WBR1 Datasheet
Tuya WBR1 Wi-Fi and Bluetooth
Version: 1.0.0
Date: 2019-10-21
No.: 0000000001
Product
Manual
Global Intelligent Platform
1. Product Overview
WBR1 is a low-power embedded Wi-Fi and Bluetooth module that Tuya has developed. It
consists of a highly integrated RF chip (RTL8720CF) with an embedded Wi-Fi network
protocol stack and robust library functions. WBR1 also contains a low-power KM4
multipoint control unit (MCU), WLAN MAC, 1T1R WLAN, 256 KB static random-access
memory (SRAM), and 2 MB flash memory, and has extensive peripherals.
WBR1 is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and
TCP/IP protocols. You can develop embedded Wi-Fi products as required.
Figure 1-1 shows the WBR1 architecture.
Figure 1-1 WBR1 architecture
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WBR1 Datasheet
1.1 Features
Embedded low-power KM4 MCU, which can also function as an application processor
Clock rate: 100 MHz
Working voltage: 3.0 V to 3.6 V
Peripherals: seven GPIOs and two universal asynchronous receivers/transmitters
(UARTs)
Wi-Fi connectivity
802.11b/g/n20
Channels 1 to 14 at 2.4 GHz
Compatible with Bluetooth low energy (BLE) 4.2 (Up to +9dBm EIPR output
power)
WPA and WPA2 security modes
Up to +20 dBm EIPR output power in 802.11b mode
Smart network configuration for Android and iOS devices
Onboard PCB antenna
Certified by CE, FCC, and SRRC
Working temperature: –20°C to +85°C
1.2 Applications
Intelligent building
Smart household and home appliances
Smart socket and light
Industrial wireless control
Baby monitor
Network camera
Intelligent bus
2
Change History
No.
Date
Change Description
Version After Change
1
2019-10-21
This is the first release.
1.0.0
WBR1 Datasheet
3
WBR1 Datasheet
Contents
1. Product Overview.........................................................................................................................1
1.1 Features.............................................................................................................................. 2
1.2 Applications.........................................................................................................................2
2 Module Interfaces..........................................................................................................................6
2.1 Dimensions and Footprint................................................................................................ 6
2.2 Interface Pin Definition......................................................................................................6
3 Electrical Parameters................................................................................................................... 8
3.1 Absolute Electrical Parameters....................................................................................... 8
3.2 Electrical Conditions..........................................................................................................8
3.3 RF Current Consumption................................................................................................. 9
3.4 Working Current.................................................................................................................9
4 RF Features.................................................................................................................................10
4.1 Basic RF Features...........................................................................................................10
4.2 TX Performance...............................................................................................................11
4.3 RX Performance.............................................................................................................. 11
5 Antenna Information................................................................................................................... 12
5.1 Antenna Type................................................................................................................... 12
5.2 Antenna Interference Reduction...................................................................................12
6 Packaging Information and Production Instructions.............................................................12
6.1 Mechanical Dimensions................................................................................................. 12
6.2 Recommended PCB Layout..........................................................................................14
6.3 Production Instructions...................................................................................................15
6.4 Recommended Oven Temperature Curve.................................................................. 17
6.5 Storage Conditions..........................................................................................................18
7 MOQ and Packing Information................................................................................................. 19
4
WBR1 Datasheet
Tables
Table 2-1 WBR1 interface pins...................................................................................................... 6
Table 3-1 Absolute electrical parameters.....................................................................................8
Table 3-2 Normal electrical conditions..........................................................................................8
Table 3-3 Power consumption during constant transmission................................................... 9
Table 3-4 Power consumption during constant receiving..........................................................9
Table 3-5 WBR1 working current...................................................................................................9
Table 4-1 Basic RF features.........................................................................................................10
Table 4-2 Performance during constant transmission............................................................. 11
Table 4-3 RX sensitivity.................................................................................................................11
Figures
Figure 1-1 WBR1 architecture....................................................................................................... 1
Figure 2-1 WBR1 front and rear views......................................................................................... 6
Figure 6-1 WBR1 mechanical dimensions................................................................................ 13
Figure 6-2 Side view......................................................................................................................13
Figure 6-3 WBR1 pins...................................................................................................................14
Figure 6-4 Layout of the PCB to which WBR1 applies............................................................15
Figure 6-5 HIC for WBR1............................................................................................................. 16
Figure 6-6 Oven temperature curve........................................................................................... 17
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WBR1 Datasheet
Pin No.
