Tuya WBR2 Wi-Fi and Bluetooth Module
Version: 2.0.0
Date: 2019-10-28
No.: 0000000001
Global Intelligent Platform
1. Product Overview
Product
Manual
WBR2 is a low-power embedded Wi-Fi and Bluetooth module that Tuya has developed. It
consists of a highly integrated RF chip (RTL8720CF) with an embedded Wi-Fi network
protocol stack and robust library functions. WBR2 also contains a low-power KM4
microcontroller unit (MCU), a WLAN MAC, a 1T1R capable WLAN baseband, 256 KB
static random-access memory (SRAM), 2 MB flash memory, and extensive peripherals.
WBR2 is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and
TCP/IP protocols. You can develop embedded Wi-Fi and Bluetooth products as required.
Figure 1-1 shows the WBR2 architecture.
Figure 1-1 WBR2 architecture
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WBR2 Datasheet
1.1 Features
Embedded low-power KM4 MCU, which can also function as an application processor
Clock rate: 100 MHz
Working voltage: 3.0 V to 3.6 V
Peripherals: six GPIOs and one universal asynchronous receiver/transmitter (UART)
Wi-Fi connectivity
802.11b/g/n20
Channels 1 to 14 at 2.4 GHz
Compatible with Bluetooth low energy (BLE) 4.2(Up to +9dBm EIPR output
power)
WPA and WPA2 security modes
Up to +20 dBm EIRP output power in 802.11b mode
EZ net pairing mode for Android and iOS devices
Onboard PCB antenna
Certified by CE, FCC, and SRRC
Working temperature: –20°C to +85°C
1.2 Application Scenarios
Intelligent building
Smart household and home appliances
Smart socket and light
Industrial wireless control
Baby monitor
Network camera
Intelligent bus
2
Change History
No.
Date
Change Description
Version After Change
1
2019-10-28
This is the first release.
2.0.0
WBR2 Datasheet
3
WBR2 Datasheet
Contents
1. Product Overview........................................................................................................................ 1
1.1 Features..............................................................................................................................2
1.2 Application Scenarios....................................................................................................... 2
2. Module Interfaces........................................................................................................................ 6
2.1 Dimensions and Footprint................................................................................................ 6
2.2 Interface Pin Definition..................................................................................................... 6
3. Electrical Parameters..................................................................................................................7
3.1 Absolute Electrical Parameters....................................................................................... 7
3.2 Working Conditions........................................................................................................... 8
3.3 RF Current Consumption................................................................................................. 8
3.4 Working Current.................................................................................................................9
4. RF Features................................................................................................................................10
4.1 Basic RF Features.......................................................................................................... 10
4.2 TX Performance.............................................................................................................. 10
4.3 RX Performance.............................................................................................................. 11
5. Antenna Information.................................................................................................................. 11
5.1 Antenna Type................................................................................................................... 11
5.2 Antenna Interference Reduction................................................................................... 11
6. Packaging Information and Production Instructions............................................................ 11
6.1 Mechanical Dimensions................................................................................................. 11
6.2 Recommended PCB Layout..........................................................................................12
6.3 Production Instructions...................................................................................................13
6.4 Recommended Oven Temperature Curve and Soldering Temperature................ 14
6.5 Storage Conditions......................................................................................................... 16
7. MOQ and Packing Information................................................................................................18
8. Appendix: Statement.................................................................................................................19
4
WBR2 Datasheet
Tables
Table 2-1 WBR2 interface pins.............................................................................................. 6
Table 3-1 Absolute electrical parameters............................................................................. 7
Table 3-2 Normal working conditions....................................................................................8
Table 3-3 Current consumption during constant transmission......................................... 8
Table 3-4 Current consumption during constant receiving............................................... 9
Table 3-5 Working current.......................................................................................................9
Table 4-1 Basic RF features.................................................................................................10
Table 4-2 Performance during constant transmission..................................................... 10
Table 4-3 RX sensitivity.........................................................................................................11
Table 6-1 Recommended wave soldering temperature.................................................. 15
Figures
Figure 1-1 WBR2 architecture............................................................................................... 1
Figure 2-1 WBR2 front and rear views................................................................................. 6
Figure 6-1 WBR2 mechanical dimensions........................................................................ 12
Figure 6-2 WBR2 pins...........................................................................................................12
Figure 6-3 Top and bottom views of the PCB to which WBR2 applies.........................13
Figure 6-4 Oven temperature curve................................................................................... 15
Figure 6-5 HIC for WBR2..................................................................................................... 16
5
WBR2 Datasheet
Pin No.
