GS840E18/32/36T/B-180/166/150/100
TQFP, BGA
256K x 18, 128K x 32, 128K x 36
Commercial Temp
Industrial Temp
4Mb Sync Burst SRAMs
Features
• FT pin for user configurable flow through or pipelined operation.
• Dual Cycle Deselect (DCD) Operation.
• 3.3V +10%/-5% Core power supply
• 2.5V or 3.3V I/O supply.
• LBO pin for linear or interleaved burst mode.
• Internal input resistors on mode pins allow floating mode pins.
• Default to Interleaved Pipelined Mode.
• Byte write (BW) and/or global write (GW) operation.
• Common data inputs and data outputs.
• Clock Control, registered, address, data, and control.
• Internal Self-Timed Write cycle.
• Automatic power-down for portable applications.
• JEDEC standard 100-lead TQFP or 119 Bump BGA package.
-180 -166 -150 -100
Pipeline
3-1-1-1
Flow Through
2-1-1-1
tCycle
tKQ
IDD
tKQ
tCycle
IDD
5.5ns
3.2ns
330mA
8ns
10ns
190mA
6.0ns
3.5ns
310mA
8.5ns
10ns
190mA
6.6ns
3.8ns
275mA
10ns
10ns
190mA
10ns
4.5ns
190mA
12ns
15ns
140mA
Functional Description
Applications
The GS840E18/32/36 is a 4,718,592 bit (4,194,304 bit for x32
version) high performance synchronous SRAM with a 2 bit burst
address counter. Although of a type originally developed for Level 2
Cache applications supporting high performance CPU’s, the device
now finds application in synchronous SRAM applications ranging from
DSP main store to networking chip set support. The GS840E18/32/36
is available in a JEDEC standard 100-lead TQFP or 119 Bump BGA
package.
Controls
Addresses, data I/O’s, chip enables (E1 , E2 , E3 ), address burst control
inputs (ADSP, ADSC, ADV) and write control inputs (Bx, BW, GW) are
synchronous and are controlled by a positive edge triggered clock
input (CK). Output enable (G) and power down control (ZZ) are
asynchronous inputs. Burst cycles can be initiated with either ADSP
or ADSC inputs. In Burst mode, subsequent burst addresses are
generated internally and are controlled by ADV. The burst address
counter may be configured to count in either linear or interleave order
with the Linear Burst Order (LBO) input. The Burst function need not
180Mhz - 100Mhz
3.3V VDD
3.3V & 2.5V I/O
be used. New addresses can be loaded on every cycle with no
degradation of chip performance.
Flow Through / Pipeline Reads
The function of the Data Output register can be controlled by the user
via the FT mode pin/bump (pin 14 in the TQFP and bump 5R in the
BGA, ). Holding the FT mode pin/bump low places the RAM in Flow
through mode, causing output data to bypass the Data Output
Register. Holding FT high places the RAM in Pipelined Mode,
activating the rising edge triggered Data Output Register.
DCD Pipelined Reads
The GS840E18/32/36 is a DCD (Dual Cycle Deselect) pipelined
synchronous SRAM. SCD (Single Cycle Deselect) versions are also
available. DCD SRAMs pipeline disable commands to the same
degree as read commands. DCD RAMs hold the deselect command
for one full cycle and then begin turning off their outputs just after the
second rising edge of clock.
Byte Write and Global Write
Byte write operation is performed by using byte write enable (BW)
input combined with one or more individual byte write signals (Bx). In
addition, Global Write (GW) is available for writing all bytes at one
time, regardless of the Byte Write control inputs.
Sleep Mode
Low power (Sleep mode) is attained through the assertion (High) of
the ZZ signal, or by stopping the clock (CK). Memory data is retained
during Sleep mode.
Core and Interface Voltages
The GS840E18/32/36 operates on a 3.3V power supply and all inputs/
outputs are 3.3V and 2.5V compatible. Separate output power (VDDQ )
pins are used to de-couple output noise from the internal circuit.
