1 Product Overview
Version: 2.0.0
Date: 2019-07-23
No.: 0000000001
Tuya BT3L BLE Module
Product
Manual
Global Intelligent Platform
BT3L is an embedded Bluetooth low energy (BLE) module that Tuya has developed. It
consists of a highly integrated Bluetooth chip (TLSR8250F512ET32) and several
peripheral components, with an embedded Bluetooth network protocol stack and robust
library functions. BT3L also contains a low-power 32-bit multipoint control unit (MCU),
BLE 5.0 component, 2.4 GHz radio component, 4 MB flash memory, 48 KB static randomaccess memory (SRAM), and nine multiplexing I/O interfaces.
1.1 Features
Embedded low-power 32-bit MCU, which can also function as an application
processor
Dominant frequency: 48 MHz
Working voltage: 1.8 V to 3.6 V (Under 1.8 V to 2.7 V, the module can start but the RF
performance is not guaranteed. Under 2.8 V to 3.6 V, the module performance is
normal.)
Peripherals: nine pulse width modulation (PWM) interfaces
BLE RF features
Compatible with BLE 5.0
Up to 2 Mbit/s RF data rate
TX power: +10 dBm
RX sensitivity: –94.5 dBm at BLE 1 Mbit/s
Embedded advanced encryption standard (AES) hardware encryption
Onboard PCB antenna with 2.5 dBi gain
BT3L Datasheet
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Working temperature: –20°C to +85°C
1.2 Applications
Smart LED lights
Smart households
Smart low-power sensors
BT3L Datasheet
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Change History
No.
Date
Change Description
Version After
Change
1
2019-03-09
This is the first release.
1.0.0
2
2019-07-23
1. Optimized the pin definition.
2. Standardized the dimensional tolerances.
3.Updated the temperature range, oven
temperature, and working voltage settings.
4. Added packing methods.
2.0.0
BT3L Datasheet
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Contents
1 Product Overview ............................................................................................................1
1.1 Features ................................................................................................................1
1.2 Applications...........................................................................................................2
Change History...................................................................................................................3
2 Module Interfaces............................................................................................................6
2.1 Dimensions and Footprint .....................................................................................6
2.2 Interface Pin Definition ..........................................................................................7
3 Electrical Parameters ......................................................................................................9
3.1 Absolute Electrical Parameters .............................................................................9
3.2 Electrical Conditions..............................................................................................9
3.3 Working Current ..................................................................................................10
4 RF Features...................................................................................................................11
4.1 Basic RF Features...............................................................................................11
4.2 RF Output Power.................................................................................................11
4.3 RF RX Sensitivity ................................................................................................12
5 Antenna Information ......................................................................................................12
5.1 Antenna Type......................................................................................................12
5.2 Antenna Interference Reduction..........................................................................12
6 Packaging Information and Production Instructions..........................................................13
6.1 Mechanical Dimensions ......................................................................................13
6.2 Production Instructions........................................................................................14
6.3 Recommended Oven Temperature Curve ..........................................................15
6.4 Storage Conditions..............................................................................................17
7 MOQ and Packing Information ......................................................................................18
8 Appendix: Statement .....................................................................................................18
BT3L Datasheet
5
Figures
Figure 2-1 BT3L pins..........................................................................................................6
Figure 6-1 BT3L mechanical dimensions .........................................................................13
Figure 6-2 HIC for BT3L ...................................................................................................14
Figure 6-3 Oven temperature curve .................................................................................16
Tables
Table 2-1 BT3L interface pins ............................................................................................7
Table 3-1 Absolute electrical parameters...........................................................................9
Table 3-2 Normal electrical conditions ...............................................................................9
Table 3-3 Current during constant transmission and receiving ........................................10
Table 4-1 Basic RF features.............................................................................................11
Table 4-2 Power during constant transmission ................................................................11
Table 4-3 RX sensitivity....................................................................................................12
BT3L Datasheet
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2 Module Interfaces
2.1 Dimensions and Footprint
BT3L has two rows of pins with a 2 mm pin spacing.
The BT3L dimensions (H x W x D) are 3.3±0.15 mm x 16±0.35 mm x 24±0.35 mm. The
PCB thickness is 0.8±0.1 mm. Figure 2-1 shows the BT3L pins.
Figure 2-1 BT3L pins
BT3L Datasheet
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2.2 Interface Pin Definition
Pin
No.
