Hangzhou Tuya Information Technology ZN5 User Manual

ZN5 Datasheet
Device Development > Module > Zigbee Module
Version: 20200319
Online Version
ZN5 Datasheet Contents
Contents
1 Product Overview 1
1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.2 Application Scenarios . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Change History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2 Module Interfaces 3
2.1 Dimensions and Footprint . . . . . . . . . . . . . . . . . . . . . . . . 3
2.2 Interface Pin Definition . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.3 Test Pin Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3 Electrical Parameters 7
3.1 Absolute Electrical Parameters . . . . . . . . . . . . . . . . . . . . . 7
3.2 Working Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.3 Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.4 Working Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4 RF Features 9
4.1 Basic RF Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.2 TX Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.3 RX Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.1 Antenna Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.2 Antenna Interference Reduction . . . . . . . . . . . . . . . . . . . . . 10
6.1 Mechanical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . 12
6.2 Side View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6.3 Pin Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6.4 Layout of the PCB to Which ZN5 Applies . . . . . . . . . . . . . . . . 14
6.5 Production Instructions . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.6 Recommended Oven Temperature Curve . . . . . . . . . . . . . . . . 17
6.7 Storage Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
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ZN5 Datasheet Contents
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ZN5 Datasheet 1 PRODUCT OVERVIEW

1 Product Overview
ZN5 is a low-power embedded Zigbee module that Tuya has developed. It consists of a highly integrated RF chip (JN5189) and several peripheral components, with an embedded network protocol stack and robust library functions. ZN5 is embedded with a low-power 32-bit CPU, 152 KB random-access memory (RAM), 640 KB flash memory, and extensive peripherals. You can develop embedded Zigbee products as required.
1.1 Features
• Embedded low-power 32-bit Arm Cortex-M4 processor, which provides digital signal processor (DSP) instructions and floating-point units (FPUs) and can also function as an application processor
– Clock rate: 48 MHz
• Working voltage: 2.3 V to 3.6 V
• Peripherals: seven GPIOs and one universal asynchronous receiver/transmitter (UART)
• Zigbee features
802.15.4 MAC/PHYWorking channels 11 to 26 at 2.400 GHz to 2.483 GHz; 250 kbit/s air inter-
face rate
Embedded DC-DC circuit, maximizing the power efficiencyMaximum output power: +11 dBm; dynamic power adjustment: > 46 dBRuntime power consumption: 10 dBm/20.3 mA; current in sleep mode:
0.35 µA
Proactive network pairing for terminalsOnboard PCB antenna with a gain of 1 dBiWorking temperature: –40°C to +85°CAES-128 or AES-256 hardware encryption
1.2 Application Scenarios
• Intelligent building
• Smart household and home appliances
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ZN5 Datasheet 1 PRODUCT OVERVIEW
• Smart socket and light
• Industrial wireless control
• Baby monitor
• Network camera
• Intelligent bus
1.3 Change History
No. Date Change Description Version After Change
1 2019-12-
20
This is the first release. 1.0.0
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ZN5 Datasheet 2 MODULE INTERFACES
2 Module Interfaces
2.1 Dimensions and Footprint
ZN5 has two rows of 14 pins with a 2 mm pin spacing. The ZN5 dimensions (H x W x D) are 2.3±0.1 mm x 20.4±0.35 mm x 14.8±0.35 mm.
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ZN5 Datasheet 2 MODULE INTERFACES
Figure 1: image.png
2.2 Interface Pin Denition
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ZN5 Datasheet 2 MODULE INTERFACES
Pin No. Symbol
1 GND P Power supply reference ground pin
2 P7 I/O Hardware PWM pin, which is connected to PIO7 (pin
3 3V3 P Power supply pin (3.3 V)
4 P15 I/O SCL pin, which is connected to PIO15 (pin 18) on the
5 P16 I/O SDA pin, which is connected to PIO16 (pin 19) on the
6 P4 I/O Hardware PWM pin, which is connected to PIO4 (pin 7)
7 P3 I/O Hardware PWM pin, which is connected to PIO3 (pin 6)
8 P5 I/O ISP pin, which is connected to PIO5 (pin 8) on the
I/O Type Function
10) on the internal IC
internal IC
internal IC
on the internal IC
on the internal IC
internal IC
9 P6 I/O Hardware PWM pin, which is connected to PIO6 (pin 9)
on the internal IC
10 RX I/O UART0_RXD pin, which is connected to PIO9 (pin 12)
on the internal IC
11 RST I/O Hardware reset pin, which is active at a low level and
has been connected to a pull-up resistor
12 3V3 P Power supply pin (3.3 V)
13 TX I/O UART0_TXD pin, which is connected to PIO8 (pin 11)
on the internal IC
14 GND P Power supply reference ground pin
Note: P indicates a power supply pin, and I/O indicates an input/output pin.