Rev: 2.05 6/2000 1/31 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS840E18 100 Pin TQFP Pinout
GS840E18/32/36T/B-180/166/150/100
NC
NC
NC
VDDQ
VSS
NC
NC
DQB1
DQB2
VSS
VDDQ
DQB3
DQB4
FT
VDD
NC
VSS
DQB5
DQB6
VDDQ
VSS
DQB7
DQB8
DQB9
NC
VSS
VDDQ
NC
NC
NC
A6
E1
A7
E2
NC
NC
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
E3
BB
VDD
BA
256K x 18
Top View
VSS
CK
G
BW
GW
ADV
ADSP
ADSC
A8
A9
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
A17
NC
NC
VDDQ
VSS
NC
DQA9
DQA8
DQA7
VSS
VDDQ
DQA6
DQA5
VSS
NC
VDD
ZZ
DQA4
DQA3
VDDQ
VSS
DQA2
DQA1
NC
NC
VSS
VDDQ
NC
NC
NC
A5
A4
A3
A2
A1
A0
NC
LBO
NC
NC
VSS
VDD
A11
NC
A10
A12
A13
A14
A16
A15
Rev: 2.05 6/2000 2/31 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com .
GS840E32 100 Pin TQFP Pinout
GS840E18/32/36T/B-180/166/150/100
NC
DQC8
DQC7
VDDQ
VSS
DQC6
DQC5
DQC4
DQC3
VSS
VDDQ
DQC2
DQC1
FT
VDD
NC
VSS
DQD1
DQD2
VDDQ
VSS
DQD3
DQD4
DQD5
DQD6
VSS
VDDQ
DQD7
DQD8
NC
A6
E1
A7
E2
BC
BD
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
E3
BB
VDD
BA
128K x 32
Top View
VSS
CK
G
BW
GW
ADV
ADSP
ADSC
A8
A9
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
NC
DQB8
DQB7
VDDQ
VSS
DQB6
DQB5
DQB4
DQB3
VSS
VDDQ
DQB2
DQB1
VSS
NC
VDD
ZZ
DQA1
DQA2
VDDQ
VSS
DQA3
DQA4
DQA5
DQA6
VSS
VDDQ
DQA7
DQA8
NC
A5
A4
A3
A2
A1
A0
NC
LBO
NC
NC
VSS
VDD
A11
NC
A10
A12
A13
A14
A16
A15
Rev: 2.05 6/2000 3/31 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com .
GS840E36 100 Pin TQFP Pinout
GS840E18/32/36T/B-180/166/150/100
DQC9
DQC8
DQC7
VDDQ
VSS
DQC6
DQC5
DQC4
DQC3
VSS
VDDQ
DQC2
DQC1
FT
VDD
NC
VSS
DQD1
DQD2
VDDQ
VSS
DQD3
DQD4
DQD5
DQD6
VSS
VDDQ
DQD7
DQD8
DQD9
A6
E1
A7
E2
BC
BD
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
E3
BB
VDD
BA
128K x 36
Top View
VSS
CK
G
BW
GW
ADV
ADSP
ADSC
A8
A9
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
DQB9
DQB8
DQB7
VDDQ
VSS
DQB6
DQB5
DQB4
DQB3
VSS
VDDQ
DQB2
DQB1
VSS
NC
VDD
ZZ
DQA1
DQA2
VDDQ
VSS
DQA3
DQA4
DQA5
DQA6
VSS
VDDQ
DQA7
DQA8
DQA9
A5
A4
A3
A2
A1
A0
NC
LBO
NC
NC
VSS
VDD
A11
NC
A10
A12
A13
A14
A16
A15
Rev: 2.05 6/2000 4/31 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com .
GS840E18/32/36T/B-180/166/150/100
TQFP Pin Description
Pin Location Symbol Type Description
37, 36 A0 , A1 I Address field LSB’s and Address Counter preset Inputs
35, 34, 33, 32, 100, 99, 82, 81,44, 45, 46,
47, 48, 49, 50
80 A17 I Address Inputs (x18 versions)
52, 53, 56, 57, 58, 59, 62, 63
68, 69, 72, 73, 74, 75, 78, 79
2, 3, 6, 7, 8, 9, 12, 13
18, 19, 22, 23, 24, 25, 28, 29
51, 80, 1, 30
51, 80, 1, 30 NC No Connect (x32 Version)
58, 59, 62, 63, 68, 69, 72, 73, 74
8, 9, 12, 13, 18, 19, 22, 23, 24
51, 52, 53, 56, 57
75, 78, 79
1, 2, 3, 6, 7
25, 28, 29, 30
87 BW I Byte Write. Writes all enabled bytes. Active Low.
93, 94 BA , BB I Byte Write Enable for DQA , DQB Data I/O’s. Active Low.
95, 96 BC , BD I
95, 96 NC - No Connect (x18 Version)
89 CK I Clock Input Signal. Active High.
88 GW I Global Write Enable. Writes all bytes. Active Low.
98, 92 E1 , E3 I Chip Enable. Active Low.
