H and D Wireless HDG200 Installation manual/ Data sheet

SPB820P-WiFi 802.11b/g/n SMD Board

Data Sheet

SPB820P R2A

WiFi SMD Board

Data Sheet 1451- Data Sheet SPB820P

Revision

Revision date

Description

PA1

2012-01-11

First Draft

PA2

2012-03-13

Revised after review

PA3

2012-11-16

Only castellated via version.

PA4

2013-01-22

Updated pin out

PA5

2013-09-13

Updated pin out and electrical data

PA6

2014-03-11

Updated Land pattern.

PB1

2014-11-21

Updated for revision R2A

PB2

2015-04-20

Updated product labels

B

2015-08-12

Release revision B

Revision History

Disclaimer and copyright notice
Information in this document, including URL references, is subject to change without notice.
THIS DOCUMENT IS PROVIDED "AS IS" WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY
OF MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY
OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. All liability, including liability for
infringement of any proprietary rights, relating to use of information in this document is disclaimed.
No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted
herein.

The Wi-Fi Alliance Member Logo is a trademark of the Wi-Fi Alliance.

All trade names, trademarks and registered trademarks mentioned in this document are property of their
respective owners, and are hereby acknowledged.
Copyright © 2015 H&D Wireless AB. All rights reserved.

Rev. B Aug-2015 Data Sheet 1451-SPB820P page 2 (27)

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Data Sheet 1451- Data Sheet SPB820P

CONTENT

1 INTRODUCTION ....................................................................................................................... 5

1.1 Overview 5

1.2 Key Features ................................................................ ..................................................................................... 5

2 HARDWARE ARCHITECTURE .................................................................................................... 6

2.1 Block Diagram .................................................................................................................................................. 6

2.2 Order information ............................................................................................................................................ 6

3 ELECTRICAL DATA .................................................................................................................... 7

3.1 Absolute maximum ratings ............................................................................................................................... 7

3.2 Electro Static Discharge (ESD) ......................................................................................................................... 7

3.3 Recommended operating conditions ................................................................................................................. 7

3.4 Power Consumption................................................................................................................................ .......... 7

3.5 RF Performance ................................................................................................................................................ 8

4 PIN CONFIGURATIONS........................................................................................................... 12

4.1 Pin Configuration SPB820P ............................................................................................................................12

4.2 Pin assignments ................................................................................................................................................12

5 APPLICATION INFORMATION ................................................................................................ 14

5.1 Power Supply ...................................................................................................................................................14

5.2 SHUTDOWN ...................................................................................................................................................14

5.3 Power down ......................................................................................................................................................14

5.4 Power save........................................................................................................................................................14

5.5 Initialization ................................ ..................................................................................................................... 14

5.6 Selecting UART or SPI as host interface .........................................................................................................15

5.7 UART host interface ........................................................................................................................................15

5.8 SPI host interface .............................................................................................................................................15

5.9 Interrupt Signals ..............................................................................................................................................16

5.10 RF interface .....................................................................................................................................................16

5.11 Firmware Upgrade ..........................................................................................................................................16

5.12 OTP Data .........................................................................................................................................................16

5.13 General application information .....................................................................................................................16

5.14 Typical Application ..........................................................................................................................................17

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Data Sheet 1451- Data Sheet SPB820P

5.15 oWL – Pico API ...............................................................................................................................................17

5.16 Soldering of the module ...................................................................................................................................18

6 PACKAGE SPECIFICATIONS .................................................................................................... 20

6.1 Mechanical outline of the SPB820P-xxQ module ............................................................................................20

6.2 Mounting information .....................................................................................................................................21

6.3 Markings on the SPB820P ...............................................................................................................................21

7 EVALUATION KIT ................................................................................................................... 22

7.1 Pin out for the EVK (SPB820PE) ....................................................................................................................22

8 STANDARDS COMPLIANCE .................................................................................................... 24

8.1 IEEE/IETF .......................................................................................................................................................24

8.2 WiFi Alliance ...................................................................................................................................................24

8.1 Regulatory ........................................................................................................................................................24

9 RELATED DOCUMENTS .......................................................................................................... 27

10 SALES OFFICES ....................................................................................................................... 27

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Data Sheet 1451- Data Sheet SPB820P

1 INTRODUCTION

1.1 Overview

SPB820P is a SMD module with the all the required components on a single module. It is a complete
solution designed to function as a standalone communication module, serial cable replacement or as an
easy to use WLAN addition with a minimal resource need, to an existing system.

