ZN5 is a low-power embedded Zigbee module that Tuya has developed. It consists
of a highly integrated RF chip (JN5189) and several peripheral components, with an
embedded network protocol stack and robust library functions. ZN5 is embedded
with a low-power 32-bit CPU, 152 KB random-access memory (RAM), 640 KB flash
memory, and extensive peripherals. You can develop embedded Zigbee products
as required.
1.1 Features
• Embedded low-power 32-bit Arm Cortex-M4 processor, which provides digital
signal processor (DSP) instructions and floating-point units (FPUs) and can also
function as an application processor
– Clock rate: 48 MHz
• Working voltage: 2.3 V to 3.6 V
• Peripherals: seven GPIOs and one universal asynchronous receiver/transmitter
(UART)
• Zigbee features
– 802.15.4 MAC/PHY
– Working channels 11 to 26 at 2.400 GHz to 2.483 GHz; 250 kbit/s air inter-
face rate
– Embedded DC-DC circuit, maximizing the power efficiency
– Maximum output power: +11 dBm; dynamic power adjustment: > 46 dB
– Runtime power consumption: 10 dBm/20.3 mA; current in sleep mode:
0.35 µA
– Proactive network pairing for terminals
– Onboard PCB antenna with a gain of 1 dBi
– Working temperature: –40°C to +85°C
– AES-128 or AES-256 hardware encryption
1.2 Application Scenarios
• Intelligent building
• Smart household and home appliances
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ZN5 Datasheet1PRODUCT OVERVIEW
• Smart socket and light
• Industrial wireless control
• Baby monitor
• Network camera
• Intelligent bus
1.3 Change History
No.DateChange DescriptionVersion After Change
12019-12-
20
This is the first release.1.0.0
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ZN5 Datasheet2MODULE INTERFACES
2 Module Interfaces
2.1 Dimensions and Footprint
ZN5 has two rows of 14 pins with a 2 mm pin spacing. The ZN5 dimensions (H x W
x D) are 2.3±0.1 mm x 20.4±0.35 mm x 14.8±0.35 mm.
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ZN5 Datasheet2MODULE INTERFACES
Figure 1: image.png
2.2 Interface Pin Denition
4 / 22
ZN5 Datasheet2MODULE INTERFACES
Pin
No.Symbol
1GNDPPower supply reference ground pin
2P7I/OHardware PWM pin, which is connected to PIO7 (pin
33V3PPower supply pin (3.3 V)
4P15I/OSCL pin, which is connected to PIO15 (pin 18) on the
5P16I/OSDA pin, which is connected to PIO16 (pin 19) on the
6P4I/OHardware PWM pin, which is connected to PIO4 (pin 7)
7P3I/OHardware PWM pin, which is connected to PIO3 (pin 6)
8P5I/OISP pin, which is connected to PIO5 (pin 8) on the
I/O
TypeFunction
10) on the internal IC
internal IC
internal IC
on the internal IC
on the internal IC
internal IC
9P6I/OHardware PWM pin, which is connected to PIO6 (pin 9)
on the internal IC
10RXI/OUART0_RXD pin, which is connected to PIO9 (pin 12)
on the internal IC
11RSTI/OHardware reset pin, which is active at a low level and
has been connected to a pull-up resistor
123V3PPower supply pin (3.3 V)
13TXI/OUART0_TXD pin, which is connected to PIO8 (pin 11)
on the internal IC
14GNDPPower supply reference ground pin
Note: P indicates a power supply pin, and I/O indicates an input/output pin.
2.3 Test Pin Denition
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ZN5 Datasheet2MODULE INTERFACES
Pin No.SymbolI/O TypeFunction
N/ATESTI/OUsed for the module product test.
Note: Test pins are not recommended.
6 / 22
3 Electrical Parameters
3.1 Absolute Electrical Parameters
ZN5 Datasheet3ELECTRICAL PARAMETERS
ParameterDescription
TsStorage
temperature
VBATPower supply
voltage
Static electricity voltage
Tamb = 25°CN/A2kV
(human body model)
Static electricity voltage
Tamb = 25°CN/A0.5kV
(machine model)
3.2 Working Conditions
Minimum
Parameter Description
Value
Minimum
Value
Maximum
ValueUnit
–40125°C
1.93.6V
Typical
Value
Maximum
ValueUnit
TaWorking
temperature
VBATPower supply
voltage
V
IL
I/O low-level
input
V
IH
I/O high-level
input
V
OL
I/O low-level
output
V
OH
I/O high-level
output
–20N/A85°C
2.33.33.6V
–0.3N/AVCC x 0.25V
VCC x 0.75N/AVCCV
N/AN/AVCC x 0.1V
VCC x 0.8N/AVCCV
7 / 22
ZN5 Datasheet3ELECTRICAL PARAMETERS
Parameter Description
I
max
I/O drive
current
3.3 Current Consumption
Working
StatusMode Rate
TXOQPSK 250
kbit/s
TXOQPSK 250
kbit/s
RXOQPSK 250
kbit/s
Minimum
Value
Typical
Value
Maximum
ValueUnit
N/AN/A12mA
TX Power/RX
Average
Value
Maximum Value
(Typical Value)Unit
+10 dBm638mA
0 dBm1834mA
–99 dBm438mA
3.4 Working Current
Working
Mode
EZThe module is in EZ
Connected The module is connected
Working Status (Ta =
25°C)
mode.
