GSI GS71108AU-8I, GS71108AU-8, GS71108AU-7I, GS71108AU-7, GS71108AU-12I Datasheet

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Rev: 1.04a 10/2002 1/14 © 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS71108ATP/J/SJ/U
128K x 8
1Mb Asynchronous SRAM
7, 8, 10, 12 ns
3.3 V V
DD
Center VDD and V
SS
SOJ, TSOP, FP-BGA Commercial Temp Industrial Temp
Features
• Fast access time: 7, 8, 10, 12 ns
• CMOS low power operation: 140/120/95/80 mA at minimum cycle time
• Single 3.3 V power supply
• All inputs and outputs are TTL-compatible
• Fully static operation
• Industrial Temperature Option: –40° to 85°C
• Package line up
J: 400 mil, 32-pin SOJ package TP: 400 mil, 32-pin TSOP Type II package SJ: 300 mil, 32-pin SOJ package U: 6 mm x 8 mm Fine Pitch Ball Grid Array package
Description
The GS71108A is a high speed CMOS Static RAM organized as 131,072 words by 8 bits. Static design eliminates the need for external clocks or timing strobes. The GS operates on a single 3.3 V power supply and all inputs and outputs are TTL­compatible. The GS71108A is available in a 6 mm x 8 mm Fine Pitch BGA package, as well as in 300 mil and 400 mil SOJ and 400 mil TSOP Type-II packages.
Pin Descriptions
SOJ & TSOP-II 128K x 8-Pin Configuration
Packages J, TP, and SJ
Fine Pitch BGA 128K x 8-Bump Configuration
Package U
6 mm x 8 mm, 0.75 mm Bump Pitch
Top View
Symbol Description
A0–A16 Address input
DQ
1–DQ8 Data input/output
CE
Chip enable input
WE
Write enable input
OE
Output enable input
V
DD
+3.3 V power supply
V
SS
Ground
NC No connect
123456
ANCOEA
2
A
6
A7NC
BDQ1NC A
1
A5CE DQ
8
CDQ2NC A
0
A4NC DQ
7
D
V
SS
NC NC A3NC
V
DD
E
V
DD
NC NC NC NC
V
SS
FDQ3NC A
14A11
DQ5DQ
6
GDQ4NC A
15A12
WE A
8
HNCA10A
16A13A9
NC
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
A
3
A
2
A
1
A
0
CE
DQ
1
DQ
2
V
DD
V
SS
DQ
3
DQ
4
WE
A
16
A
15
A
14
A
13
A
4
A5
A6
A
7
OE
DQ
8
DQ
7
V
SS
V
DD
DQ6
DQ
5
A
8
A
9
A
10
A
11
A
12
32-pin
400 mil SOJ
300 mil SOJ
&
&
400 mil TSOP II
Rev: 1.04a 10/2002 2/14 © 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS71108ATP/J/SJ/U
Note: X: “H” or “L”
Truth Table
CE OE WE DQ1 to DQ
8
VDD Current
H X X Not Selected ISB1, ISB
2
L L H Read
I
DD
LX L Write
LH H High Z
Memory Array
Row
Decoder
Column Decoder
Address
Input
Buffer
Control
I/O Buffer
A
0
CE
WE
OE
DQ
1
A
16
Block Diagram
DQ
8
Rev: 1.04a 10/2002 3/14 © 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS71108ATP/J/SJ/U
Note: Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation shall be restricted to Rec­ommended Operating Conditions. Exposure to higher than recommended voltages for extended periods of time could affect device reliability.
Notes:
1. Input overshoot voltage should be less than V
DD
+2 V and not exceed 20 ns.
2. Input undershoot voltage should be greater than –2 V and not exceed 20 ns.
Absolute Maximum Ratings
Parameter Symbol Rating Unit
Supply Voltage V
DD
–0.5 to +4.6 V
Input Voltage V
IN
–0.5 to V
DD
+0.5
(4.6 V max.)