SPB820P enables a cost efficient low power, high performance and feature rich client solution. It supports

802.11b, 802.11g and 802.11n. The SPB820P offloads the IP-stack and much of the WiFi-handling code from
the host to drastically reduce memory footprint and MCU requirements for adding WiFi to a host system.

The oWL-Pico API is simple and easy to use but still gives full detailed controlled of the WLAN.

SPB820P features an Access Point mode ideal for configuration of Wireless LAN, IP, and other system
parameters to be set by the user.

This data sheet pertains to hardware revision R2A and later of the SPB820P.

1.2 Key Features

 WLAN 802.11 b/g/n radio modem for 2.4GHz ISM band.
 Data Rates: 1, 2, 5.5, 6, 7.2, 9, 11, 12, 14.4, 18, 21.7, 24, 28.9, 36, 43.3, 48, 54, 57.8, 65 Mbps
 Modulation: QPSK, 16QAM, 64QAM DBPSK, DQPSK, CCK, OFDM with BPSK
 Open WEP, WPA/WPA2 encryption
 Operates in station or access point mode
 Integrated IPv4-stack
 Up to four simultaneous TCP, UDP and RAW sockets.
 Low power consumption
 Ultra low power down mode
 Simple configuration and control via oWL-Pico API.
 Single Supply Voltage 2.85 – 4.35 V
 Small footprint 20.9 x 26.6 mm with castellated pads.
 RoHS Compliant
 Integrated Chip antenna, U.FL connector or RF on pad versions available
 Evaluation kits available

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Data Sheet 1451- Data Sheet SPB820P

EXAMPLE:

Product Family

SPB820

Firmware Programming

P= oWL-pico Server

Antenna Option
B=Integrated Chip Antenna
D= U.FL. RF connnector for external antenna
R= RF Pad

Operating Temperature

C= 0oC - 70oC

M= -20oC - 85oC (release pending)

Region

E= Europe and rest of the world (ETSI)

F= North America (FCC)

Package

Q= 24 pin SMD module, castellated via pads

Delivery Package

1= ESD bag
2= Tape & Reel
3= Tray

SPB820P-

BCQ1E

2 HARDWARE ARCHITECTURE

2.1 Block Diagram

Figure 1 Block Diagram:

2.2 Order information

Table 2.1: Ordering Information

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Data Sheet 1451- Data Sheet SPB820P

Rating

Min

Max

Unit

Supply voltage

-0.3

4.55

V

Supply voltage I/O

-0.3

3.6V and VBAT + 0.31

V

Input RF level

10

dBm

Storage temperature

-50

+125

o

C

Symbol

Min

Typ.

Max

Unit

VCC

Supply Voltage

2.85

3.3

4.35 V V

IHN

All pins

2.0 3.46

V

VIL

All pins

-0.3 0.7

V

TOP

Operating temperature SPB820P
(industrial temperature range version)

-20

+25

+85 oC

Operating temperature SPB820P
(commercial temperature range version)

01) 70 oC

Mode

Conditions

Min

Typ.

Max

Unit

Peak current

All modes

300

mA

TX [802.11b]

CCK 11Mbps

205

230

mA

TX [802.11g]

OFDM 54 Mbps

165

200

mA

TX [802.11n]

OFDM 65 Mbps

140

170

mA

3 ELECTRICAL DATA

3.1 Absolute maximum ratings

Table 3.1: Absolute maximum ratings. Exceeding any of the maximum ratings, even briefly lead to deterioration in
performance or even destruction. Values indicates condition applied one at the time.

