GSI GS8180D18D-333I, GS8180D18D-333, GS8180D18D-300I, GS8180D18D-300, GS8180D18D-250I Datasheet

...
Rev: 2.00f 6/2002 1/27 © 2002, Giga Semiconductor, Inc.
Specifications cited are design targets and are subject to change without notice. For latest documentation contact your GSI representative.
Preliminary
GS8180D18D-333/300/250/200
18Mb Σ2x2B4
SigmaQuad SRAM
1.8 V V
DD
1.8 V and 1.5 V I/O
165-Bump BGA Commercial Temp Industrial Temp
Features
• Simultaneous Read and Write SigmaQuad™ Interface
• JEDEC-standard pinout and package
• Dual Double Data Rate interface
• Echo Clock outputs track data output drivers
• Byte Write controls sampled at data-in time
• Burst of 4 Read and Write
• 1.8 V +150/–100 mV core power supply
• 1.5 V or 1.8 V HSTL Interface
• Pipelined read operation
• Fully coherent read and write pipelines
• ZQ mode pin for programmable output drive strength
• IEEE 1149.1 JTAG-compliant Boundary Scan
• 165-bump, 13 mm x 15 mm, 1 mm bump pitch BGA package
• Pin-compatible with future 36Mb, 72Mb, and 144Mb devices
SigmaRAM Family Overview
GS8180D18 are built in compliance with the SigmaQuad SRAM pinout standard for Separate I/O synchronous SRAMs. They are 18,874,368-bit (18Mb) SRAMs. These are the first in a family of wide, very low voltage HSTL I/O SRAMs designed to operate at the speeds needed to implement economical high performance networking systems.
SigmaQuad SRAMs are offered in a number of configurations. Some emulate and enhance other synchronous separate I/O SRAMs. A higher performance SDR (Single Data Rate) Burst of 2 version is also offered. The logical differences between the protocols employed by these RAMs hinge mainly on various combinations of address bursting, output data registering, and write cueing. Along with the Common I/O family of SigmaRAMs, the SigmaQuad family of SRAMs allows a user to implement the interface protocol best suited to the task at hand.
Clocking and Addressing Schemes
A
Σ
2x2B4 SigmaQuad SRAM is a synchronous device. It employs
two input register clock inputs, K and K
. K and K are independent single-ended clock inputs, not differential inputs to a single differential clock input buffer. The device also allows the user to manipulate the output register clock inputs quasi independently with the C and C clock inputs. C and C
are also independent single-ended clock inputs,
not differential inputs. If the C clocks are tied high, the K clocks are routed internally to fire the output registers instead. Each
Σ
2x2B4
SigmaQuad SRAM also supplies Echo Clock outputs, CQ and CQ
, that are synchronized with read data output. When used in a source synchronous clocking scheme, these Echo Clock outputs can be used to fire input registers at the data’s destination.
Because Separate I/O
Σ
2x2B4 RAMs always transfer data in four
packets, A0 and A1 are internally set to 0 for the first read or write transfer, and automatically incremented by 1 for the next transfers. Because the LSBs are tied off internally, the address field of a
Σ
2x2B4 RAM is always two address pins less than the advertised
index depth (e.g., the 1M x 18 has a 256K addressable index).
- 333 -300 -250 -200
tKHKH 3.0 ns 3.3 ns 4 ns 5 ns
tKHQV 1.6 ns 1.8 ns 2.1 ns 2.3 ns
165-Bump, 13 mm x 15 mm BGA
1 mm Bump Pitch, 11 x 15 Bump Array
Bottom View
JEDEC Std. MO-216, Variation CAB-1
Rev: 2.00f 6/2002 2/27 © 2002, Giga Semiconductor, Inc.
Specifications cited are design targets and are subject to change without notice. For latest documentation contact your GSI representative.
