GS74108TP/J
SOJ, TSOP
512K x 8
Commercial Temp
Industrial Temp
4Mb Asynchronous SRAM
Features
• Fast access time: 8, 10, 12, 15ns
• CMOS low power operation: 150/125/110/90 mA at min. cycle time.
• Single 3.3V ± 0.3V power supply
• All inputs and outputs are TTL compatible
• Fully static operation
• Industrial Temperature Option: -40° to 85°C
• Package line up
J: 400mil, 36 pin SOJ package
TP: 400mil, 44 pin TSOP Type II package
Description
The GS74108 is a high speed CMOS static RAM organized as
524,288-words by 8-bits. Static design eliminates the need for external clocks or timing strobes. Operating on a single 3.3V power supply
and all inputs and outputs are TTL compatible. The GS74108 is available in 400 mil SOJ and 400 mil TSOP Type-II packages.
Pin Descriptions
Symbol Description
A0 to A18
DQ1 to DQ8 Data input/output
CE Chip enable input
WE Write enable input
OE Output enable input
VDD +3.3V power supply
VSS Ground
NC No connect
Address input
SOJ 512K x 8 Pin Configuration
A4
A3
A2
A1
A0
CE
DQ1
DQ2
VDD
VSS
DQ3
DQ4
WE
A17
A16
A15
A14
A13
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
36 pin
400mil SOJ
8, 10, 12, 15ns
3.3V VDD
Center VDD & VSS
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19 NC
NC
A5
A6
A7
A8
OE
DQ8
DQ7
VSS
VDD
DQ6
DQ5
A9
A10
A11
A12
A18
Rev: 1.06 7/2000 1/12 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
TSOP-II 512K x 8 Pin Configuration
GS74108TP/J
NC
NC
A4
A3
A2
A1
A0
CE
DQ1
DQ2
VDD
VSS
DQ3
DQ4
WE
A17
A16
A15
A14
A13
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44 pin
400mil TSOP II
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
NC
NC
NC
A5
A6
A7
A8
OE
DQ8
DQ7
VSS
VDD
DQ6
DQ5
A9
A10
A11
A12
A18
NC
NC
NC
Block Diagram
A0
A18
CE
WE
OE
Address
Input
Buffer
Control
Row
Decoder
Memory Array
Column
Decoder
I/O Buffer
DQ1
DQ8
Rev: 1.06 7/2000 2/12 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Truth Table
CE OE WE DQ1 to DQ8 VDD Current
H X X Not Selected ISB1 , ISB2
L L H Read
L H H High Z
Note: X: “H” or “L”
Absolute Maximum Ratings
Parameter Symbol Rating Unit
Supply Voltage VDD -0.5 to +4.6 V
GS74108TP/J
IDDL X L Write
Input Voltage VIN
Output Voltage VOUT
Allowable power dissipation PD 0.7 W
Storage temperature TSTG -55 to 150
Note:
Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation shall be restricted to Recommended
Operating Conditions. Exposure to higher than recommended voltages for extended periods of time could affect device reliability.
-0.5 to VDD+0.5
(≤ 4.6V max.)
-0.5 to VDD+0.5
(≤ 4.6V max.)
V
V
o
C
Rev: 1.06 7/2000 3/12 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Recommended Operating Conditions
Parameter Symbol Min Typ Max Unit
Supply Voltage for -10/12/15 VDD 3.0 3.3 3.6 V
Supply Voltage for -8 VDD 3.135 3.3 3.6 V
Input High Voltage VIH 2.0 - VDD +0.3 V
Input Low Voltage VIL -0.3 - 0.8 V
GS74108TP/J
Ambient Temperature,
Commercial Range
Ambient Temperature,
Industrial Range
Note:
