GSI GS8320Z36T-250I, GS8320Z36T-250, GS8320Z36T-225I, GS8320Z36T-225, GS8320Z36T-200I Datasheet

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GS8320Z18/36T-250/225/200/166/150/133

100-Pin TQFP

36Mb Pipelined and Flow Through

Commercial Temp
Industrial Temp

Synchronous NBT SRAM

Features

• NBT (No Bus Turn Around) functionality allows zero wait
read-write-read bus utilization; Fully pin-compatible with
both pipelined and flow through NtRAM™, NoBL™ and
ZBT™ SRAMs

• 2.5 V or 3.3 V +10%/–5% core power supply

• 2.5 V or 3.3 V I/O supply

• User-configurable Pipeline and Flow Through mode

• LBO pin for Linear or Interleave Burst mode

• Pin compatible with 2Mb, 4Mb, 8Mb, and 16Mb devices

• Byte write operation (9-bit Bytes)

• 3 chip enable signals for easy depth expansion

• ZZ Pin for automatic power-down

• JEDEC-standard 100-lead TQFP package

-250 -225 -200 -166 -150 -133 Unit

Pipeline

3-1-1-1

3.3 V

2.5 V
Flow

Through

2-1-1-1

3.3 V

2.5 V

t

KQ

tCycle

Curr (x18)

Curr (x32/x36)

Curr (x18)

Curr (x32/x36)

t

KQ

tCycle

Curr (x18)

Curr (x32/x36)

Curr (x18)

Curr (x32/x36)

2.3

2.5

3.0

3.5

3.8

4.0

4.0

4.4

5.0

6.0

6.6

7.5nsns

365

335

300

265

240

220

430

390

350

305

280

245mAmA

360

330

295

260

235

215

420

380

340

295

270

235mAmA

6.0

6.5

7.5

8.51010101115ns

7.0

7.5

8.5

200

200

180

180

180

135

230

230

195

195

195

145mAmA

200

200

180

180

180

130

225

225

195

195

195

145mAmA

Flow Through and Pipelined NBT SRAM Back-to-Back Read/Write Cycles

ns

250 MHz–133 MHz

2.5 V or 3.3 V V

DD

2.5 V or 3.3 V I/O

Functional Description

The GS8320Z18/36T is a 36Mbit Synchronous Static SRAM.
GSI's NBT SRAMs, like ZBT, NtRAM, NoBL or other
pipelined read/double late write or flow through read/single
late write SRAMs, allow utilization of all available bus
bandwidth by eliminating the need to insert deselect cycles
when the device is switched from read to write cycles.

Because it is a synchronous device, address, data inputs, and
read/ write control inputs are captured on the rising edge of the
input clock. Burst order control (LBO) must be tied to a power
rail for proper operation. Asynchronous inputs include the
Sleep mode enable (ZZ) and Output Enable. Output Enable can
be used to override the synchronous control of the output
drivers and turn the RAM's output drivers off at any time.
Write cycles are internally self-timed and initiated by the rising
edge of the clock input. This feature eliminates complex off­chip write pulse generation required by asynchronous SRAMs
and simplifies input signal timing.

The GS8320Z18/36T may be configured by the user to operate
in Pipeline or Flow Through mode. Operating as a pipelined
synchronous device, meaning that in addition to the rising edge
triggered registers that capture input signals, the device
incorporates a rising-edge-triggered output register. For read
cycles, pipelined SRAM output data is temporarily stored by
the edge triggered output register during the access cycle and
then released to the output drivers at the next rising edge of
clock.

The GS8320Z18/36T is implemented with GSI's high
performance CMOS technology and is available in a JEDEC­standard 100-pin TQFP package.

Clock

Address

Read/Write

Flow Through

Data I/O

Pipelined

Data I/O

Rev: 1.01 10/2001 1/25 © 2001, Giga Semiconductor, Inc.

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

NoBL is a trademark of Cypress Semiconductor Corp.. NtRAM is a trademark of Samsung Electronics Co.. ZBT is a trademark of Integrated Device Technology, Inc.

