Grid Connect BLE300SMTINT User Manual

SMT BLE Module ­Industrial Temperature
(GC-BLE300-BGA)

Description:Features:

• Surface Mount BLE (Bluetooth

4.2) Embedded Module

• Low cost and Compact Wireless

Networking Device (Size 13 x 18
mm)

• Internal Chip Antenna

• High Speed UART Data Interface

• UART Interface is +1.8V

Compatible and Supports Free/
Auto Frame Function

• BLE, Bluetooth Classic and Blue-

tooth Audio Protocols

• Maximum of XX BLE Connections

• 128-bit AES-CCM Data Encyption

• MCU available to run your custom

software

• Mesh-capable (coming in 2016)

• +1.8 - 4.2Vcc Power Supply (30

mA (peak)

• Customizable via SDK

• FCC/CE Certi ied

* SDK Required

The low cost GC-BLE300-BGA Embedded BLE Module provides support for
Bluetooth 4.2 networking for a printed circuit board device design. The compact
module is a high performance feature rich surface mount (SMT) embedded
module. For optimal performance, the GC-BLE300-BGA has an internal PCB
antenna. (See the table on the reverse side for a summary of the GC-BLE300­BGA ordering options.)

Based on the Marvell 88MB300 SoC, the GC-BLE300-BGA is a feature-rich
module that can provide Bluetooth support for an exisiting CPU or can host an
application on the module. Interface with the GC-BLE300-BGA via GPIOs or

high speed UART. Congure the device with Marvell’s BLE development toolkit

(contact Grid Connect for more information). The GC-BLE300-BGA can support
BLE, Bluetooth Classic and Bluetooth Audio.

With a small footprint, low cost, and a rich feature set, the GC-BLE300-BGA Em­bedded WiFi Module is well suited for many applications. The module is small
enough to be added to handheld devices. With an industrial temperature range,
the GC-BLE300-BGA can be used in devices designed for harsh environments.
Multiple antenna options allow the GC-BLE300-BGA to be added to existing

device designs or to provide engineers with the design exibility to meet specic

application requirements. The GC-BLE300-BGA is a member of a complete line
of Embedded Modules provided by Grid Connect. Need a smaller device size,
lower power, SPI interface? Grid Connect can help pick the best embedded
module to meet your needs.

Development is done via our GC-BLE300-BGA-EVK which brings out all the
pins and interfaces on the module to allow for quick development.

1630 W. Diehl Road, Naperville, IL 60563  Phone: [phone]  USA Toll Free: [phone] gridconnect.com

Specications:

Security

Data Rates

Frequency Band

Encryption

Power

Dimensions

Interfaces

Protocols

Antenna Options

Product Weight

User Conguration

Network Type(s)

Firmware

Interfaces

Certications

128-bit Encyption

UART: 1200 bps - 230400 bps

2.4 GHz

AES-CCM

1.8 - 4.2 Vcc Current: ~ mA ( 30 mA Peak)

13mm x 18mm x 3 mm SMT

Wireless: Bluetooth Serial: UART, GPIO - Up to 32*

BLE, Bluetooth Classic, Bluetooth Audio (Bluetooth 4.2)

Chip antenna

0.1 lb

AT Commands

Piconet, Scatternet

Upgradeable via OTA

•

(2) UART

•

(2) I2C

•

(2) SSP/SPI

FCC, CE

Application Software

Connector(s)

Temperature Range

* Requires customization via SDK

GC-BLE300-BGA Ordering Summary

GC-BLE300-BGA

GC-BLE300-BGA-EVK

Call for Volume Pricing

SMT Package, Internal PCB Antenna

BLE300 SMT Eval Kit

Custom software via SDK (contact Grid Connect for more information)
Marvell BLE Toolkit

40-pin SMT Package

Operating: -40ºC to +85ºC (-40ºF to +185ºF)
Storage: -45ºC to +125ºC (-40ºF to +185ºF)

Contact Us:

Grid Connect Inc.
1630 W. Diehl Road
Naperville, IL 60563

Phone: [phone]
USA Toll Free: [phone]
Fax: [phone]
Email: [e-mail]

Website: gridconnect.com