Symbol
I/O Type
Function
1
VinPUART_TX power conversion pin (5 V or 3.3 V)
2TXI/O
GPIOA_14, UART_TX (user-side serial
interface)
3RXI/O
GPIOA_13, UART_RX (user-side serial
interface)
2 Module Interfaces
2.1 Dimensions and Footprint
WBR1 has two rows of 16 pins (2 x 8) with a 2 mm pin spacing.
The WBR1 dimensions (H x W x D) are 2.9±0.15 mm x 18±0.35 mm x 23.5±0.35 mm.
Figure 2-1 shows the WBR1 front and rear views.
Figure 2-1 WBR1 front and rear views
2.2 Interface Pin Definition
Table 2-1 WBR1 interface pins
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WBR1 Datasheet
Pin No.
Symbol
I/O Type
Function
4
3V3PPower supply pin (3.3 V)
5
GND
P
Power supply reference ground pin
6
A_2
I/O
GPIOA_2, hardware PWM pin, which is
connected to pin 18 on the internal IC
7
A_3
I/O
GPIOA_3, hardware PWM pin, which is
connected to pin 19 on the internal IC
8
Log_TX
P
GPIOA_16, UART_Log_TXD, which is used
for printing the module internal information
and can be configured as a common GPIO
9
A_4
I/O
GPIOA_4, hardware PWM pin, which is
connected to pin 20 on the internal IC
10
A_11
I/O
GPIOA_11, hardware PWM pin, which is
connected to pin 25 on the internal IC
11
Log_RX
I/O
GPIOA_15, UART_Log_RXD, which is used
for printing the module internal information
and can be configured as a common GPIO
12
A_12
I/O
GPIOA_12, hardware PWM pin, which is
connected to pin 26 on the internal IC
13
A_17
I/O
GPIOA_17, hardware PWM pin, which is
connected to pin 38 on the internal IC
14
GND
P
Power supply reference ground pin
15
GND
P
Power supply reference ground pin
16ENI/O
Enable pin, which is active at a high level (The
pin has been pulled up and is externally
controllable.)
17
A_18
I/O
GPIOA_18, hardware PWM pin, which is
connected to pin 39 on the internal IC
18
GND
P
Power supply reference ground pin
Note:
P indicates power supply pins, and I/O indicates input/output pins.
7
3 Electrical Parameters
Parameter
Description
Minimum
Value
Maximum
Value
Unit
Ts
Storage temperature
–40
105
°C
VDD
Power supply voltage
–0.3
3.6
V
Static electricity voltage
(human body model)
Tamb = 25°C
N/A2kV
Static electricity voltage
(machine model)
Tamb = 25°C
N/A
0.5
kV
Parameter
Description
Minimum
Value
Typical
Value
Maximum
Value
Unit
Ta
Working temperature
–20
N/A85°C
VDD
Working voltage
3.0
N/A
3.6
V
VIL
I/O low-level input
N/A
N/A
0.8
V
VIH
I/O high-level input
2.0
N/A
N/A
V
VOL
I/O low-level output
N/A
N/A
0.4
V
VOH
I/O high-level output
2.4
N/A
N/A
V
Imax
I/O drive current
N/A
N/A16mA
Cpad
Input pin capacitance
N/A2N/A
pF
3.1 Absolute Electrical Parameters
Table 3-1 Absolute electrical parameters
WBR1 Datasheet
3.2 Electrical Conditions
Table 3-2 Normal electrical conditions
8
3.3 RF Current Consumption
Symbol
Mode
Power
Typical
Value
Peak
Value
Unit
IRF
802.11b
11 Mbit/s
17 dBm
217
268
mA
IRF
18 dBm
231
283
mA
IRF
802.11g
54 Mbit/s
15 dBm
159
188
mA
IRF
17.5 dBm
177
213
mA
IRF
802.11n BW20
MCS7
13 dBm
145
167
mA
IRF
16.5 dBm
165
193
mA
Symbol
Mode
Typical
Value
Peak
Value
Unit
IRF
802.11b
11 Mbit/s
6365mA
IRF
802.11g
54 Mbit/s
6567mA
IRF
802.11n
HT20 MCS7
6567mA
Working Mode
Working Status (Ta = 25°C)
Typical
Value
Peak
Value
Unit
EZ
The module is in EZ mode, and the
Wi-Fi indicator blinks quickly.
