GSI GS71116U-15I, GS71116U-15, GS71116U-12I, GS71116U-12, GS71116U-10I Datasheet

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GS71116TP/J/U
64K x 16
Commercial Temp Industrial Temp
1Mb Asynchronous SRAM
Features
• Fast access time: 10, 12, 15ns
• CMOS low power operation: 100/85/70 mA at min. cycle time.
• Single 3.3V ± 0.3V power supply
• All inputs and outputs are TTL compatible
• Byte control
• Fully static operation
• Industrial Temperature Option: -40° to 85°C
• Package line up J: 400mil, 44 pin SOJ package TP: 400mil, 44 pin TSOP Type II package U: 6 mm x 8 mm Fine Pitch Ball Grid Array package
Description
The GS71116 is a high speed CMOS static RAM organized as 65,536-words by 16-bits. Static design eliminates the need for exter­nal clocks or timing strobes. Operating on a single 3.3V power supply and all inputs and outputs are TTL compatible. The GS71116 is avail­able in a 6x8 mm Fine Pitch BGA package as well as in 400 mil SOJ and 400 mil TSOP Type-II packages.
SOJ 64K x 16 Pin Configuration
A4 A3 A2 A1 A0
CE DQ1 DQ2 DQ3 DQ4 VDD
VSS DQ5 DQ6 DQ7 DQ8
WE A15 A14 A13
A12
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
16 17 18 19 20 21 22
Top view
44 pin
SOJ
10, 12, 15ns
3.3V VDD
Center VDD & VSS
44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28
27 26 25 24 23
A5 A6 A7 OE UB LB DQ16 DQ15 DQ14
DQ13 VSS VDD DQ12 DQ11 DQ10 DQ9 NC A8 A9 A10 A11 NCNC
Pin Descriptions
Symbol Description
A0 to A15
DQ1 to DQ16 Data input/output
CE Chip enable input
LB
UB
WE Write enable input OE Output enable input VDD +3.3V power supply VSS Ground NC No connect
Address input
Lower byte enable input
(DQ1 to DQ8)
Upper byte enable input
(DQ9 to DQ16)
Fine Pitch BGA 64K x 16 Bump Configuration
1 2 3 4 5 6
A LB OE A0 A1 A2 NC B DQ16 UB A3 A4 CE DQ1 C DQ14 DQ15 A5 A6 DQ2 DQ3 D VSS DQ13 NC A7 DQ4 VDD E VDD DQ12 NC NC DQ5 VSS F DQ11 DQ10 A8 A9 DQ7 DQ6 G DQ9 NC A10 A11 WE DQ8 H NC A12 A13 A14 A15 NC
6mm x 8mm, 0.75mm Bump Pitch
Top View
Rev: 1.06 6/2000 1/15 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. M
TSOP-II 64K x 16 Pin Configuration
GS71116TP/J/U
CE DQ1 DQ2 DQ3 DQ4 VDD
VSS
DQ5 DQ6 DQ7 DQ8
WE A15
A14
A13
A12
A4 A3 A2 A1 A0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
16 17 18 19 20 21 22
Top view
44 pin
TSOP II
44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28
A5 A6 A7 OE UB LB DQ16 DQ15 DQ14
DQ13 VSS VDD DQ12 DQ11 DQ10 DQ9 NC
27
A8
26
A9
25
A10
24
A11
23
NCNC
Block Diagram
A0
A15
CE
WE
OE
UB LB
_____
_____
Address
Input
Buffer
Control
Row
Decoder
Memory Array
Column Decoder
I/O Buffer
DQ1
DQ16
Rev: 1.06 6/2000 2/15 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS71116TP/J/U
Truth Table
CE OE WE LB UB DQ1 to DQ8 DQ9 to DQ16 VDD Current
H X X X X Not Selected Not Selected ISB1, ISB2
L L Read Read
L L H
L X L
L H H X X High Z High Z L X X H H High Z High Z
Note: X: “H” or “L”
L H Read High Z
H L High Z Read
L L Write Write L H Write Not Write, High Z
H L Not Write, High Z Write
Absolute Maximum Ratings
Parameter Symbol Rating Unit
Supply Voltage VDD -0.5 to +4.6 V
Input Voltage VIN
Output Voltage VOUT
-0.5 to VDD+0.5 (4.6V max.)
-0.5 to VDD+0.5 (4.6V max.)
IDD
V
V
Allowable power dissipation PD 0.7 W
Storage temperature TSTG -55 to 150
Note: Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation shall be restricted to Recommended Operating Conditions. Exposure to higher than recommended voltages for extended periods of time could affect device reliability.
Rev: 1.06 6/2000 3/15 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
o
C
Recommended Operating Conditions
Parameter Symbol Min Typ Max Unit
Supply Voltage for -12/15 VDD 3.0 3.3 3.6 V
Supply Voltage for -10 VDD 3.135 3.3 3.6 V
Input High Voltage VIH 2.0 - VDD+0.3 V
Input Low Voltage VIL -0.3 - 0.8 V
GS71116TP/J/U
Ambient Temperature,
Commercial Range
Ambient Temperature,
Industrial Range
Note:
1. Input overshoot voltage should be less than VDD+2V and not exceed 20ns.
2. Input undershoot voltage should be greater than -2V and not exceed 20ns.
TAc 0 - 70
TAI -40 - 85
Capacitance
Parameter Symbol Test Condition Max Unit
Input Capacitance CIN VIN=0V 5 pF
Output Capacitance COUT VOUT=0V 7 pF
Notes:
1. Tested at TA=25°C, f=1MHz
2. These parameters are sampled and are not 100% tested
DC I/O Pin Characteristics
Parameter Symbol Test Conditions Min Max
o
C
o
C
Input Leakage
Current
Output Leakage
Current
Output High Voltage VOH IOH = - 4mA 2.4
Output Low Voltage VOL ILO = + 4mA 0.4V
Rev: 1.06 6/2000 4/15 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
IIL VIN = 0 to VDD -1uA 1uA
ILO
Output High Z
VOUT = 0 to VDD
-1uA 1uA
Power Supply Currents
Parameter Symbol Test Conditions
CE VIL
Operating
Supply
Current
Standby
Current
IDD (max)
ISB1 (max)
All other inputs
VIH or VIL
Min. cycle time
IOUT = 0 mA
CE VIH
All other inputs
VIH or VIL
Min. cycle time
GS71116TP/J/U
0 to 70°C -40 to 85°C
10ns 12ns 15ns 10ns 12ns 15ns
100mA 85mA 70mA 115mA 100mA 85mA
45mA 40mA 35mA 50mA 45mA 40mA
Standby
Current
ISB2 (max)
CE VDD - 0.2V
All other inputs
VDD - 0.2V or 0.2V
10mA 15mA
Rev: 1.06 6/2000 5/15 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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