GOSUNCN ME3630 mini-PCIE Development Manual

HARDWARE DEVELOPMENT GUIDE OF

MODULE

Version: V1.5

Date: 2018-04-28

LTE Module Series

ME3630 MINI-PCIE

Website: www.gosuncnwelink.com

E-mail: welink@gosuncn.com

ME3630 mini-PCIE

REVISION HISTORY

Version

Date

Description

V1.0

2016-05-27

1st published

V1.1

2016-07-06

Add the PID of ME3630_MP0 & MP1 in table 2-1,

update the pin in chapter 4.1

Update the Related Test data in chapter 7

V1.2

2016-08-24

Update the USIM_DET pin description, Figure 4-8 & Figure 4-9

Update the WAKEUP_IN & WAKEUP_OUT pins, Add 4.5 WAKEUP_IN signal, Figure 4-3 to Figure 4-6 , Table 4-3 to Table 4-4

V1.3

2017-02-16

Update the information of PIN 33

Update the picture of module

Add information of Evaluation Board in chapter 1.3

V1.4

2017-10-24

Update the pin20&22 description

Add information of ME3630-E&ME3630-J2A& ME3630-J2AS

V1.5

2018-04-28

Update the document format

Hardware Development Guide

ME3630 mini-PCIE

Abbreviations

Full Name

3GPP

Third Generation Partnership Project

AP

Another name of DTE

CHAP

Challenge Handshake Authentication Protocol

CE

European Conformity

CMOS

Complementary Metal Oxide Semiconductor

DCE

Data Communication Equipment

DL

Downlink

DTE

Data Terminal Equipment

EIA

Electronic Industries Association

EMC

Electromagnetic Compatibility

ESD

Electro-Static discharge

ESR

Equivalent Series Resistance

FDD

Frequency Division Duplex

GPIO

General-purpose I/O

LCC

Leadless Chip Carrier

LDO

Low-Dropout

LED

Light Emitting Diode

LTE

Long Term Evolution

ME

Mobile Equipment

MO

Mobile Origination Call

MT

Mobile Termination Call

MSB

Most Significant Bit

PC

Personal Computer

PCB

Printed Circuit Board

PDA

Personal Digital Assistant

PDU

Protocol Data Unit

PAP

Password Authentication Protocol

PPP

Point to Point Protocol

RTC

Real Time Clock

SMS

Short Messaging Service

SMT

Surface Mount Technology

SPI

Serial Peripheral Interface

TBD

To Be Determined

TCP

Transmission Control Protocol

ABOUT THIS DOCUMENT

A. Application Range

This document is the Product Technical Specification for the ME3630 GSM/CDMA/WCDMA/ TD-SCDMA/LTE TDD/LTE FDD module. It defines the high level product features and illustrates the interface for these features. This document is intended to cover the hardware aspects of the product, including electrical and mechanical.

B. Reading Note

The symbols below are the reading notes you should pay attention on:

: Warning or Attention

: Note or Remark

C. Purpose

This document provides the hardware solutions and development fundamentals for a product with the module. By reading this document, the user can have an overall knowledge of the module and a clear understanding of the technical parameters. With this document, the user can successfully fulfill the application and development of wireless Internet product or equipment.

Besides the product features and technical parameters, this document also provides the product reliability tests and related testing standards, RF performance indexes and a guide on the design of user circuits, to provide the user with a complete design reference.

D. Abbreviations

Table below is a list of abbreviations involved in this document, as well as the English full names.

ME3630 mini-PCIE

TIS

Total Isotropic Sensitivity

TRP

Total Radiated Power

TVS

Transient Voltage Suppressor

UART

Universal Asynchronous Receiver-Transmitter

UDP

User Datagram Protocol

UL

Up Link

USB

Universal Serial Bus

USIM

Universal Subscriber Identity Module

URC

Unsolicited result code

VIH

Logic High level of input voltage

VIL

Logic Low level of input voltage

VOH

Logic High level of output voltage

VOL

Logic Low level of output voltage

Hardware Development Guide

ME3630 mini-PCIE

Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a hands free kit) cause distraction and can lead to an accident. You must comply with laws and regulations restricting the use of wireless devices while driving.

Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it switched off. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. Consult the airline staff about the use of wireless devices on boarding the aircraft, if your device offers a Airplane Mode which must be enabled prior to boarding an aircraft.

Switch off your wireless device when in hospitals or clinics or other health care facilities. These requests are designed to prevent possible interference with sensitive medical equipment.

GSM cellular terminals or mobiles operate over radio frequency signal and cellular network and cannot be guaranteed to connect in all conditions, for example no mobile fee or an invalid SIM card. While you are in this condition and need emergent help, please remember using emergency call. In order to make or receive call, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength.

Your cellular terminal or mobile contains a transmitter and receiver. When it is on, it receives and transmits radio frequency energy. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment.

In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres including fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders.

SAFETY INFORMATION

The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating ME3610 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. If not so, GOSUNCN does not take on any liability for customer failure to comply with these precautions.

Hardware Development Guide

ME3630 mini-PCIE

TABLES

Table 2-1 Information of ME3630 mini-PCIE .............................................................................................................. 13

Table 2-2 Major Technical Parameters .................................................................................................................... 14

Table 4-1 PIN Definitions ......................................................................................................................................... 18

Table 4-2 Power Level of IO Interface ....................................................................................................................... 20

Table 4-3 WAKEUP_IN definition ......................................................................................................................... 22

Table 4-4 WAKEUP_OUT definition ..................................................................................................................... 23

Table 4-5 Definition and Description of W_DISABLE_N Signal ...................................................................................... 24

Table 4-6 Definition and Description of RESET_IN Signal ................................ ............................................................. 24

Table 4-7 Description of LED_WWAN_N Status .......................................................................................................... 25

Table 4-8 Definition and Description of USIM Card Signal ........................................................................................... 26

Table 4-9 Definition and Description of USB Interface ................................................................................................ 27

Table 4-10 Definition of UART Signal ......................................................................................................................... 28

Table 7-1 Product Temperature Range .................................................................................................................... 37

Table 7-2 GNSS Technical Parameters ....................................................................................................................... 37

Table 7-3 ESD ......................................................................................................................................................... 38

Table 7-4 Averaged standby DC power consumption [1] ............................................................................................. 38

Table 7-5 Averaged working current [1] ................................................................................................ .................... 38

Table 7-6 Averaged working current [2] .................................................................................................................... 38

Table 7-7 Conducted RF Output Power ..................................................................................................................... 38

Table 7-8 Conducted RF Receiving Sensitivity [1] ........................................................................................................ 39

Table 7-9 Conducted RF Receiving Sensitivity [2] ........................................................................................................ 39

Table 7-10 Averaged standby DC power consumption [1] ................................................................................... 39

Table 7-11 Averaged working current [1] ............................................................................................................. 39

Table 7-12 Averaged working current [2] ............................................................................................................. 40

Table 7-13 Conducted RF Output Power ............................................................................................................. 40

Table 7-14 Conducted RF Receiving Sensitivity Typical Value [1] ....................................................................... 40

Table 7-15 Conducted RF Receiving Sensitivity Typical Value [2] ....................................................................... 40

Table 7-16 Averaged standby DC power consumption [1] ................................................................................... 41

Table 7-17 Averaged working current [1] ............................................................................................................. 41

