Gosuncn Technology Group GM500U1A Users manual

HARDWARE DEVELOPMENT GUIDE

Version: V1.1

Date: 2018-04-28

LTE Module Series

GM500_U1A

Website: www.gosuncnwelink.com

E-mail: [e-mail]

GM500_U1A

Hardware Development Guide

Version

Date

Description

1.0

2018-04-18

1st released version

REVISION HISTORY

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GM500_U1A

Hardware Development Guide

Abbreviations

Full Name

3GPP

Third Generation Partnership Project

AP

Another name of DTE

CHAP

Challenge Handshake Authentication Protocol

CE

European Conformity

CMOS

Complementary Metal Oxide Semiconductor

DCE

Data Communication Equipment

DL

Downlink

DTE

Data Terminal Equipment

EIA

Electronic Industries Association

EMC

Electromagnetic Compatibility

ESD

Electro-Static discharge

ESR

Equivalent Series Resistance

FDD

Frequency Division Duplex

GPIO

General-purpose I/O

LCC

Leadless Chip Carrier

ABOUT THIS DOCUMENT

A. Application Range

This document is the Product Technical Specification for the GM500_U1A GSM/WCDMA/LTE-FDD module. It defines the high
level product features and illustrates the interface for these features. This document is intended to cover the hardware aspects of
the product, including electrical and mechanical.

B. Reading Note

The symbols below are the reading notes you should pay attention on:

: WARNING or ATTENTION : NOTE or REMARK

C. Purpose

This document provides the hardware solutions and development fundamentals for a product with the module. By reading this
document, the user can have an overall knowledge of the module and a clear understanding of the technical parameters. With this
document, the user can successfully fulfill the application and development of wireless Internet product or equipment.

Besides the product features and technical parameters, this document also provides the product reliability tests and related
testing standards, RF performance indexes and a guide on the design of user circuits, to provide the user with a complete design
reference.

NOTE:

To ensure the module manufacturing and welding quality, do as the chapter 7 of Manufacturing Guide in

this document. The force on the squeegee should be adjusted so as to produce a clean stencil surface on a

single pass and ensure the module soldering quality.

D. Abbreviations

Table below is a list of abbreviations involved in this document, as well as the English full names.

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Hardware Development Guide

LDO

Low-Dropout

LED

Light Emitting Diode

LTE

Long Term Evolution

ME

Mobile Equipment

MO

Mobile Origination Call

MT

Mobile Termination Call

MSB

Most Significant Bit

PC

Personal Computer

PCB

Printed Circuit Board

PDA

Personal Digital Assistant

PDU

Protocol Data Unit

PAP

Password Authentication Protocol

PPP

Point to Point Protocol

RTC

Real Time Clock

SMS

Short Messaging Service

SMT

Surface Mount Technology

SPI

Serial Peripheral Interface

TBD

To Be Determined

TCP

Transmission Control Protocol

TIS

Total Isotropic Sensitivity

TRP

Total Radiated Power

TVS

Transient Voltage Suppressor

UART

Universal Asynchronous Receiver-Transmitter

UDP

User Datagram Protocol

UL

Up Link

USB

Universal Serial Bus

USIM

Universal Subscriber Identity Module

URC

Unsolicited result code

VIH

Logic High level of input voltage

VIL

Logic Low level of input voltage

VOH

Logic High level of output voltage

VOL

Logic Low level of output voltage

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Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a

mobile while driving (even with a hands free kit) cause distraction and can lead to an accident. You must

comply with laws and regulations restricting the use of wireless devices while driving.

Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it switched off. The

operation of wireless appliances in an aircraft is forbidden to prevent interference with communication

systems. Consult the airline staff about the use of wireless devices on boarding the aircraft, if your device

offers a Airplane Mode which must be enabled prior to boarding an aircraft.

Switch off your wireless device when in hospitals or clinics or other health care facilities. These

requests are designed to prevent possible interference with sensitive medical equipment.

GSM cellular terminals or mobiles operate over radio frequency signal and cellular network and

cannot be guaranteed to connect in all conditions, for example no mobile fee or an invalid SIM card. While

you are in this condition and need emergent help, please remember using emergency call. In order to make

or receive call, the cellular terminal or mobile must be switched on and in a service area with adequate

cellular signal strength.

