Hangzhou Tuya Information Technology TYWE3SE User Manual
TYWE3SE Datasheet
1
1. Product Overview
Tuya TYWE3SE Wi-Fi and Bluetooth
Module
Version: 1.0.1
Date: 2019-07-23
No.: 0000000001
Product
Manual
Global Intelligent Platform
TYWE3SE is a low-power embedded 2.4 GHz Wi-Fi and Bluetooth module that Tuya has
developed. It consists of a highly integrated RF chip (ESP32) and several peripheral
components, with an embedded Wi-Fi network protocol stack and robust library functions.
TYWE3SE is embedded with a low-power 32-bit CPU, 4 MB flash memory, 448 KB read
only memory (ROM), and 520 KB static random-access memory (SRAM), and has
extensive peripherals. TYWE3SE is an RTOS platform that integrates all function libraries
of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi and Bluetooth
products as required.
1.1 Features
Embedded low-power 32-bit CPU, which can also function as an application
processor
Dominant frequency: 160 MHz
Working voltage: 3.0 V to 3.6 V
Peripherals: 14 GPIOs, 1 universal asynchronous receiver/transmitter (UART), and 1
analog-to-digital converter (ADC)
Wi-Fi connectivity
802.11b/g/n
2.4 GHz Wi-fi
WPA and WPA2 security modes
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Up to +20 dBm output power in 802.11b mode
Smart and AP network configuration modes for Android and iOS devices
Onboard PCB antenna with a gain of 2.5 dBi
Working temperature: –20°C to +85°C
Bluetooth connectivity
Complete Bluetooth 4.2 standards: Bluetooth Basic Rate/Enhanced Data Rate
(BR/EDR) and Bluetooth Low Energy (BLE)
Class 1, Class 2, and Class 3 standards, requiring no external power amplifiers
Up to +9 dBm output power
Zero-IF receiver: –92 dBm BLE RX sensitivity
Adaptive frequency hopping (AFH)
Connections with multiple traditional Bluetooth and BLE devices
Simultaneous broadcasting and scanning
1.2 Applications
Intelligent building
Smart household and home appliances
Smart socket and light
Industrial wireless control
Baby monitor
Network camera
Intelligent bus
TYWE3SE Datasheet
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Change History
No.
Date
Change Description
Version After Change
1
2019-06-25
This is the first release.
1.0.0
2
2019-07-23
Added GPIO information.
1.0.1
TYWE3SE Datasheet
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Contents
1. Product Overview ...........................................................................................................1
1.1 Features ................................................................................................................1
1.2 Applications ...........................................................................................................2
Tables.................................................................................................................................6
Figures................................................................................................................................6
2. Module Interfaces...........................................................................................................7
2.1 Dimensions and Footprint......................................................................................7
2.2 Interface Pin Definition ..........................................................................................7
2.3 Test Pin Definition .................................................................................................9
3. Electrical Parameters....................................................................................................10
3.1 Absolute Electrical Parameters ...........................................................................10
3.2 Electrical Conditions............................................................................................10
3.3 RF Current...........................................................................................................11
3.4 Working Current ..................................................................................................11
4. RF Features..................................................................................................................12
4.1 Basic RF Features...............................................................................................12
4.2 TX Performance ..................................................................................................12
4.3 RX Performance..................................................................................................13
5. Antenna Information .....................................................................................................14
5.1 Antenna Type......................................................................................................14
5.2 Antenna Interference Reduction..........................................................................14
5.3 Antenna Connector Specifications ......................................................................15
6. Packaging Information and Production Instructions .....................................................16
6.1 Mechanical Dimensions.......................................................................................16
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6.2 Recommended PCB Encapsulation....................................................................17
6.3 Production Instructions........................................................................................18
6.4 Recommended Oven Temperature Curve ..........................................................20
6.5 Storage Conditions..............................................................................................21
7. MOQ and Packing Information .....................................................................................22
8. Appendix: Statement ....................................................................................................23
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Tables
Table 2-1 TYWE3SE interface pins....................................................................................7
Table 2-2 TYWE3SE test pins............................................................................................9
Table 3-1 Absolute electrical parameters.........................................................................10
Table 3-2 Normal electrical conditions .............................................................................10
Table 3-3 Current during constant transmission and receiving ........................................11
Table 3-4 TYWE3SE working current...............................................................................11
Table 4-1 Basic RF features.............................................................................................12
Table 4-2 Performance during constant transmission......................................................12
Table 4-3 RX sensitivity....................................................................................................13
Figures
Figure 2-1 TYWE3SE front and rear views ........................................................................7
Figure 6-1 TYWE3SE mechanical dimensions.................................................................16
Figure 6-2 Side view.........................................................................................................16
Figure 6-3 TYWE3SE pins ...............................................................................................17
Figure 6-4 PCB encapsulation diagram of TYWE3SE .....................................................18
Figure 6-5 HIC for TYWE3SE...........................................................................................19
Figure 6-6 Oven temperature curve .................................................................................20
TYWE3SE Datasheet
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2. Module Interfaces
Pin No.
Symbol
I/O Type
Function
1NCN/A
N/A2ADC
AI
10-bit SAR ADC (See the following Note 2.)
3ENInput
Module enabling pin, which is connected to
3.3 V for normal use
2.1 Dimensions and Footprint
TYWE3SE has three rows of pins with a 2 mm pin spacing.
The TYWE3SE dimensions (H x W x D) are 3.3±0.15 mm x 16±0.35 mm x 24±0.35 mm.
The PCB thickness is 0.8±0.1 mm. The shield cover height is 2.5±0.05 mm. Figure 2-1
shows the TYWE3SE front and rear views.
Figure 2-1 TYWE3SE front and rear views
2.2 Interface Pin Definition
Table 2-1 TYWE3SE interface pins
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Pin No.
Symbol
I/O Type
Function
4
IO33
I/O
Used as a GPIO, which is connected to
32K_XN (pin 13) on the internal IC
5
IO14
I/O
Used as a GPIO, which is connected to
MTMS (pin 17) on the internal IC
6
IO25
I/O
Used as a GPIO, which is connected to
GPIO25 (pin 14) on the internal IC
7
IO13
I/O
Used as a GPIO, which is connected to
MTCK (pin 20) on the internal IC
8
VDD
P
Power supply pin (3.3 V)
9
IO26
I/O
Used as a GPIO, which is connected to
GPIO_26 (pin 15) on the internal IC
10
IO27
I/O
Used as a GPIO, which is connected to
GPIO_27 (pin 16) on the internal IC
11
GND
P
Power supply reference ground pin
12
IO16
I/O
Used as a GPIO, which is connected to
GPIO_16 (pin 25) on the internal IC
13
IO17
I/O
Used as a GPIO, which is connected to
GPIO_17 (pin 27) on the internal IC
14
IO15
I/O
Used as a GPIO, which is connected to
MTDO (pin 21) on the internal IC
15
GND
P
Power supply reference ground pin
16
IO4
I/O
Used as a GPIO, which is connected to
GPIO_4 (pin 24) on the internal IC
17
IO2
Output
UART0_TXD (used to print the module
internal information, but not recommended
to be used. For details, see the following
Note 3.)
18
IO0
I/O
GPIO_0 (used during module power-on and
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