Table 7-18 Averaged working current [2] ............................................................................................................. 41

Table 7-19 Averaged working current [3] .................................................................................................................. 41

Table 7-20 Conducted RF Output Power ............................................................................................................. 41

Table 7-21 Conducted RF Receiving Sensitivity Typical Value [1] ....................................................................... 42

Table 7-22 Conducted RF Receiving Sensitivity Typical Value [2] ....................................................................... 42

Table 7-23 Conducted RF Receiving Sensitivity Typical Value [3] ....................................................................... 42

Table 7-24 Averaged standby DC power consumption [1] ................................................................................... 42

Hardware Development Guide

ME3630 mini-PCIE

Table 7-25 Averaged working current [1] ............................................................................................................. 42

Table 7-26 Averaged working current [2] ............................................................................................................. 43

Table 7-27 Conducted RF Output Power ............................................................................................................. 43

Table 7-28 Conducted RF Receiving Sensitivity Typical Value [1] ....................................................................... 43

Table 7-29 Conducted RF Receiving Sensitivity Typical Value [2] ....................................................................... 44

Hardware Development Guide

ME3630 mini-PCIE

1 ABOUT THIS DOCUMENT

1.1 APPLICATION SCOPE

This document is applicable as the hardware development guide of GOSUNCN ME3630 mini-PCIe modules (hereinafter referred to as

the ME3630 module).

ME3630 mini-PCIE is one module of GOSUNCN mini-PCIE Series currently.

This document is intended for GOSUNCN customers to quickly understand ME3630 module interface specifications, electrical and

mechanical details.

1.2 PURPOSE

This document provides the hardware solutions and development fundamentals for a product with the module. By reading this

document, the user can have an overall knowledge of module and a clear understanding of the technical parameters. With this

document, the user can successfully fulfill the application and development of wireless 4G Internet product or equipment.

Besides the product features and technical parameters, this document also provides the product reliability tests and related testing

standards, service function implementation flow, RF performance indexes, and guide on the design of user circuits, to provide the

user with a complete design reference.

1.3 EVALUATION BOARD

In order to help you to develop applications with ME3630-PCIe, GOSUNCN supplies an evaluation board GE2015, RS-232 to USB

cable, USB data cable, power adapter, antenna and other peripherals to control or test the module. For details, please refer to the related document [GOSUNCN GE2015 Dev Board User Guide].

Hardware Development Guide

ME3630 mini-PCIE

ME3630 PCIe PID

RF support

RF Band

Transmit Frequency (TX)

Receive Frequency (RX)

U1A_MP0&U1A_MP

1(CAT4)

U1C_MP0&U1C_MP1

(CAT1)

LTE FDD

B2

1850 to 1910 MHz

1930 to 1990 MHz

B4

1710 to 1755 MHz

2110 to 2155 MHz

B5

824 to 849 MHz

869 to 894 MHz

B12

698 to 716 MHz

728 to 746 MHz

B17

704 to 716 MHz

734 to 746 MHz

WCDMA

B2

1850 to 1910 MHz

1930 to 1990 MHz

B5

824 to 849 MHz

869 to 894 MHz

E1C_MP0&E1C_MP1(

CAT4)

E1C_MP0&E1C_MP1(

CAT1)

LTE FDD

B1

1920 to 1980 MHz

2110 to 2170 MHz

B3

1710 to 1785 MHz

1805 to 1880 MHz

B7

2500 to 2570 MHz

2620 to 2690 MHz

B8

880 to 915 MHz

925 to 960 MHz

B20

832 to 862MHz

791 to 821 MHz

WCDMA

B1

1920 to 1980 MHz

2110 to 2170 MHz

B8

880 to 915 MHz

925 to 960 MHz

GSM

B3

1710 to 1785 MHz

1805 to 1880 MHz

B8

880 to 915 MHz

925 to 960 MHz

J2A_MP0&J2A_MP1(

Cat 4)

J2AS_MP0&J2AS_MP

1(Cat 1)

LTE FDD

B1

1920 to 1980 MHz

2110 to 2170 MHz

B3

1710 to 1785 MHz

1805 to 1880 MHz

B5

824 to 849 MHz

869 to 894 MHz

B7

2500 to 2570 MHz

2620 to 2690 MHz

B8

880 to 915 MHz

925 to 960 MHz

B18

815 to 830 MHz

860 to 875 MHz

B19

830 to 845 MHz

875 to 890 MHz

B21

1447.9 to 1462.9 MHz

1459.9 to 1510.9 MHz

WCDMA

B1

1920 to 1980 MHz

2110 to 2170 MHz

B5

824 to 849 MHz

869 to 894 MHz

2 PRODUCT OVERVIEW

ME3630 mini-PCIe is LTE wireless Internet modules with PCI Express Mini Card interface. It is widely applied to but not limited the

various products and equipment such as laptops, vehicle-mounted terminals, and electric devices, by providing data services.

Customer can choose the dedicated type based on the wireless network and function configuration. The following table shows the

entire radio band configuration of the ME3630 mini-PCIe series.

Table 2-1 Information of ME3630 mini-PCIE

Hardware Development Guide

ME3630 mini-PCIE

B6

830 to 840 MHz

875 to 885 MHz

B8

880 to 915 MHz

925 to 960 MHz

B19

830 to 845 MHz

875 to 890 MHz

Name

Parameter Item

Specifications

Mechanical Feature

Dimensions

About 51mm×31mm×4.75 mm

Weight

About 10.0g

Form Factor

PCI Express Mini Card

Baseband

USIM/SIM

3V SIM card and 1.8V SIM card

USB Version

USB 2.0 HIGH SPEED, the data transfer rate can reach up to 480 Mbps.

Power supply

3.0~4.0V(Typ.3.3V/3.8V)

LED pin

Support

RF

Max. transmitter power

WCDMA Bands: 24 +1/-3dBm (Power Class 3)

GSM Band 8: 33±2dBm (Power Class 4)

GSM Band 3: 30±2dBm (Power Class 1)

LTE: +23dBm +2.7/-2.7dB (Power Class 3)

TD-SCDMA : 24 +1/-3dBm (Power Class 2)

Receiving sensitivity

WCDMA Band 1: ≤-106.7 dBm

GSM Band 3/ Band 8: ≤-102dBm

TD SCDMA Band34/39 : : ≤-107.3dBm

Main Antenna interface

Support, Provide Antenna Connector

Receive Diversity Antenna

Support, Provide Antenna Connector

GPS Antenna

Support, Provide Antenna Connector

2.1 TE CHNICAL PARAME TERS

The major features of ME3630 mini-PCIE can be described from the aspects of mechanic feature, base band, radio frequency,

technical standard and environment feature. The table below is a list of the major technical parameters and features supported by

products.

Table 2-2 Major Technical Parameters

2.2 BASE BAND FUNC TION

The baseband part of module mainly includes the following signal groups: USB signal, SIM card signal, Analog Voice signal,

WAKEUP_OUT wakeup (PC) signal, working status indicator signal WWAN_LED_N, RF switch control signal W_DISABLE_N, whole-set

reset signal PERST_N, power and grounding. Meanwhile, the product also provides the main antenna, GPS antenna and the Dx

antenna. Figure below is a system connection diagram.