V
Output Voltage V
OUT
–0.5 to V
DD
+0.5
(4.6 V max.)
V
Allowable power dissipation PD 0.7 W
Storage temperature T
STG
–55 to 150
o
C
Recommended Operating Conditions
Parameter Symbol Min Typ Max Unit
Supply Voltage for -7/-8/-10/-12
V
DD
3.0 3.3 3.6 V
Input High Voltage V
IH
2.0
V
DD
+0.3
V
Input Low Voltage V
IL
–0.3 0.8 V
Ambient Temperature,
Commercial Range
T
Ac 0 70
o
C
Ambient Temperature,
Industrial Range
T
A
I
–40 85
o
C
Rev: 1.04a 10/2002 4/14 © 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS71108ATP/J/SJ/U
Notes:
1. Tested at T
A
= 25°C, f = 1 MHz
2. These parameters are sampled and are not 100% tested.
Capacitance
Parameter Symbol Test Condition Max Unit
Input Capacitance C
IN
V
IN
= 0 V 5 pF
Output Capacitance C
OUT VOUT = 0 V 7 pF
DC I/O Pin Characteristics
Parameter Symbol Test Conditions Min Max
Input Leakage
Current
I
IL
V
IN
= 0 to V
DD
–1 uA 1 uA
Output Leakage
Current
I
LO
Output High Z
V
OUT
= 0 to V
DD
–1 uA 1 uA
Output High Voltage V
OH IOH = –4 mA 2.4
Output Low Voltage V
OL
I
LO
= +4 mA 0.4 V
Power Supply Currents
Parameter Symbol Test Conditions
0 to 70°C –40 to 85°C
7 ns 8 ns 10 ns 12 ns 7 ns 8 ns 10 ns 12 ns
Operating
Supply
Current
I
DD
CE VIL
All other inputs
V
IH or ≤ VIL
Min. cycle time
I
OUT = 0 mA
140 mA 120 mA 95 mA 80 mA 145 mA 125 mA 100 mA 85 mA
Standby
Current
I
SB1
CE VIH
All other inputs
V
IH or ≤VIL
Min. cycle time
25 mA 20 mA 20 mA 15 mA 30 mA 25 mA 25 mA 20 mA
Standby
Current
I
SB2
CE VDD – 0.2 V
All other inputs
V
DD – 0.2 V or 0.2 V
2 mA 5 mA
Rev: 1.04a 10/2002 5/14 © 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS71108ATP/J/SJ/U
AC Test Conditions
AC Characteristics
* These parameters are sampled and are not 100% tested
Read Cycle
Parameter Symbol
-7
-8
-10 -12 Unit
Min Max Min Max Min Max Min Max
Read cycle time t
RC 7 8 10 12 ns
Address access time t
AA 7 8 10 12 ns
Chip enable access time (CE
)tAC— 7 8 10 12 ns
Output enable to output valid (OE
)tOE —3—3.5—4—5ns
Output hold from address change t
OH
3—3—3—3—ns
Chip enable to output in low Z (CE
)tLZ*3—3—3—3—ns
Output enable to output in low Z (OE
)tOLZ*0 — 0 — 0—0—ns
Chip disable to output in High Z (CE
)t
HZ
*—3.5— 4 —5—6ns
Output disable to output in High Z (OE
)tOHZ*— 3 —3.5— 4 — 5ns
DQ
VT = 1.4 V
50
30pF
1
DQ
3.3 V
Output Load 1
Output Load 2
589
434
5pF
1
Note:
1. Include scope and jig capacitance.
2. Test conditions as specified with output loading as shown in Fig. 1 unless otherwise noted.
3. Output load 2 for t
LZ, tHZ, tOLZ and tOHZ
Parameter Conditions
Input high level VIH = 2.4 V
Input low level V
IL
= 0.4 V
Input rise time tr = 1 V/ns
Input fall time tf = 1 V/ns
Input reference level 1.4 V
Output reference level 1.4 V
Output load Fig. 1& 2
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