Your cellular terminal or mobile contains a transmitter and receiver. When it is on, it receives and

transmits radio frequency energy. RF interference can occur if it is used close to TV set, radio, computer or

other electric equipment.

In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices

such as your phone or other cellular terminals. Areas with potentially explosive atmospheres including

fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air

contains chemicals or particles such as grain, dust or metal powders.

SAFETY INFORMATION

The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any
cellular terminal or mobile incorporating ME3610 module. Manufacturers of the cellular terminal should send the following safety
information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. If not
so, GOSUNCN does not take on any liability for customer failure to comply with these precautions.

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GM500_U1A

Hardware Development Guide

CONTENTS

1. Product Overview ....................................................................................................................................................................... 11

1.1. General Description ........................................................................................................................................................................... 11

1.2. Key Features 11

1.3. Function Diagram............................................................................................................................................................................... 12

1.4. Evaluation Board ................................................................................................................................................................................ 13

2. Application Interface ................................................................................................................................................................... 14

2.1. General Description ........................................................................................................................................................................... 14

2.2. Pin Assignment 14

2.3. Pin Description 16

2.4. Power Supply 22

2.4.1. Power Supply Pins ................................................................................................................................................................... 22

2.4.2. Decrease Voltage Drop ............................................................................................................................................................ 22

2.4.3. Reference Circuit of Power Supply .......................................................................................................................................... 22

2.5. Turn on Scenarios .............................................................................................................................................................................. 23

2.6. Turn off Scenarios .............................................................................................................................................................................. 25

2.7. Reset Scenarios 26

2.8. USIM Card Interface........................................................................................................................................................................... 28

2.8.1. Description of PINs .................................................................................................................................................................. 28

2.8.2. Design Considerations for USIM Card Holder .......................................................................................................................... 29

2.9. USB Interface 31

2.10. UART Interface ................................................................................................................................................................................. 33

2.10.1. UART CONNECTION ............................................................................................................................................................... 34

2.10.2. UART LEVEL MATCH .............................................................................................................................................................. 35

2.10.3. Use ic for level switch ............................................................................................................................................................ 40

2.11. Network Status Indication ............................................................................................................................................................... 41

2.12. POWER_ON/OFF Status Indicator ON_STATE .................................................................................................................................. 42

2.13. ADC Interface 43

2.14. WAKEUP_IN Signal ........................................................................................................................................................................... 43

2.15. WAKEUP_OUT Signal ....................................................................................................................................................................... 44

2.16. GPIO Interface 46

3. Antenna Interface ....................................................................................................................................................................... 47

3.1. Pin Definition 47

3.2. Reference Design ............................................................................................................................................................................... 47

3.3. Reference PCB Layout of Antenna ..................................................................................................................................................... 49

3.4. Suggestions for EMC & ESD Design .................................................................................................................................................... 49

3.4.1. EMC Design Requirements ...................................................................................................................................................... 49

3.4.2. ESD Design Requirements ....................................................................................................................................................... 49

3.5. Test Methods for Whole-Set Antenna OTA ....................................................................................................................................... 50

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4. Electrical, Reliability and Radio Characteristics ............................................................................................................................ 51

4.1. Absolute Maximum Ratings ............................................................................................................................................................... 51

4.2. Operating Temperature ..................................................................................................................................................................... 51

4.3. Electrostatic Discharge ...................................................................................................................................................................... 51

4.4. GM500_U1A Test ............................................................................................................................................................................... 51

4.4.1. Current Consumption .............................................................................................................................................................. 51

4.4.2. RF Output Power ..................................................................................................................................................................... 52

4.4.3. RF Receiving Sensitivity ........................................................................................................................................................... 52

4.5. GNSS Technical Parameters ............................................................................................................................................................... 52

5. Mechanical Dimensions .............................................................................................................................................................. 53

5.1. Mechanical Dimensions of the Module ............................................................................................................................................. 53

5.2. Footprint of Recommendation .......................................................................................................................................................... 55

6. Related Test & Test Standard ...................................................................................................................................................... 56

6.1. Testing Reference .............................................................................................................................................................................. 56

6.2. Description of Testing Environment .................................................................................................................................................. 56