ME3630 mini-PCIE

Figure 2–1 System Connection Diagram

PCI Express Mini Card

wireless Internet-access

module

Module system-side interface

USB

USIM

UART

WAKEUP_OUT

W_DISABLE_N

WWAN_LED_N

PERST_N

Main

GPS

Div

Hardware Development Guide

ME3630 mini-PCIE

3 MECHANIC FEATURES

3.1 DIMENSIONS

The product employs the standard PCI Express Mini Card interface type, with its dimensions designed according to F2 type. Figure

3-1 illustrates the dimensions and slot compatibility of PCI Express Mini Card (Unit: mm).

Figure 3–1 PCI Express Mini Card Dimensions

Figure 3–2 Thickness of PCI Express Mini Card

Hardware Development Guide

ME3630 mini-PCIE

3.2 HEAT-DISSI PAT ION DESIGN

The heat-dissipation design of ME3630 mini-PCIE strictly complies with PCI Express Mini Card Electromechanical Specification

Revision 1.2, October 26 2007. The heat sources are evenly distributed, and the product has a very excellent heat-dissipation design.

To ensure that the product performance is fully played out, it is recommended to design the main board as follows:

 Locate the module far away from the switch power and high-speed signal cable as much as possible. Well protect the wiring of

the interference sources.

 The antenna, and the coaxial cable connecting the network cable and the antenna, cannot be located close the interference

sources.

 Do not locate the module close to devices with large heat dissipation, such as CPU, south bridge, etc. The high temperature will

affect the RF performance.

Hardware Development Guide

ME3630 mini-PCIE

ME3630_MP0 PCIE Signal

ME3630_MP1 PCIE Signal

Pin Voltage

(VDD_PX)

I/O

Description of Pins

1

WAKEUP_OUT

NC

O

MP0: Module wakes up external AP,need to pull up externally.

Active low

MP1: Not connected

2

V_MAIN

I Power supply

3.0~4.0V(Typ.3.3V/3.8V)

3

NC

Not connected

4

GND

Ground

5

NC

Not connected

6

NC

Not connected

7

NC

Not connected

4 DESCRIPTION OF PINS

4.1 DEFINITION OF PIN SIGN ALS

4.1.1 PIN CONFIGURATION DIAGRAM

The products are designed according to PCI Express Mini Card Electromechanical Specification Revision 1.2, October 26 2007. Figure

below illustrates the PIN sequence, and Table 4-2 describes the detailed PIN definitions.

Figure 4–1 PIN Distribution Diagram

4.1.2 PIN DESCRIPTION

The table below descript the pins of module ME3630_MP0 and ME3630_MP1, there is several difference of PIN definition between

this two PID.

Table 4-1 PIN Definitions

Hardware Development Guide

ME3630 mini-PCIE

8

USIM_VCC

1.8V/3V

O

Power supply for USIM

9

GND

Ground

10

USIM_DATA

1.8V/3V

I/O

USIM data

11

UART_RXD

1.8V

1.8V I MP0:UART Receive Data

MP1: Reference Voltage

Output current must be lower than 10mA

12

USIM_CLK

3V O USIM clock

13

UART_TXD

NC

1.8V O UART Transmit Data

14

USIM_RST

1.8V/3V

O

USIM reset

15

GND

Ground

16

UART_DSR

1.8V O Module set ready

17

UART_RI

1.8V O UART Ring Indicator

18

GND

Ground

19

WAKEUP_IN

1.8V External AP to set the module into sleep or wake up the module

from sleep

20

W_DISABLE_N

I Active low signal for RF disable (Airplane mode) 21

GND

Ground

22

RESET_IN

I Module’s reset signal, active low

23

UART_CTS

UART_RX

1.8V I MP0:UART Clear to Send

MP1: UART Receive Data

24

V_MAIN

3.3V I Power supply

3.0~4.0V(Typ.3.3V/3.8V)

25

UART_RTS

1.8V O UART Request to send

26

GND

Ground

27

GND

Ground

28

1.8V

Reference Voltage

Output current must be lower than 10mA

29

GND

Ground

30

NC

Not connected

31

UART_DTR

UART_TXD

1.8V I MP0:UART DTE get ready

MP1 : UART Transmit Data

32

NC

WAKEUP_OUT

MP0:Not connected

MP1 : Module wakes up external AP,need to pull up externally.

Active low

33

UART_DCD

RESET_IN

1.8V MP0: UART Carrier detects, Output.

MP1: Module’s reset signal, Input pin. active low, the low level

Hardware Development Guide

ME3630 mini-PCIE

input must be higher than 50mV. 34

GND

Ground

35

GND

Ground

36

USB_DM

USB data signal D-

37

GND

Ground

38

USB_DP

I/O

USB data signal D+

39

V_MAIN

3.3V I Power supply

3.0~4.0V(Typ.3.3V/3.8V)

40

GND

Ground

41

V_MAIN

3.3V I Power supply

3.0~4.0V(Typ.3.3V/3.8V)

42

LED_WWAN_N

O

LED pin, Work status indication

43

GND

Ground

44

USIM_DET

1.8V O SIM card Detect, need to pull up externally. When detect high

level SIM card is un-existed, detect low SIM card is existed.

45

NC

46

NC

Not connected

47

NC

48

NC

Not connected

49

NC

50

GND

Ground

51

NC

52

V_MAIN

3.3V Power supply

3.0~4.0V(Typ.3.3V/3.8V)

Parameter

Description

Minimum

Maximum

Unit

VIH

High-level input voltage

0.65*VDD_PX

VDD_PX+0.3

V

VIL

Low-level input voltage

-0.3

0.35*VDD_PX

V

VOH

High-level output voltage

VDD_PX-0.45

VDD_PX

V

 NOTE: “NC” indicates Not Connected.

4.2 FEATURE OF DIGITAL POW ER LEVEL

The following table shows logic level specifications used in the module’s interface circuits:

Table 4-2 Power Level of IO Interface

Hardware Development Guide

ME3630 mini-PCIE

VOL

Low-level output voltage

0

0.45

V

 NOTE:

1. High and low level of input voltage must locate within the ranges specified in the above table.

2. High and low level of external interface signals must match interface level of this product.

3. VDD_PX=1.8V/3.3V, which indicates the pin voltage, the concrete value please refer to the table 4-1

4.3 DESCRIP TIO N O F MAJOR PIN SIG NAL S

The following section describes the common pins of module, including the functions of each interface, its default input and output

features, and its matched circuits. The user can reasonably design the application circuits on the system board according to the PIN

descriptions.

The module provides the interfaces/signals as follows:

 Power and Reset Interface  UART Interface  USIM Card Interface  USB2.0 interface  Antenna Interface  LED Interface  WAKEUP_OUT & W_DISABLE_N Signal

4.4 POWER SUPPLY

The host provides power to the module through multiple ground and power pins as summarized in 4.4.1 and 4.4.2. The host must

provide safe and continuous power at all times; the module does not have an independent power supply.

4.4.1 GND INTERFACE

The GND signal (PIN No: 4/9/15/18/21/26/27/29/34/35/37/40/43/50). This is the power grounding and signal grounding of module.

They need to be all connected to the ground level of system boards. The incomplete connection of GND signals will affect the

performance of the module.

Figure 4–2 GND Signal Connection

4.4.2 POWER SUPPLY

The 3.3Vaux signal (PIN No: 2/24//39/41/52, Power Interface). This is the positive signal of 3.3V/3.8V power, and is also the input

signaling of module’s power. The power supply is recommended to be within the range of 3.0~4.0V(Typ.3.3V/3.8V)

Hardware Development Guide

ME3630 mini-PCIE

Signal

No.