to the network.
Average
Value
Maximum Value
(Typical Value)Unit
334mA
16mA
8 / 22
ZN5 Datasheet4RF FEATURES
4 RF Features
4.1 Basic RF Features
ParameterDescription
Working frequency2.400 GHz to 2.483 GHz
Physical layer standardIEEE 802.15.4
Data transmission rate250 kbit/s
Antenna typeOnboard PCB antenna with a gain of 1 dBi
Line-of-sight transmission distance> 120 m
4.2 TX Performance
Continuous TX performance |Parameter |Minimum Value |TypicalValue
|Maximum Value |Unit| |——–|———|———|———-|—–| |Maximum output power
|N/A |+10| N/A |dBm |Minimum output power| N/A |–36| N/A |dBm |Output power
adjustment step| N/A |0.5 |1 |dBm |Frequency error |–15| N/A |+15| ppm
4.3 RX Performance
RX sensitivity |Parameter |Minimum Value |Typical Value |Maximum Value
|Unit| |———|——-|———|——-|——-| |PER < 10%, 250 kbit/s, OQPSK |N/A |–99 |N/A
|dBm
9 / 22
ZN5 Datasheet5ANTENNA INFORMATION
5 Antenna Information
5.1 Antenna Type
By default, ZN5 uses an onboard PCB antenna.
5.2 Antenna Interference Reduction
To ensure optimal RF performance, it is recommended that the antenna be at least
15 mm away from other metal parts.
• Solutions 1 and 2 are recommended, where the antenna is placed outside the
PCB frame and there is no or little RF attenuation.
• If the PCB antenna must be placed on the base plate due to design restrictions,
solution 3 is recommended. The antenna is placed on the PCB along the edge
without copper or wires nearby. The RF performance may be attenuated by 1
dBm to 2 dBm.
• Solution 4 is not recommended.If the antenna is placed on the PCB with
copper or wires below, RF signals will be attenuated significantly.
10 / 22
ZN5 Datasheet5ANTENNA INFORMATION
Figure 2: image.png
11 / 22
ZN5 Datasheet6PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
6 Packaging Information and Production Instructions
6.1 Mechanical Dimensions
The PCB dimensions (H x W x D) are 0.8±0.1 mm x 20.4±0.35 mm x 14.8±0.35 mm.
Figure 3: image.png
12 / 22
6.2 Side View
Figure 4: image.png
6.3 Pin Connections
ZN5 Datasheet6PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
Figure 5: image.png
13 / 22
ZN5 Datasheet6PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
6.4 Layout of the PCB to Which ZN5 Applies
Figure 6: image.png
14 / 22
ZN5 Datasheet6PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
6.5 Production Instructions
1. Use an SMT placement machine to mount the stamp hole module that Tuya
produces onto the PCB within 24 hours after the module is unpacked and the
firmware is burned. If not, vacuum pack the module again. Bake the module
before mounting it onto the PCB.
(1) SMT placement equipment
i. Reflow soldering machine
ii. Automated optical inspection (AOI) equipment
iii. Nozzle with a 6 mm to 8 mm diameter
(2) Baking equipment
i. Cabinet oven
ii. Anti-static heat-resistant trays
iii. Anti-static heat-resistant gloves
2. Storage conditions for a delivered module are as follows:
(1) The moisture-proof bag is placed in an environment where the tempera-
ture is below 30°C and the relative humidity is lower than 70%.
(2) The shelf life of a dry-packaged product is six months from the date when
the product is packaged and sealed.
(3) The package contains a humidity indicator card (HIC).
15 / 22
ZN5 Datasheet6PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
Figure 7: Figure 10
3. Bake a module based on HIC status as follows when you unpack the module
package:
(1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consec-
utive hours.
