Hangzhou Tuya Information Technology ZS2S Installation Guide

Hangzhou Tuya Information Technology Co., Ltd. 1 V1.0.0

1 Product Overview

ZS2S is a low-power embedded Zigbee module that Tuya has developed. It consists of a
highly integrated Zigbee chip (EFR32MG21A020F768) and several peripheral circuits,
with an embedded Zigbee network protocol stack and robust library functions. ZS2S also
contains a 32-bit, 80 MHz, low-power Arm Cortex-M33 core, 768 KB flash memory, 64 KB
static random-access memory (SRAM), and extensive peripherals.

1.1 Features

 Embedded low-power 32-bit microcontroller unit (MCU), which can also function as

an application processor

 Clock rate: 80 MHz
 Working voltage: 2.0 V to 3.8 V
 Peripherals: five pulse width modulation (PWM) pins, one analog to digital converter

(ADC), and one universal asynchronous receiver/transmitter (UART)

 Zigbee RF features

 Channels 11 to 26 at 2.400 GHz to 2.483 GHz, 250 kbit/s air interface rate

 TX power: +20 dBm; dynamic output power: > 35 dB

 Runtime power consumption: 60 µA/MHz; current in sleep mode: 5 µA

 Embedded Advanced Encryption Standard (AES) hardware encryption

 Onboard PCB antenna

 Working temperature: –20°C to +85°C

Tuya ZS2S Zigbee Module

Version: 1.0.0

Date: 2019-12-06

No.: 0000000001

Global Intelligent Platform

Product

Manual

Hangzhou Tuya Information Technology Co., Ltd. 2 V1.0.0

1.2 Application Scenarios

 Intelligent building
 Smart household and home appliances
 Smart low-power sensors
 Smart socket and light
 Asset tracing
 Industrial wireless control

Hangzhou Tuya Information Technology Co., Ltd. 3 V1.0.0

Change History

No.

Date

Change Description

Version After Change

1

2019-12-06

This is the first release.

1.0.0

Hangzhou Tuya Information Technology Co., Ltd. 4 V1.0.0

Contents

1 Product Overview ........................................................................................................... 1

1.1 Features ............................................................................................................... 1

1.2 Application Scenarios ........................................................................................... 2

Change History ................................................................................................................. 3

2 Module Interfaces ........................................................................................................... 6

2.1 Dimensions and Footprint .................................................................................... 6

2.2 Interface Pin Definition ......................................................................................... 6

3 Electrical Parameters ..................................................................................................... 7

3.1 Absolute Electrical Parameters ............................................................................ 7

3.2 Working Conditions .............................................................................................. 8

3.3 RF Current Consumption ..................................................................................... 9

3.4 Working Current ................................................................................................... 9

4 RF Features ................................................................................................................. 10

4.1 Basic RF Features ............................................................................................. 10

4.2 RF TX Power ..................................................................................................... 10

4.3 RF RX Sensitivity ............................................................................................... 11

5 Antenna Information ..................................................................................................... 11

5.1 Antenna Type ..................................................................................................... 11

5.2 Antenna Interference Reduction ......................................................................... 11

6 Packaging Information and Production Instructions ..................................................... 12

6.1 Mechanical Dimensions and Rear Solder Pad Dimensions ............................... 12

6.2 Production Instructions ...................................................................................... 12

6.3 Recommended Oven Temperature Curve .......................................................... 14

6.4 Storage Conditions ............................................................................................. 15

7 MOQ and Packing Information ..................................................................................... 16

8 Appendix: Statement .................................................................................................... 16

Hangzhou Tuya Information Technology Co., Ltd. 5 V1.0.0

Figures

Figure 2-1 ZS2S front and rear views ........................................................................ 6

Figure 6-1 ZS2S mechanical dimensions and rear solder pad dimensions ............. 12

Figure 6-2 Oven temperature curve ......................................................................... 14

Figure 6-3 HIC for ZS2S .......................................................................................... 15

Tables

Table 2-1 ZS2S interface pins .................................................................................... 6

Table 3-1 Absolute electrical parameters ................................................................... 7

Table 3-2 Normal working conditions ......................................................................... 8

Table 3-3 RF current consumption ............................................................................. 9

Table 3-4 Working current .......................................................................................... 9

Table 4-1 Basic RF features ..................................................................................... 10

Table 4-2 Power during constant transmission ......................................................... 10

Table 4-3 RX sensitivity ............................................................................................ 11

Table 6-1 Recommended wave soldering temperature ............................................ 14

Hangzhou Tuya Information Technology Co., Ltd. 6 V1.0.0

2 Module Interfaces

2.1 Dimensions and Footprint

ZS2S has two rows of pins with a 2 mm pin spacing.
The ZS2S dimensions (H x W x L) are 2.8±0.15 mm x 14.9±0.35 mm x 17.9±0.35 mm.

The PCB thickness is 0.8±0.1 mm. Figure 2-1 shows the ZS2S front and rear views.

Figure 2-1 ZS2S front and rear views

2.2 Interface Pin Definition

Table 2-1 ZS2S interface pins

Pin No.

Symbol

I/O Type

Function

1

3V3

P

Power supply pin (3.3 V)

2

PA00

I/O

Common I/O pin, which can be used as a PWM
output of the LED drive and is connected to the
PA00 pin on the internal IC

3

GND

P

Power supply reference ground pin

4

PA03

I/O

Common I/O pin, which can be used as a PWM
output of the LED drive and is connected to the
PA03 pin on the internal IC

5

RX

I/O

Serial interface receiving pin (UART RX), which