I/O

Description of Pins

Note

WAKEUP_IN

19

DI

Input signal

1.8V domain, drop-down default. it triggers

the action only when level change

Rising edge wake up module; Falling edge modules

can enter sleep.

WAKEUP_IN

High

Low

Module state

Operating State Sleep state

High

Operating State

4.5 WAKEUP_IN SIG NAL

WAKEUP_IN pin is the authorization signal of module entering sleep state.

If the signal is pulled up to high level (1.8 V), module cannot enter sleep mode. If this pin is not connected, it will keep in low level by

default.

Table below shows the definition of the WAKEUP_IN signal.

Table 4-3 WAKEUP_IN definition

Figure 4–3 WAKEUP_IN input sequence

Figure 4–4 Reference Connection Circuit of WAKEUP_IN Signal

NOTE:

The resistors in Figure above is only the recommended value and they need to adjust according to the actual situation.

There is anti-shake design with pin WAKEUP_IN internal, external processor need to pull-up or pull-down the pin last for

at least 500ms.

Hardware Development Guide

ME3630 mini-PCIE

Signal

No.

I/O

Description of Pins

Note

WAKEUP_OUT

1

DO

MP0:

Module wakes up

external AP, need to pull

up externally. Active low

This pin outputs a high-level voltage by

default. When a wake-up source arrives,

such as new SMS, call or network data

arrives, this pin outputs a low-level-voltage

pulse lasting for 1s.

WAKEUP_OUT

4.6 WAKEUP_OUT SI GNA L

The WAKEUP_OUT signal (PIN No. 1) is an output signal, active low. This signal is used for module to wake up the host. It is

designed as an OC gate, so it should be pulled up by the host and it is active-low. Figure 4-3 illustrates the reference connection

circuit of WAKEUP_OUT signal.

Table 4-4 WAKEUP_OUT definition

Figure 4–5 Reference Connection Circuit of WAKEUP_OUT Signal

 NOTE:

The resistors in Figure above is only the recommended value and they need to adjust according to the actual situation.

Do not directly connect this signal to the positive end of the power supply.

When there is a call/SMS received by the module, it will output the level shown as the figure below through WAKEUP_OUT pin to

wake the host.

Hardware Development Guide

ME3630 mini-PCIE

Module status

Operating state

Sleep state

low

High

WAKEUP_OUT

1s

W_DISABLE_N

Module Status

‘1’

RF is enabled.

‘0’

RF is disabled.

RESET_IN

Module Status

‘1’

Module is in the normal working status.

‘0’ and t≥1s

RF is in the OFF mode, Module will reset.

Figure 4–6 PIN1(WAKEUP_OUT) output sequence

4.7 W_DISABLE_N SIGN AL

The W_DISABLE_N signal (PIN No: 20) -- Active low, pulled up internally, input from a hardware switch to the module that disables

the main RF radio. Table below describes its control logic.

Table 4-5 Definition and Description of W_DISABLE_N Signal

The reference circuit design of W_DISABLE_N signal can refer to the interface of RESET_IN signal.

 NOTE: Do not directly connect this signal to the positive end of the power supply.

4.8 RESET_IN SIGNAL

The RESET_IN signal (PIN No: 22) is the system reset signal of the module, active low. Table below illustrates its control logic. Figure

below shows that pull down the reset key (RESET_IN) more than 1s will reset the module.

 NOTE: Do not directly connect this signal to the positive end of the power supply.

Table 4-6 Definition and Description of RESET_IN Signal

ME3630 mini-PCIE

Figure 4–7 Reference Circuit Design of RESET_IN Signal

1s

1

0

PON_RESET_N

Module

LED_WWAN_N Signal Status

Status of Module

Expected Indicator Status

High power level ‘1’, 3.3V

Not registered to the network

The indicator is OFF.

Low power level ‘0’, 0V

Registered to the network

The indicator is always on.

Figure 4–8 Resetting signal

Hardware Development Guide

4.9 LED_WWAN_N SI GNA L

The LED_WWAN_N signal (PIN No: 42, Status Indication PIN) is the signal indicating the current working status of the module, which

is generated by the module. The LED indicator need to be equipped on the system side for this feature, and the LED indicator is ON

when this signal generates the low power level. Table below illustrates the indicator status, and Figure below illustrates the

reference circuit design of LED_WWAN_N signal.

Table 4-7 Description of LED_WWAN_N Status

Figure 4–9 Reference Design Circuit of LED_WWAN_N

Hardware Development Guide

ME3630 mini-PCIE

Signal Definition

Signal Description

8

USIM_VCC

USIM card power, output by Module

10

USIM_DATA

USIM card DATA signal, two-way signal

12

USIM_CLK

USIM card clock signal, output by Module

14

USIM_RST

USIM card reset signal, output by Module

44

USIM_DET

SIM card Detect, need to pull up externally. When detect high level SIM card is

un-existed, detect low SIM card is existed.

Module

(Modem)

USIM

Card

Connecter with

detect pin

4.10 (U)SIM CARD IN TER FACE

SIM -- supported through the interface connector. The USIM connector must be placed on the host device for this feature. The signal

group of USIM card is as follows: PIN No: 8/10/12/14). Table below is a detailed description of each signal. Voltage levels over th is

interface comply with 3GPP standards.

Table 4-8 Definition and Description of USIM Card Signal

To comply with the requirements of 3GPP TS 51.010-1 and EMC authentication, it is recommended to place (U)SIM card console

close to the (U)SIM card interface, to prevent the wiring from being too long, which might seriously distort the waveform and thus

affect the signal integrity.

The following Figure shows the reference design of as well as the recommended circuit of the USIM card. ESD circuit protection and

UIM_DATA pull-up have been added in the board of ME3630 mini-PCIE.

Figure 4–10 Connection Circuit of U(S)IM Card Signal

ME3630 mini-PCIE

4.11 USB INTE RFACE

Name

Description

USB_DM

36

USB data negative

USB_DP

38

USB data positive

Hardware Development Guide

Figure 4–11 USIM_DET pin logic

The module has a high-speed USB2.0 interface, which supports both the full-speed (12 Mbps) mode and the high-speed (480 Mbps)

mode. It is connected to the system board side by the PIN 36 (USD_DM) and 38 (USB_DP). The USB interface is the path for

communication between the host and module and it is mainly used in data transmission.

Table 4-9 Definition and Description of USB Interface

The USB interface complies with the USB2.0 specifications and the electric features. When designing the host device, careful PCB

layout practices must be followed. USB_DP, USB_DM should be wired strictly according to the differential mode, and the length

difference between the two cables should be restricted within 1mm.

It is important to route the USB signal traces as differential pairs with total grounding. The impedance of USB differential trace is

90ohm.

Pay attention to the influence of junction capacitance of ESD component on USB data lines. Typically, the capacitance value should

be less than 2pF.

ME3630 mini-PCIE

Figure 4–12 Connection Circuit of USB Signal

Signal Name

I/O

Description

UART1_RX

DI

UART port RX receive data

UART1_TX

DO

UART port TX transmit data

UART1_DSR

DO

Data is ready

UART1_RI

DO

Ringtone indicator

UART1_CTS

DI

UART port CTS clear to send

UART1_RTS

DO

preparing to receive

UART1_DTR

DI

Data terminal is ready

UART1_DCD

DO

Carrier detection

 NOTE: The differential impedance should be controlled within 90ohm.