1. Input overshoot voltage should be less than VDD +2V and not exceed 20ns.
2. Input undershoot voltage should be greater than -2V and not exceed 20ns.
TAc 0 - 70
TAI -40 - 85
Capacitance
Parameter Symbol Test Condition Max Unit
Input Capacitance CIN VIN =0V 5 pF
Output Capacitance COUT VOUT =0V 7 pF
Notes:
1. Tested at TA =25°C, f=1MHz
2. These parameters are sampled and are not 100% tested
DC I/O Pin Characteristics
Parameter Symbol Test Conditions Min Max
o
C
o
C
Input Leakage
Current
Output Leakage
Current
Output High Voltage VOH IOH = - 4mA 2.4
Output Low Voltage VOL ILO = + 4mA 0.4V
Rev: 1.06 7/2000 4/12 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
IIL VIN = 0 to VDD -1uA 1uA
ILO
Output High Z
VOUT = 0 to VDD
-1uA 1uA
Power Supply Currents
Parameter Symbol Test Conditions
CE ≤ VIL
Operating
Supply
Current
Standby
Current
IDD
ISB1
All other inputs
≥ VIH or ≤ VIL
Min. cycle time
IOUT = 0 mA
CE ≥ VIH
All other inputs
≥ VIH or ≤VIL
Min. cycle time
GS74108TP/J
0 to 70°C -40 to 85°C
8ns 10ns 12ns 15ns 10ns 12ns 15ns
150mA 125mA 110mA 90mA 135mA 120mA 100mA
70mA 65mA 60mA 55mA 75mA 70mA 65mA
Standby
Current
ISB2
CE ≥ VDD - 0.2V
All other inputs
≥ VDD - 0.2V or ≤ 0.2V
AC Test Conditions
Parameter Conditions
Input high level VIH =2.4V
Input low level VIL =0.4V
Input rise time tr=1V/ns
Input fall time tf=1V/ns
Input reference level 1.4V
Output reference level 1.4V
Output load Fig. 1& 2
Note:
1. Include scope and jig capacitance.
2. Test conditions as specified with output loading as shown in Fig. 1
unless otherwise noted
3. Output load 2 for tLZ , tHZ , tOLZ and tOHZ .
30mA 40mA
Output Load 1
DQ
Output Load 2
DQ
VT=1.4V
1
5pF
50Ω
3.3V
589Ω
434Ω
30pF
1
Rev: 1.06 7/2000 5/12 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
AC Characteristics
Read Cycle
Parameter Symbol
Read cycle time tRC 8 --- 10 --- 12 --- 15 --- ns
Address access time tAA --- 8 --- 10 --- 12 --- 15 ns
Chip enable access time (CE) tAC --- 8 --- 10 --- 12 --- 15 ns
Output enable to output valid (OE) tOE --- 3.5 --- 4 --- 5 --- 6 ns
Output hold from address change tOH 3 --- 3 --- 3 --- 3 --- ns
GS74108TP/J
-8 -10 -12 -15
Unit
Min Max Min Max Min Max Min Max
Chip enable to output in low Z (CE)
Output enable to output in low Z (OE)
Chip disable to output in High Z (CE)
Output disable to output in High Z (OE)
* These parameters are sampled and are not 100% tested
Read Cycle 1: CE = OE = VIL, WE = V
Address
Data Out Previous Data Data valid
IH
tLZ
tOLZ
tHZ
tOHZ
tOH
*
*
*
*
3 --- 3 --- 3 --- 3 --- ns
0 --- 0 --- 0 --- 0 --- ns
--- 4 --- 5 --- 6 --- 7 ns
--- 3.5 --- 4 --- 5 --- 6 ns
tRC
tAA
Rev: 1.06 7/2000 6/12 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS74108TP/J
Read Cycle 2: WE = V
Write Cycle
Parameter Symbol
IH
Address
CE
OE
Data Out
High impedance
tRC
tAA
tAC
tLZ
tOLZ
tOE
DATA VALID
tHZ
tOHZ
-8 -10 -12 -15
Min Max Min Max Min Max Min Max
Unit
Write cycle time tWC 8 --- 10 --- 12 --- 15 --- ns
Address valid to end of write tAW 5.5 --- 7 --- 8 --- 10 --- ns
Chip enable to end of write tCW 5.5 --- 7 --- 8 --- 10 --- ns
Data set up time tDW 4 --- 5 --- 6 --- 7 --- ns
Data hold time tDH 0 --- 0 --- 0 --- 0 --- ns
Write pulse width tWP 5.5 --- 7 --- 8 --- 10 --- ns
Address set up time tAS 0 --- 0 --- 0 --- 0 --- ns
Write recovery time (WE) tWR 0 --- 0 --- 0 --- 0 --- ns
Write recovery time (CE) tWR1 0 --- 0 --- 0 --- 0 --- ns
Output Low Z from end of write