6.3. Reliability Testing Environment ......................................................................................................................................................... 57

7. SMT Process and Baking Guide .................................................................................................................................................... 58

7.1. Storage Requirements ....................................................................................................................................................................... 58

7.2. Module Plainness Standard ............................................................................................................................................................... 58

7.3. Process Routing Selection .................................................................................................................................................................. 58

7.3.1. Solder Paste Selection ............................................................................................................................................................. 58

7.3.2. Design of module PAD’s steel mesh opening on main board .................................................................................................. 58

7.3.3. Module Board’s SMT process .................................................................................................................................................. 59

7.3.4. Module Soldering Reflow Curve .............................................................................................................................................. 60

7.3.5. Reflow method ........................................................................................................................................................................ 61

7.3.6. Maintenance of defects .......................................................................................................................................................... 61

7.4. Module’s Baking Requirements ......................................................................................................................................................... 61

7.4.1. Module’s Baking Environment ................................................................................................................................................ 61

7.4.2. Baking device and operation procedure ................................................................................................................................. 62

7.4.3. Module Baking Conditions ...................................................................................................................................................... 62

8. Federal Communication Commission Interference Statement ..................................................................................................... 62

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Hardware Development Guide

TABLES

Table 1-1 GM500_U1A Supported Band ...................................................................................... 11

Table 1-2 GM500_U1A Key Features .......................................................................................... 11

Table 2-1 IO Parameters Definition .............................................................................................. 16

Table 2-2 Logic levels Description ................................................................................................ 16

Table 2-3 Pin Description ............................................................................................................. 16

Table 2-4 Power Supply ................................ ................................................................ ............... 22

Table 2-5 Definition of POWER_ON ............................................................................................. 24

Table 2-6 Power-on Time ............................................................................................................. 25

Table 2-7 Power-off Time ............................................................................................................. 25

Table 2-8 Pin Definition of the USIM Interface .............................................................................. 28

Table 2-9 Pin Description of Molex USIM Card Holder ................................................................. 30

Table 2-10 Pin Description of Amphenol USIM Card Holder ......................................................... 31

Table 2-11 USB Pin Description ................................................................................................... 32

Table 2-12 Pin Definition of the Main UART Interface .................................................................. 33

Table 2-13 Pin Definition of the Debug UART Interface ................................................................ 34

Table 2-14 Pin Definition of Network Indicator .............................................................................. 42

Table 2-15 Working State of the Network Indicator ...................................................................... 42

Table 2-16 Pin Definition of ON_STATE ....................................................................................... 42

Table 2-17 Pin Definition of the ADC ............................................................................................ 43

Table 2-18 Characteristic of the ADC ........................................................................................... 43

Table 2-19 Pin Definition of WAKEUP_IN .................................................................................... 43

Table 2-20 Pin Definition of WAKEUP_OUT ................................................................................ 45

Table 2-21 Pin Definition of GPIO ................................................................................................ 46

Table 3-1 Pin Definition of Antenna .............................................................................................. 47

Table 4-1 Absolute Maximum Ratings .......................................................................................... 51

Table 4-2 Operating Temperature ................................................................................................ 51

Table 4-3 ESD characteristic ........................................................................................................ 51

Table 4-4 Averaged standby DC power consumption [1] .............................................................. 51

Table 4-5 Averaged working current [1] ........................................................................................ 51

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Table 4-6 Averaged working current [2] ........................................................................................ 52

Table 4-7 Conducted RF Output Power........................................................................................ 52

Table 4-8 Conducted RF Receiving Sensitivity Typical Value [1] .................................................. 52

Table 4-9 Conducted RF Receiving Sensitivity Typical Value [2] .................................................. 52

Table 4-10 GNSS Technical Parameters ...................................................................................... 52

Table 6-1 Testing Standard .......................................................................................................... 56

Table 6-2 Testing Environment .................................................................................................... 56

Table 6-3 Testing Instrument & Device......................................................................................... 57

Table 6-4 Reliability Features ....................................................................................................... 57

Table 7-1 Baking parameters ....................................................................................................... 58

Table 7-2 LCC module PAD’s steel mesh opening ................................................................................ 58

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FIGURES

Figure 1–1 System Connection Structure ....................................................................................................... 13