97 E2 I Chip Enable. Active High.
86 G I Output Enable. Active Low.
83 ADV I Burst address counter advance enable. Active Low.
84, 85 ADSP, ADSC I Address Strobe (Processor, Cache Controller). Active Low.
64 ZZ I Sleep Mode control. Active High.
14 FT I Flow Through or Pipeline mode. Active Low.
31 LBO I Linear Burst Order mode. Active Low.
15, 41, 65, 91 VDD I Core power supply.
5,10,17, 21, 26, 40, 55, 60, 67, 71, 76, 90 VSS I I/O and Core Ground.
4, 11, 20, 27, 54, 61, 70, 77 VDDQ I Output driver power supply.
16, 38, 39, 42, 43, 66 NC - No Connect.
A2 -16 I Address Inputs
DQA1 -DQA8
DQB1 -DQB8
DQC1 -DQC8
DQD1 -DQD8
DQA9 , DQB9 ,
DQC9 , DQD9
DQA1 -DQA9
DQB1 -DQB9
NC - No Connect (x18 Version)
I/O Data Input and Output pins. (x32, x36 Version)
I/O Data Input and Output pins. (x36 Version)
I/O Data Input and Output pins. (x18 Version)
Byte Write Enable for DQC , DQD Data I/O’s. Active Low.
(x32, x36 Version)
Rev: 2.05 6/2000 5/31 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com .
GS840E18 Pad Out
GS840E18/32/36T/B-180/166/150/100
119 Bump BGA - Top View
1 2 3 4 5 6 7
A
B
C
D
E
F
G
H
J
K
L
VDDQ A6 A7 ADSP A8 A9 VDDQ
NC E2 A4 ADSC A15 E3 NC
NC A5 A3 VDD A14 A16 NC
DQB1 NC VSS NC VSS DQA9 NC
NC DQB2 VSS E1 VSS NC DQA8
VDDQ NC VSS G VSS DQA7 VDDQ
NC DQ B3 BB ADV NC NC DQA6
DQB4 NC VSS GW VSS DQA5 NC
VDDQ VDD NC VDD NC VDD VDDQ
NC DQB5 VSS CK VSS NC DQA4
DQB6 NC NC NC BA DQA3 NC
M
N
P
R
T
U
VDDQ DQB7 VSS BW VSS NC VDDQ
DQB8 NC VSS A1 VSS DQA2 NC
NC DQB9 VSS A0 VSS NC DQA1
NC A2 LBO VDD FT A13 NC
NC A10 A11 NC A12 A17 ZZ
VDDQ NC NC NC NC NC VDDQ
Rev: 2.05 6/2000 6/31 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com .
GS840E32 Pad Out
GS840E18/32/36T/B-180/166/150/100
119 Bump BGA - Top View
1 2 3 4 5 6 7
A
B
C
D
E
F
G
H
J
K
L
VDDQ A6 A7 ADSP A8 A9 VDDQ
NC E 2 A4 ADSC A15 E3 NC
NC A5 A3 VDD A14 A16 NC
DQC4 NC VSS NC VSS NC DQB4
DQC3 DQC8 VSS E1 VSS DQB8 DQB3
VDDQ DQC7 VSS G VSS DQB7 VDDQ
DQC2 DQ C6 BC ADV BB DQB6 DQB2
DQC1 DQC5 VSS GW VSS DQB5 DQB1
VDDQ VDD NC VDD NC VDD VDDQ
DQD1 DQD5 VSS CK VSS DQA5 DQA1
DQD2 DQD6 BD NC BA DQA6 DQA2
M
N
P
R
T
U
VDDQ DQD78 VSS BW VSS DQA7 VDDQ
DQD3 DQD8 VSS A1 VSS DQA8 DQA3
DQD4 NC VSS A0 VSS NC DQA4
NC A2 LBO VDD FT A13 NC
NC NC A10 A11 A12 NC ZZ
VDDQ NC NC NC NC NC VDDQ
Rev: 2.05 6/2000 7/31 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com .
