NO 20
HIN231 +5V and +7.5V to 13.2V 2 2 2 Capacitors NO/NO 16
HIN232 +5V 2 2 4 Capacitors NO/NO 16
HIN233 +5V 2 2 None NO/NO 20
HIN234 +5V 4 0 4 Capacitors NO/NO 16
HIN235 +5V 5 5 None YES/YES 24
HIN236 +5V 4 3 4 Capacitors YES/YES 24
HIN237 +5V 5 3 4 Capacitors NO/NO 24
HIN238 +5V 4 4 4 Capacitors NO/NO 24
HIN239 +5V and +7.5V to 13.2V 3 5 2 Capacitors NO/YES 24
HIN240 +5V 5 5 4 Capacitors YES/YES 44
HIN241 +5V 4 5 4 Capacitors YES/YES 28
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
© Harris Corporation 1997
File Number 3138.4
8-30
Ordering Information
Pin Descriptions
PART
NUMBER
TEMP.
RANGE (oC) PACKAGE PKG. NO.
HIN230CB 0 to 70 20 Ld SOIC M20.3
HIN230IB -40 to 85 20 Ld SOIC M20.3
HIN230BY Die
HIN231CB 0 to 70 16 Ld SOIC M16.3
HIN231IB -40 to 85 16 Ld SOIC M16.3
HIN231BY Die
HIN232CP 0 to 70 16 Ld PDIP E16.3
HIN232CB 0 to 70 16 Ld SOIC M16.3
HIN232IP -40 to 85 16 Ld PDIP E16.3
HIN232IJ -40 to 85 16 Ld CERDIP F16.3
HIN232IB -40 to 85 16 Ld SOIC M16.3
HIN232MJ -55 to 125 16 Ld CERDIP F16.3
HIN232BY Die
HIN233CP 0 to 70 20 Ld PDIP E20.3
HIN234CB 0 to 70 16 Ld SOIC M16.3
HIN234IB -40 to 85 16 Ld SOIC M16.3
HIN234BY Die
HIN235CP 0 to 70 24 Ld PDIP E24.3
HIN236CP 0 to 70 24 Ld PDIP E24.3
HIN236CB 0 to 70 24 Ld SOIC M24.3
HIN236IP -40 to 85 24 Ld PDIP E24.3
HIN236IB -40 to 85 24 Ld SOIC M24.3
HIN236BY Die
HIN237CP 0 to 70 24 Ld PDIP E24.3
HIN237CB 0 to 70 24 Ld SOIC M24.3
HIN237IP -40 to 85 24 Ld PDIP E24.3
HIN237IB -40 to 85 24 Ld SOIC M24.3
HIN237BY Die
HIN238CP 0 to 70 24 Ld PDIP E24.3
HIN238CB 0 to 70 24 Ld SOIC M24.3
HIN238IP -40 to 85 24 Ld PDIP E24.3
HIN238IB -40 to 85 24 Ld SOIC M24.3
HIN238BY Die
HIN239CB 0 to 70 24 Ld SOIC M24.3
HIN239IB -40 to 85 24 Ld SOIC M24.3
HIN239BY Die
HIN240CN 0 to 70 44 Ld MQFP Q44.10X10
HIN240IN -40 to 85 44 Ld MQFP Q44.10X10
HIN240BY Die
HIN241CB 0 to 70 28 Ld SOIC M28.3
HIN241IB -40 to 85 28 Ld SOIC M28.3
HIN241CA 0 to 70 28 Ld SSOP M28.209
HIN241IA -40 to 85 28 Ld SSOP M28.209
HIN241BY Die
PART
NUMBER
TEMP.
RANGE (oC) PACKAGE PKG. NO.
PIN FUNCTION
V
CC
Power Supply Input 5V ±10%. HIN233 and HIN235 5V ±5%.
V+ Internally generated positive supply (+10V nominal), HIN231 and HIN239 requires +7.5V to +13.2V.
V- Internally generated negative supply (-10V nominal).
GND Ground lead. Connect to 0V.
C1+ External capacitor (+ terminal) is connected to this lead.
C1- External capacitor (- terminal) is connected to this lead.