Write to output in High Z
* These parameters are sampled and are not 100% tested
tWLZ
tWHZ
*
3 --- 3 --- 3 --- 3 --- ns
*
--- 3.5 --- 4 --- 5 --- 6 ns
Rev: 1.06 7/2000 7/12 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Write Cycle 1: WE control
Address
GS74108TP/J
tWC
CE
WE
Data In
Data Out
Write Cycle 2: CE control
Address
OE
CE
OE
tAW
tCW
tAS tWP
tWC
tAW
tAS tCW
tWR
tDW tDH
DATA VALID
tWLZtWHZ
HIGH IMPED ANCE
tWR1
tWP
WE
tDW tDH
Data In
Data Out
DATA VALID
HIGH IMPED ANCE
Rev: 1.06 7/2000 8/12 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
36 Pin SOJ, 400 mil
1
A2
A1
GS74108TP/J
Dimension in inch Dimension in mm
Symbol
L
D
E
e
y
B
B1
HE
c
A
Detail A
GE
Q
Note:
1. Dimension D& E do not include interlead flash
2. Dimension B1 does not include dambar protrusion / intrusion
3. Controlling dimension: inches
min nom max min nom max
A - - 0.146 - - 3.70
A1 0.026 - - 0.66 - -
A2 0.105 0.110 0.115 2.67 2.80 2.92
B 0.013 0.017 0.021 0.33 0.43 0.53
B1 0.024 0.028 0.032 0.61 0.71 0.81
c 0.006 0.008 0.012 0.15 0.20 0.30
D 0.920 0.924 0.929 23.37 23.47 23.60
E 0.395 0.400 0.405 10.04 10.16 10.28
e - 0.05 - - 1.27 -
HE 0.430 0.435 0.440 10.93 11.05 11.17
GE 0.354 0.366 0.378 9.00 9.30 9.60
L 0.082 - - 2.08 - -
y - - 0.004 - - 0.10
Q
o
0
-
10
o
o
0
-
10
o
Rev: 1.06 7/2000 9/12 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
44 Pin, 400 mil TSOP-II
Controlling dimension: mm
1 22
A
A1 A2
e
y
GS74108TP/J
Dimension in inch Dimension in mm
D
23 44
E
HE
B
L1
c
Q
Detail A
Symbol
A1 0.002 - - 0.05 - -
A
L
A2 0.037 0.039 0.041 0.95 1.00 1.05
HE 0.455 0.463 0.471 11.56 11.76 11.96
L1 - 0.031 - - 0.80 -
Note:
1. Dimension D& E do not include interlead flash
2. Dimension B does not include dambar protrusion / intrusion
min nom max min nom max
A - - 0.047 - - 1.20
B 0.01 0.014 0.018 0.25 0.35 0.45
c - 0.006 - - 0.15 -
D 0.721 0.725 0.729 18.31 18.41 18.51
E 0.396 0.400 0.404 10.06 10.16 10.26
e - 0.031 - - 0.80 -
L 0.016 0.020 0.024 0.40 0.50 0.60
y - - 0.004 - - 0.10
Q
o
0
-
o
o
5
0
-
o
5
Rev: 1.06 7/2000 10/12 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Ordering Information
GS74108TP/J
Part Number
GS74108TP-8 400 mil TSOP-II 8 ns Commercial
GS74108TP-10 400 mil TSOP-II 10 ns Commercial
GS74108TP-12 400 mil TSOP-II 12 ns Commercial
GS74108TP-15 400 mil TSOP-II 15 ns Commercial
GS74108TP-8I 400 mil TSOP-II 8 ns Industrial
GS74108TP-10I 400 mil TSOP-II 10 ns Industrial
GS74108TP-12I 400 mil TSOP-II 12 ns Industrial
GS74108TP-15I 400 mil TSOP-II 15 ns Industrial
GS74108J-8 400 mil SOJ 8 ns Commercial
GS74108J-10 400 mil SOJ 10 ns Commercial
GS74108J-12 400 mil SOJ 12 ns Commercial
GS74108J-15 400 mil SOJ 15 ns Commercial
GS74108J-8I 400 mil SOJ 8 ns Industrial
GS74108J-10I 400 mil SOJ 10 ns Industrial
*
Package Access Time Temp. Range Status
GS74108J-12I 400 mil SOJ 12 ns Industrial
GS74108J-15I 400 mil SOJ 15 ns Industrial
*
Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. For example: GS74108TP-8T
Rev: 1.06 7/2000 11/12 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Revision History
GS74108TP/J
Rev. Code: Old;
New
741081.04d 5/1999/741081.05 1/
2000 Content
GS74108Rev1.05 10/19991/
2000K;Rev 5 2/2000L
Types of Changes
Format or Content
Format/Content
Page #/Revisions/Reason
1. Page 2/Pins 16 - 20 and 26 - 30 on 44 pin TSOP II Pin Configuration/
Correction.
1. GSI Logo
2.
Rev: 1.06 7/2000 12/12 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.