GS840E36Pad Out
GS840E18/32/36T/B-180/166/150/100
119 Bump BGA - Top View
1 2 3 4 5 6 7
A
B
C
D
E
F
G
H
J
K
L
VDDQ A6 A7 ADSP A8 A9 VDDQ
NC E 2 A4 ADSC A15 E3 NC
NC A5 A3 VDD A14 A16 NC
DQC4 DQC9 VSS NC VSS DQB9 DQB4
DQC3 DQC8 VSS E1 VSS DQB8 DQB3
VDDQ DQC7 VSS G VSS DQB7 VDDQ
DQC2 DQ C6 BC ADV BB DQB6 DQB2
DQC1 DQC5 VSS GW VSS DQB5 DQB1
VDDQ VDD NC VDD NC VDD VDDQ
DQD1 DQD5 VSS CK VSS DQA5 DQA1
DQD2 DQD6 BD NC BA DQA6 DQA2
M
N
P
R
T
U
VDDQ DQD78 VSS BW VSS DQA7 VDDQ
DQD3 DQD8 VSS A1 VSS DQA8 DQA3
DQD4 DQD9 VSS A0 VSS DQA9 DQA4
NC A2 LBO VDD FT A13 NC
NC NC A10 A11 A12 NC ZZ
VDDQ NC NC NC NC NC VDDQ
Rev: 2.05 6/2000 8/31 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com .
BGA Pin Description
Pin Location Symbol Type Description
N4, P4 A0 , A1 I Address field LSB’s and Address Counter Preset Inputs.
A2, A3, A5, A6, B3, B5, C2, C3, C5,
C6, R2, R6, T3, T5
T4 An Address Input (x32/36 Versions)
T2, T6 NC - No Connect (x32/36 Versions)
T2, T6 An I Address Input (x18 Version)
K7, K6, L7, L6, M6, N7, N6, P7
H7, H6, G7, G6, F6, E7, E6, D7
H1, H2, G1, G2, F2, E1, E2, D1
K1, K2, L1, L2, M2, N1, N2, P1
P6, D6, D2, P2
P6, D6, D2, P2 NC - No Connect (x32 Version)
L5, G5, G3, L3 BA , BB , BC , BD I Byte Write Enable for DQA , DQB , DQC , DQD I/O’s. Active Low. ( x36 Version)
P7, N6, L6, K7, H6, G7, F6, E7, D6
D1, E2, G2, H1, K2, L1, M2, N1, P2
L5, G3 BA , BB I Byte Write Enable for DQA , DQB I/O’s. Active Low. ( x18 Version)
B1, C1, R1, T1, U2, J3, U3, D4, L4,
U4, J5, U5, U6, B7, C7, R7
P6, N7, M6, L7, K6, H7, G6, E6, D7,
D2, B1, E1, F2, G1, H2, K1, L2, N2,
P1, G5, L3, T4
K4 CK I Clock Input Signal. Active High.
M4 BW I Byte Write. Writes all enabled bytes. Active Low.
H4 GW I Global Write Enable. Writes all bytes. Active Low.
E4, B6 E1 , E3 I Chip Enable. Active Low.
B2 E2 I Chip Enable. Active High.
F4 G I Output Enable. Active Low.
G4 ADV I Burst address counter advance enable. Active Low.
A4, B4 ADSP, ADSC I Address Strobe (Processor, Cache Controller). Active Low.
T7 ZZ I Sleep Mode control. Active High.
R5 FT I Flow Through or Pipeline mode. Active Low.
R3 LBO I Linear Burst Order mode. Active Low.
J2, C4, J4, R4, J6 VDD I Core power supply.
D3, E3, F3, H3, K3, M3, N3, P3, D5,
E5, F5, H5, K5, M5, N5, P5
A1, F1, J1, M1, U1, A7, F7, J7, M7,
U7
GS840E18/32/36T/B-180/166/150/100
An I Address Inputs
DQA1 -DQA8
DQB1 -DQB8
DQC1 -DQC8
DQD1 -DQD8
DQA9 , DQB9 ,
DQC9 , DQD9
DQA1 -DQA9
DQB1 -DQB9
NC - No Connect
NC - No Connect (x18 Version)
VSS I I/O and Core Ground.
VDDQ I Output driver power supply.
I/O Data Input and Output pins. (x32/36 Versions)
I/O Data Input and Output pins. (x36 Version)
I/O Data Input and Output pins. (x18 Version)
Rev: 2.05 6/2000 9/31 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com .
GS840E18/32/36 Block Diagram
A0-An
LBO
ADV
CK
ADSC
ADSP
GW
BW
BA
Register
D Q
A0
A1
D0
D1
Counter
Load
Register
D Q
Q0
Q1
GS840E18/32/36T/B-180/166/150/100
A0
A1
A
Memory
Array
Q D
BB
BC
BD
E1
E3
E2
FT
G
Register
D Q
Register
D Q
Register
D Q
Register
D Q
Register
D Q
Register
D Q
36
4
D Q
Register
36
Register
D Q
ZZ
Note: Only x36 version shown for simplicity.
Power Down
Control
0
DQx0-DQx9
Rev: 2.05 6/2000 10/31 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com .