C2+ External capacitor (+ terminal) is connected to this lead.
C2- External capacitor (- terminal) is connected to this lead.
T
IN
Transmitter Inputs. These leads accept TTL/CMOS levels. An internal 400kΩ pull-up resistor to VCCis
connected to each lead.
T
OUT
Transmitter Outputs. These are RS-232 levels (nominally ±10V).
R
IN
Receiver Inputs. These inputs accept RS-232 input levels. An internal 5kΩ pull-down resistor to GND is connected
to each input.
R
OUT
Receiver Outputs. These are TTL/CMOS levels.
EN Enable input. This is an active low input which enables the receiver outputs. With EN = 5V, the outputs are placed
in a high impedance state.
SD Shutdown Input. With SD = 5V, the charge pump is disabled, the receiver outputs are in a high impedance state and
the transmitters are shut off.
NC No Connect. No connections are made to these leads.
HIN230 thru HIN241
8-31
Pinouts
HIN230 (SOIC)
TOP VIEW
HIN231 (SOIC)
TOP VIEW
T3
OUT
T1
OUT
T2
OUT
T2
IN
T1
IN
GND
C1+
V
CC
V+
C1-
T4
OUT
NC
SHUTDOWN
T5
OUT
T5
IN
T4
IN
T3
IN
VC2C2+
11
12
13
14
15
16
17
18
20
19
10
9
8
7
6
5
4
3
2
1
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
C+
C-
V-
T2
OUT
R2
IN
NC
T2
IN
V+
GND
T1
OUT
R1
IN
R1
OUT
T1
IN
NC
V
CC
R2
OUT
V
CC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1
OUT
T2
OUT
T3
OUT
T4
OUT
T5
OUT
T5
IN
T4
IN
T1
IN
T2
IN
T3
IN
T1
T2
T3
T4
T5
+5V
400kΩ
+5V
+
1µF
+
1µF
+
1µF
5
4
2
3
14 1
15 20
1619
8
10
9
13
V+
V-
C1+
C1C2+
C2-
17
SHUTDOWN
7
+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
+
1µF
11
12
6
V
CC
+5V
16
V+
+7.5V TO +13.2V
15
T1
OUT
T2
OUT
T1
IN
T2
IN
T1
T2
10
7
13
4
+5V
400kΩ
+5V
400kΩ
R1
OUT
R1
IN
R1
1211
5kΩ
R2
OUT
R2
IN
R2
56
5kΩ
+12V TO -12V
VOLTAGE INVERTER
1µF
3
V-
C+
C-
+
1µF
1
2
+
14
HIN230 thru HIN241
8-32
HIN232 (PDIP, CERDIP, SOIC)
TOP VIEW
HIN233 (PDIP, SOIC)
TOP VIEW
Pinouts
(Continued)
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
C1+
V+
C1-
C2+
C2-
R2
IN
T2
OUT
V
CC
T1
OUT
R1
IN
R1
OUT
T1
IN
T2
IN
R2
OUT
GND
V-
11
12
13
14
15
16
17
18
20
19
10
9
8
7
6
5
4
3
2
1
T2
IN
T1
IN
R1
OUT
R1
IN
T1
OUT
GND
(V+) C1+
V
CC
GND
(V-) C2-
R2
OUT
T2
OUT
VC2-
R2
IN
C2+
V+ (C1-)
C1- (C1+)
V- (C2+)
C2+ (C2-)
NOTE: Pin numbers in parentheses are for SOIC Package.