2.3 Test Pin Denition
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ZN5 Datasheet 2 MODULE INTERFACES
Pin No. Symbol I/O Type Function
N/A TEST I/O Used for the module product test.
Note: Test pins are not recommended.
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3 Electrical Parameters
3.1 Absolute Electrical Parameters
ZN5 Datasheet 3 ELECTRICAL PARAMETERS
Parameter Description
Ts Storage
temperature
VBAT Power supply
voltage
Static electricity voltage
Tamb = 25°C N/A 2 kV
(human body model)
Static electricity voltage
Tamb = 25°C N/A 0.5 kV
(machine model)
3.2 Working Conditions
Minimum
Parameter Description
Value
Minimum Value
Maximum Value Unit
–40 125 °C
1.9 3.6 V
Typical Value
Maximum Value Unit
Ta Working
temperature
VBAT Power supply
voltage
V
IL
I/O low-level input
V
IH
I/O high-level input
V
OL
I/O low-level output
V
OH
I/O high-level output
–20 N/A 85 °C
2.3 3.3 3.6 V
–0.3 N/A VCC x 0.25 V
VCC x 0.75 N/A VCC V
N/A N/A VCC x 0.1 V
VCC x 0.8 N/A VCC V
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ZN5 Datasheet 3 ELECTRICAL PARAMETERS
Parameter Description
I
max
I/O drive current
3.3 Current Consumption
Working Status Mode Rate
TX OQPSK 250
kbit/s
TX OQPSK 250
kbit/s
RX OQPSK 250
kbit/s
Minimum Value
Typical Value
Maximum Value Unit
N/A N/A 12 mA
TX Pow­er/RX
Average Value
Maximum Value (Typical Value) Unit
+10 dBm 6 38 mA
0 dBm 18 34 mA
–99 dBm 4 38 mA
3.4 Working Current
Working Mode
EZ The module is in EZ
Connected The module is connected
Working Status (Ta = 25°C)
mode.
to the network.
Average Value
Maximum Value (Typical Value) Unit
3 34 mA
1 6 mA
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ZN5 Datasheet 4 RF FEATURES
4 RF Features
4.1 Basic RF Features
Parameter Description
Working frequency 2.400 GHz to 2.483 GHz
Physical layer standard IEEE 802.15.4
Data transmission rate 250 kbit/s
Antenna type Onboard PCB antenna with a gain of 1 dBi
Line-of-sight transmission distance > 120 m
4.2 TX Performance
Continuous TX performance |Parameter |Minimum Value |Typical Value |Maximum Value |Unit| |——–|———|———|———-|—–| |Maximum output power |N/A |+10| N/A |dBm |Minimum output power| N/A |–36| N/A |dBm |Output power adjustment step| N/A |0.5 |1 |dBm |Frequency error |–15| N/A |+15| ppm
4.3 RX Performance
RX sensitivity |Parameter |Minimum Value |Typical Value |Maximum Value |Unit| |———|——-|———|——-|——-| |PER < 10%, 250 kbit/s, OQPSK |N/A |–99 |N/A |dBm
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ZN5 Datasheet 5 ANTENNA INFORMATION
5 Antenna Information
5.1 Antenna Type
By default, ZN5 uses an onboard PCB antenna.
5.2 Antenna Interference Reduction
To ensure optimal RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts.
• Solutions 1 and 2 are recommended, where the antenna is placed outside the PCB frame and there is no or little RF attenuation.
• If the PCB antenna must be placed on the base plate due to design restrictions, solution 3 is recommended. The antenna is placed on the PCB along the edge without copper or wires nearby. The RF performance may be attenuated by 1 dBm to 2 dBm.
• Solution 4 is not recommended. If the antenna is placed on the PCB with copper or wires below, RF signals will be attenuated significantly.
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ZN5 Datasheet 5 ANTENNA INFORMATION
Figure 2: image.png
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ZN5 Datasheet6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
6 Packaging Information and Production Instructions
6.1 Mechanical Dimensions
The PCB dimensions (H x W x D) are 0.8±0.1 mm x 20.4±0.35 mm x 14.8±0.35 mm.