75
324
mA
Table 3-3 Power consumption during constant transmission
WBR1 Datasheet
Table 3-4 Power consumption during constant receiving
3.4 Working Current
Table 3-5 WBR1 working current
9
Working Mode
Working Status (Ta = 25°C)
Typical
Value
Peak
Value
Unit
Connected and idle
The module is connected to the
network, and the Wi-Fi indicator is
steady on.
64
314
mA
Connected and
operating
The module is connected to the
network, and the Wi-Fi indicator is
steady on.
66
305
mA
Disconnected
The module is disconnected from the
network, and the Wi-Fi indicator is
steady off.
66
309
mA
4 RF Features
Parameter
Description
Frequency range
Bluetooth:2.400 GHz to 2.4835 GHz
Wi-Fi:2.412 GHz to 2.484 GHz
Wi-Fi standard
IEEE 802.11b/g/n (channels 1 to 14,Ch1-11 for
US/CA,Ch1-13 for EU/CN)
Data transmission rate
802.11b: 1, 2, 5.5, or 11 (Mbit/s)
802.11g: 6, 9, 12, 18, 24, 36, 48, or 54 (Mbit/s)
802.11n: HT20 MCS0 to MCS7
Antenna type
PCB antenna
WBR1 Datasheet
4.1 Basic RF Features
Table 4-1 Basic RF features
10
4.2 TX Performance
Parameter
Minimum
Value
Typical
Value
Maximum
Value
Unit
Average RF output power,
802.11b CCK mode
1 Mbit/s
N/A
17.5
N/A
dBm
Average RF output power,
802.11g OFDM mode
54 Mbit/s
N/A
14.5
N/A
dBm
Average RF output power,
802.11n OFDM mode
MCS7
N/A
13.5
N/A
dBm
Frequency error
–20
N/A
+20
ppm
EVM under 802.11b CCK, 11 Mbit/s, 17.5
dBm
–10
dB
EVM under 802.11g OFDM, 54 Mbit/s, 14.5
dBm
–29
dB
EVM under 802.11n OFDM, MCS7, 13.5
dBm
–30
dB
Parameter
Minimum
Value
Typical
Value
Maximum
Value
Unit
PER < 8%, 802.11b CCK
mode
1 Mbit/s
N/A
–91
N/A
dBm
PER < 10%, 802.11g OFDM
mode
54 Mbit/s
N/A
–75
N/A
dBm
PER < 10%, 802.11n OFDM
mode
MCS7
N/A
–72
N/A
dBm
Table 4-2 Performance during constant transmission
WBR1 Datasheet
4.3 RX Performance
Table 4-3 RX sensitivity
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WBR1 Datasheet
5 Antenna Information
5.1 Antenna Type
WBR1 uses an onboard PCB antenna with a gain of 2.5 dBi.
5.2 Antenna Interference Reduction
To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB
antenna, it is recommended that the antenna be at least 15 mm away from other metal
parts.
6 Packaging Information and Production Instructions
6.1 Mechanical Dimensions
The PCB dimensions (H x W x D) are 0.8±0.1 mm x 18±0.35 mm x 23.5±0.35 mm. Figure
6-1 shows the WBR1 mechanical dimensions.
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WBR1 Datasheet
Figure 6-1 WBR1 mechanical dimensions
Figure 6-2 Side view
Note:
The default dimensional tolerance is ±0.35 mm. If a customer has other requirements,
clearly specify them in the datasheet after communication.
13
6.2 Recommended PCB Layout
WBR1 Datasheet
Figure 6-3 WBR1 pins
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WBR1 Datasheet
Figure 6-4 Layout of the PCB to which WBR1 applies
6.3 Production Instructions
1. Use an SMT placement machine to mount the stamp hole module that Tuya produces
onto the PCB within 24 hours after the module is unpacked and the firmware is
burned. If not, vacuum pack the module again. Bake the module before mounting it
onto the PCB.