V
CC
+5V
2
V+
16
T1
OUT
T2
OUT
T1
IN
T2
IN
T1
T2
11
10
14
7
+5V
400kΩ
+5V
400kΩ
R1
OUT
R1
IN
R1
1312
5kΩ
R2
OUT
R2
IN
R2
89
5kΩ
+10V TO -10V
VOLTAGE INVERTER
1µF
6
V-
C2+
C2-
+
1µF
4
5
+5V TO 10V
VOLTAGE INVERTER
C1+
C1-
+
1µF
1
3
+
1µF
+
+
1µF
15
6
V
CC
T1
OUT
T2
OUT
R1
OUT
R2
IN
T1
IN
T2
IN
R1
IN
T1
+5V
+
0.1µF
4
5
1
2
18
14 (8)
19
8 (13)
12 (10)
V+
V-
C1+
C1-
C2+
C2-
+5V
400kΩ
GND
9
GND
17
R2
OUT
NO
CONNECT
INTERNAL
-10V
SUPPLY
INTERNAL
+10V
SUPPLY
V-
C2+
C2-
13 (14)
5kΩ
6
20
11 (12)
15
16
10 (11)
3
T2
+5V
400kΩ
5kΩ
HIN230 thru HIN241
8-33
HIN234 (SOIC)
TOP VIEW
HIN235 (PDIP)
TOP VIEW
Pinouts
(Continued)
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
T1
OUT
T2
OUT
T2
IN
T1
IN
GND
V+
C1+
T3
OUT
T4
IN
T3
IN
VC2C2+
C1-
T4
OUT
V
CC
1
2
3
4
5
6
7
8
9
10
11
12
T4
OUT
T3
OUT
T1
OUT
T2
OUT
R2
IN
R2
OUT
T2
IN
T1
IN
R1
OUT
R1
IN
GND
V
CC
16
17
18
19
20
21
22
23
24
15
14
13
R3
IN
T5
IN
SD
EN
T5
OUT
R4
OUT
T3
IN
R5
OUT
R5
IN
R3
OUT
R4
IN
T4
IN
6
V
CC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1
OUT
T2
OUT
T3
OUT
T4
OUT
T4
IN
T1
IN
T2
IN
T3
IN
T1
T2
T3
T4
+5V
+
1µF
+
1µF
+
1µF
4
3
1
2
13 16
14 15
7
9
8
12
V+
V-
C1+
C1C2+
C2-
+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
+
1µF
10
11
5
12
V
CC
T1
OUT
T1
IN
T1
+5V
+
0.1µF
6
2
3
18
1
19
24
10
400kΩ
13
14
R1
OUT
R1
IN
R1
4
5
R2
OUT
R2
IN
R2
23
22
R3
OUT
R3
IN
R3
16
17
21
20
+5V
T2
OUT
T2
IN
+5V
T3
OUT
T3
IN
+5V
T4
OUT
T4
IN
+5V
T5
OUT
T5
IN
+5V
400kΩ
400kΩ
400kΩ
400kΩ
T2
T3
T4
T5
GND
9
R4
IN
R5
IN
R4
R5
11
15
7
8
R4
OUT
R5
OUT
EN
SD
5kΩ
5kΩ
5kΩ
5kΩ
5kΩ
HIN230 thru HIN241
8-34
HIN236 (PDIP, SOIC)
TOP VIEW
HIN237 (PDIP, SOIC)
TOP VIEW
Pinouts
(Continued)
T3
OUT
T1
OUT
T2
OUT
R1
IN
R1
OUT
T2
IN
T1
IN
GND
V
CC
C1+
V+
C1-
T4
OUT
R2
OUT
SHUTDOWN
EN
T4
IN
R3
OUT
VC2C2+
R2
IN
T3
IN
R3
IN
1
2
3
4
5
6
7
8
9
10
11
12
16
17
18
19
20
21
22
23
24
15
14
13
T3
OUT
T1
OUT
T2
OUT
R1
IN
R1
OUT
T2
IN
T1
IN
GND
V
CC
C1+
V+
C1-
T4
OUT
R2
OUT
T5
IN
T5
OUT
T4
IN
R3
OUT
VC2C2+
R2
IN
T3
IN
R3
IN
1
2
3
4
5
6
7
8
9
10
11
12
16
17
18
19
20
21
22
23
24
15
14
13
9
V
CC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1
OUT
T2
OUT
T3
OUT
T4
OUT
T4
IN
T1
IN
T2
IN
T3
IN
T1
T2
T3
T4
+5V
+
1µF
+
1µF
+
1µF
7
6
2
3
18 1
19 24
10
12
11
15
V+
V-
C1+
C1C2+
C2-
+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
+
1µF
13
14
R1
OUT
R1
IN
R1
45
5kΩ
R2
OUT
R2
IN
R2
2322
5kΩ
R3
OUT
R3
IN
R3
1617
5kΩ
EN
20
21
SHUTDOWN
8
9
V
CC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1
OUT
T2
OUT
T3
OUT
T4
OUT
T4
IN
T1
IN
T2
IN
T3
IN
T1
T2
T3
T4
+5V
+
1µF
+
1µF
+
1µF
7
6
2
3
18 1
19 24
10
12
11
15
V+
V-
C1+
C1C2+
C2-
+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
+
1µF
13
14
R1
OUT