3.2 Electro Static Discharge (ESD)

SPB820P withstands ESD voltages up to 2000V HBM (Human Body Model) according to JESD22-A114 and up
to 300 V CDV (Charged Device Model) according to JESD22-A115.

3.3 Recommended operating conditions

Table 3.2: Recommended operating conditions

1) Note: can be extended to -20

o

C, see Application Note or contact H&D Wireless

3.4 Power Consumption

If no other conditions are stated does VDD=3.6V, T

= 25oC apply.

amb

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Data Sheet 1451- Data Sheet SPB820P

RX [802.11b]

Max sensitivity

53

59

mA

RX [802.11g]

Max sensitivity

56

64

mA

RX [802.11n]

Max sensitivity

56

64

mA

Power Save1 DTIM1

Beacon Interval 100ms

2.7

mA

Power Save1 DTIM3

Beacon Interval 300ms

1.3

mA

Sleep

Between Beacons

80 uA

Shutdown2

Held in shutdown

12 uA

Power down3

PWR_DWN high

0.1 uA

Parameter

Conditions

Min

Typical

Max

Units

Frequency range

ETSI1

2412

2472

MHz

FCC1

2412

2462

Supported Channels

ETSI1

Ch.1
(2412
MHz)

Ch. 13

(2472

MHz)

FCC1

Ch.1
(2412

MHz

Ch. 11

(2462

MHz)

RF impedance

50

ohm

Transmitter performance

2,3,4

Output power, avg.

CCK 1 Mbit/s

+15

+16

+17

dBm

Output power, avg.

CCK 11 Mbit/s

+15

+16

+17

dBm

Output power, avg.

OFDM 6 Mbit/s

+13

+14

+15

dBm

Output power, avg.

OFDM 54Mbit/s

+13

+14

+15

dBm

Output power , avg.

HT20 MSC0-6

+10

+11

+12

dBm

Receiver performance 11b/g, T

amb

= 25oC

Receiver sensitivity

DSSS 1Mbit/s

-94

-87

dBm

Receiver sensitivity

DSSS 2Mbit/s

-91

-85

dBm

Receiver sensitivity

CCK 5.5Mbit/s

-89

-84

dBm

Receiver sensitivity

CCK 11Mbit/s

-86

-81

dBm

Table 3.3: Current consumption in different modes.

Notes:

1) WLAN in power save mode listening to access point beacons.

2) SHUTDOWNB pin set to low level

3) PWR_DWN pin set to high level.

3.5 RF Performance

Conditions: VBAT= 3.6V, T

= 25°C Spectrum Mask and BER according to IEEE 802.11b/g/n specification.

amb

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Data Sheet 1451- Data Sheet SPB820P

Receiver sensitivity

BPSK 6Mbit/s

-89

-84

dBm

Receiver sensitivity

BPSK 9Mbit/s

-88

-83

dBm

Receiver sensitivity

QPSK 12Mbit/s

-86

-81

dBm

Receiver sensitivity

QPSK 18Mbit/s

-84

-79

dBm

Receiver sensitivity

16QAM 1/2 24Mbit/s

-82

-76

dBm

Receiver sensitivity

16QAM 3/4 36Mbit/s

-79

-72

dBm

Receiver sensitivity

64QAM 2/3 48Mbit/s

-74

-68

dBm

Receiver sensitivity

64QAM 3/4 54Mbit/s

-72

-67

dBm

Receiver performance 11n, T

amb

= 25

o

C

Receiver sensitivity

OFDM/BPSK 7.2Mbit/s

-90

-83

dBm

Receiver sensitivity

OFDM/BPSK 14.4Mbit/s

-88

-80

dBm

Receiver sensitivity

OFDM/BPSK 21.7Mbit/s

-86

-78

dBm

Receiver sensitivity

OFDM/16-QAM 28.9Mbit/s

-83

-75

dBm

Receiver sensitivity

OFDM/16-QAM 43.4Mbit/s

-79

-71

dBm

Receiver sensitivity

OFDM/64-QAM 57.8Mbit/s

-72

-67

dBm

Receiver sensitivity

OFDM/64-QAM 65Mbit/s

-70

-66

dBm

Table 3.4: RF performance.