Figure 2–1 Pin Assignment ............................................................................................................................. 16

Figure 2–2 The input reference circuit of VBAT ............................................................................................. 22

Figure 2–3 Reference circuit of DC-DC ........................................................................................................... 23

Figure 2–4 Reference circuit of LDO ............................................................................................................... 23

Figure 2–5 Reference circuit of POWER_ON .................................................................................................. 24

Figure 2–6 Timing of Turning on Mode .......................................................................................................... 25

Figure 2–7 Timing of Turning off Mode .......................................................................................................... 26

Figure 2–8 reference circuit to reset module ................................................................................................. 27

Figure 2–9 Timing of Reset Mode .................................................................................................................. 27

Figure 2–10 Reference Circuit of the 8 Pin USIM Card ................................................................................... 29

Figure 2–11 Reference Circuit of the 6 Pin USIM Card ................................................................................... 29

Figure 2–12 Molex 91228 USIM Card Holder ................................................................................................. 30

Figure 2–13 Amphenol C707 10M006 512 2 USIM Card Holder .................................................................... 31

Figure 2–14 Reference Circuit of USB Application ......................................................................................... 32

Figure 2–15 Reference Circuit of USB Communication between module and AP ......................................... 32

Figure 2–16 Reference circuit of USB when USB is not the desired function ................................................ 33

Figure 2–17 Schematic of 8-wire UART Connection....................................................................................... 34

Figure 2–18 Schematic of 3-wire UART Connection....................................................................................... 34

Figure 2–19 Schematic of 4-wire UART Connection....................................................................................... 35

Figure 2–20 Recommended TXD circuit ......................................................................................................... 36

Figure 2–21 Recommended RXD circuit ......................................................................................................... 37

Figure 2–22 Recommended RTS circuit .......................................................................................................... 38

Figure 2–23 Recommended CTS circuit .......................................................................................................... 39

Figure 2–24 Recommended 8-wires UART level switch circuit ...................................................................... 40

Figure 2–25 Recommended 4-wires UART level switch circuit ...................................................................... 41

Figure 2–26 Recommended 2-wires UART level switch circuit ...................................................................... 41

Figure 2–27 The test point of debug UART .................................................................................................... 41

Figure 2–28 Reference Circuit of the Network Indicator ............................................................................... 42

Figure 2–29 WAKEUP_IN input sequence ...................................................................................................... 44

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Figure 2–30 Connections of the WAKEUP_IN pin .......................................................................................... 44

Figure 2–31 The output signal of WAKEUP_OUT ........................................................................................... 45

Figure 2–32 Connections of the WAKEUP_OUT pin ....................................................................................... 45

Figure 3–1 Reference Circuit of Antenna Interface ........................................................................................ 48

Figure 3–2 Reference Circuit of GNSS Antenna .............................................................................................. 48

Figure 3–3 The OTA test system of CTIA ........................................................................................................ 50

Figure 5–1 GM500_U1A Top and Side Dimensions ........................................................................................ 53

Figure 5–2 GM500_U1A Bottom Dimensions .............................................................................................. 54

Figure 5–3 Recommended Footprint ............................................................................................................. 55

Figure 7–1 Module Board’s Steel Mesh Diagram ........................................................................................... 59

Figure 7–2 Material Module Pallet ................................................................................................................. 59

Figure 7–3 Tape Reel Dimension .................................................................................................................... 60

Figure 7–4 Module Furnace Temperature Curve Reference Diagram ........................................................... 61

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PID

RF support

RF Band

Transmit Frequency (TX)

Receive Frequency (RX)

GM500_U1A(CAT4)

LTE FDD

B2

1850 to 1910 MHz

1930 to 1990 MHz

B4

1710 to 1755 MHz

2110 to 2155 MHz

B5

824 to 849 MHz

869 to 894 MHz

B12

698 to 716 MHz

728 to 746 MHz

WCDMA

B2

1850 to 1910 MHz

1930 to 1990 MHz

B5

824 to 849 MHz

869 to 894 MHz

GSM

850

824.2 to 848.8MHz

869.2 to 893.8 MHz

1900

1850.2 to 1909.8 MHz

1930.2 to 1989.8MHz

Feature

Description

Physical

Small form factor-30 mm × 30 mm × 2.3mm

LCC with 80 pins

Power Supply

The range of voltage supply is 3.4V-4.2V, typical value is 3.8V

Frequency Bands

U1A

(for America)