R1
IN
R1
45
5kΩ
R2
OUT
R2
IN
R2
2322
5kΩ
R3
OUT
R3
IN
R3
1617
5kΩ
T5
OUT
T5
IN
T5
21 20
+5V
400kΩ
8
HIN230 thru HIN241
8-35
HIN238 (PDIP, SOIC)
TOP VIEW
HIN239 (SOIC)
TOP VIEW
Pinouts
(Continued)
T2
OUT
T1
OUT
R2
IN
R2
OUT
T1
IN
R1
OUT
R1
IN
GND
V
CC
C1+
V+
C1-
T3
OUT
R3
OUT
T4
IN
T4
OUT
T3
IN
R4
OUT
VC2C2+
R3
IN
T2
IN
R4
IN
1
2
3
4
5
6
7
8
9
10
11
12
16
17
18
19
20
21
22
23
24
15
14
13
R1
OUT
R1
IN
GND
V
CC
V+
C1+
C1-
V-
R5
IN
R5
OUT
R4
OUT
R4
IN
T1
IN
R2
OUT
R2
IN
T2
OUT
T1
OUT
R3
OUT
NC (NOTE)
EN
T3
OUT
T2
IN
R3
IN
T3
IN
1
2
3
4
5
6
7
8
9
10
11
12
16
17
18
19
20
21
22
23
24
15
14
13
NOTE: No Connect
9
V
CC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1
OUT
T2
OUT
T3
OUT
T4
OUT
T4
IN
T1
IN
T2
IN
T3
IN
T1
T2
T3
T4
+5V
+
1µF
+
1µF
+
1µF
5
18
2
1
19 24
21 20
10
12
11
15
V+
V-
C1+
C1C2+
C2-
+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
+
1µF
13
14
R1
OUT
R1
IN
R1
76
5kΩ
R2
OUT
R2
IN
R2
34
5kΩ
R3
OUT
R3
IN
R3
2322
5kΩ
R4
OUT
R4
IN
R4
1617
5kΩ
8
4
V
CC
+10V TO -10V
VOLTAGE INVERTER
T1
OUT
T2
OUT
T3
OUT
T1
IN
T2
IN
T3
IN
T1
T2
T3
+5V
+
1µF
+
1µF
24
23
19
20
16 13
6
7
5
8
V+
C1+
C1-
+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
R1
OUT
R1
IN
R1
2
5kΩ
R2
OUT
R2
IN
R2
2122
5kΩ
R3
OUT
R3
IN
R3
1817
5kΩ
R4
OUT
R4
IN
R4
1211
5kΩ
R5
OUT
R5
IN
R5
910
5kΩ
EN
14
1
+7.5V TO +13.2V
V-
3
HIN230 thru HIN241
8-36
HIN240 (MQFP)
HIN241 (SOIC, SSOP)
TOP VIEW
Pinouts
(Continued)
NC
GND
NC
R2
IN
NC
T2
OUT
T1
OUT
T3
OUT
T4
OUT
R3
IN
R3
OUT
T5
IN
NC
1
2
3
4
5
6
7
8
9
10
11
12 13 14 15 16 17
28
27
26
25
24
23
2221201918
39 38 37 36 35 34
33
32
31
30
29
44 43 42 41 40
R4
OUT
T4INT3INR5
OUTR5IN
NC
NC
SHUT
EN
T5
OUT
R4
IN
R2
OUT
T2INT1
IN
R1
OUT
R1
IN
V
CC
NCNCNC
NC
NC
C1+
V+
C1-
C2+
C2-
V-
NC
NC
NC
DOWN
T3
OUT
T1
OUT
T2
OUT
R2
IN
R2
OUT
T2
IN
T1
IN
R1
OUT
R1
IN
GND
V
CC
C1+
V+
C1-
T4
OUT
R3
OUT
SHUTDOWN
EN
R4
IN
T4
IN
R5
OUT
R5
IN
VC2C2+
R3
IN
R4
OUT
T3
IN
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
19
V
CC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1
OUT
T2
OUT
T3
OUT
T1
IN
T2
IN
T3
IN
T1
T2
T3
+5V
+
1µF
1µF
+
1µF
15
14
7
8
37 6
25
27
26
30
V+
V-
C1+
C1-
C2+
C2-
+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
+
1µF
28
29
R1
OUT
R1
IN
R1
17
5kΩ
R2
OUT
R2
IN
R2
1013
5kΩ
R3
OUT
R3
IN
R3
43
5kΩ
R4
OUT
R4
IN
R4
4039
5kΩ
R5
OUT
R5
IN
R5
3536
5kΩ
EN
42
16
T4
OUT
T4
IN
T4
38 5
+5V
400kΩ
T5
OUT
T5
IN
T5
241
+5V
400kΩ
SHUTDOWN
43
18
11
V
CC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1
OUT
T2
OUT
T3
OUT
T1
IN
T2
IN
T3
IN
T1
T2
T3
+5V
+
1µF
+
1µF
+
1µF
7
6
2
3
20 1
12
14
13
17
V+
V-
C1+
C1-
C2+
C2-
+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
+
1µF
15
16
R1
OUT
R1
IN
R1
9
