Hangzhou Tuya Information Technology BT3L G Installation Guide

BT3L-G Datasheet

Tuya BT3L-G BLE Module

Date: 2019-10-24

No.: 0000000001

Product

Manual

Global Intelligent Platform

Version: 1.0.0

1 Product Overview

BT3L-G is an embedded Bluetooth Low Energy (BLE) module that Tuya has developed. It

consists of a highly integrated Bluetooth chip (TLSR8250F512GT32) and several

peripheral circuits, with an embedded Bluetooth network protocol stack and robust library

functions. BT3L-G also contains a low-power 32-bit multipoint control unit (MCU), BLE 5.0

or 2.4 GHz radio, 4 MB flash memory, 48 KB static random-access memory (SRAM), and

nine multiplexing I/O pins.

1.1 Features

 Embedded low-power 32-bit MCU, which can also function as an application

processor

 Clock rate: 48 MHz

Working voltage: 1.8 V to 3.6 V (Under 1.8 V to 2.7 V, the module can start but the RF



performance is not guaranteed. Under 2.8 V to 3.6 V, the module performance is

normal.)

 Peripherals: nine pulse width modulation (PWM) pins

 BLE RF features

Compatible with BLE 5.0



 Up to 2 Mbit/s RF data rate

 TX power: +10 dBm

RX sensitivity: –94.5 dBm at BLE 1 Mbit/s



 Embedded Advanced Encryption Standard (AES) hardware encryption

 Onboard PCB antenna

 Working temperature: –20°C to +105°C

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1.2 Applications

 Smart LED lights

Smart households



 Smart low-power sensors

BT3L-G Datasheet

2

Change History

No.

Date

Change Description

Version After Change

1

2019-10-24

This is the first release.

1.0.0

BT3L-G Datasheet

3

BT3L-G Datasheet

Contents

1 Product Overview.....................................................................................................................1

1.1 Features.........................................................................................................................1

1.2 Applications...................................................................................................................2

2 Module Interfaces.....................................................................................................................6

2.1 Dimensions and Footprint...........................................................................................6

2.2 Interface Pin Definition................................................................................................ 6

3 Electrical Parameters.............................................................................................................. 9

3.1 Absolute Electrical Parameters................................................................................. 9

3.2 Electrical Conditions....................................................................................................9

3.3 Power Consumption..................................................................................................10

4 RF Features............................................................................................................................ 11

4.1 Basic RF Features..................................................................................................... 11

4.2 RF TX Power...............................................................................................................11

4.3 RF RX Sensitivity.......................................................................................................12

5 Antenna Information..............................................................................................................12

5.1 Antenna Type..............................................................................................................12

5.2 Antenna Interference Reduction............................................................................. 12

6 Packaging Information and Production Instructions........................................................ 13

6.1 Mechanical Dimensions and Rear Solder Pad Dimensions...............................13

6.2 Production Instructions............................................................................................. 13

6.3 Recommended Oven Temperature Curve.............................................................15

6.4 Storage Conditions....................................................................................................17

7 MOQ and Packing Information............................................................................................ 18

8 Appendix: Statement.............................................................................................................18

4

BT3L-G Datasheet

Figures

Figure 2-1 BT3L-G front and rear views.............................................................................. 6

Figure 6-1 BT3L-G mechanical dimensions and rear solder pad dimensions............ 13

Figure 6-2 HIC for BT3L-G...................................................................................................14

Figure 6-3 Oven temperature curve................................................................................... 16

Tables

Table 2-1 BT3L-G interface pins............................................................................................6

Table 3-1 Absolute electrical parameters.............................................................................9

Table 3-2 Normal electrical conditions..................................................................................9

Table 3-3 Power consumption in different working modes............................................. 10

Table 4-1 Basic RF features.................................................................................................11

Table 4-2 Power during constant transmission................................................................. 11

Table 4-3 RX sensitivity.........................................................................................................12

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BT3L-G Datasheet

Pin

No.

Symbol

I/O

Type

Function

1

RST

I/O

Hardware reset pin, which is active at a low level and

is connected to the RESETB pin on the internal IC

2

ADC

AI

12-bit ADC pin, which is connected to the TL_C4 pin

on the internal IC

2 Module Interfaces

2.1 Dimensions and Footprint

BT3L-G has two rows of pins with a 2 mm pin spacing.

The BT3L-G dimensions (H x W x D) are 3.3±0.15 mm x 16±0.35 mm x 24±0.35 mm. The

PCB thickness is 0.8±0.1 mm. Figure 2-1 shows the BT3L-G front and rear views.

Figure 2-1 BT3L-G front and rear views

2.2 Interface Pin Definition

Table 2-1 BT3L-G interface pins

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