(1) SMT placement equipment
i. Reflow soldering machine
ii. Automated optical inspection (AOI) equipment
iii. Nozzle with a 6 mm to 8 mm diameter
(2) Baking equipment
i. Cabinet oven
ii. Anti-static heat-resistant trays
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WBR1 Datasheet
iii. Anti-static heat-resistant gloves
2. Storage conditions for a delivered module are as follows:
(1) The moisture-proof bag is placed in an environment where the temperature is
below 30°C and the relative humidity is lower than 70%.
(2) The shelf life of a dry-packaged product is six months from the date when the
product is packaged and sealed.
(3) The package contains a humidity indicator card (HIC).
Figure 6-5 HIC for WBR1
3. Bake a module based on HIC status as follows when you unpack the module
package:
(1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive
hours.
(2) If the 30% circle is pink, bake the module for 4 consecutive hours.
(3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
(4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive
hours.
4. Baking settings:
(1) Baking temperature: 125±5°C
(2) Alarm temperature: 130°C
(3) SMT placement ready temperature after natural cooling: < 36°C
(4) Number of drying times: 1
(5) Rebaking condition: The module is not soldered within 12 hours after baking.
5. Do not use SMT to process modules that have been unpacked for over three months.
Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are
exposed to the air for over three months, they will be oxidized severely and dry joints
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WBR1 Datasheet
or solder skips may occur. Tuya is not liable for such problems and consequences.
6. Before SMT placement, take electrostatic discharge (ESD) protective measures.
7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and
AOI before first SMT placement to determine a proper oven temperature and
component placement method. Draw 5 to 10 modules every hour from subsequent
batches for visual inspection and AOI.
6.4 Recommended Oven Temperature Curve
Perform SMT placement based on the following reflow oven temperature curve. The
highest temperature is 245°C.
Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice.
Figure 6-6 Oven temperature curve
17
6.5 Storage Conditions
WBR1 Datasheet
18
7 MOQ and Packing Information
WBR1 Datasheet
19
WBR1 Datasheet
8 Appendix: Statement
Federal Communications Commission (FCC) Declaration of Conformity
FCC Caution: Any changes or modifications not expressly approved by the party
responsible for compliance could void the user's authority to operate this equipment.
This device complies with Part 15 of the FCC Rules.Operation is subject to the following
two conditions: (1) This device may not cause harmful interference, and (2) this device
must accept any interference received, including interference that may cause undesired
operation.
Note: This equipment has been tested and found to comply with the limits for a Class B
digital device, pursuant to part 15 of the FCC Rules.These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates, uses and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the
user is encouraged to try to correct the interference by one or more of the following
measures:
—Reorient or relocate the receiving antenna.
—Increase the separation between the equipment and receiver.
—Connect the equipment into an outlet on a circuit different from that to which
the receiver is connected.
—Consult the dealer or an experienced radio/TV technician for help.
Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
rolled environment. This equipment should be installed and operated with minimum
distance 20cm between the radiator and your body.
Important Note
This radio module must not installed to co-locate and operating simultaneously with other
radios in host system except in accordance with FCC multi-transmitter product procedures.
Additional testing and equipment authorization may be required to operating
simultaneously with other radio.
The availability of some specific channels and/or operational frequency bands are country
dependent and are firmware programmed at the factory to match the intended destination.
The firmware setting is not accessible by the end user.
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WBR1 Datasheet
This product must not be disposed of as normal household waste, in
accordance with EU directive for waste electrical and electronic
equipment (WEEE- 2012/19/EU). Instead ， it should be disposed of by
returning it to the point of sale, or to a municipal recycling collection point.
Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that
this module product is in compliance with essential requirements and
other relevant provisions of Directive 2014/53/EU,2011/65/EU.A copy of
the Declaration of conformity can be found at https://www.tuya.com
The host product manufacturer is responsible for compliance to any other FCC rules that
apply to the host not covered by the modular transmitter grant of certification. The final
host product still requires Part 15 Subpart B compliance testing with the modular
transmitter installed.
The end user manual shall include all required regulatory information/warning as shown in
this manual, including: This product must be installed and operated with a minimum
distance of 20 cm between the radiator and user body.
This device have got a FCC ID：2ANDL-WBR1.The final end product must be labeled in a
visible area with the following: “Contains Transmitter Module FCC ID:2ANDL-WBR1”
This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20cm is maintained between the antenna and
users, and
2) The transmitter module may not be co-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be required.
However, the OEM integrator is still responsible for testing their end-product for any
additional compliance requirements required with this module installed.
Declaration of Conformity European notice
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