5kΩ
R2
OUT
R2
IN
R2
45
5kΩ
R3
OUT
R3
IN
R3
2726
5kΩ
R4
OUT
R4
IN
R4
2322
5kΩ
R5
OUT
R5
IN
R5
1819
5kΩ
EN
24
8
T4
OUT
T4
IN
T4
21 28
+5V
400kΩ
SHUTDOWN
25
10
8-37
Absolute Maximum Ratings Thermal Information
VCC to Ground . . . . . . . . . . . . . . . . . . . . . .(GND -0.3V) < VCC < 6V
V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . (VCC -0.3V) < V+ < 12V
V- to Ground. . . . . . . . . . . . . . . . . . . . . . . -12V < V- < (GND +0.3V)
Input Voltages
TIN . . . . . . . . . . . . . . . . . . . . . . . . . (V- -0.3V) < VIN < (V+ +0.3V)
RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V
Output Voltages
T
OUT
. . . . . . . . . . . . . . . . . . . . (V- -0.3V) < V
TXOUT
< (V+ +0.3V)
R
OUT
. . . . . . . . . . . . . . . . . .(GND -0.3V) < V
RXOUT
< (V+ +0.3V)
Short Circuit Duration
T
OUT
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
R
OUT
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
Operating Conditions
Temperature Range
HIN-XXXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0oC to 70oC
HIN-XXXIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
HIN-XXXMX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Thermal Resistance (Typical, Note 1) θJA (oC/W) θJC (oC/W)
16 Ld PDIP Package. . . . . . . . . . . . . . 90 N/A
24 Ld PDIP Package. . . . . . . . . . . . . . 75 N/A
16 Ld SOIC (W) Package . . . . . . . . . . 100 N/A
24 Ld SOIC Package. . . . . . . . . . . . . . 80 N/A
28 Ld SOIC Package. . . . . . . . . . . . . . 75 N/A
28 Ld SSOP Package . . . . . . . . . . . . . 100 N/A
44 Ld MQFP Package. . . . . . . . . . . . . 80 N/A
16 Ld CERDIP Package . . . . . . . . . . . 80 18
Maximum Junction Temperature (Hermetic Package) . . . . . . . . 175oC
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300oC
(SOIC, SSOP, MQFP - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications Test Conditions: V
CC
= +5V ±10%, (VCC = +5V ±5% HIN233 and HIN235)
TA = Operating Temperature Range
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
Output Voltage Swing, T
OUT
Transmitter Outputs, 3kΩ to Ground ±5 ±9 ±10 V
Power Supply Current, I
CC
No Load, TA = 25oC, HIN232-233 - 5 10 mA
HIN230, HIN234-238, HIN240-241 - 7 15 mA
HIN231, HIN239 - 0.4 1 mA
V+ Power Supply Current, I
CC
HIN231 - 1.8 5 mA
HIN239 - 5.0 15 mA
Shutdown Supply Current, I
CC
(SD) - 1 10 µA
Input Logic Low, T
IN
, EN, V
lL
TIN, EN, Shutdown - - 0.8 V
Input Logic High, V
lH
T
IN
2.0 - - V
EN, Shutdown 2.4 - - V
Logic Pullup Current, I
P
TIN = 0V - 15 200 µA
RS-232 Input Voltage Range, V
IN
-30 - +30 V
Receiver Input Impedance, R
IN
VIN = ±3V 3.0 5.0 7.0 kΩ
Receiver Input Low Threshold, V
lN
(H-L) VCC = 5V, TA = 25oC 0.8 1.2 - V