Symbol
I/O
Type
Function
1
RST
I/O
Hardware reset pin, which is active at a low level
and is connected to pin 25 on the IC
2
ADC
AI
12-bit ADC, which is connected to pin 24 on the
IC3NC
I/ONC4
TL_D7
I/O
GPIO, which is connected to pin 2 on the IC
5
TL_D2
I/O
Common I/O, which can be used as a PWM
output of the LED drive and is connected to pin 31
on the IC
6
TL_C3
I/O
Common I/O, which can be used as a PWM
output of the LED drive and is connected to pin 23
on the IC
7
TL_C2
I/O
Common I/O, which can be used as a PWM
output of the LED drive and is connected to pin 22
on the IC
8
VDD_BAT
P
Power supply pin (3.3 V)
9
GND
P
Power supply reference ground pin
10
TL_C0
I/O
GPIO, which is connected topin 20 on the IC
11
SWS
Input
Programming pin, which is connected to pin 5 on
the IC
Table 2-1 BT3L interface pins
BT3L Datasheet
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Pin
No.
Symbol
I/O
Type
Function
12
TL_A0
I/O
GPIO, which is connected to pin 3 on the IC
13
TL_B4
I/O
Common I/O, which can be used as a PWM
output of the LED drive and is connected to pin 14
on the IC
14
TL_B5
I/O
Common I/O, which can be used as a PWM
output of the LED drive and is connected to pin 15
on the IC
15
TL_B7
I/O
Serial interface receiving pin (UART RX), which is
connected to pin 17 on the IC
16
TL_B1
I/O
Serial interface transmission pin (UART TX),
which is connected to pin 6 on the IC
Note:
1. P indicates power supply pins, I/O indicates input/output pins, and AI indicates analog
input pins.
2. If you have special requirements for light colors controlled by PWM outputs, contact
Tuya business personnel.
BT3L Datasheet
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3 Electrical Parameters
Parameter
Description
Minimum
Value
Maximum
Value
Unit
Ts
Storage
temperature
–65
150°CVCC
Power supply
voltage
–0.3
3.9
V
Static electricity voltage
(human body model)
Tamb = 25°C
N/A
2
kV
Static electricity voltage
(machine model)
Tamb = 25°C
N/A
0.5
kV
Parameter
Description
Minimum
Value
Typica
l Value
Maximum
Value
Unit
Ta
Working
temperature
–20
N/A
85°CVCC
Working
voltage
2.8
3.3
3.6
V
V
IH
I/O high-
VCC x 0.7
N/A
VCC
V
3.1 Absolute Electrical Parameters
Table 3-1 Absolute electrical parameters
3.2 Electrical Conditions
Table 3-2 Normal electrical conditions
BT3L Datasheet
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Parameter
Description
Minimum
Value
Typica
l Value
Maximum
Value
Unit
level input
V
OL
I/O low-
level output
VSS
N/A
VCC x 0.1
V
V
OH
I/O high-
level output
VCC x 0.9
N/A
VCC
V
3.3 Working Current
Symbol
Description
Typical
Value
Unit
I
tx
Constant transmission, 0 dBm
output power
6.7
mA
IrxConstant receiving
6.3mAIDCConnected to a mesh network
7.4
mA
I
deepsleep1
Deep sleep mode 1 (16 KB
RAM is reserved.)
1.2μAI
deepsleep2
Deep sleep mode 2 (No RAM
is reserved.)
0.4
μA
Table 3-3 Current during constant transmission and receiving
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4 RF Features
Parameter
Description
Frequency band
2.4 GHz ISM band
Wireless standard
BLE 5.0
Data transmission rate
1 Mbit/s or 2 Mbit/s
Antenna type
Onboard PCB antenna
Parameter
Minimum
Value
Typical
Value
Maximum
Value
Unit
Average RF output power
–221010.5
dBm
20 dB modulation signal
bandwidth (1 Mbit/s)
N/A
2500
N/A
kHz
20 dB modulation signal
bandwidth (2 Mbit/s)
N/A
1400
N/A
kHz
4.1 Basic RF Features
Table 4-1 Basic RF features
4.2 RF Output Power
Table 4-2 Power during constant transmission
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4.3 RF RX Sensitivity
Parameter
Minimum
Value
Typica
l Value
Maximum
Value
Unit
1 Mbit/s
N/A
–94.5
N/A
RX sensitivity
2 Mbit/s
N/A
–91
N/A
dBm
1 Mbit/s
–250
N/A
+300
Frequency offset
2 Mbit/s
–300
N/A
+200
kHz
Co-channel interference
suppression
N/A
N/A
–10
N/A
dB
Table 4-3 RX sensitivity
5 Antenna Information
5.1 Antenna Type
BT3L uses an onboard PCB antenna.
5.2 Antenna Interference Reduction
To ensure optimal RF performance, it is recommended that the antenna be at least 15 mm
away from other metal parts. If metal materials are wrapped around the antenna, the
wireless signals will be reduced greatly, deteriorating the RF performance. Because BT3L
is inserted to the PCB, sufficient space needs to be reserved for the antenna.