LTE FDD: B2,B4 ,B5,B12

WCDMA: B2,B5

Rx Diversity

U1A LTE FDD:B2,B4,B5,B12

WCDMA:B2,B5

Transmission Rate

LTE FDD (CAT4): Max 150Mbps(DL)/Max 50Mbps(UL)

Network Protocols

Support TCP/PPP/UDP/FTP protocols

Support PAP, CHAP protocols used for PPP connection.

USIM Interface

1.8V/3V support

SIM extraction/hot plug detection

Support SIM and USIM

UART Interface

Support two UART interface: main UART interface and debug UART interface

1. PRODUCT OVERVIEW

1.1. GEN ERAL DESCRIPTION

GM500_U1A is a LTE/WCDMA/GSM wireless communication module with LCC interface. It is widely applied to but not limited
to the various products and equipment such as laptops, vehicle-mounted terminals, and electric devices, by providing data services.

Customer can choose the dedicated type based on the wireless network configuration and using area. The following table
shows the entire radio band configuration of GM500_U1A.

Table 1-1 GM500_U1A Supported Band

1.2. KEY FEATURE S

The table below describes the detailed features of the GM500_U1A module.

Table 1-2 GM500_U1A Key Features

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Main UART interface:

Eight lines on main UART interface

Support RTS and CTS hardware flow control

Baud rate can reach up to 921600 bps,115200 bps by default

Used for AT command, data transmission or firmware upgrade

Debug UART interface:

Two lines on debug UART interface, can be used for software debug, firmware upgrade

USB Interface

Compliant with USB 2.0 specification (slave only)

Used for AT command communication, data transmission, software debug and firmware upgrade.

USB Driver

Support Windows XP, Windows Vista, Windows 7, Windows 8, Windows 10,

Windows CE5.0/6.0 and later,

Linux 2.6.20 and later,

Android 2.3 / 4.X/ 5.X

SDIO interface

1.8V support (full speed) 4bits,SDIO compatible to WLAN (802.11)

Antenna Interface

Include main antenna ,diversity antenna and GNSS antenna

Rx-diversity

Support WCDMA/LTE Rx-diversity

AT commands

Compliant with 3GPP TS 27.007,27.005 and GOSUNCN enhanced AT commands

Network Indication

Use LED_MODE to indicate network connectivity status

SMS

Text and PDU mode

Point to point MO and MT

SMS saving/reading to SIM card or module storage

SMS cell broadcast

Temperature Range

Normal operation: -30°C to +75°C

Restricted operation: -40°C~ -30°C and +75°C~ +85°C1)

Storage temperature: -40°C to +85°C

Firmware Upgrade

USB interface or UART interface or OTA(WEFOTA)

1.3. FUN CTION DIAGRAM

The figure below shows a block diagram of the GM500_U1A and illustrates the major functional parts.

 Power management

 Baseband

 Memory

 RF send-receive

 Peripheral interface

--UART interface

--USIM card interface

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--USB interface

--SDIO interface

--SPI interface

Hardware Development Guide

Baseband

USB

USIM

UART

I2C

SDIO

SPI

LED

ADC

GPIO

FLASH

&

LPDDR2

Data

Control

Control

Rx&Tx

RF

Transceiver

RF PA

Duplexer

Duplexer

Tx

Rx

MAIN_ANT

80PIN LCC Connector Interface

Rx

GNSS

Rx

DIV_ANT

--I2C interface

--ADC interface

--Status interface (LED)

Figure 1–1 System Connection Structure

1.4. EVA LUATI ON BOA RD

In order to help you to develop applications with GM500_U1A, GOSUNCN supplies an evaluation board (G2000/GE2015),
RS-232 to USB cable, USB data cable, power adapter, antenna and other peripherals to control or test the module. For details, please
refer to the related document [GE2015 Dev Board User Guide].