Symbol
I/O Type
Function
1
3V3
N/A
Power supply pin (3.3 V)
2
A19
I/O
GPIOA_19, hardware PWM pin, which is
connected to pin 40 on the internal IC
2. Module Interfaces
2.1 Dimensions and Footprint
WBR2 has two rows of pins with a 2 mm pin spacing.
The WBR2 dimensions (H x W x D) are 2.9±0.15 mm x 15±0.35 mm x 18±0.35 mm. Figure
2-1 shows the WBR2 front and rear views.
Figure 2-1 WBR2 front and rear views
2.2 Interface Pin Definition
Table 2-1 WBR2 interface pins
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WBR2 Datasheet
Pin No.
Symbol
I/O Type
Function
3
GND
P
Power supply reference ground pin
4
A18
I/O
GPIOA_18, hardware PWM pin, which is
connected to pin 39 on the internal IC
5
A13
I/O
GPIOA_13, user-side serial interface pin
(UART0_RXD)
6
A17
I/O
GPIOA_17, hardware PWM pin, which is
connected to pin 38 on the internal IC
7
A14
I/O
GPIOA_14, user-side serial interface pin
(UART0_TXD)
8
A20
I/O
GPIOA_20, common GPIO, which is connected
to pin 1 on the internal IC
9
A12
I/O
GPIOA_12, hardware PWM pin, which is
connected to pin 26 on the internal IC
10ENI/O
Enable pin, which is active at a high level (The
pin has been pulled up and is externally
controllable.)
11
A11
I/O
GPIOA_11, hardware PWM pin, which is
connected to pin 25 on the internal IC
Parameter
Description
Minimum
Value
Maximum
Value
Unit
Ts
Storage temperature
–40
105
°C
VDD
Power supply voltage
–0.3
3.6
V
Note:
P indicates a power supply pin, and I/O indicates an input/output pin.
3. Electrical Parameters
3.1 Absolute Electrical Parameters
Table 3-1 Absolute electrical parameters
7
Parameter
Description
Minimum
Value
Maximum
Value
Unit
Static electricity voltage
(human body model)
Tamb = 25°C
N/A
2
kV
Static electricity voltage
(machine model)
Tamb = 25°C
N/A
0.5
kV
3.2 Working Conditions
Parameter
Description
Minimum
Value
Typical
Value
Maximum
Value
Unit
Ta
Working temperature
–20
N/A
85
°C
VDD
Working voltage
3.0
N/A
3.6
V
VIL
I/O low-level input
N/A
N/A
0.8
V
VIH
I/O high-level input
2.0
N/A
N/A
V
VOL
I/O low-level output
N/A
N/A
0.4
V
VOH
I/O high-level output
2.4
N/A
N/A
V
Imax
I/O drive current
N/A
N/A
16
mA
Cpad
Input pin capacitance
N/A2N/A
pF
Symbol
Mode
Power
Typical Value
Peak Value
Unit
IRF
802.11b
11 Mbit/s
17 dBm
217
268
mA
IRF
18 dBm
231
283
mA
IRF
802.11g
15 dBm
159
188
mA
Table 3-2 Normal working conditions
WBR2 Datasheet
3.3 RF Current Consumption
Table 3-3 Current consumption during constant transmission
8
Symbol
Mode
Power
Typical Value
Peak Value
Unit
54 Mbit/s
IRF
17.5 dBm
177
213
mA
IRF
802.11n BW20
MCS7
13 dBm
145
167
mA
IRF
16.5 dBm
165
193
mA
Table 3-4 Current consumption during constant receiving
Symbol
Mode
Typical Value
Peak Value
Unit
IRF
802.11b
11 Mbit/s
63
65
mA
IRF
802.11g
54 Mbit/s
65
67
mA
IRF
802.11n
HT20 MCS7
65
67
mA
Working Mode
Working Status (Ta = 25°C)
Typical
Value
Peak
Value
Unit
EZ
The module is in EZ mode, and the Wi-Fi
indicator blinks quickly.
75
324
mA
Connected
and idle
The module is connected to the network,
and the Wi-Fi indicator is steady on.
64
314
mA
Connected
and operating
The module is connected to the network,
and the Wi-Fi indicator is steady on.
66
305
mA
Disconnected
The module is disconnected from the
network, and the Wi-Fi indicator is
steady off.