Preliminary
GS8180D18D-333/300/250/200
1M x 18 SigmaQuad SRAM — Top View
1234567891011
A CQ
MCL/SA (144Mb)
NC/SA (36Mb)
W
BW1 K NC R SA
MCL/SA
(72Mb)
CQ
B NC Q9 D9 SA NC K BW0
SA NC NC Q8
C NC NC D10 V
SS
SA
NC SA V
SS
NC Q7 D8
D NC D11 Q10 V
SS
V
SS
V
SS
V
SS
V
SS
NC NC D7
E NC NC Q11 V
DDQ
V
SS
V
SS
V
SS
V
DDQ
NC D6 Q6
F NC Q12 D12 V
DDQ
V
DD
V
SS
V
DD
V
DDQ
NC NC Q5
G NC D13 Q13 V
DDQ
V
DD
V
SS
V
DD
V
DDQ
NC NC D5
H NC V
REF
V
DDQ
V
DDQ
V
DD
V
SS
V
DD
V
DDQ
V
DDQ
V
REF
ZQ
J NC NC D14 V
DDQ
V
DD
V
SS
V
DD
V
DDQ
NC Q4 D4
K NC NC Q14 V
DDQ
V
DD
V
SS
V
DD
V
DDQ
NC D3 Q3
L NC Q15 D15 V
DDQ
V
SS
V
SS
V
SS
V
DDQ
NC NC Q2
M NC NC D16 V
SS
V
SS
V
SS
V
SS
V
SS
NC Q1 D2
N NC D17 Q16 V
SS
SA SA SA V
SS
NC NC D1
P NC NC Q17 SA SA C SA SA NC D0 Q0
R TDO TCK SA SA SA C
SA SA SA TMS TDI
11 x 15 Bump BGA—13 x 15 mm2 Body—1 mm Bump Pitch
Notes:
1. Expansion addresses: A3 for 36Mb, A10 for 72Mb, A2 for 144Mb
2. BW0
controls writes to D0:D8. BW1 controls writes to D9:D17.
3. MCL = Must Connect Low
4. It is recommended that H1 be tied low for compatibility with future devices.
Rev: 2.00f 6/2002 3/27 © 2002, Giga Semiconductor, Inc.
Specifications cited are design targets and are subject to change without notice. For latest documentation contact your GSI representative.
Preliminary
GS8180D18D-333/300/250/200
Note: NC = Not Connected to die or any other pin
Background
Separate I/O SRAMs, from a system architecture point of view, are attractive in applications where alternating reads and writes are needed. Therefore, the SigmaQuad SRAM interface and truth table are optimized for alternating reads and writes. Separate I/O SRAMs are unpopular in applications where multiple reads or multiple writes are needed because burst read or write transfers from Separate I/O SRAMs can cut the RAM’s bandwidth in half.
A SigmaQuad SRAM can begin an alternating sequence of reads and writes with either a read or a write. In order for any separate I/O SRAM that shares a common address between its two ports to keep both ports running all the time, the RAM must implement some sort of burst transfer protocol. The burst must be at least long enough to cover the time the opposite port is receiving instructions on what to do next. The rate at which a RAM can accept a new random address is the most fundamental performance metric for the RAM. Each of the three SigmaQuad SRAMs support similar address rates because random address rate is determined by the internal performance of the RAM and they are all based on the
Pin Description Table
Symbol Description Type Comments
SA Synchronous Address Inputs Input
NC No Connect
R
Synchronous Read Input Active Low
W
Synchronous Write Input Active Low
BW0
–BW1 Synchronous Byte Writes Input
Active Low
K Input Clock Input Active High
K
Input Clock Input Active Low
C Output Clock Input Active High
C
Output Clock Input Active Low
TMS Test Mode Select Input
TDI Test Data Input Input
TCK Test Clock Input Input
TDO Test Data Output Output
V
REF
HSTL Input Reference Voltage Input
ZQ Output Impedance Matching Input Input
MCL Must Connect Low
CQ Synchronous Echo Clock Output Output Echoes C or K Clock
CQ
Synchronous Echo Clock-bar Output Output Echoes C or K Clock
D0–D17 Synchronous Data Inputs Input
Q0–Q17 Synchronous Data Outputs Output
V
DD
Power Supply Supply 2.5 V Nominal
V
DDQ
Isolated Output Buffer Supply Supply 1.5 V Nominal
V
SS
Power Supply: Ground Supply
Rev: 2.00f 6/2002 4/27 © 2002, Giga Semiconductor, Inc.