Receiver Input High Threshold, V
IN
(L-H) VCC = 5V, TA = 25oC - 1.7 2.4 V
Receiver Input Hysteresis, V
HYST
0.2 0.5 1.0 V
TTL/CMOS Receiver Output Voltage Low,V
OLIOUT
= 1.6mA
(HIN231-HIN233 I
OUT
= 3.2mA)
- 0.1 0.4 V
TTL/CMOS Receiver Output V oltage High,V
OHIOUT
= -1.0mA 3.5 4.6 - V
Output Enable Time, t
EN
HIN235, 236, 239, 240, 241 - 400 - ns
Output Disable Time, t
DIS
HIN235, 236, 239, 240, 241 - 250 - ns
Propagation Delay, t
PD
RS-232 to TTL - 0.5 - µs
Instantaneous Slew Rate, SR C
L
= 10pF, RL = 3kΩ, TA = 25oC (Note 2) - - 30 V/µs
Transition Region Slew Rate, SR
T
RL = 3kΩ, CL = 2500pF Measured from
+3V to -3V or -3V to +3V
-3-V/µs
Output Resistance, R
OUT
VCC = V+ = V- = 0V, V
OUT
= ±2V 300 - - Ω
RS-232 Output Short Circuit Current, I
SC
T
OUT
shorted to GND - ±10 - mA
NOTE:
2. Guaranteed by design.
HIN230 thru HIN241
8-38
Detailed Description
The HIN230 thru HIN241 family of RS-232 transmitters/receivers are powered by a single +5V power supply (e xcept HIN-231
and HIN239), feature low power consumption, and meet all ElA
RS-232C and V.28 specifications. The circuit is divided into
three sections: the charge pump, transmitter , and receiver.
Charge Pump
An equivalent circuit of the charge pump is illustrated in Figure
1. The charge pump contains two sections: the voltage doubler and the voltage inverter. Each section is driven by a two
phase, internally generated clock to generate +10V and -10V.
The nominal clock frequency is 16kHz. During phase one of
the clock, capacitor C1 is charged to V
CC
. During phase two,
the voltage on C1 is added to V
CC
, producing a signal across
C3 equal to twice V
CC
. During phase one, C2 is also charged
to 2V
CC
, and then during phase two, it is inv erted with respect
to ground to produce a signal across C4 equal to -2V
CC
. The
charge pump accepts input voltages up to 5.5V. The output
impedance of the voltage doubler section (V+) is approximately 200Ω, and the output impedance of the voltage
inverter section (V-) is approximately 450Ω. A typical application uses 1µF capacitors for C1-C4, however, the value is not
critical. Increasing the values of C1 and C2 will lower the output impedance of the voltage doubler and inverter, increasing
the values of the reservoir capacitors, C3 and C4, lowers the
ripple on the V+ and V- supplies .
During shutdown mode (HIN230, 236, 240 and 241), SHUTDOWN control line set to logic “1”, the charge pump is
turned off, V+ is pulled down to V
CC
, V- is pulled up to GND,
and the supply current is reduced to less than 10µA. The
transmitter outputs are disabled and the receiver outputs are
placed in the high impedance state.