66
309
mA
WBR2 Datasheet
3.4 Working Current
Table 3-5 Working current
9
4. RF Features
Parameter
Description
Frequency range
Bluetooth:2.400 GHz to 2.4835 GHz
Wi-Fi:2.412 GHz to 2.484 GHz
Wi-Fi standard
IEEE 802.11b/g/n (channels 1 to 14,Ch1-11 for
US/CA,Ch1-13 for EU/CN)
Data transmission rate
802.11b: 1, 2, 5.5, or 11 (Mbit/s)
802.11g: 6, 9, 12, 18, 24, 36, 48, or 54 (Mbit/s)
802.11n: HT20 MCS0 to MCS7;
Antenna type
PCB antenna
Parameter
Minimum
Value
Typical
Value
Maximum
Value
Unit
Average RF output power, 802.11b
CCK mode
1 Mbit/s
N/A
17.5
N/A
dBm
Average RF output power, 802.11g
OFDM mode
54 Mbit/s
N/A
14.5
N/A
dBm
Average RF output power, 802.11n
OFDM mode
MCS7
N/A
13.5
N/A
dBm
Frequency error
–20
N/A
+20
ppm
EVM under 802.11b CCK, 11 Mbit/s, 17.5 dBm
–10
dB
EVM under 802.11g OFDM, 54 Mbit/s, 14.5 dBm
–29
dB
EVM under 802.11n OFDM, MCS7, 13.5 dBm
–30
dB
4.1 Basic RF Features
WBR2 Datasheet
Table 4-1 Basic RF features
4.2 TX Performance
Table 4-2 Performance during constant transmission
10
4.3 RX Performance
Parameter
Minimum
Value
Typical
Value
Maximum
Value
Unit
PER < 8%, 802.11b CCK mode
1 Mbit/s
N/A
–91
N/A
dBm
PER < 10%, 802.11g OFDM
mode
54
Mbit/s
N/A
–75
N/A
dBm
PER < 10%, 802.11n OFDM
mode
MCS7
N/A
–72
N/A
dBm
WBR2 Datasheet
Table 4-3 RX sensitivity
5. Antenna Information
5.1 Antenna Type
WBR2 uses an onboard PCB antenna with a gain of 2.5 dBi.
5.2 Antenna Interference Reduction
To ensure optimal Wi-Fi performance when the Wi-Fi and Bluetooth module uses an
onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from
other metal parts.
6. Packaging Information and Production Instructions
6.1 Mechanical Dimensions
The PCB dimensions (H x W x D) are 0.8±0.1 mm x 15±0.35 mm x 18±0.35 mm, as
shown in Figure 6-1.
11
Figure 6-1 WBR2 mechanical dimensions
WBR2 Datasheet
6.2 Recommended PCB Layout
Figure 6-2 WBR2 pins
12
Figure 6-3 Top and bottom views of the PCB to which WBR2 applies
6.3 Production Instructions
WBR2 Datasheet
1. Preferentially use the wave soldering machine to solder the module, which is
recommended for Tuya-developed modules that are through-hole mounted onto
PCBs. Use hand soldering only when there is no operational wave soldering machine.
Complete soldering within 24 hours after the module is unpacked. If not, vacuum pack
the module again.
(1) Required materials for soldering:
i. Wave soldering machine
ii. Wave soldering fixture
iii. Constant-temperature iron
iv. Wave solder bar, wire, and flux
v. Oven temperature tester
(2) Baking equipment:
i. Cabinet oven
ii. Anti-static heat-resistant trays
iii. Anti-static heat-resistant gloves
2. Bake the module if any of the following conditions is met:
(1) The vacuum package is damaged before the module is unpacked.
(2) The package does not contain a humidity indicator card (HIC).
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WBR2 Datasheet
(3) After the module is unpacked, the HIC shows that the 30% and higher rate circles
are pink.
(4) Production is not completed within 72 hours after the module is unpacked.
(5) The module has been packed for more than six months.
3. Baking settings:
(1) Baking temperature: 65±5°C in reel pack mode and 125±5°C in tray pack mode
(2) Baking time: 48 hours in reel pack mode and 12 hours in tray pack mode
(3) Alarm temperature: 70°C in reel pack mode and 130°C in tray pack mode
(4) Production ready temperature after natural cooling: < 36°C
(5) Number of baking times: 1
(6) Rebaking condition: Production is not completed within 72 hours after baking.