Hardware Development Guide

4.12 UART INTER FACE

4.12.1 DESCRIPTION OF PINS

The wireless module supports the full UART interface with flow control function, which complies with the RS-232 interface protocol.

This UART port supports the programmable data width; programmable data stop bit and programmable parity check, and has an

independent TX and RX FIFOs (512 bytes for each). For the normal UART application (non-Bluetooth), the maximum baud rate is

230400bps, and the default baud rate is 115200bps. The PINs are defined as shown in Table below.

 NOTE: This chapter is only used for PID MP0.

Table 4-10 Definition of UART Signal

4.12.2 ELECTRIC FEATURE

It is recommended that this UART interface be kept during the design and the testing point be reserved for the software

interconnection. If the module’s UART interface is connected with the host device, and the UART PWL of host device matches wi th

1.8V, the connection mode is as shown in figure below.

ME3630 mini-PCIE

Figure 4–13 Module Serial Port & AP Application Processor

UART1_RX

UART1_TX

UART1_CTS

UART1_RTS

UART1_DTR

UART1_DSR

UART1_DCD

UART1_RI

TXD

RXD

RTS

CTS

DTR

DSR

DCD

RING

Module Application

DCE

DTE

TTL-

RS232

level

translator

SP3238

MAX3238

Module

1.8V

-TTL level

translator

NLSX5014MUTAG

UART1_DCD

UART1_DSR

UART1_TX

UART1_CTS

UART1_RX

UART1_RFR

UART1_DTR

UART1_RI

GND

RS232_DCD RS232_DSR

RS232_TXD

RS232_CTS

RS232_RXD

RS232_RTS RS232_DTR

RS232_RI

GND

1

2

3

4

5

6

7

8

9

User Board

Female DB9

Note:UART1_RFR is equal to UART1_RTS.

Hardware Development Guide

If it does not match the PWL of AP interface, it is recommended to add the PWL conversion circuit. Otherwise, it might cause

unstable com ports because the level is not matched or cause damage to the module because it is at high level for long time. The

connection of module UART port and standard RS-232-C interface can be through the chip like class 232. The design involves the

transformation of TTL level and EIA level. We recommend to use the chip of NLSX5014MUTAG. If using the 2-wire serial bus interface,

MAX3232 is recommended, and if using the 8-wire serial bus interface, SP3238 or MAX3238 is recommended. The connection mode

is as shown in Figure below.

If customer wants to connect a 3.3V application system, a level shifter should be used. The following figure shows the reference

design. The diode in this Figure is Schottky diode (forward voltage drop is 0.3V). If you select other diodes, please select one with

lower forward voltage drop to make sure UART_RXD is below the threshold when inputting low level.

Figure 4–14 The connection of UART and Standard RS-232-C interface

Hardware Development Guide

ME3630 mini-PCIE

VCC_EXT

Module（DCE）

UART1_TX(1V8)

33.2K 1K

VCC(3.3V)

AP（DTE）

UART_RXD(3V3)

22pF

10K

100pF

VCC_EXT

Module（DCE）

UART1_RX(1V8)

AP（DTE）

UART_TXD(3V3)

NOTE:

The resistors in Figure below is only the recommended value and they need to adjust according to the actual situation.

Figure 4–15 UART level shifter from 1.8V to 3.3V

Hardware Development Guide

ME3630 mini-PCIE

5 POWER INTERFACE DESIGN GUIDELINE

This chapter provides the power supply requirements, general design rules. Users can design the power supply of module to achieve

stable and well working performance according to this document.

5.1 GE NERAL DESIGN RULE S

When the module is used for different external applications, pay special attention to the design for the power supply.

In the process of peripheral circuit designing, users of this Module product should ensure that the external power supply cir cuit is

capable of providing sufficient power supply capacity firstly, and control the supply range between 3.0~4.0V(Typ.3.3V/3.8V) strictly. If

the value above module voltage range, it will lead the main chip burned, while below required voltage range, it will affect t he RF

circuit’s performance or cause shutdown and restart occurred. For the design of high-speed USB signal lines, it requires to control the

differential impedance at 90ohm. The voltage design of external circuit interfaces should match that of the module PINs, and the

detailed value can be got in Chapter 4. The module product has a good RF indicator; customers can refer to Chapter 6 in the process

of antenna circuit designing.

5.2 POWER SUPPLY REQ UIREMENT

The power supply of PCIE Type module is usually recommended to be within the range of 3.0~4.0V(Typ.3.3V/3.8V). According to the

requirement of mobile terminal device, the power supply voltage of module is 3.3V under normal working condition.

If the network is in poor situation, the antenna will transmit at the maximum power, and the transient maximum peak current can

reach as high as 2.3A. So the power supply capacity for peak current on the main board needs to be above 2.3A to satisfy the

requirement of module peak current; and the average current on the system side needs to be above 2.0A. Meanwhile, consider the

voltage drop of power supply on the side of main board. If the network is in a poor situation or under 2G, the module peak cu rrent

will be great. Therefore the power supply has to be designed in order to withstand with these current peaks without big voltage

drops; this means that both the electrical design and the board layout must be designed for this current flow. If the layout of the PCB

is not well designed a strong noise floor is generated on the ground and the supply; and exceptions such as restart of the module

may occur.

The peak current of module under the GSM BURST mode is different due to the differences in actual network environments. And i ts

transient current under different powers will be various as well. The greater the power is, the greater the transient current is. The

network quality also directly affects the work current of the module. If the network is in well situation, the peak work current on the

module will be small. But if the network is in poor situation, its peak current will be great as shown in Figure 5-1 (when the module

works under the EDGE/GPRS Time Slot (2-high 6-low) and CLASS10). If the module works under the 2-high work Time Slot, it requires

greater current, and the voltage drop will occur accordingly.

ME3630 mini-PCIE

Figure 5–1 Power Supply Current and Voltage Change under EDGE/GPRS

0

t/ms

0

Unit: 200mA/cell

Unit: V/cell

Voltage

Current

EDGE/GPRS TS

2-high 6-low

CLASS10

3.462ms1.154ms

(577us/cell)

200mA

1V

2V

3V

3.6V

DC3.3V

VDD_3V3

0.47uF

22uF

330uF

2200uF

330uF

C1

C2

C3

C4

C5

C6

330uF

Hardware Development Guide

5.3 CIRC UIT RE QUIREMENT S O F POWE R SUPP LY OUTPUT

Requirement:

The electrical design for the Power supply should be made ensuring it will be capable of a peak current output of at least 2.5 A.

The average current supplied by the system host needs to be above 2.0A.

When designing the PCB line, the power cable on the system board should be thick enough, and should form a good reflux with the

ground.

In the power supply circuit design, the user needs to add the large storage capacitor on the kilo level, to guarantee the transient

power supply capability as well as the system instantaneous power capacity, and to prevent the module from resetting and shutting

down caused by voltage fluctuation.

Figure 5–2 Add storage capacitor to Module power supply terminal

5.4 Recommended Power Reference Circuit

Option one:

Use DCDC switching power supply and large storage capacitor on the kilo level to ensure the normal operation of the RF power

amplifier to withstand these current peaks without big voltage drops.