Transmitters
The transmitters are TTL/CMOS compatible inverters which
translate the inputs to RS-232 outputs. The input logic threshold is about 26% of V
CC
, or 1.3V for VCC = 5V. A logic 1 at the
input results in a voltage of between -5V and V- at the output,
and a logic 0 results in a voltage between +5V and (V+ -0.6V).
Each transmitter input has an internal 400kΩ pullup resistor
so any unused input can be left unconnected and its output
remains in its low state. The output voltage swing meets the
RS-232C specifications of ±5V minimum with the worst case
conditions of: all transmitters driving 3kΩ minimum load
impedance, V
CC
= 4.5V, and maximum allowable operating
temperature. The transmitters hav e an internally limited output
slew rate which is less than 30V/µs. The outputs are short circuit protected and can be shorted to ground indefinitely. The
powered down output impedance is a minimum of 300Ω with
±2V applied to the outputs and V
CC
= 0V.
Receivers
The receiver inputs accept up to ±30V while presenting the
required 3kΩ to 7kΩ input impedance even it the pow er is off
(V
CC
= 0V). The receivers have a typical input threshold of
1.3V which is within the ±3V limits, known as the transition
region, of the RS-232 specifications. The receiver output is
0V to V
CC
. The output will be low whenever the input is
greater than 2.4V and high whenever the input is floating or
driven between +0.8V and -30V. The receivers feature 0.5V
hysteresis to improve noise rejection. The receiver Enable
line
EN, when set to logic “1”, (HIN236, 239, 240, and 241)
disables the receiver outputs, placing them in the high
impedance mode. The receiver outputs are also placed in
the high impedance state when in shutdown mode.
+
-
C1
+
-
C3
+
-
C2
+
-
C4
S1
S2
S5
S6
S3
S4
S7
S8
V
CC
GND
RC
OSCILLATOR
V
CC
GND
V+ = 2V
CC
GND
V- = -(V+)
C1
+
C1-
C2
-
C2
+
VOLTAGE INVERTER
VOLTAGE DOUBLER
FIGURE 1. CHARGE PUMP
T
OUT
V- < V
TOUT
< V+
300Ω
400kΩ
T
XIN
GND < T
XIN
< V
CC
V-
V+
V
CC
FIGURE 2. TRANSMITTER
R
OUT
GND < V
ROUT
< V
CC
5kΩ
R
XIN
-30V < R
XIN
< +30V
GND
V
CC
FIGURE 3. RECEIVER
T
IN
V
OL
V
OL
t
PLH
t
PHL
Average Propagation Delay =
t
PHL +tPLH
2
OR
R
IN
T
OUT
OR
R
OUT
FIGURE 4. PROPAGATION DELAY DEFINITION
HIN230 thru HIN241
8-39
Typical Performance Curves
FIGURE 5. V- SUPPLY VOL TAGE vs VCC, VARYING CAPACITORS FIGURE 6. V+, V- OUTPUT VOLTAGE vs LOAD
12
10
8
6
4
2
0
3.5
4.0 4.5 6.0
V
CC
V- SUPPLY VOLTAGE
5.0 5.5
3.0
0.10µF
0.47µF
1µF
35
|I
LOAD
| (mA)
V+ (VCC = 4V)
V+ (VCC = 5V)
V- (VCC = 5V)
V- (VCC = 4V)
TA = 25oC
TRANSMITTER OUTPUTS
OPEN CIRCUIT
30252015105
0
SUPPLY VOLTAGE (|V|)
0
12
10
8
6
4
2
Test Circuits (HIN232)
FIGURE 7. GENERAL TEST CIRCUIT
FIGURE 8. POWER-OFF SOURCE RESISTANCE
CONFIGURA TION
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
C1+
V+
C1C2+
C2V-
R2
IN
12
OUT
V
CC
T1
OUT
R1
IN
R1
OUT
T1
IN
T2
IN
R2
OUT
GND
+4.5V TO
+5.5V INPUT
3kΩ
T1 OUTPUT
RS-232 ±30V INPUT
TTL/CMOS OUTPUT
TTL/CMOS INPUT
TTL/CMOS INPUT
TTL/CMOS OUTPUT
+
-
1µF
C3
+
-
1µF
C1
+
-
1µF
C2
+
-
1µF C4
3kΩ
OUTPUT
RS-232
±30V INPUT
T2
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
C1+
V+
C1C2+
C2V-
R2
IN
12
OUT
V
CC
T1
OUT
R1
IN
R1
OUT
T1
IN
T2
IN
R2
OUT
GND
T2
OUT
T1
OUT
VIN = ±2V
A
R
OUT
= VIN/1
HIN230 thru HIN241
8-40
Applications
The HINXXX may be used for all RS-232 data terminal and
communication links. It is particularly useful in applications
where ±12V power supplies are not available for conventional RS-232 interface circuits. The applications presented
represent typical interface configurations.