A B C D E F

R W R W R W

Q

A

D

B

Q

A

Q

C

D

B

D

D

Q

C

Q

E

D

D

Q

E

GS8320Z18T Pinout

Product Preview

GS8320Z18/36T-250/225/200/166/150/133

DD

A6

E1

A7

E2

NC

NC

E3

BB

BA

SS

V

V

CKE

W

G

CK

ADV

A8

A17

A18

A9

NC
NC
NC

V

DDQ

V

NC

NC
DQB1
DQB2

V

V

DDQ

DQB3
DQB4

V
V

V
DQB5
DQB6

V

DDQ

V
DQB7
DQB8

DQB9

NC

V

V

DDQ

NC
NC
NC

SS

SS

FT

DD

DD

SS

SS

SS

100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30

31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50

2M x 18

Top View

80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51

A20
NC
NC
V

DDQ

V

SS

NC
DQA9
DQA8
DQA7
V

SS

V

DDQ

DQA6
DQA5
V

SS

NC
V

DD

ZZ
DQA4
DQA3
V

DDQ

V

SS

DQA2
DQA1
NC
NC
V

SS

V

DDQ

NC
NC
NC

SS

A5

A4

A3

A2

A1

A0

NC

LBO

NC

DD

A19

NC

V

V

A11

A10

A12

A13

A14

A16

A15

Rev: 1.01 10/2001 2/25 © 2001, Giga Semiconductor, Inc.

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS8320Z36T Pinout

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GS8320Z18/36T-250/225/200/166/150/133

DD

A6

E1

A7

E2

BC

BD

E3

BB

BA

SS

V

V

CKE

W

G

CK

ADV

A8

A17

A18

A9

DQC9
DQC8
DQC7

V

DDQ

V

SS

DQC6
DQC5
DQC4
DQC3

V

SS

V

DDQ

DQC2
DQC1

FT
V
V

DD

V

SS

DQD1
DQD2

V

DDQ

V

DQD3
DQD4
DQD5
DQD6

V

V

DDQ

DQD7
DQD8
DQD9

DD

SS

SS

100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30

31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50

1M x 36

Top View

80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51

DQB9
DQB8
DQB7
V

DDQ

V

SS

DQB6
DQB5
DQB4
DQB3
V

SS

V

DDQ

DQB2
DQB1
V

SS

NC
V

DD

ZZ
DQA1
DQA2
V

DDQ

V

SS

DQA3
DQA4
DQA5
DQA6
V

SS

V

DDQ

DQA7
DQA8
DQA9

SS

A5

A4

A3

A2

A1

A0

NC

LBO

NC

DD

NC

V

A19

V

A11

A10

A12

A13

A14

A16

A15

Rev: 1.01 10/2001 3/25 © 2001, Giga Semiconductor, Inc.

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

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GS8320Z18/36T-250/225/200/166/150/133

100-Pin TQFP Pin Descriptions

Pin Location Symbol Type Description

37, 36 A0, A1 In Burst Address Inputs; Preload the burst counter

35, 34, 33, 32, 100, 99, 82, 81,

44, 45, 46,47, 48, 49, 50, 83, 84, 43A2–A19 In Address Inputs

80 A20 In Address Input (x18 Version Only)
89 CK In Clock Input Signal
93 BA In Byte Write signal for data inputs DQA1-DQA9; active low
94 BB In Byte Write signal for data inputs DQB1-DQB9; active low
95 BC In Byte Write signal for data inputs DQC1-DQC9; active low (x36 Version Only)
96 BD In Byte Write signal for data inputs DQD1-DQD9; active low (x36 Version Only)
88 W In Write Enable; active low
98 E1 In Chip Enable; active low
97 E2 In Chip Enable; Active High. For self decoded depth expansion
92 E3 In Chip Enable; Active Low. For self decoded depth expansion
86 G In Output Enable; active low
85 ADV In Advance/Load; Burst address counter control pin
87 CKE In Clock Input Buffer Enable; active low

58, 59, 62,63, 68, 69, 72, 73, 74 DQA1–DQA9 I/O Byte A Data Input and Output pins (x18 Version Only)

8, 9, 12, 13, 18, 19, 22, 23, 24 DQB1–DQB9 I/O Byte B Data Input and Output pins (x18 Version Only)