Advantage:

Hardware Development Guide

ME3630 mini-PCIE

Vin=5V

Vout=3.3V

3V3

Can provide well transient current under 2G weak signal environment to satisfy modules requirements, to prevent device shutdown

and ports re-enumeration as a consequence of the supply voltage drop.

The over-current capability requirement of DC/DC switching power supply need to be above 3A, for example, ZI1153, AAT2138 and

so on.

Input voltage range of ZI1153 is: 2.5～5.5V,output voltage range of ZI1153 is from 0.6V to VIN( input voltage). Input voltage range of AAT2138is: 2.7～5.5V,output voltage range of AAT2138is from 3.3～5.5V.

As shown in the Figure below, use DC/DC switching power supply ZI1153 as the buck chip. Place a tantalum capacitor of 330μF at the

input of the chip. Place a 2200UF capacitor or place several 330μF tantalum capacitors in parallel. This circuit fully meets the module

power requirements. (If the user’s PCB size is limited, the output of buck chip can place three more 330μF tantalum capacitors of

which the total capacity is more than 1000μF)

Figure 5–3 DC/DC Switching Power Supply

Option two:

Use LDO as the buck chip. The over-current capability of LDO is above 3A. As the poor transient response of linear regulator, large

capacitors should be placed at the input and output of LDO. The output of LDO, place a capacitors above 2000μF. The reference

power supply circuit design with LDO is as shown in Figure below.

Figure 5–4 LDO Power Supply

 NOTE: The resistor and capacitor in the Figure 5-3 and Figure 5-4 is just for example, the use need to choose the proper ones

according to the output voltage level.

Hardware Development Guide

ME3630 mini-PCIE

6 RF ANTENNA DESIGN GUIDE

The antenna connection is one of the most important aspect in the full product design as it strongly affects the product

overall performances, hence read carefully and follow the requirements and the guidelines for a proper design.

6.1 ANTENNA IN TERFAC E

The Mini PCIE adapter is equipped with three RF antenna connectors: the main antenna interface, GPS antenna interface

and Diversity antenna interface, as shown in Figure 6-1. The antennal connector employs the U.FL-R-SMT1 (80) RF console

from HRS Corporation, as shown in Figure 6-2. For the specified cables on the RF interface, it is recommended to use

U.FL_LP_088 of HRS Corporation, as shown in Figure 6-3. Profile Dimensions of RF antenna console is shown in Figure 6-4

(Unit: mm).

For more information about mating connectors visit the website http://www.hirose-connectors.com/.

Figure 6–1 Antennal Interface Diagram

Figure 6–2 RF Interface Testing Console (U.FL-R-SMT1 (80) of HRS Corporation)

ME3630 mini-PCIE

Figure 6–3 Testing Cable

Figure 6–4 Profile Dimensions of RF antenna console

Hardware Development Guide

6.2 ANTENNA IN DEX ES

The module supports the AGPS/GPS function, so the system equipment needs to add the GPS antenna. The design of GPS

antenna is consistent with that of the main antenna, and its efficiency can be 3dB lower. The isolation between the main

antenna and the diversity antenna is required to be greater than 12dB. The difference between Rx TIS and the TIS of main

antenna should be within 6dB.

The antenna index is divided into the Passive index and Active index. The Passive index includes S11, efficiency, gains,

radiation pattern and polarity, which can be used as the parameter measuring the performance of the antenna itself. The

Active index is also called the OTA index, including TRP (all-round radiation power), TIS (all-round receiving sensitivity),

radiation pattern, which is an important index measuring the radiation performance of the whole set (including the antenna,

module, main board).

Hardware Development Guide

ME3630 mini-PCIE

6.3 TE ST ME THODS FOR WHOLE -SE T ANTENNA OTA

Figure 6-5 is the diagram of OTA test system of CTIA. The system is mainly composed of test chamber, high-precision

positioning system and its controller, Windows based PC running test software and RF test instruments with automatic test

program. The main RF instruments are integrated RF test equipment, Spectrum Analyzer, Network Analyzer.

The radio equipments, Relay Switch Unit and PC with automatic test software are communicated via GPIB interface.

Figure 6–5 The OTA test system of CTIA

Hardware Development Guide

ME3630 mini-PCIE

Working Condition

Min Temperature

Max Temperature

Remark

Normal working condition

-30°C

75°C

All the indexes are good.

Extreme working condition

-40°C~ -30°C

+75°C~ +85°C ℃

Some indexes become poorer.

Storage

-40°C

85°C

Storage environment of module

GNSS (GPS/GLONASS)

Technical specification

GPS Frequency

1575.42±1.023 MHz

Tracking sensitivity

-155dbm

Cold-start sensitivity

-143dbm

TTFF (Open Sky)

Hot start: 4s

Cold start: 55s

Receiver Type

Qualcomm GPS Gen8C

GPS L1 Frequency

1575.42MHz

Update rate

2-4 HZ

GNSS (GPS/GLONASS) data format

GOSUNCN Loc API/GOSUNCN auto-negotiation

GNSS (GPS/GLONASS) Current consumption

65mA

GNSS (GPS/GLONASS) antenna

Passive/Active antenna

7 RELATED TEST

7.1 OPERATI NG & STOR AGE TEMPERATURE

The working temperature range of the module is divided into the normal working temperature range and the extreme

working temperature range. Under the normal working temperature range, the testing result of RF complies with the

requirements of 3GPP specifications, and its function is normal. Under the extreme temperature range, the RF index

basically complies with the 3GPP specifications, and the quality of data communication is affected to a certain extent, but its

normal function is not affected. The table below is the requirement for the testing environment.

Table 7-1 Product Temperature Range

 NOTE: Table above lists the extreme working conditions for the module. Using the module beyond these conditions

may result in permanent damage to the module.

7.2 GNSS TE CHN ICA L PARA METERS

The following table shows the GNSS techinical parameters of ME3630-mini PCIE module.

Table 7-2 GNSS Technical Parameters

7.3 ELECTRO STA TIC DISCH ARG E

The module is not protected against electrostatics discharge (ESD) in general. Consequently, it is subject to ESD

handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must

be applied throughout the processing, handling and operation of any application that incorporates the module.

The following table shows the module electrostatics discharge characteristics.

ME3630 mini-PCIE

Table 7-3 ESD

Tested Points

Contact discharge

Air Discharge

Unit

V_BAT

± 5

± 10

kV

All antenna interfaces

± 4

± 8

kV

Other interfaces

± 0.5

± 1

kV

Parameter

Condition

Typical Value

Unit

OFF state

Power down

45

μ A

Sleep

All system is halted

0.9

mA

Parameter

Condition

Typical Value

Unit

Bandwidth

5MHz

10MHz

15MHz

20MHz

LTE

LTE FDD Band 1, Pout=23dBm

550

560

590

600

mA

LTE FDD Band 3, Pout=23dBm

500

520

580

590

mA

LTE TDD Band 38 ,Pout=23dBm

380

390

430

450

mA

LTE TDD Band 39 ,Pout=23dBm

300

310

360

390

mA

LTE TDD Band 40, Pout=23dBm

350

360

400

430

mA

LTE TDD Band 41, Pout=23dBm

380

390

430

450

mA

Parameter

Condition

Typical Value

Unit

WCDMA

Band1 ,Pout=24dBm

550

mA

TD-SCDMA

Band34, Pout=24dBm

180

mA

Band39, Pout=24dBm

180

mA

CDMA

BC0, Pout=23dBm

600

mA

GSM

Band3, Pout=30dBm

200

mA

Band8, Pout=33dBm

300

mA

Frequency

Max

Min

LTE FDD Band 1

23dBm ±2.7dB

-39dBm

LTE FDD Band 3

23dBm ±2.7dB

-39dBm

7.4 ME3630-C TEST

7.4.1 OPERATING CURRENT

The values of current consumption in different operating mode are shown below.