1) SPB820P products sold for final use in North America has the Operations Region set to FCC in

the OTP memory. This limits the use of frequencies to those allowed in FCC Part15.

2) TX output power is noted as average power. Peak power may be 2-5 dBm higher for DSSS

modulation and 6-10 dBm for OFDM.

3) TX output power varies with temperature as shown in Figure 2

Figure 2: Pout vs ambient temperature

4) TX Output power varies with temperature as shown in Figure 3

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Data Sheet 1451- Data Sheet SPB820P

Parameter

Symbol

Min

Max

ns

Comments

Input set-up time

tISU

5 ns

Input hold time

tIH

5 ns

Clock fall time

tTHL

10

ns

Clock rise time

tTLH

10

ns Output delay time

tODLY

0

14

ns

Clock Frequency

25

MHz

Figure 3: Output Power vs. VCC voltage

3.5.1 SPI timing characteristics

The SPI host interface timing is showed in Figure 3-4 and Table 3-5
Condition: VDDIO= 1.7 – 3.6 V, Tamb= 0 to +70°C Parameter Condition Min Typical Max Units

Figure 3-4: SPI timing diagram (default mode

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Data Sheet 1451- Data Sheet SPB820P

Parameter

Symbol

Min

Typ

Max

Units

Comments

Input low voltage

VIL

-0.3

0.3*VIO V

Input high voltage

VIH

0.625*VIO

VIO+0.3 V

Input leakage current

IIL

-1 1

μA

Output low voltage

VOL

0.4

V

Iout<1mA

Output high voltage

VOH

VIO-0.4 V Iout>-1mA

Input pin capacitance

CIP

5.5 pF VDDIO, VDD_SDIO

VIO

1.7 3.6 V

Table 3-5: SPI timing parameter values

3.5.2 Digital input/output pad (I/O)

The digital I/O pads are of type none inverting three-state driver/receiver. The I/O pin functional schematic
is shown in Figure 3-5. It includes an input buffer and an output buffer with enable/disable control inputs. It
also includes a hold-function. When an I/O is neither driven by the internal nor by an external circuitry, the

hold function holds the latest state of the I/O. This is the case for example when Shutdown is active.

Figure 3-5: Function schematics of the I/O input pad configuration.

Table 3-6: I/O pin DC characteristics.

3.5.3 Protection of digital pins

All digital pins are protected against over-voltage with a “snap-back” circuit connected between the pad
and GND. The “snap-back” voltage is 6.2 V and the holding voltage is 6 V. This provides a satisfying

protection against over voltages and ESD. Also there is a diode included to protect against reversed
voltages.

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Data Sheet 1451- Data Sheet SPB820P

Pin

Function

Type

Description 1 VDD

S

Supply pin 3.3V

2

JTAG_TMS

I/O

Production Test interface, Do Not Connect

3

JTAG_TCK

I

Production Test interface, Do Not Connect

4

SPI_MOSI

I

SPI Host interface Input

5

SPI_CLK

I

SPI Host interface Input

6

UARTb_SPI

WAKE_UP

I

Pin Sensed at boot to select UART or SPI Host Interface
After boot use to wake up the SPB820P from sleep
mode 7 JTAG_TDI

NC

Production Test interface, Do Not Connect

8

JTAG_TDO

NC

Production Test interface, Do Not Connect

4 PIN CONFIGURATIONS

4.1 Pin Configuration SPB820P

Figure 4.1: Package pin out, top view

4.2 Pin assignments

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Data Sheet 1451- Data Sheet SPB820P

9

UART_RX/SPI_MISO

I/O

UART Host interface Receive
SPI Host Interface Output

10

UART_TX/SPI_CS

O

UART Host Interface Transmit
SPI Host Interface Chip Select

11

UART_CTS/SPI_INT

I

UART Host Interface CTS
SPI Host Interface Interrupt

12

UART_RTS

O

UART Host Interface RTS

13

GND

S

Ground

14

RF_PAD

Input

RF Signal (only for –R version)

15

GND

S

Ground

16

LED1

Output

LED1 Indicates WLAN association1

17

GPIO2

NC

GPIO pin, function defined by FW can be left
unconnected

18

HOST_ATT

Output

Wake Host From SPB820P

19

GPIO3

NC

GPIO pin, function defined by FW can be left
unconnected

20

GPIO4

NC

GPIO pin, function defined by FW can be left
unconnected

21

GPIO1

NC

GPIO pin, function defined by FW can be left
unconnected

22

SHUTDOWNb

Input

Module Reset Signal, Internal Pull up, not required to
be connected.