4. Do not wave solder modules that have been unpacked for over three months.
Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are
exposed to the air for over three months, they will be oxidized severely and dry joints
or solder skips may occur. Tuya is not liable for such problems and consequences.
5. Throughout the production process, take electrostatic discharge (ESD) protective
measures.
6. For a good product quality, ensure that the following items meet requirements:
(1) Flux amount
(2) Wave height
(3) Amount of tin dross and copper in the solder pot
(4) Wave soldering fixture window and thickness
(5) Oven temperature curve for wave soldering
6.4 Recommended Oven Temperature Curve and Soldering
Temperature
Set the oven temperature to a value recommended for wave soldering. The peak
temperature is 260±5°C. Figure 6-4 shows the oven temperature curve for wave
soldering.
14
WBR2 Datasheet
Wave Soldering
Hand Soldering
Preheat temperature
80°C to 130°C
Wave soldering
temperature
360±20°C
Preheat time
75s to 100s
Soldering time
< 3s per point
Contact time
3s to 5s
N/A
N/A
Solder pot temperature
260±5°C
N/A
N/A
Temperature increase
rate
≤ 2°C per second
N/A
N/A
Temperature drop rate
≤ 6°C per second
N/A
N/A
Figure 6-4 Oven temperature curve
Table 6-1 Recommended wave soldering temperature
15
WBR2 Datasheet
6.5 Storage Conditions
Storage conditions for a delivered module are as follows:
1. The moisture-proof bag is placed in an environment where the temperature is below
30°C and the relative humidity is lower than 70%.
2. The shelf life of a dry-packaged product is six months from the date when the product
is packaged and sealed.
3. The package contains a HIC.
Figure 6-5 HIC for WBR2
16
WBR2 Datasheet
17
7. MOQ and Packing Information
WBR2 Datasheet
18
WBR2 Datasheet
8. Appendix: Statement
Federal Communications Commission (FCC) Declaration of Conformity
FCC Caution: Any changes or modifications not expressly approved by the party
responsible for compliance could void the user's authority to operate this equipment.
This device complies with Part 15 of the FCC Rules.Operation is subject to the following
two conditions: (1) This device may not cause harmful interference, and (2) this device
must accept any interference received, including interference that may cause undesired
operation.
Note: This equipment has been tested and found to comply with the limits for a Class B
digital device, pursuant to part 15 of the FCC Rules.These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates, uses and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the
user is encouraged to try to correct the interference by one or more of the following
measures:
—Reorient or relocate the receiving antenna.
—Increase the separation between the equipment and receiver.
—Connect the equipment into an outlet on a circuit different from that to which
the receiver is connected.
—Consult the dealer or an experienced radio/TV technician for help.
Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
rolled environment. This equipment should be installed and operated with minimum
distance 20cm between the radiator and your body.
Important Note
This radio module must not installed to co-locate and operating simultaneously with other
radios in host system except in accordance with FCC multi-transmitter product procedures.
Additional testing and equipment authorization may be required to operating
simultaneously with other radio.
The availability of some specific channels and/or operational frequency bands are country
dependent and are firmware programmed at the factory to match the intended destination.
The firmware setting is not accessible by the end user.
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WBR2 Datasheet
This product must not be disposed of as normal household waste, in
accordance with EU directive for waste electrical and electronic
equipment (WEEE- 2012/19/EU). Instead ， it should be disposed of by
returning it to the point of sale, or to a municipal recycling collection point.
Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that
this module product is in compliance with essential requirements and
other relevant provisions of Directive 2014/53/EU,2011/65/EU.A copy of
the Declaration of conformity can be found at https://www.tuya.com
The host product manufacturer is responsible for compliance to any other FCC rules that
apply to the host not covered by the modular transmitter grant of certification. The final
host product still requires Part 15 Subpart B compliance testing with the modular
transmitter installed.
The end user manual shall include all required regulatory information/warning as shown in
this manual, including: This product must be installed and operated with a minimum
distance of 20 cm between the radiator and user body.
This device have got a FCC ID：2ANDL-WBR2.The final end product must be labeled in a
visible area with the following: “Contains Transmitter Module FCC ID:2ANDL-WBR2”
This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20cm is maintained between the antenna and
users, and
2) The transmitter module may not be co-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be required.
However, the OEM integrator is still responsible for testing their end-product for any
additional compliance requirements required with this module installed.
Declaration of Conformity European notice
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