A simple duplex RS-232 port with CTS/RTS handshaking is
illustrated in Figure 9. Fixed output signals such as DTR
(data terminal ready) and DSRS (data signaling rate select)
is generated by driving them through a 5kΩ resistor
connected to V+.
In applications requiring four RS-232 inputs and outputs
(Figure 10), note that each circuit requires two charge pump
capacitors (C1 and C2) but can share common reservoir
capacitors (C3 and C4). The benefit of sharing common reservoir capacitors is the elimination of two capacitors and the
reduction of the charge pump source impedance which
effectively increases the output swing of the transmitters.
-
+
-
+
-
+
CTR (20) DATA
TERMINAL READY
DSRS (24) DATA
SIGNALING RATE
RS-232
INPUTS AND OUTPUTS
TD (2) TRANSMIT DATA
RTS (4) REQUEST TO SEND
RD (3) RECEIVE DATA
CTS (5) CLEAR TO SEND
SIGNAL GROUND (7)15
8
13
7
14
16
-
+
6
R2
R1
T2
T1
9
12
10
11
4
5
3
1
HIN232
C1
1µF
C2
1µF
TD
RTS
RD
CTS
SELECT
+5V
INPUTS
OUTPUTS
TTL/CMOS
FIGURE 9. SIMPLE DUPLEX RS-232 PORT WITH CTS/RTS
HANDSHAKING
-
+
RS-232
INPUTS AND OUTPUTS
DTR (20) DATA TERMINAL READY
DSRS (24) DATA SIGNALING RATE SELECT
DCD (8) DATA CARRIER DETECT
R1 (22) RING INDICATOR
SIGNAL GROUND (7)15
8
13
7
14
2
-
+
4
R2
R1
T2
T1
9
12
10
11
3
1
HIN232
C1
1µF
DTR
DSRS
DCD
R1
+5V
INPUTS
OUTPUTS
TTL/CMOS
-
+
-
+
TD (2) TRANSMIT DATA
RTS (4) REQUEST TO SEND
RD (3) RECEIVE DATA
CTS (5) CLEAR TO SEND
8
13
7
14
15
R2
R1
T2
T1
9
12
10
11
4
5
3
1
HIN232
C1
1µF
C2
1µF
TD
RTS
RD
CTS
INPUTS
OUTPUTS
TTL/CMOS
-
+
5
C2
1µF
16
C3
2µF
6
26
V- V+
-
+
C4
2µF
16
FIGURE 10. COMBINING TWO HIN232s FOR 4 PAIRS OF RS-232 INPUTS AND OUTPUTS
HIN230 thru HIN241
8-41
Die Characteristics
DIE DIMENSIONS:
160 mils x 140 mils
METALLIZATION:
Type: Al
Thickness: 10k
Å ±1kÅ
SUBSTRATE POTENTIAL
V+
PASSIVATION:
Type: Nitride over Silox
Nitride Thickness: 8kÅ
Silox Thickness: 7kÅ
TRANSISTOR COUNT:
238
PROCESS:
CMOS Metal Gate
Metallization Mask Layout
HIN240
T3
OUT
T1
OUT
T2
OUT
R2
IN
R2
OUT
T2
IN
T1
IN
R1
OUT
R1
IN
GND
V
CC
C1+ V+ C1-
T4
OUT
R3
OUT
EN
R4
IN
T4
IN
R5
OUT
V-C2-C2+
R3
IN
R4
OUT
T3
IN
R5
IN
SHUTDOWN
T5
OUT
T5
IN
HIN230 thru HIN241
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