23

GPIO6

Input

GPIO pin, function defined by FW can be left
unconnected

24

PWR_OFF

Input

Active high powers down the SPB820P, Internal Pull
Down

Table 4.1: Pin Description for SPB820P R2A
1: Depends on firmware.

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Data Sheet 1451- Data Sheet SPB820P

5 APPLICATION INFORMATION

5.1 Power Supply

SPB820P should be powered by a single supply voltage on the supply on VDD, pin 1. The SPB820P generates
all required voltages on board.

5.2 SHUTDOWN

The SHUTDOWNb pin shall be set high during normal operation. Pulling the SHUTDOWNb pin low, sets the
HDG820 in reset mode. This turns OFF most parts of the circuit and minimizes the current consumption. All
I/O interface pins are set to predefined states (high, low or high-z) when in Shutdown mode. For minimum
power consumption turn external 1.5 V, OFF while the SHUTDOWNb pin is low.

To end reset mode set SHUTDOWNb pin high wait for the HDG820 to signal that it is ready with a low pulse
on HOST_ATT, or wait t

On SPB820P SHUTDOWNb has an internal delay circuit that will pull SHUTDOWNb high, 100 ms after
voltage is applied on VDD or PWR_DWN is released. If not used by the host the pin can be left
unconnected.

for it to respond on the host interface.

READY

5.3 Power down

By raising the PWR_DWN signal high the supply voltage to the SPB820P is switch off by the on board PMOS
FET transistor and the current consumption is brought to a minimum.

5.4 Power save

Power save is an energy saving mode where HDG820 is only listening at regular intervals for the beacons
transmitted from an access point and is set in sleep mode in between. During this sleep mode, FW is kept in
RAM but all not needed functions are turned off. Since the receive time is very short compared to the
listening interval the average current consumption is reduced significantly.
The timing of the listening interval is based on the internal 32 kHz clock.

5.5 Initialization

At power on and after reset the SPB820P will load firmware and calibrate the radio. During these 5s the
upgrade mode can be entered by the host or a serial port terminal. The UARTb_SPI signal will be sampled
at the end of the initialization period.

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Data Sheet 1451- Data Sheet SPB820P

H
L

H
L
H
L

PWR_DWN (input)

VDD (supply)

SHUTDOWN (input)

HOST_ATT (output)

UARTb_SPI (input)

t

VDD_ON

t

SHUTDOWN

t

READY

H
L

UARTb_SPI (pull-down)

WAKE_UP(pull-up)High: SPI

Low: UART

H

L

t

PWR_DWN

Parameter

Symbol

Min

Typ

Max

Unit

Comment

VDD rise time

t

VDD_ON

2

μs PWR_DWN release to VDD high

t

PWR_DWN

150 μs

SHUTDOWNb release delay

t

SHUTDOWN

1

100*

ms

Internal RC

link delay

IO supply ramp time

t

VDD_LDO_IO

360

μs Digital 1.5V supply ramp time

t

VDD_DCDC

150

μs SHUTDOWNb release to host alert

t

READY

4

s

Figure 6; Initialization timing

Table 7: Initialization timing

5.6 Selecting UART or SPI as host interface

By setting UARTb_SPI low or high during the initialization the type of host interface can be selected.
If UARTb_SPI is set low UART will be selected as host interface
If UARTb_SPI is set high SPI will be selected as host interface.
Note that the UARTb_SPI is sampled every time the SPB820P initializes, at power on and after PWR_DWN
or SHUTDOWNB signals are released.
After initialization the UARTb_SPI pin switch function to WAKE_UP.