51, 52, 53, 56, 57, 75, 78, 79,

1, 2, 3, 6, 7, 25, 28, 29, 30

63, 62, 59, 58, 57, 56, 53, 52, 51 DQA1–DQA9 I/O Byte A Data Input and Output pins (x36 Version Only)

68, 69, 72, 73, 74, 75,

78, 79, 80

13, 12, 9, 8, 7, 6, 3, 2, 1 DQC1–DQC9 I/O Byte C Data Input and Output pins (x36 Version Only)

18, 19, 22, 23, 24, 25, 28, 29, 30 DQD1–DQD9 I/O Byte D Data Input and Output pins (x36 Version Only)

64 ZZ In Power down control; active high
14 FT In Pipeline/Flow Through Mode Control; active low
31 LBO In Linear Burst Order; active low

15, 16, 41, 65, 91

5,10, 17, 21, 26, 40, 55, 60, 67,

71, 76, 90

4, 11, 20, 27, 54, 61, 70, 77

38, 39, 42, 66 NC — No Connect

NC — No Connect (x18 Version Only)

DQB1–DQB9 I/O Byte B Data Input and Output pins (x36 Version Only)

V

V
V

DDQ

DD

SS

In Core power supply
In Ground
In Output driver power supply

Rev: 1.01 10/2001 4/25 © 2001, Giga Semiconductor, Inc.

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS8320Z18/36 NBT SRAM Functional Block Diagram

A

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GS8320Z18/36T-250/225/200/166/150/133

DQa–DQn

FT

D Q

K

Sense Amps

Array

Memory

Write Drivers

Write Data

Write Data

K

Register 1

K

Register 2

FT

SA1’

SA0’

Burst

Counter

Register 2

Write Address

SA1

SA0

D Q

0–An

K

Register 1

Write Address

K

LBO

ADV

K K

Match

Read, Write and

W

BA

Control Logic

Data Coherency

K

BB

BC

E1

BD

CK

E3

E2

G

CKE

Rev: 1.01 10/2001 5/25 © 2001, Giga Semiconductor, Inc.

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

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GS8320Z18/36T-250/225/200/166/150/133

Functional Details

Clocking

Deassertion of the Clock Enable (CKE) input blocks the Clock input from reaching the RAM's internal circuits. It may be used to
suspend RAM operations. Failure to observe Clock Enable set-up or hold requirements will result in erratic operation.

Pipeline Mode Read and Write Operations

All inputs (with the exception of Output Enable, Linear Burst Order and Sleep) are synchronized to rising clock edges. Single cycle
read and write operations must be initiated with the Advance/Load pin (ADV) held low, in order to load the new address. Device
activation is accomplished by asserting all three of the Chip Enable inputs (E1, E2 and E3). Deassertion of any one of the Enable
inputs will deactivate the device.

Function W BA BB BC BD

Read H X X X X
Write Byte “a” L L H H H
Write Byte “b” L H L H H
Write Byte “c” L H H L H
Write Byte “d” L H H H L

Write all Bytes L L L L L

Write Abort/NOP L H H H H

Read operation is initiated when the following conditions are satisfied at the rising edge of clock: CKE is asserted Low, all three
chip enables (E1, E2, and E3) are active, the write enable input signals W is deasserted high, and ADV is asserted low. The address
presented to the address inputs is latched in to address register and presented to the memory core and control logic. The control
logic determines that a read access is in progress and allows the requested data to propagate to the input of the output register. At
the next rising edge of clock the read data is allowed to propagate through the output register and onto the output pins.

Write operation occurs when the RAM is selected, CKE is active, and the Write input is sampled low at the rising edge of clock.
The Byte Write Enable inputs (BA, BB, BC, & BD) determine which bytes will be written. All or none may be activated. A write
cycle with no Byte Write inputs active is a no-op cycle. The pipelined NBT SRAM provides double late write functionality,
matching the write command versus data pipeline length (2 cycles) to the read command versus data pipeline length (2 cycles). At
the first rising edge of clock, Enable, Write, Byte Write(s), and Address are registered. The Data In associated with that address is
required at the third rising edge of clock.