(2) If the 30% circle is pink, bake the module for 4 consecutive hours.
(3) If the 30% and 40% circles are pink, bake the module for 6 consecutive
hours.
(4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consec-
utive hours.
4. Baking settings:
(1) Baking temperature: 125±5°C
(2) Alarm temperature: 130°C
(3) SMT placement ready temperature after natural cooling: < 36°C
(4) Number of drying times: 1
(5) Rebaking condition: The module is not soldered within 12 hours after bak-
ing.
5. Do not use SMT to process modules that have been unpacked for over three
months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the
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ZN5 Datasheet6PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
solder pads are exposed to the air for over three months, they will be oxidized
severely and dry joints or solder skips may occur. Tuya is not liable for such
problems and consequences.
6. Before SMT placement, take electrostatic discharge (ESD) protective measures.
7. To reduce the reflow defect rate, draw 10% of the products for visual inspection
and AOI before first SMT placement to determine a proper oven temperature
and component placement method. Draw 5 to 10 modules every hour from
subsequent batches for visual inspection and AOI.
6.6 Recommended Oven Temperature Curve
Perform SMT placement based on the following reflow oven temperature curve. The
highest temperature is 245°C.
Figure 8: 图片 11
17 / 22
6.7 Storage Conditions
ZN5 Datasheet6PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
Figure 9: Figure 12
18 / 22
ZN5 Datasheet7MOQ AND PACKING INFORMATION
7 MOQ and Packing Information
Number of
Product
ModelMOQ
Packing
Method
Modules in Each
Reel Pack
Number of Reel
Packs in Each Box
ZN54000 Carrier tape
and reel
packing
10004
19 / 22
ZN5 Datasheet8APPENDIX: STATEMENT
8 Appendix: Statement
Federal Communications Commission (FCC) Declaration of Conformity
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment.
This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions: (1) This device may not cause
harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
This device and its antenna(s) must not be co-located or operating in conjunction
with any other antenna or transmitter.
15.105 Information to the user.
(b) For a Class B digital device or peripheral, the instructions furnished the user shall
include the following or similar statement, placed in a prominent location in the text
of the manual:
Note: This equipment has been tested and found to comply with the limits for a
Class B digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate
radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there
is no guarantee that interference will not occur in a particular installation. If this
equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to
try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which
the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
This equipment should be installed and operated with minimum distance 20 cm
between the radiator and your body.
Radiation Exposure Statement
20 / 22
ZN5 Datasheet8APPENDIX: STATEMENT
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. The availability of some specific
channels and/or operational frequency bands is country dependent and firmware
programmed at the factory to match the intended destination.
The firmware setting is not accessible by the end user.
The final end product must be labeled in a visible area with the following:
“Contains Transmitter Module 2ANDL-ZN5”
This radio module must not be installed to co-locate and operating simultaneously
with other radios in host system, additional testing and equipment authorization
may be required to operating simultaneously with other radio.
The availability of some specific channels and/or operational frequency bands are
country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user.
The host product manufacturer is responsible for compliance to any other FCC rules
that apply to the host not covered by the modular transmitter grant of certification.
The final host product still requires Part 15 Subpart B compliance testing with the
modular transmitter installed.
The end user manual shall include all required regulatory information/warning as
shown in this manual, including: This product must be installed and operated with
a minimum distance of 20 cm between the radiator and user body.
This device have got a FCC ID:2ANDL-ZN5.The final end product must be labeled
in a visible area with the following: “Contains Transmitter Module FCC ID:2ANDLZN5”
This device is intended only for OEM integrators under the following conditions:
1)The antenna must be installed such that 20cm is maintained between the antenna
and users, and
2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product
for any additional compliance requirements required with this module installed.
Declaration of Conformity European Notice
21 / 22
ZN5 Datasheet8APPENDIX: STATEMENT
Figure 10: Figure 13
Hereby, Hangzhou Tuya Information Technology Co., Ltd. declares that this module
product is in compliance with essential requirements and other relevant provisions
of Directive 2014/53/EC. A copy of the Declaration of Conformity can be found at
https://www.tuya.com.
Figure 11: image.png
This product must not be disposed of as normal household waste, in accordance
with EU directive for waste electrical and electronic equipment (WEEE- 2012/19/EU).
Instead,it should be disposed of by returning it to the point of sale, or to a municipal
recycling collection point.
EN 300 328 V2.1.1
EN 301 489-1 V2.1.1; EN 301 489-17 V3.1.1
EN 62311:2008
EN 60950-1:2006+A11:2009+A1:2010+A12:2011+A2:2013
22 / 22
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