5.7 UART host interface

If UARTb_SPI is low during initialization of the SPB820P the UART1_TX and UART1_RX will become the host
interface of the SPB820P

To communicate with the SPB820P an UART interface is used. The signals “UART1_RTS” and “UART1_CTS”
are only active when hardware flow control is enabled by commands from the host.

The SPB820P supports baud rates from 9600 baud up to 4 000 000 baud on the UART interface.

5.8 SPI host interface

If UARTb_SPI is high during initialization of the SPB820P will use the SPI bus in slave mode as host interface.
The SPI interface support a maximum clock rate of 25MHz

Note: SPI host interface is only supported for oWL-pico Server FW release 2.2 and higher.

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Data Sheet 1451- Data Sheet SPB820P

5.9 Interrupt Signals

5.9.1 WAKE_UP

After initialization the UARTb_SPI signal assumes the function of WAKE_UP.
Active low input signal, allows the host to wake up the SPB820P from Power Save, if not utilized it can be
left unconnected as the signal has an internal pull up resistor.

5.9.2 HOST_ATT

Active low output signal. Allows the host to go into low power mode and be woken by the SPB820P when
data is received on the WLAN.
HOST_ATT signals with a low pulse when the HDG820 is ready after power on.

5.10 RF interface

The SPB820P-Bxx has a high performance chip antenna as the primary RF interface.

The SPB820P-Dxx has a U.FL connector as RF interface. Use Hirose U.FL receptacle or comparable for
connection.

The SPB820P-Rxx has a pad 14 as RF interface.

5.11 Firmware Upgrade

The firmware in SPB820P can be upgraded either via the serial port or over the air. Upgrade over the serial
port has to be initiated by the host or via serial port terminal during start up. Upgrade over the air is
initialized by the host via oWL-pico command. Always check the compatibility of the FW version and HW
version of your device before attempting an upgrade. Upgrades will not overwrite data stored in the OTP
memory.

The SPB820P is an 802.11 compliant WLAN device functional within the ISM band on 2.4GHz using BPSK,
QPSK, 16-QAM and 64-QAM modulations with a calibrated fixed value for maximum transmission output
power. These properties are an integral part of the device and cannot be modified or customized by change
of firmware or other alterations.

5.12 OTP Data

MAC address, calibration data and region of intended use, is permanently stored in One Time
Programmable register during production and cannot be altered by any command or re-programming. A
firmware upgrade will not affect OTP data.

5.13 General application information

5.13.1 Design directions

The design using the SPB820P must be performed according to good RF design considerations. Keep the
area under the antenna free from all metal including signal or ground wires.

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Data Sheet 1451- Data Sheet SPB820P

5.14 Typical Application

Figure 7: Typical application connection with UART host interface

Figure 8: Typical application connection with SPI host interface

5.15 oWL – Pico API

The HDG820/SPB820P utilizes the oWL-pico API for communication from and to the host processor.
This gives the host control over the WLAN interface and the possibility to set up up to 4 simultaneous TCP,
RCP or RAW sockets. All IP and WLAN protocols are offloaded from the host. See Figure 9

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Data Sheet 1451- Data Sheet SPB820P

Figure 9: oWL-pico API

Please refer to http://pico.hd-wireless.se for more information in the oWL-pico API and reference designs.

5.16 Soldering of the module

The SPB820P is a surface mount PCB module. If the modules has been exposed to air or are delivered in
non-hermetically sealed packages it is recommended to bake the modules before soldering. To lower the
moisture content bake the packages for 192 hours at 40–45°C and <5%RH, or 24 hours at 120–130°C,
depending on the maximum temperature rating of the packaging. The recommended solder profile is
pictured in Figure 5.6

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Data Sheet 1451- Data Sheet SPB820P

Type

Rising Zone

Preheat
Zone

Reflow
Zone

Peak
Zone

Cooldown
Zone

Comment

PSR

125ºC-Peak
No

110­190ºC
60-120 s

>220ºC
>30 s

230­250ºC

Peak­125ºC
No

Figure 5.6: Reflow Temperture Profile.