Flow Through Mode Read and Write Operations

Operation of the RAM in Flow Through mode is very similar to operations in Pipeline mode. Activation of a Read Cycle and the
use of the Burst Address Counter is identical. In Flow Through mode the device may begin driving out new data immediately after
new address are clocked into the RAM, rather than holding new data until the following (second) clock edge. Therefore, in Flow
Through mode the read pipeline is one cycle shorter than in Pipeline mode.

Write operations are initiated in the same way, but differ in that the write pipeline is one cycle shorter as well, preserving the ability
to turn the bus from reads to writes without inserting any dead cycles. While the pipelined NBT RAMs implement a double late
write protocol, in Flow Through mode a single late write protocol mode is observed. Therefore, in Flow Through mode, address
and control are registered on the first rising edge of clock and data in is required at the data input pins at the second rising edge of
clock.

Rev: 1.01 10/2001 6/25 © 2001, Giga Semiconductor, Inc.

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Product Preview

GS8320Z18/36T-250/225/200/166/150/133

Synchronous Truth Table

Operation Type Address E1 E2 E3 ZZ ADV W Bx G CKE CK DQ Notes

Deselect Cycle, Power Down D None H X X L L X X X L L-H High-Z
Deselect Cycle, Power Down D None X X H L L X X X L L-H High-Z
Deselect Cycle, Power Down D None X L X L L X X X L L-H High-Z
Deselect Cycle, Continue D None X X X L H X X X L L-H High-Z 1
Read Cycle, Begin Burst R External L H L L L H X L L L-H Q
Read Cycle, Continue Burst B Next X X X L H X X L L L-H Q 1,10
NOP/Read, Begin Burst R External L H L L L H X H L L-H High-Z 2
Dummy Read, Continue Burst B Next X X X L H X X H L L-H High-Z 1,2,10
Write Cycle, Begin Burst W External L H L L L L L X L L-H D 3
Write Cycle, Continue Burst B Next X X X L H X L X L L-H D 1,3,10
NOP/Write Abort, Begin Burst W None L H L L L L H X L L-H High-Z 2,3
Write Abort, Continue Burst B Next X X X L H X H X L L-H High-Z 1,2,3,10
Clock Edge Ignore, Stall Current X X X L X X X X H L-H - 4
Sleep Mode None X X X H X X X X X X High-Z
Notes:

1. Continue Burst cycles, whether read or write, use the same control inputs. A Deselect continue cycle can only be entered into if a Dese­lect cycle is executed first.

2. Dummy Read and Write abort can be considered NOPs because the SRAM performs no operation. A Write abort occurs when the W
pin is sampled low but no Byte Write pins are active so no write operation is performed.

3. G can be wired low to minimize the number of control signals provided to the SRAM. Output drivers will automatically turn off during
write cycles.

4. If CKE High occurs during a pipelined read cycle, the DQ bus will remain active (Low Z). If CKE High occurs during a write cycle, the bus
will remain in High Z.

5. X = Don’t Care; H = Logic High; L = Logic Low; Bx = High = All Byte Write signals are high; Bx = Low = One or more Byte/Write
signals are Low

6. All inputs, except G and ZZ must meet setup and hold times of rising clock edge.

7. Wait states can be inserted by setting CKE high.

8. This device contains circuitry that ensures all outputs are in High Z during power-up.

9. A 2-bit burst counter is incorporated.

10. The address counter is incriminated for all Burst continue cycles.

Rev: 1.01 10/2001 7/25 © 2001, Giga Semiconductor, Inc.

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Pipeline and Flow Through Read Write Control State Diagram

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GS8320Z18/36T-250/225/200/166/150/133

D

B

Deselect

R

D

W

New Read New Write

R

B

R

W

W

D

R

R

Burst Read Burst Write

B

Key Notes:

ƒ

Current State (n)

Input Command Code

Transition

Next State (n+1)

1. The Hold command (CKE Low) is not
shown because it prevents any state change.

2. W, R, B and D represent input command

codes ,as indicated in the Synchronous Truth Table.

W

B

W

B

DD

n n+1 n+2 n+3

Clock (CK)

Command

Current State Next State

ƒ

ƒ ƒ ƒ

Current State and Next State Definition for Pipeline and Flow Through Read/Write Control State Diagram

Rev: 1.01 10/2001 8/25 © 2001, Giga Semiconductor, Inc.

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.