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USER'S MANUAL
Rev: 1.0
Release date: May 30, 2016
Of
Intel H81 Express Chipset
Based
M/B for LGA 1150 Quad Core Ready
Intel Core Processor
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
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ENVIRONMENTAL SAFETY INSTRUCTION................................................................................ iii
ENVIRONMENTAL PROTECTION ANNOUCEMENT.................................................................. iii
USER’S NOTICE............................................................................................................................... iv
MANUAL REVISION INFORMATION............................................................................................. iv
ITEM CHECKLIST............................................................................................................................. iv
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 SPECIFICATION................................................................................................................ 1
1-2 LAYOUT DIAGRAM.......................................................................................................... 2
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING............................................................................................................ 5
2-2 CONNECTORS AND HEADERS..................................................................................... 7
2-2-1 REAR I/O BACK PANEL CONNECTORS
.......................................................
7
2-2-2 MOTHERBOARD INTERNAL CONNECTORS............................................... 8
2-2-3 HEADER PIN DEFINITION................................................................................ 10
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERNING SETUP
.........................................................................................................
15
3-2 BIOS MENU SCREEN.......................................................................................................15
3-3 FUNCTION KEYS.............................................................................................................. 16
3-4 GETTING HELP................................................................................................................. 16
3-5 MENU BARS...................................................................................................................... 17
3-6 MAIN MENU....................................................................................................................... 17
3-7 ADVANCED MENU
...........................................................................................................
18
3-8 CHIPSET MENU.................................................................................................................24
3-9 BOOT MENU...................................................................................................................... 27
3-10 SECURITY MENU.............................................................................................................. 28
3-11 SAVE & EXIT MENU......................................................................................................... 28
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Environmental Safety Instruction
Avoid the dusty, humidity and temperature extremes. Do not place the product in
0 to 40 centigrade is the suitable temperature. (The figure comes from the request
Generally speaking, dramatic changes in temperature may lead to contact
The increasing temperature of the capacitor may decrease the life of computer.
Attention to the heat sink when you over-clocking. The higher temperature may
any area where it may become wet.
of the main chipset)
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
decrease the life of the device and burned the capacitor.
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.
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USER’S NOTICE
DVD for motherboard utilities
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition May 30, 2016
Item Checklist
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Introduction of the Motherboard
ATX form factor; PCB size: 24.5 x 30.5 cm
Intel®H81 Express Chipset
Supports Intel®Core™ i7, Core™ i5, Core™ i3 series,
Pentium®processor in LAG1150 Package
* for detailed CPU support information please visit our website
2* DDRIII RAM module slot
Supporting 2 * DDRIII 1600/1333 MHz RAM Module
Support dual-channel function
1 * PCI-Express x16 slot (PE1)
2 * PCI-Express x 1 slot (PE2/3)
4 *32-bit PCI slot (PCI1/2/3/4)
2 * SATAIII 6Gb/s port (SATA1/2)
1 * SATAII 3Gb/s port (SATA5)
1 * Full-size M-SATA slot (MSATA)
Integrated 2* Intel®i211ATGigabit Ethernet LAN chip that
supports Fast Ethernet LAN function of providing
10/100/1000Mbps Ethernet data transfer rate
4-CH HD Audio Codec integrated
Audio driver and utility included
1*PS/2 keyboard & mouse combo connector
1* DVI-D port connector
2* USB 2.0 port connector
4* USB 3.0 port connector
1*3-jack audio connector (Line-in; Line-out; MIC)
Internal I/O Connectors& Headers:
1 *24-pin main power connector
1 *8-pin 12V Power connector
1* vertical USB 2.0 port connector (USB20_V)
1* Front panel audio header
2* USB 2.0 header(support 4*expansion USB 2.0 port)
1*LAN activity LED header
2* 9-pin RS232/422/485 serial port header (COM1/2)
2* RS232 serial port expansion block (COM3-6/COM7-10)
1* Parallel port header (LPT)
1*CPU fan header & 2*System fan header
1-1 Specification
Chapter 1
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1-2 Layout Diagram
PCI Express x16 Slot (PE1)
Full-size
MSATA Slot
(MSATA)
DVI–D Port
Over HDMI Port
RJ-45 LAN Ports
Over USB 3.0 Ports
PS/2 KB&MS Combo Port
Over USB 2.0 Ports
Serial Port Headers
(COM1/2)
Serial Port
Expansion Block
(COM3-6)
Serial Port
Expansion Block
(COM7-10)
Rear IO Diagram
Motherboard Internal Diagram
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Motherboard Jumper Position
COM1 Header Pin9 Function Select
COM2 Header Pin9 Function Select
Clear CMOS RAM Function Setting
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Internal USB 2.0 Port Connector
PS/2 Keyboard & Mouse
Combo Port Connector
USB_PS2
(Middle & Bottom)
USB 2.0 Port Connector x2
VGA1/2
High Definition Multimedia Interface
UL1(Middle & Bottom)
/UL2(Middle & Bottom)
USB 3.0 Port Connector x4
AUDIO
Line-out ; Line In; MIC Connector
JW_FP
(Front Panel Header)
PWR LED/ HD LED/ /Power Button
/Reset
Serial Port Header Expansion Block
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Chapter 2
Hardware Installation
2-1 Jumper Setting
JPCOM1 (4-pin): COM1 Header Pin9 Function Select
JPCOM2 (4-pin): COM2 Header Pin9 Function Select
JBAT (3-pin): Clear CMOS Function Settings
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JPME (2-pin): ME Features Select
1-2 Closed:ME Features Disabled.
1-2 Open:ME Features Enabled(Normal);
AT_MODE→AT/ATX Mode Select
1-2 Open: ATX Mode Selected (Default);
1-2 Closed: AT Mode Selected.
AT_MODE (2-pin): AT Mode / ATX Mode Select
*ATX Mode Selected: Press power button to power on after power input ready;
AT Mode Selected: Directly power on as power input ready.
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