5.16.1 Environmental statement

The SPB820P is designed and manufactured to comply with the RoHS and Green directives.

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Data Sheet 1451- Data Sheet SPB820P

6 PACKAGE SPECIFICATIONS

6.1 Mechanical outline of the SPB820P-xxQ module

Figure 10: Top view

Figure 11: Side View

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Data Sheet 1451- Data Sheet SPB820P

6.2 Mounting information

6.2.1 Recommended land pattern on the PCB for SPB820P-xxQ

Figure 12: SPB820P-xxQ land pattern

Place no via holes or exposed metal under the module.

For the SPB820P-B with chip antenna an area around the module should be kept free of metal in all layers
of the PCB, see Figure 12.

6.3 Markings on the SPB820P

The label on the EMC Shield is imprinted with the FCC ID and serial number.

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Data Sheet 1451- Data Sheet SPB820P

Header Pin

Pin Function

SPB820P-xxP

Pad

Comment

1

UART_RTS

12

Optional

2

PWR_DWN

24

Internal pull down can be left
unconnected

3

UART_TX

10

To host RX

4

UART_RX

9

To host TX

5

UART_CTS

11

Optional

6

HOST_ATT

18

Optional Host attention to wake up
the host from sleep.

7

WAKE_UP

23

Optional to wake up SPB820P from
sleep.

8

NC

Do not connect

9

Ground

13, 15

10

Supply 3.3V

1

7 Evaluation Kit

The Evaluation kit has the main signals of the SPB820P conveniently available on a 10 position header
socket. The LED indicator signal is connected to an onboard LED. As the PWR_DWN signal has an onboard
pull down resistor that will keep it low (active) it can be left unconnected. To power down the SPB820P the
PWR_DWN signal has to be set high.

7.1 Pin out for the EVK (SPB820PE)

Figure 13: SPB820P EVK pins top view

Rev. B Aug-2015 Data Sheet 1451-SPB820P page 22 (27)

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Data Sheet 1451- Data Sheet SPB820P

Table 7.1: SPB820P Evaluation Kit pin out

To connect to a host MCU in UART mode follow the block diagram below:

Rev. B Aug-2015 Data Sheet 1451-SPB820P page 23 (27)

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Data Sheet 1451- Data Sheet SPB820P

Standard

Notes

802.11b

Rates: 1, 2, 5.5, 11 Mbps

802.11d

International (country-to-country) roaming extensions

802.11g

Rates: 6, 9, 12, 18, 24, 36, 48, 54 Mbps

802.11i

Enhanced security

802.11j

Extensions for Japan

802.11n

Rates: 7.2, 14.4, 21.7, 28.9, 43.3, 57.8, 65

Specification

Notes

WiFi 802.11n STA

WPS2.0

Country

Approval
authority

Regulatory

Frequency band

USA

FCC

FCC ID: XO2HDG200

2.412 GHz -2.462 GHz

Canada

IC

RSS: TBA

2.412 GHz -2.462 GHz

Europe

National

ETSI

2.412 GHz -2.4835 GHz

8 STANDARDS COMPLIANCE

8.1 IEEE/IETF

Table 8.1: Applicable IEEE standards

8.2 WiFi Alliance

Table 8.2: Applicable WiFi Alliance standards

8.1 Regulatory

Table 8.3: Regulatory standards

8.1.1 FCC (United States of America)

This equipment complies with Part 15 of the FCC rules and regulations.
To fulfill FCC Certification requirements, an OEM manufacturer must comply with the following regulations:

The modular transmitter is labeled with its own FCC ID number, and, if the FCC ID is not visible when the
module is installed inside another device, then the outside of the device into which the module is installed
must also display a label referring to the enclosed module. This exterior label can use wording such as the
following:

Rev. B Aug-2015 Data Sheet 1451-SPB820P page 24 (27)

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Data Sheet 1451- Data Sheet SPB820P

Example of label required for OEM product containing SPB820P module

NOTE: Only antennas approved may be used with SPB820 module. The SPB820 Module may be integrated
with custom design antennas which OEM installer must authorize following the FCC 15.201 requirements

IMPORTANT: This equipment complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any
interference received, including interference that may cause undesired operation (FCC 15.19).