Specifications cited are design targets and are subject to change without notice. For latest documentation contact your GSI representative.
Preliminary
GS8180D18D-333/300/250/200
same internal circuits. Differences between the truth tables of the different SigmaQuad SRAMs, or any other Separate I/O SRAMs, follow from differences in how the RAM’s interface is contrived to interact with the rest of the system. Each mode of operation has its own advantages and disadvantages. The user should consider the nature of the work to be done by the RAM to evaluate which version is best suited to the application at hand.
Alternating Read-Write Operations
SigmaQuad SRAMs follow a few simple rules of operation.
- Read or Write commands issued on one port are never allowed to interrupt an operation in progress on the other port.
- Read or Write data transfers in progress may not be interrupted and re-started.
- R
and W high always deselects the RAM but does not disable the CQ or CQ output pins.
- All address, data, and control inputs are sampled on clock edges.
In order to enforce these rules, each RAM combines present state information with command inputs. See the Truth Table for details.
Rev: 2.00f 6/2002 5/27 © 2002, Giga Semiconductor, Inc.
Specifications cited are design targets and are subject to change without notice. For latest documentation contact your GSI representative.
Preliminary
GS8180D18D-333/300/250/200
Σ
2x2B4 SigmaQuad SRAM DDR Read
The status of the Address Input, W
, and R pins are sampled at each rising edge of K. W and R high causes chip disable. A low on the Read
Enable-bar pin, R
, begins a read cycle. R is always ignored if the previous command loaded was a read command. The four resulting data output
transfers begin after the next rising edge of the K clock. Data is clocked out by the next rising edge of the C, the rising edge of C
after that, the
next rising edge of C, and finally by the next rising edge of C
.
Σ
2x2B4 Double Data Rate SigmaQuad SRAM Read First
Dwg Re v. G
DC0 DC1 DC2 DC3 DE0
QB0 QB1 QB2 QB3 QD0
/CQ
/W
D
Q
CQ
/BWx
C
/C
DE F
/R
Address XX B C
Write Read Write Read
K
/K
No Op Read
Rev: 2.00f 6/2002 6/27 © 2002, Giga Semiconductor, Inc.
Specifications cited are design targets and are subject to change without notice. For latest documentation contact your GSI representative.
Preliminary
GS8180D18D-333/300/250/200
Σ
2x2B4 SigmaQuad SRAM DDR Write
The status of the Address Input, W
, and R pins are sampled at each rising edge of K. W and R high causes chip disable. A low on the Write
Enable-bar pin, W
, and a high on the Read Enable-bar pin, R, begins a write cycle. W is always ignored if the previous command was a write
command. Data is clocked in by the next rising edge of K, the rising edge of K
after that, the next rising edge of K, and finally by the next rising
edge of K
.
Σ
2x2B4 Double Data Rate SigmaQuad SRAM Write First
Special Functions
Byte Write Control
Byte Write Enable pins are sampled at the same time that Data In is sampled. A high on the Byte Write Enable pin associated with a particular byte (e.g., BW0
controls D0–D8 inputs) will inhibit the storage of that particular byte, leaving whatever data may be stored at the current address at that byte location undisturbed. Any or all of the Byte Write Enable pins may be driven high or low during the data in sample times in a write sequence.
Dwg Re v. G
DB0 DB1 DB2 DB3 DD0 DD1 DD2
QC0 QC1 QC2
CQ
/CQ
DE
/W
D
Q
C
/C
/BWx
F
/R
Address XX B C
Read Write Read Write
K
/K
No O p Write
Rev: 2.00f 6/2002 7/27 © 2002, Giga Semiconductor, Inc.