Table 7-4 Averaged standby DC power consumption [1]

Table 7-5 Averaged working current [1]

Hardware Development Guide

Table 7-6 Averaged working current [2]

7.4.2 RF OUTPUT POWER

The following table shows the RF output power of ME3630 C1A_MP0 module.

Table 7-7 Conducted RF Output Power

ME3630 mini-PCIE

LTE TDD Band38

23dBm ±2.7dB

-39dBm

LTETDD Band 39

23dBm ±2.7dB

-39dBm

LTE TDD Band40

23dBm ±2.7dB

-39dBm

LTE TDD Band 41

23dBm ±2.7dB

-39dBm

WCDMA Band1

24+1/-3 dBm

-50dBm

TD-SCDMA Band34

24+1/-3 dBm

-50dBm

TD-SCDMA Band39

24+1/-3 dBm

-50dBm

CDMA BC0

23~30 dBm

-50dBm

GSM Band3

30dBm ±2dB

-5dBm

GSM Band8

33dBm ±2dB

0dBm

7.4.3 RF RECEIVING SENSITIVITY

Band

5 MHz(dBm)

10 MHz(dBm)

20 MHz(dBm)

LTE FDD Band 1

-100 dBm

-97 dBm

-94 dBm

LTE FDD Band 3

-97 dBm

-94dBm

-91dBm

LTE TDD Band 38

-100 dBm

-97 dBm

-94 dBm

LTE TDD Band 39

-100 dBm

-97 dBm

-94 dBm

LTE TDD Band 40

-100 dBm

-97 dBm

-94 dBm

LTE TDD Band 41

-100 dBm

-97 dBm

-94 dBm

Band

Sensitivity

WCDMA Band1

-107 dBm

TD-SCDMA BAND34

-108 dBm

-104 dBm

-107 dBm

TD-SCDMA BAND39

CDMA BC0

GSM Band3

GSM Band8

Parameter

Condition

Typical Value

Unit

OFF state

Power down

45

uA

Base Current

Flight Mode[Sleep]

0.9

mA

Parameter

Condition

Typical Value

Unit

The following table shows the conducted RF receiving sensitivity of ME3630 C1A_MP0 module.

Table 7-8 Conducted RF Receiving Sensitivity [1]

Hardware Development Guide

Table 7-9 Conducted RF Receiving Sensitivity [2]

7.5 ME3630-U TE ST

7.5.1 CURRENT CONSUMPTION

The values of current consumption in different operating mode are shown below.

Table 7-10 Averaged standby DC power consumption [1]

Table 7-11 Averaged working current [1]

ME3630 mini-PCIE

Bandwidth

5MHz

10MHz

15MHz

20MHz

LTE

LTE FDD Band 2, Pout=23dBm

575

620

630

mA

LTE FDD Band 4, Pout=23dBm

515

530

550

600

mA

LTE FDD Band 5 ,Pout=23dBm

610

mA

LTE FDD Band 12,Pout=23dBm

620

630

mA

LTE FDD Band 17, Pout=23dBm

550

600

mA

Table 7-12 Averaged working current [2]

Parameter

Condition

Typical Value

Unit

WCDMA

Band2, Pout=24dBm

532

mA

Band5, Pout=24dBm

526

mA

Frequency

Max

Min

LTE FDD Band 2

23±2.7dBm

-39dBm

LTE FDD Band 4

23 ±2.7dBm

-39dBm

LTE FDD Band 5

23 ±2.7dBm

-39dBm

LTE FDD Band 12

23 ±2.7dBm

-39dBm

LTE FDD Band 17

23 ±2.7dBm

-39dBm

WCDMA Band 2

24+1/-3 dBm

-50dBm

WCDMA Band 5

24+1/-3 dBm

-50dBm

Band

5 MHz(dBm)

10 MHz(dBm)

20 MHz(dBm)

LTE FDD Band 2

-98 dBm

-95 dBm

-92 dBm

LTE FDD Band 4

-100 dBm

-97 dBm

-94 dBm

LTE FDD Band 5

-98 dBm

-95 dBm

/

LTE FDD Band 12

-97 dBm

-94 dBm

/

LTE FDD Band 17

-97 dBm

-94 dBm

/

Band

Sensitivity

WCDMA Band 2

-104.7 dBm

WCDMA Band 5

-104.7 dBm

7.5.2 RF OUTPUT POWER

The following table shows the RF output power of ME3630-U1A_MP0 module.

Table 7-13 Conducted RF Output Power

Hardware Development Guide

7.5.3 RF RECEIVING SENSITIVITY

The following table shows the conducted RF receiving sensitivity typical value of ME3630 module.

Table 7-14 Conducted RF Receiving Sensitivity Typical Value [1]

Table 7-15 Conducted RF Receiving Sensitivity Typical Value [2]

ME3630 mini-PCIE

7.6 ME3630-E TEST

Parameter

Condition

Typical Value

Unit

Sleep state

Sleep mode ( LTE )

2.5

mA

Sleep mode (WCDMA)

1.8

mA

Sleep mode ( GSM)

2.7

mA

Parameter

Condition

Typical Value

Unit

LTE

LTE FDD Band 1, Pout=23dBm

785

mA

LTE FDD Band 3, Pout=23dBm

731

mA

LTE FDD Band 7 ,Pout=23dBm

902

mA

LTE FDD Band 8,Pout=23dBm

671

mA

LTE FDD Band 20, Pout=23dBm

915

mA

Parameter

Condition

Typical Value

Unit

WCDMA

Band1, Pout=24dBm

670

mA

Band8, Pout=24dBm

558

mA

Parameter

Condition

Typical Value

Unit

GSM

Band3, Pout=24dBm

290

mA

Band8, Pout=24dBm

199

mA

Frequency

Max

Min

LTE FDD Band 1

23±2.7dBm

-39dBm

LTE FDD Band 3

23 ±2.7dBm

-39dBm

LTE FDD Band 7

23 ±2.7dBm

-39dBm

LTE FDD Band 8

23 ±2.7dBm

-39dBm

LTE FDD Band 20

23 ±2.7dBm

-39dBm

WCDMA Band 1

24+1/-3 dBm

-50dBm

7.6.1 CURRENT CONSUMPTION

The values of current consumption in different operating mode are shown below.

Table 7-16 Averaged standby DC power consumption [1]

Table 7-17 Averaged working current [1]

Hardware Development Guide

Table 7-18 Averaged working current [2]

Table 7-19 Averaged working current [3]

7.6.2 RF OUTPUT POWER

The following table shows the RF output power of ME3630 module.