The internal / external antenna(s) used for this mobile transmitter must provide a separation distance of at
least 20 cm from all persons and must not be co-located or operating in conjunction with any other
antenna or transmitter.

This device is approved as a mobile device with respect to RF exposure compliance, and may only be
marketed to OEM installers. Use in portable exposure conditions (FCC 2.1093) requires separate equipment
authorization.

IMPORTANT: Modifications not expressly approved by this company could void the user's authority to
operate this equipment (FCC section 15.21).

IMPORTANT: The finished product is required to comply with all applicable FCC equipment authorizations
regulations, requirements and equipment functions not associated with the transmitter module portion.

Compliance for unintentional radiators (Part 15 Subpart B “Unintentional Radiators”), such as digital

devices, computer peripherals, radio receivers, etc. has to be demonstrated.

8.1.2 IC (Canada)

Equipment is subject to certification under the applicable RSSs, shall be permanently labeled on each item,
or as an inseparable combination. The label must contain the following information for full compliance:

IMPORTANT: This equipment for which a certificate has been issued is not considered certified if it is not
properly labeled. The information on the Canadian label can be combined with the manufacturer's other
labeling requirements

IMPORTANT: Operation is subject to the following two conditions: (1) this device may not cause harmful
interference, and (2) this device must accept any interference received, including interference that may
cause undesired operation.

Rev. B Aug-2015 Data Sheet 1451-SPB820P page 25 (27)

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Data Sheet 1451- Data Sheet SPB820P

IMPORTANT: To reduce potential radio interference to other users, the antenna type and its gain should be
so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for
successful communication.

IMPORTANT: The installer of this radio equipment must ensure that the antenna is located or pointed such
that it does not emit RF field in excess of Health Canada limits for the general population. Consult Safety
Code 6, obtainable from Health Canada's website www.hc-sc.gc.ca/rpb.

8.1.3 ETSI (Europe)

The SPB820P module has been certified for use in European union countries according to ETSI EN 300 328
(Electromagnetic compatibility and Radio spectrum matters for equipment operating in the 2,4 GHz ISM
band using spread spectrum modulation techniques). This standard is harmonized within the European
Union and covering essential requirements under article 3.2 of the R&TTE-directive.

If the SPB820P module are incorporated into a product, the manufacturer must ensure compliance of the
final end-user product to the European harmonized EMC and low voltage/safety standards. A declaration of
conformity must be issued for the product including compliance references to these standards. Underlying
the declaration of conformity a technical construction file (TCF), including all relevant test reports and
technical documentation, must be issued and kept on file as described in Annex II of the R&TTE-directive.

Furthermore, the manufacturer must maintain a copy of the SPB820P module documentation and ensure
the final product does not exceed the specified power ratings, antenna specifications, and/or installation
requirements as specified in the user manual. If any of these specifications are exceeded in the final
product, a complete re-test must be made in order to comply with all relevant standards as basis for CE­marking. A submission to notified body must be used only if deviations from standards have been found or
if non-harmonized standards have been used.

Rev. B Aug-2015 Data Sheet 1451-SPB820P page 26 (27)

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Data Sheet 1451- Data Sheet SPB820P

9 Related Documents

oWL-pico Doxygen information in oWL-pico Software Framework

1543-SPB820P (o)WL-pico API, user manual

1453-SPB820P Power Management Application Note

Wiki at http://pico.hd-wireless.se

10 SALES OFFICES

Global Sales Office Sweden

H&D Wireless AB
H&D Wireless AB
Norgegatan 1
164 32 Kista
Sweden

E-mail: [e-mail]
Support: [e-mail]
Home page: www.hd-wireless.se

Local sales offices and representatives see www.hd-wireless.se

Rev. B Aug-2015 Data Sheet 1451-SPB820P page 27 (27)

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