Figure 3: image.png
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6.2 Side View
Figure 4: image.png
6.3 Pin Connections
ZN5 Datasheet6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
Figure 5: image.png
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ZN5 Datasheet6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
6.4 Layout of the PCB to Which ZN5 Applies
Figure 6: image.png
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ZN5 Datasheet6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
6.5 Production Instructions
1. Use an SMT placement machine to mount the stamp hole module that Tuya produces onto the PCB within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting it onto the PCB.
(1) SMT placement equipment
i. Reflow soldering machine
ii. Automated optical inspection (AOI) equipment
iii. Nozzle with a 6 mm to 8 mm diameter
(2) Baking equipment
i. Cabinet oven
ii. Anti-static heat-resistant trays
iii. Anti-static heat-resistant gloves
2. Storage conditions for a delivered module are as follows:
(1) The moisture-proof bag is placed in an environment where the tempera-
ture is below 30°C and the relative humidity is lower than 70%.
(2) The shelf life of a dry-packaged product is six months from the date when
the product is packaged and sealed.
(3) The package contains a humidity indicator card (HIC).
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ZN5 Datasheet6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
Figure 7: Figure 10
3. Bake a module based on HIC status as follows when you unpack the module package:
(1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consec-
utive hours.
(2) If the 30% circle is pink, bake the module for 4 consecutive hours.
(3) If the 30% and 40% circles are pink, bake the module for 6 consecutive
hours.
(4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consec-
utive hours.
4. Baking settings:
(1) Baking temperature: 125±5°C
(2) Alarm temperature: 130°C
(3) SMT placement ready temperature after natural cooling: < 36°C
(4) Number of drying times: 1
(5) Rebaking condition: The module is not soldered within 12 hours after bak-
ing.
5. Do not use SMT to process modules that have been unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the
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ZN5 Datasheet6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences.
6. Before SMT placement, take electrostatic discharge (ESD) protective measures.
7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI.
6.6 Recommended Oven Temperature Curve
Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245°C.
Figure 8: 图片 11
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6.7 Storage Conditions
ZN5 Datasheet6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
Figure 9: Figure 12
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ZN5 Datasheet7 MOQ AND PACKING INFORMATION
7 MOQ and Packing Information
Number of Product Model MOQ
Packing Method
Modules in Each
Reel Pack
Number of Reel Packs in Each Box
ZN5 4000 Carrier tape
and reel packing
1000 4
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ZN5 Datasheet 8 APPENDIX: STATEMENT
8 Appendix: Statement
Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party re­sponsible for compliance could void the user’s authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, in­cluding interference that may cause undesired operation. This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter.
15.105 Information to the user. (b) For a Class B digital device or peripheral, the instructions furnished the user shall include the following or similar statement, placed in a prominent location in the text of the manual: Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interfer­ence in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instruc­tions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
This equipment should be installed and operated with minimum distance 20 cm between the radiator and your body.
Radiation Exposure Statement
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ZN5 Datasheet 8 APPENDIX: STATEMENT
This equipment complies with FCC radiation exposure limits set forth for an uncon­trolled environment. This transmitter must not be co-located or operating in con­junction with any other antenna or transmitter. The availability of some specific channels and/or operational frequency bands is country dependent and firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user.
The final end product must be labeled in a visible area with the following: “Contains Transmitter Module 2ANDL-ZN5” This radio module must not be installed to co-locate and operating simultaneously with other radios in host system, additional testing and equipment authorization may be required to operating simultaneously with other radio.
The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the in­tended destination. The firmware setting is not accessible by the end user.
The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
The end user manual shall include all required regulatory information/warning as shown in this manual, including: This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body.
This device have got a FCC ID2ANDL-ZN5.The final end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID:2ANDL­ZN5”
This device is intended only for OEM integrators under the following conditions:
1)The antenna must be installed such that 20cm is maintained between the antenna and users, and
2) The transmitter module may not be co-located with any other transmitter or an­tenna. As long as 2 conditions above are met, further transmitter test will not be re­quired. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.
Declaration of Conformity European Notice
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ZN5 Datasheet 8 APPENDIX: STATEMENT
Figure 10: Figure 13
Hereby, Hangzhou Tuya Information Technology Co., Ltd. declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EC. A copy of the Declaration of Conformity can be found at
https://www.tuya.com.
Figure 11: image.png
This product must not be disposed of as normal household waste, in accordance with EU directive for waste electrical and electronic equipment (WEEE- 2012/19/EU). Instead,it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.
EN 300 328 V2.1.1 EN 301 489-1 V2.1.1; EN 301 489-17 V3.1.1 EN 62311:2008 EN 60950-1:2006+A11:2009+A1:2010+A12:2011+A2:2013
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