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Table of Content
1. Introduction............................................................................................................................................. 3
2. Specifications ........................................................................................................................................... 3
Quick overview of Specification. ............................................................................................................ 3
Technical Specification ........................................................................................................................... 3
3. Mechanical overview ............................................................................................................................... 4
Mechanical Dimension ............................................................................................................................. 4
4. I/O specification....................................................................................................................................... 5
Pin Configurations ................................................................................................................................... 5
5. Bluetooth RF Specification ....................................................................................................................... 7
Bluetooth ................................................................................................................................................ 7
6. FCC & IC Statement .................................................................................................................................. 8
7. Antenna List ........................................................................................................................................... 11
Appendix - Module Functional Block Diagram ........................................................................................... 11
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1 Introduction
The LUXABT01 BT Platform module consumer audio platform for wired and wireless applications
integrates an ultra-low-power DSP and application processor with embedded flash memory, a high-
performance stereo codec, a power management subsystem, LED and LCD drivers and capacitive touch
sensor inputs in a SOC IC. The dual-core architecture with flash memory enables manufacturers to easily
differentiate their products with new features without extending development cycles.
2 Specifications
Quick overview of Specification.
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3 Mechanical overview
Mechanical Dimension
The maximum mechanical form factor of the module is shown below.
Physical Dimension Unit in mm
BT Chip
BT Module(with BT Chip)