Hangzhou Tuya Information Technology BR3L, BT3L User Manual
1 Product Overview
Version: 2.0.0
Date: 2019-07-23
No.: 0000000001
Tuya BT3L BLE Module
Product
Manual
Global Intelligent Platform
BT3L is an embedded Bluetooth low energy (BLE) module that Tuya has developed. It
consists of a highly integrated Bluetooth chip (TLSR8250F512ET32) and several
peripheral components, with an embedded Bluetooth network protocol stack and robust
library functions. BT3L also contains a low-power 32-bit multipoint control unit (MCU),
BLE 5.0 component, 2.4 GHz radio component, 4 MB flash memory, 48 KB static randomaccess memory (SRAM), and nine multiplexing I/O interfaces.
1.1 Features
Embedded low-power 32-bit MCU, which can also function as an application
processor
Dominant frequency: 48 MHz
Working voltage: 1.8 V to 3.6 V (Under 1.8 V to 2.7 V, the module can start but the RF
performance is not guaranteed. Under 2.8 V to 3.6 V, the module performance is
normal.)
Peripherals: nine pulse width modulation (PWM) interfaces
BLE RF features
Compatible with BLE 5.0
Up to 2 Mbit/s RF data rate
TX power: +10 dBm
RX sensitivity: –94.5 dBm at BLE 1 Mbit/s
Embedded advanced encryption standard (AES) hardware encryption
Onboard PCB antenna with 2.5 dBi gain
BT3L Datasheet
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Working temperature: –20°C to +85°C
1.2 Applications
Smart LED lights
Smart households
Smart low-power sensors
BT3L Datasheet
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Change History
No.
Date
Change Description
Version After
Change
1
2019-03-09
This is the first release.
1.0.0
2
2019-07-23
1. Optimized the pin definition.
2. Standardized the dimensional tolerances.
3.Updated the temperature range, oven
temperature, and working voltage settings.
4. Added packing methods.
2.0.0
BT3L Datasheet
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Contents
1 Product Overview ............................................................................................................1
1.1 Features ................................................................................................................1
1.2 Applications...........................................................................................................2
Change History...................................................................................................................3
2 Module Interfaces............................................................................................................6
2.1 Dimensions and Footprint .....................................................................................6
2.2 Interface Pin Definition ..........................................................................................7
3 Electrical Parameters ......................................................................................................9
3.1 Absolute Electrical Parameters .............................................................................9
3.2 Electrical Conditions..............................................................................................9
3.3 Working Current ..................................................................................................10
4 RF Features...................................................................................................................11
4.1 Basic RF Features...............................................................................................11
4.2 RF Output Power.................................................................................................11
4.3 RF RX Sensitivity ................................................................................................12
5 Antenna Information ......................................................................................................12
5.1 Antenna Type......................................................................................................12
5.2 Antenna Interference Reduction..........................................................................12
6 Packaging Information and Production Instructions..........................................................13
6.1 Mechanical Dimensions ......................................................................................13
6.2 Production Instructions........................................................................................14
6.3 Recommended Oven Temperature Curve ..........................................................15
6.4 Storage Conditions..............................................................................................17
7 MOQ and Packing Information ......................................................................................18
8 Appendix: Statement .....................................................................................................18
BT3L Datasheet
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Figures
Figure 2-1 BT3L pins..........................................................................................................6
Figure 6-1 BT3L mechanical dimensions .........................................................................13
Figure 6-2 HIC for BT3L ...................................................................................................14
Figure 6-3 Oven temperature curve .................................................................................16
Tables
Table 2-1 BT3L interface pins ............................................................................................7
Table 3-1 Absolute electrical parameters...........................................................................9
Table 3-2 Normal electrical conditions ...............................................................................9
Table 3-3 Current during constant transmission and receiving ........................................10
Table 4-1 Basic RF features.............................................................................................11
Table 4-2 Power during constant transmission ................................................................11
Table 4-3 RX sensitivity....................................................................................................12
BT3L Datasheet
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2 Module Interfaces
2.1 Dimensions and Footprint
BT3L has two rows of pins with a 2 mm pin spacing.
The BT3L dimensions (H x W x D) are 3.3±0.15 mm x 16±0.35 mm x 24±0.35 mm. The
PCB thickness is 0.8±0.1 mm. Figure 2-1 shows the BT3L pins.
Figure 2-1 BT3L pins
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