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Hardware Development Guide

2. APPLICATION INTERFACE

2.1. GEN ERAL DESCRIPTION

GM500_U1A is equipped with an 80-pin 0.72mm pitch SMT pads plus 16-pin ground pads and reserved pads that connect to
customer’s cellular application platform. Sub-interface included in these pads is described in detail in the following chapters:

 Pin assignment

 Pin description

 Power supply

 Turn on/off scenarios

 USIM interface

 USB interface

 UART interface

 Network status indication

 ADC interface

 WAKEUP_IN signal

 WAKEUP_OUT signal

 GPIO interface

2.2. PIN AS SIGNMENT

The following figure shows the pin assignment of the GM500_U1A module.

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Type

Description

IO

Bidirectional input/output

DI

Digital input

DO

Digital output

PI

Power input

PO

Power output

AI

Analog input

AO

Analog output

OD

Open drain

Parameter

Min

Max

Unit

VIH

0.65*VDD_IO

VDD_IO+0.3

V

VIL

-0.3

0.35* VDD_IO

V

VOH

VDD_IO-0.45

VDD_IO

V

VOL 0 0.45

V

Power Supply
Pin Name

Pin NO.

I/O

Description

DC Characteristics

Comment

V_BAT

50.51

PI

Power supply for

module

Vmax = 4.2V

Vmin = 3.4V

Vnorm = 3.8V

It must be able to provide sufficient

current in a transmitting burst which

typically rises to 2.0A

VREF_1V8

5

PO

Provide 1.8V for

external circuit

Vnorm = 1.8V

Imax = 300mA

Power supply for external GPIO’S pull

up circuits

PLL_1V8

4

PO

Provide 1.8V for

external circuit

Vnorm = 1.8V

Imax = 20mA

This pin can only be used for WiFi

interface, and can left

unconnected when not used.

GND

3,9,11,20,21,31,36,

46,49,52, 61,63,78,

Ground

NOTE:

Keep all NC pins unconnected.

2.3. PIN DE SCR IPTION

The following table shows the IO Parameters Definition.

Figure 2–1 Pin Assignment

Table 2-1 IO Parameters Definition

The logic levels are described in the following table.

Table 2-2 Logic levels Description

NOTE:

VDD_IO is the voltage level of pins.

The following tables show the GM500_U1A’s pin definition.

Table 2-3 Pin Description

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Hardware Development Guide

80,

Turn On/Off
Pin Name

Pin NO.

I/O

Description

DC Characteristics

Comment

POWER_ON

1

DI

Turn on/off module

VIH max = 2.1V

VIH min = 1.17V

VIL max = 0.63V

Pull-up to 0.8V internally, active low

RESET_N

2

DI

Reset module

VIH max = 2.1V

VIH min = 1.17V

VIL max = 0.63V

Active low

Status Indication

Pin Name

Pin NO.

I/O

Description

DC Characteristics

Comment

ON_STATE

69

DO

Module power

on/off status

indicator

VOH min = 1.35V

VOL max = 0.45V

1.8V power domain

LED_MODE

70

DO

Indicate the module

network registration

mode

VOH min = 1.35V

VOL max = 0.45V

1.8V power domain

USB Interface

Pin Name

Pin NO.

I/O

Description

DC Characteristics

Comment

USB_DP

24

IO

USB differential data

bus

Compliant with USB 2.0 standard

specification Require differential

impedance of 90Ω

USB_DM

23

IO
USB_VBUS

22

PI

USB power

HSIC Interface

Pin Name

Pin NO.

I/O

Description

DC Characteristics

Comment

USB_STROBE

25

IO

HSIC strobe

InterChip USB(HSIC)

line impedance 50 ohm, isometric

constraint is less than 2 mm, line

length is less than 10 cm

USB_DATA

26

IO

HSIC data

USIM Interface
Pin Name

Pin NO.