Specifications cited are design targets and are subject to change without notice. For latest documentation contact your GSI representative.
Preliminary
GS8180D18D-333/300/250/200
Each write enable command and write address loaded into the RAM provides the base address for a 4 beat data transfer. The x18 version of the RAM, for example, may write 72 bits in association with each address loaded. Any 9-bit byte may be masked in any write sequence.
Example x18 RAM Write Sequence using Byte Write Enables
Resulting Write Operation
Output Register Control
SigmaQuad SRAMs offer two mechanisms for controlling the output data registers. Typically, control is handled by the Output Register Clock inputs, C and C
. The Output Register Clock inputs can be used to make small phase adjustments in the firing of the output registers by allowing the user to delay driving data out as much as a few nanoseconds beyond the next rising edges of the K and K
clocks. If the C and C clock inputs
are tied high, the RAM reverts to K and K
control of the outputs, allowing the RAM to function as a conventional pipelined read SRAM.
Echo Clock
SigmaQuad SRAMs feature Echo Clock outputs, CQ and CQ
, that track the performance of the output drivers. The Echo Clocks are delayed
copies of the Output Register clocks, C and C
or K and K (if the C and C clock inputs are tied high). Echo Clocks are designed to track changes in output driver delays due to variance in die temperature and supply voltage. The Echo Clocks are designed to fire with the rest of the data output drivers. SigmaQuad SRAMs provide both in-phase, or true, Echo Clock output, CQ and inverted Echo Clock output CQ
.
Echo Clocks are always active.
Neither inhibiting reads via holding R
high, nor deselection of the RAM via holding R and W high will
deactivate the Echo Clocks.
Data In Sample
Time
BW0 BW1 D0–D8 D9–D17
Beat 1 0 1 Data In Don’t Care
Beat 2 1 0 Don’t Care Data In
Beat 3 0 0 Data In Data In
Beat 4 1 0 Don’t Care Data In
Byte 1 D0–D8
Byte 2
D9–D17
Byte 3
D0–D8
Byte 4
D9–D17
Byte 5
D0–D8
Byte 6
D9–D17
Byte 7
D0–D8
Byte 8
D9–D17
Written Unchanged Unchanged Written Written Written Unchanged Written
Rev: 2.00f 6/2002 8/27 © 2002, Giga Semiconductor, Inc.
Specifications cited are design targets and are subject to change without notice. For latest documentation contact your GSI representative.
Preliminary
GS8180D18D-333/300/250/200
Example Four Bank Depth Expansion Schematic
A
K
R
W
A0–A
n
K
W
0
D1–D
n
Bank 0
Bank 1 Bank 2
Bank 3
R
0
CQ
D
A
K
W
CQ
D
A
K
W
CQ
D
A
K
W
CQ
D
R
R
R
QQQ Q
CC CC
Q1–Q
n
C
CQ
0
CQ
1
CQ
2
CQ
3
W
1
R
1
W
2
R
2
W
3
R
3
Note: For simplicity BWn, K, C and CQ are not shown.
Rev: 2.00f 6/2002 9/27 © 2002, Giga Semiconductor, Inc.
Specifications cited are design targets and are subject to change without notice. For latest documentation contact your GSI representative.
Preliminary
GS8180D18D-333/300/250/200
Σ
2x2B4 SigmaQuad SRAM Depth Expansion
Dwg Re v. G
DC0 DC1 DC2 DC3 DE0 DE1 DE2 DE3
QD0 QD1 QD2 QD3
QB0 QB1 QB2 QB3
QB0 QB1 QB2 QB3 QD0 QD1 QD2 QD3
CQ
Bank 1
C
Q
Bank 2
Q
Bank 1
B
/C
CQ
Bank 2
Q Bank 1 +
Q Bank 2
/R2
/R1
/W1
/W2
D
Bank 1
D
Bank 2
GDEFCAddress XX
Wri t e
- Bank 2 Bank 2 Bank 1 Bank 2 Bank 1 Bank 1
Write Read Write Read
K
/K
No Op Read
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