BT3L Datasheet
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6 Packaging Information and Production Instructions
6.1 Mechanical Dimensions
Figure 6-1 BT3L mechanical dimensions
Note:
The default dimensional tolerance is ±0.35 mm, and the tolerance for some
measurements is ±0.1 mm. If a customer has other requirements, clearly specify them in
the datasheet after communication.
BT3L Datasheet
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6.2 Production Instructions
1. Use an SMT placement machine to mount components to the stamp hole module that
Tuya produces within 24 hours after the module is unpacked and the firmware is
burned. If not, vacuum pack the module again. Bake the module before mounting
components to the module.
(1) SMT placement equipment
i. Reflow soldering machine
ii. Automated optical inspection (AOI) equipment
iii. Nozzle with a 6 mm to 8 mm diameter
(2) Baking equipment
i. Cabinet oven
ii. Anti-static heat-resistant trays
iii. Anti-static heat-resistant gloves
2. Storage conditions for a delivered module are as follows:
(1) The moisture-proof bag is placed in an environment where the temperature is
below 30°C and the relative humidity is lower than 70%.
(2) The shelf life of a dry-packaged product is six months from the date when the
product is packaged and sealed.
(3) The package contains a humidity indicator card (HIC).
Figure 6-2 HIC for BT3L
BT3L Datasheet
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3. Bake a module based on HIC status as follows when you unpack the module package:
(1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive
hours.
(2) If the 30% circle is pink, bake the module for 4 consecutive hours.
(3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
(4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive
hours.
4. Baking settings:
(1) Baking temperature: 125±5°C
(2) Alarm temperature: 130°C
(3) SMT placement ready temperature after natural cooling: < 36°C
(4) Number of drying times: 1
(5) Rebaking condition: The module is not soldered within 12 hours after baking.
5. Do not use SMT to process modules that have unpacked for over three months.
Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are
exposed to the air for over three months, they will be oxidized severely and dry joints
or solder skips may occur. Tuya is not liable for such problems and consequences.
6. Before SMT placement, take electrostatic discharge (ESD) protective measures.
7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and
AOI before first SMT placement to determine a proper oven temperature and
component placement method. Draw 5 to 10 modules every hour from subsequent
batches for visual inspection and AOI.
6.3 Recommended Oven Temperature Curve
Perform SMT placement based on the following reflow oven temperature curve. The
highest temperature is 245°C.
Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice.
BT3L Datasheet
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Figure 6-3 Oven temperature curve
BT3L Datasheet
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6.4 Storage Conditions
BT3L Datasheet
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7 MOQ and Packing Information
MOQ and Packing Information
Product Model
MOQ (PCS)
Packing
Method
Number of
Modules in
Each Reel Pack
Number of Reel
Packs in Each
Box
BT3L
3600
Carrier tape and
reel packing
900
4
8 Appendix: Statement
Federal Communications Commission (FCC) Declaration of Conformity
FCC Caution: Any changes or modifications not expressly approved by the party
responsible for compliance could void the user's authority to operate this equipment.
This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions: (1) This device may not cause harmful
interference, and (2) this device must accept any interference received, including
interference that may cause undesired operation.
This device and its antenna(s) must not be co-located or operating in conjunction with any
other antenna or transmitter.
15.105 Information to the user.
(b) For a Class B digital device or peripheral, the instructions furnished the user shall include
the following or similar statement, placed in a prominent location in the text of the manual:
Note: This equipment has been tested and found to comply with the limits for a Class B
digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference in
a residential installation. This equipment generates, uses and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause
BT3L Datasheet
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harmful interference to radio communications. However, there is no guarantee that
interference will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to correct the interference by one or
more of the following measures:
—Reorient or relocate the receiving antenna.
—Increase the separation between the equipment and receiver.
—Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
—Consult the dealer or an experienced radio/TV technician for help.
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with minimum distance 20
cm between the radiator and your body.
Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
environment.
This transmitter must not be co-located or operating in conjunction with any other antenna
or transmitter.
The availability of some specific channels and/or operational frequency bands is country
dependent and firmware programmed at the factory to match the intended destination.
The firmware setting is not accessible by the end user.
The final end product must be labeled in a visible area with the following:
"Contains Transmitter Module 2ANDL-BT3L"
This radio module must not be installed to co-locate and operating simultaneously with
other radios in host system, additional testing and equipment authorization may be
required to operating simultaneously with other radio.
BT3L Datasheet
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Declaration of Conformity European notice
Hereby, Hangzhou Tuya Information Technology Co., Ltd. declares that this Wi-Fi module
product is in compliance with essential requirements and other relevant provisions of
Directive 2014/53/EC. A copy of the Declaration of conformity can be found at
https://www.tuya.com.
EN 300 328 V2.1.1
EN 301 489-1 V2.1.1; EN 301 489-17 V3.1.1
EN 62311:2008
EN 60950-1:2006+A11:2009+A1:2010+A12:2011+A2:2013
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