I/O

Description

DC Characteristics

Comment

USIM_VCC

40

PO

Power supply for

USIM card

For 1.8V USIM:

Vmax = 1.9V

Vmin = 1.7V

For 3.0V USIM:

Vmax = 3.05V

Vmin = 2.7V

IO max = 50mA

Either 1.8V or 3V is supported by the

module automatically

USIM_DATA

38

IO

Data signal of USIM

card

For 1.8V USIM:

VIL max = 0.63V

VIH min = 1.17V

Pull-up to USIM_VCC with 10k resistor

internally

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Hardware Development Guide

VOL max = 0.45V

VOH min = 1.35V

For 3V USIM:

VIL max = 1.05V

VIH min = 1.95V

VOL max = 0.45V

VOH min = 2.6V

USIM_CLK

37

DO

Clock signal of USIM

card

For 1.8V USIM:

VOL max = 0.45V

VOH min = 1.35V

For 3V USIM:

VOL max = 0.45V

VOH min = 2.6V

USIM_RST

39

DO

Reset signal of USIM

card

For 1.8V USIM:

VOL max = 0.45V

VOH min = 1.35V

For 3V USIM:

VOL max = 0.45V

VOH min = 2.6V

USIM_DETECT

41

DI

USIM card input

detection

VIL min = -0.3V

VIL max = 0.63V

VIH min = 1.17V

VIH max = 2.1V

1.8V power domain. Active low

If no need of USIM detect, leave this

pin not connected.

ADC Interface
Pin Name

Pin NO.

I/O

Description

DC Characteristics

Comment

ADC1

48

AI

Analog to digital

0.05V to 4.15V

External sensor signal detection

ADC2

47

AI

Analog to digital

0.05V to 4.15V

External sensor signal detection

Main UART Interface
Pin Name

Pin NO.

I/O

Description

DC Characteristics

Comment

UART_TXD

53

DO

Transmit data

VOL max = 0.45V

VOH min = 1.35V

1.8V power domain

UART_RXD

54

DI

Receive data

VIL min = -0.3V

VIL max = 0.63V

VIH min = 1.17V

VIH max = 2.1V

1.8V power domain

UART_RTS

55

DO

Request to send

VIL min = -0.3V

VIL max = 0.63V

VIH min = 1.17V

VIH max = 2.1V

1.8V power domain

UART_CTS

56

DI

Clear to send

VOL max = 0.45V

VOH min = 1.35V

1.8V power domain

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Hardware Development Guide

UART_DSR

57

DO

Data set ready

VIL min = -0.3V

VIL max = 0.63V

VIH min = 1.17V

VIH max = 2.1V

1.8V power domain.

UART_DTR

58

DI

Data terminal ready

VIL min = -0.3V

VIL max = 0.63V

VIH min = 1.17V

VIH max = 2.1V

1.8V power domain.

UART_DCD

59

DO

Data carrier

detection

VOL max = 0.45V

VOH min = 1.35V

1.8V power domain

UART_RI

60

DO

Ring indicator

VOL max = 0.45V

VOH min = 1.35V

1.8V power domain, DO not pull-up

external

Debug UART Interface

Pin Name

Pin NO.

I/O

Description

DC Characteristics

Comment

UART_DEBUG_TXD

68

DO

Transmit data

VOL max = 0.45V

VOH min = 1.35V

1.8V power domain

UART_DEBUG_RXD

67

DI

Receive data

VIL min = -0.3V

VIL max = 0.63V

VIH min = 1.17V

VIH max = 2.1V

1.8V power domain

RF Interface

Pin Name

Pin NO.

I/O

Description

DC Characteristics

Comment

MAIN_ANT

62

IO

Main antenna

50Ω impedance

DIV_ANT

79

AI

Diversity antenna

50Ω impedance

GNSS_ANT

10

IO

GNSS antenna

50Ω impedance

I2C Interface
Pin Name

Pin NO.

I/O

Description

DC Characteristics

Comment

I2C_SCL

73

DO

I2C serial clock

VOL max = 0.45V

VOH min = 1.35V

Pull-up to 1.8V through external 2.2K

resistance, active low

I2C_SDA

74

IO

I2C serial data

VOL max = 0.45V

VOH min = 1.35V

VIL min = -0.3V

VIL max = 0.63V

VIH min = 1.17V

VIH max = 2.1V

Pull-up to 1.8V through external 2.2K

resistance, active low

SDIO Interface
Pin Name

Pin NO.

I/O

Description

DC Characteristics

Comment

SDIO_CMD

14

IO

Secure digital CMD

VOL max = 0.45V

VOH min = 1.35V

VIL min = -0.3V

Pull-up to 1.8V through external 10K

resistance, active low

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