Table 7-20 Conducted RF Output Power

Hardware Development Guide

ME3630 mini-PCIE

WCDMA Band 8

24+1/-3 dBm

-50dBm

GSM Band3

33+2/-2 dBm

0±5dBm

GSM Band8

30+2/-2 dBm

5±5dBm

Band

10 MHz(dBm)

20 MHz(dBm)

LTE FDD Band 1

-94

LTE FDD Band 3

-94.2

LTE FDD Band 7

-92.4

LTE FDD Band 8

-93.7 LTE FDD Band 20

-96.5

Band

Sensitivity

WCDMA Band 1

-109.8 dBm

WCDMA Band 8

-110.2 dBm

Band

Sensitivity

GSM Band3

-109 dBm

GSM Band8

-109dBm

Parameter

Condition

Typical Value

Unit

Sleep state

Sleep mode

2.43

mA

Parameter

Condition

Typical Value

Unit

Bandwidth

5MHz

10MHz

15MHz

20MHz

LTE

LTE FDD Band 1, Pout=23dBm

629

mA

LTE FDD Band 3, Pout=23dBm

645

mA

LTE FDD Band 5 ,Pout=23dBm

523

mA

LTE FDD Band 7,Pout=23dBm

662 LTE FDD Band 8,Pout=23dBm

512

mA

7.6.3 RF RECEIVING SENSITIVITY

The following table shows the conducted RF receiving sensitivity typical value of ME3630 module.

Table 7-21 Conducted RF Receiving Sensitivity Typical Value [1]

Table 7-22 Conducted RF Receiving Sensitivity Typical Value [2]

Table 7-23 Conducted RF Receiving Sensitivity Typical Value [3]

7.7 ME3630-J2A TEST

7.7.1 CURRENT CONSUMPTION

The values of current consumption in different operating mode are shown below.

Table 7-24 Averaged standby DC power consumption [1]

Table 7-25 Averaged working current [1]

ME3630 mini-PCIE

LTE FDD Band18, Pout=23dBm

597 mA

LTE FDD Band19, Pout=23dBm

617 mA

LTE FDD Band21, Pout=23dBm

586 mA

Table 7-26 Averaged working current [2]

Parameter

Condition

Typical Value

Unit

WCDMA

Band1, Pout=24dBm

514

mA

Band5, Pout=24dBm

496

mA

Band6, Pout=24dBm

580

mA

Band8, Pout=24dBm

502

mA

Band19, Pout=24dBm

572

mA

Frequency

Max (uplimit/downlimit)

Min

LTE FDD Band 1

23±2.7dBm

-39dBm

LTE FDD Band 3

23 ±2.7dBm

-39dBm

LTE FDD Band5

23 ±2.7dBm

-39dBm

LTE FDD Band 7

23 ±2.7dBm

-39dBm

LTE FDD Band 8

23 ±2.7dBm

-39dBm

LTE FDD Band18

23 ±2.7dBm

-39dBm

LTE FDD Band 19

23 ±2.7dBm

-39dBm

LTE FDD Band21

23 ±2.7dBm

-39dBm

WCDMA Band 1

24+1/-3 dBm

-50dBm

WCDMA Band5

24+1/-3 dBm

-50dBm

WCDMA Band6

24+1/-3 dBm

-50dBm

WCDMA Band 8

24+1/-3 dBm

-50dBm

WCDMA Band 19

24+1/-3 dBm

-50dBm

Band

5 MHz(dBm)

10 MHz(dBm)

15 MHz(dBm)

20 MHz(dBm)

LTE FDD Band 1

-99.6

-94.1

LTE FDD Band 3

-99.8

-94.4

LTE FDD Band5

-101.2

-98.7

7.7.2 RF OUTPUT POWER

The following table shows the RF output power of ME3630 module.

Table 7-27 Conducted RF Output Power

Hardware Development Guide

7.7.3 RF RECEIVING SENSITIVITY

The following table shows the conducted RF receiving sensitivity typical value of ME3630 module.

Table 7-28 Conducted RF Receiving Sensitivity Typical Value [1]

ME3630 mini-PCIE

LTE FDD Band 7

-101.5

-92.1

LTE FDD Band 8

-101.2

-98.7

LTE FDD Band18

-100.9

-96.2 LTE FDD Band 19

-101 -96.5 LTE FDD Band 21

-105 -98.9

Band

Sensitivity(dBm)

WCDMA Band 1

-110.6

WCDMA Band5

-110.8

WCDMA Band6

-110.3

WCDMA Band 8

-110.1

WCDMA Band 19

-110.2

Hardware Development Guide

Table 7-29 Conducted RF Receiving Sensitivity Typical Value [2]

GOSUNCN ME3630 mini-PCIE Development Manual

REVISION HISTORY

ABOUT THIS DOCUMENT

SAFETY INFORMATION

CONTENTS

TABLES

1 ABOUT THIS DOCUMENT

1.1 APPLICATION SCOPE

1.2 PURPOSE

1.3 EVALUATION BOARD

2 PRODUCT OVERVIEW

2.1 TE CHNICAL PARAME TERS

2.2 BASE BAND FUNC TION

3 MECHANIC FEATURES

3.1 DIMENSIONS

3.2 HEAT-DISSI PAT ION DESIGN

4 DESCRIPTION OF PINS

4.1 DEFINITION OF PIN SIGN ALS

4.1.1 PIN CONFIGURATION DIAGRAM

4.1.2 PIN DESCRIPTION

4.2 FEATURE OF DIGITAL POW ER LEVEL

4.3 DESCRIP TIO N O F MAJOR PIN SIG NAL S

4.4 POWER SUPPLY

4.4.1 GND INTERFACE

4.4.2 POWER SUPPLY

4.5 WAKEUP_IN SIG NAL

4.6 WAKEUP_OUT SI GNA L

4.7 W_DISABLE_N SIGN AL

4.8 RESET_IN SIGNAL

4.9 LED_WWAN_N SI GNA L

4.10 (U)SIM CARD IN TER FACE

4.11 USB INTE RFACE

4.12 UART INTER FACE

4.12.1 DESCRIPTION OF PINS

4.12.2 ELECTRIC FEATURE

5 POWER INTERFACE DESIGN GUIDELINE

5.1 GE NERAL DESIGN RULE S

5.2 POWER SUPPLY REQ UIREMENT

5.3 CIRC UIT RE QUIREMENT S O F POWE R SUPP LY OUTPUT

5.4 Recommended Power Reference Circuit

6 RF ANTENNA DESIGN GUIDE

6.1 ANTENNA IN TERFAC E

6.2 ANTENNA IN DEX ES

6.3 TE ST ME THODS FOR WHOLE -SE T ANTENNA OTA

7 RELATED TEST

7.1 OPERATI NG & STOR AGE TEMPERATURE

7.2 GNSS TE CHN ICA L PARA METERS

7.3 ELECTRO STA TIC DISCH ARG E

7.4 ME3630-C TEST

7.4.1 OPERATING CURRENT

7.4.2 RF OUTPUT POWER

7.4.3 RF RECEIVING SENSITIVITY

7.5 ME3630-U TE ST

7.5.1 CURRENT CONSUMPTION

7.5.2 RF OUTPUT POWER

7.5.3 RF RECEIVING SENSITIVITY

7.6 ME3630-E TEST

7.6.1 CURRENT CONSUMPTION

7.6.2 RF OUTPUT POWER

7.6.3 RF RECEIVING SENSITIVITY

7.7 ME3630-J2A TEST

7.7.1 CURRENT CONSUMPTION

7.7.2 RF OUTPUT POWER

7.7.3 RF RECEIVING SENSITIVITY